19331results about "Edge grinding machines" patented technology

Methods for manufacturing silicon carbide wafers having superior specifications for bow, warp, total thickness variation (TTV), local thickness variation (LTV), and site front side least squares focal plane range (SFQR). The resulting SiC wafer has a mirror-like surface that is fit for epitaxial deposition of SiC. The specifications for bow, warp, total thickness variation (TTV), local thickness variation (LTV), and site front side least squares focal plane range (SFQR) of the wafer are preserved following the addition of the epitaxy layer.

A substrate processing apparatus (1) has a first polishing unit (400A) and a second polishing unit (400B) for polishing a peripheral portion of a substrate. Each of the two polishing units (400A, 400B) includes a bevel polishing device (450A, 450B) for polishing a peripheral portion of a substrate and a notch polishing device (480A, 480B) for polishing a notch of a substrate. The substrate processing apparatus (1) has a maintenance space (7) formed between the two polishing units (400A, 400B). The bevel polishing devices (450A, 450B) in the two polishing units (400A, 400B) face the maintenance space (7) so as to be accessible from the maintenance space (7).

Exemplary apparatus for obtaining information for a structure can be provided. For example, the exemplary apparatus can include at least one first optical fiber arrangement which is configured to transceive at least one first electromagnetic radiation, and can include at least one fiber. The exemplary apparatus can also include at least one second focusing arrangement in optical communication with the optical fiber arrangement. The second arrangement can be configured to focus and provide there through the first electromagnetic radiation. Further, the exemplary apparatus can include at least one third dispersive arrangement which is configured to receive a particular radiation which is the first electromagnetic radiation and / or the focused electromagnetic radiation, and forward a dispersed radiation thereof to at least one section of the structure. At least one end of the fiber can be directly connected to the second focusing arrangement and / or the third dispersive arrangement. In addition, an exemplary embodiment of a method for producing an optical arrangement can be provided. For example, a first set of optical elements having a first size in a first configuration and a second set of optical elements in cooperation with the second set and having a second size in a second configuration can be provided. The first and second sets can be clamped into a third set of optical elements. The third set can be polished, and a further set of optical elements may be deposited on the polished set.

The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier, and a plurality of vacuum openings that a re disposed only adjacent to an inner side of the inner seal at a location corresponding to the backside periphery of the wafer.

In a process for polishing the chamfered peripheral part of a wafer using a polishing cloth while supplying a polishing slurry in order to improve productivity of the process by reducing a polishing time, at least two steps of polishing processes are performed in sequence. The process comprises a first polishing process to polish a particular part, e.g. the part corresponding to the {110} plane of a peripheral part of the wafer and a second polishing process in which the whole part of a peripheral part of the wafer is polished for finishing by means of varying a hardness of the polishing clothes and / or a particle size of abrasives in the slurry such as the hardness of the polishing cloth in the second polishing process being softer than that of in the first polishing process and a particle size of abrasives in the slurry in the second polishing process being finer than that of in the first polishing process.

A structure and method for polishing a device include oscillating a carrier over an abrasive surface (the carrier bringing a polished surface of the device into contact with the abrasive surface, the oscillating allowing a portion of the polished surface to periodically oscillate off the abrasive surface), optically determining a reflective measure of a plurality of locations of the polished surface as the portion of the device oscillates off the abrasive surface and calculating depths of the locations of the polished surface based of the reflective measure.

An electrolytic in-process dressing device 10 is provided with a disk-shaped metal-bonded grindstone 2 with a surface 2a with a circular arc shape with a radius R at its outer periphery and a numerical control device 16. The disk-shaped metal-bonded grindstone 2 rotates around an axis Y, and the grindstone is dressed electrolytically while the device 10 grinds the workpiece 1. The numerical control device 16 is provided with a rotary truing device 12 that rotates around the X axis that orthogonally crosses the axis of rotation Y and trues the circular arc surface 2a, a shape measuring device 14 for measuring the shape of the circular arc surface of the grindstone and the shape of the processed surface of workpiece 1 on the machine, and controls the grindstone numerically in the three directions along the axes X, Y and Z. The numerical control device 16 moves the grindstone in three axial directions and repeats the operations of truing, grinding and measurements on-line. Thus, an axially asymmetrical aspheric mirror with a highly accurate shape and extremely low surface roughness, that can precisely reflect or converge light can be manufactured within a short time with a high accuracy.

The invention relates to an ornament grinding and burnishing machine, in particular to an automatic-circulating dual-clamp ornament grinding and burnishing machine. The invention designs the automatic-circulating dual-clamp ornament grinding and burnishing machine with high efficiency, high integrated degree and high automatic degree, which mainly aims at overcoming the defects of low automatic degree and low efficiency of clamp switching in the prior art. The invention has the main technical scheme that the automatic-circulating dual-clamp ornament grinding and burnishing machine comprises a stand, wherein a feeding and discharging work part, at least one group of front grinding work part, at least one group of front burnishing work part, a switching work part, at least one group of rear grinding work part and at least one group of rear burnishing work part are sequentially arranged on the stand; and a manipulator work part is arranged in the middle of the stand.

A method for manufacturing an endovascular support device comprises positioning a generally tubular member made of an implantable metal and having a generally cylindrical wall in a working relationship with a laser beam. A desired pattern is cut in the generally cylindrical wall in order to produce a stent having a plurality of openings and a plurality of edges. The stent is tumbled in a medium to round its edges and, in turn, to produce more rounded cross-sections of stent elements.

A sharpener includes a motor driven shaft with at least one slidably mounted sharpening assembly consisting of a supporting hub structure mounted by its central bore hole on the shaft. The hub structure supports a symmetrically shaped rotating surface containing an ultra fine abrasive material. The rotating surface is pressed with a force of less than 0.2 lb. by a spring action to make sustained rotating abrading contact with a facet of a knife positioned by a knife guide to align the facet into contact with the surface containing the abrasive materials.

A single-use grinding tool includes a wheel portion having a profiled recess (e.g., such as a U, V, or bowl shape) extending circumferentially along the wheel portion's periphery. A multi-layered bonded abrasive (e.g., 3-dimensional matrix of abrasive grains and bond material, or multiple layers of abrasive tape) is conformably coated or otherwise applied in a uniform thickness along the profiled recess. The bonded abrasive in one particular case includes a metal bond with diamonds. However, organic, resinous, vitrified, and hybrid bonds, as well as other abrasive grit types, can be used. The wheel portion is supported by an arbor portion which may be removably coupled to the wheel portion, or formed integrally with the wheel portion. The tool is useful, for example, in edge grinding a workpiece, such as sheet glass. Methods of tool use and tool manufacture are disclosed as well.

A multidisc floor grinder is constructed as a wheeled device that may be moved about the floor by means of a handle. The chassis of the floor grinder supports a bearing housing on gimbals that allow the bearing housing to vary in orientation as the device is moved across an uneven floor. The gimbals are aligned to allow rotation of the bearing housing about a bearing housing axis that is parallel to the floor. The bearing housing supports a main drive shaft which extends downwardly from the bearing housing. The main drive shaft is rotatable relative to the bearing housing within its bearings. A grinder mounting frame is rotatably mounted about the main drive shaft and is supported therefrom. The grinder mounting frame is driven in rotation about the main drive shaft at a greatly reduced speed relative to the rotation of the main drive shaft. The grinder mounting frame carries a plurality of grinding elements which are also driven from the main drive shaft, but at a substantially increased speed of rotation relative thereto. The grinding elements thereby rotate not only about their own axes, but also about the axis of the main drive shaft so as to cover a relatively large floor area with relatively small grinding elements. This arrangement substantially reduces the time required to grind paint or other matter from a floor surface.

Unitary finishing elements having discrete finishing members fixedly attached to unitary resilient body are disclosed for finishing semiconductor wafers. The discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements can reduce unwanted surface defect creation on the semiconductor wafers during finishing.

The end face processing apparatus of the present invention is an end face processing apparatus for processing the cut face of a cut ceramic molded body, which comprises an air blowing outlet and an extraneous material removal member, and is configured to remove burrs remaining on the cut face from the time of cutting as well as powder adhering to the cut face and on the periphery thereof using the extraneous material removal member and air from the air blowing outlet.

A high-speed, hand-held attachment for flex rotor shafts of power rotary tools, and also for direct attachment to power rotary tools without flex rotor shafts, that converts rotary motion to reciprocating motion for precision control of cutting, carving, sawing, chiseling, filing, sanding, and engraving on delicate work pieces. The attachment is one assembly comprising a one-piece front one-piece enclosure (20), a rear one-piece enclosure (30), a high-speed bearing (22), a one-piece rotating piece (40) with integral cam groove, a one-piece reciprocating piece (50) with an integral cam follower on one end and with its other, exposed end accomodating the attachment of a chuck or collet and with geometry to prevent rotation, and a thumbscrew (32). Rotating piece (40) attaches directly to the rotary power source and provides the cam action drive to reciprocating piece (50). Bearing (22) provides rotative support for the other end of rotating piece (40). Reciprocating piece (50) slidably mounts in front one-piece enclosure (20). Front one-piece enclosure (20) and rear one-piece enclosure (30) are attached to each other and maintain proper alignment for rotating piece (40), bearing (22), and reciprocating piece (50). Thumbscrew (32) secures the attachment to the flex rotor shaft of a power rotary tool. A tool holder / collet is attached to the exposed end of reciprocating piece (50) whereby numerous types of cutting tools may be utilized. Alternative versions of the rear one-piece enclosure, (30A) and (30B), described herein, allow for attachment directly to power rotary tools without flex rotor shafts. Alternative versions of the reciprocating piece, (50A), (50B), and (50C), and of the rotating piece, (40A), are also described herein.

In order to omit a lapping process or a double disk grinding process by performing slicing operation so as not to generate long period waviness on the surface of the wafer in a slicing process and by completely removing short period waviness remaining in the surface of the sliced wafer during a polishing process, there is provided a manufacturing method includes a slicing process of slicing a work of the semiconductor wafer by reciprocating a wire of a wire saw at constant cycles of 3 or more and less than 8 per a minute a grinding process of grinding both sides of the sliced wafer by a grinding wheel, one-side by one-side and a polishing process of performing a chemical mechanical polishing on both sides of the ground wafer by a fixed abrasive grain polishing cloth, in which an abrasive grain is fixed, and a abrasive containing no abrasive grains.

A finishing apparatus modifies the physical structure along the edge of a metal knife blade wherein the edge is formed at the junction of two edge facets presharpened with abrasives. The finishing apparatus consists of at least one precision angular knife guide that positions the edge of the blade into contact with the rigid surface of a driven moving member and positions the plane of the adjacent edge facet at a precise predetermined angle relative to the plane of the rigid surface that is harder than the metal of the knife and is without tendency to abrade.

Apparatus, systems and methods for forming complex edges on a glass member through the use of a glass slumping process are disclosed. According to one aspect of the invention, a method of forming a complex edge in a glass forming process includes grinding an edge of a glass member and polishing the edge of the glass member. Grinding the edge of the glass member causes the edge of the glass member to have a first level of complexity. The method also includes performing a slumping process on the glass member. Performing the slumping process causes the edge of the glass member to have a second level of complexity that is more complex than the first level of complexity.

An apparatus for simultaneously polishing wafers including at least a first and a second web of polishing media. At least two polishing heads are provided on a carrier coupled to a drive system such that one polishing head positions a wafer against the first web and a second polishing head positions a second wafer against the second web. The drive system imparts a programmed polishing motion or pattern to the polishing heads.

A deburring device includes a deburring tool for removing burrs from an object, a robot for moving an object or the tool, a force sensor for detecting force acting on the tool, and a visual sensor for detecting a position of a burr portion of the object. According to the deburring device, information regarding shape data of the burr portion and a posture of the tool is obtained beforehand based on three-dimensional data of the object. Based on the shape data and the posture of the tool, a robot program is created. In accordance with an actual burr portion detected by the visual sensor, the robot program is replaced as necessary. During the deburring, the robot is controlled according to the force control by using a detected value from the force sensor.

A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with abrasive particles. Adhesive is applied in layers with abrasive particles in-between each layer of adhesive. Abrasive particles may vary in size and material from layer to layer to achieve cleaning, shaping and polishing objectives.

A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A bonding system employing finely powdered aluminum oxide particles mixed with a suitable adhesive is employed to bond the abrasive layer to the aluminum oxide substrate. Silicon carbide particles mixed into a compatible adhesive carrier including a polymer composition is preferred for bonding the abrasive particle layer to a graphite or carbide substrate.

The invention discloses an automatic grinding and polishing system for crystal blanks. The automatic grinding and polishing system comprises a first left-right transfer mechanism and a second left-right transfer mechanism, feeding and discharging stations, a plurality of upper hemispherical grinding and polishing stations and butting stations are sequentially arranged from left to right along the first left-right transfer mechanism, butting stations, a plurality of lower hemispherical grinding and polishing stations and feeding and discharging stations are sequentially arranged from right to left along the second left-right transfer mechanism, feeding and discharging machines are arranged on the feeding and discharging stations, grinding and polishing machines are arranged on the grinding and polishing stations, butting machines are arranged on the butting stations, each left-right transfer mechanism comprises a plurality of transfer manipulators and a rail linearly extending left and right, the feeding and discharging machines, the grinding and polishing machines and clamp holders for mounting clamps on the butting machines are arranged in a left-right rowed manner along the length direction of the clamps, and the transfer manipulators push the clamps to slide between the left-right adjacent clamp holders along the length direction of the clamps. By the aid of the technical scheme, the automatic grinding and polishing system is more reasonable in structure, simpler in action, lower in cost, more reliable in operation and higher in efficiency.

Prior to the polishing of the wafer 4, a reflective body which has the same shape and dimensions as the wafer 4 is held on the polishing head 2 instead of the wafer 4. A polishing agent 5 is interposed between the window 15 of the polishing head 13 and the reflective body, and the reflective body is pressed against the polishing pad 13 with the same pressure as that applied during the polishing of the wafer 4. In this state, the reflective body is irradiated via the window 15 with a probe light emitted from the light source 31, and the spectroscopic intensity of the reflected light is obtained from the sensor 43 as a reference spectrum. During the polishing of the wafer 4, the spectroscopic intensity of the reflected light from the wafer 4 is successively obtained as measured spectra from sensor 43; the intensity ratio of these measured spectra to the above-mentioned reference spectrum is determined, and the polishing state of the wafer 4 is monitored on the basis of this intensity ratio.

There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is immersed in an abrasive liquid 50 containing free abrasive grains, and an inner peripheral end surface of the glass substrate is polished using the abrasive liquid containing the free abrasive grains by rotating a rotary brush 4 or a polishing pad in contact with the inner peripheral end surface.

An apparatus for polishing a semiconductor wafer includes a polishing pad to be in contact with the semiconductor wafer; a turn table which rotates the polishing pad; and an elastic member which is arranged between the turn table and the polishing pad. The polishing pad includes a polishing layer which is made of a material having a good characteristic of slurry holding; and a support layer which is made of a rigid material having an optimum thickness to prevent the polishing layer from loosening. The polishing pad is attached to the turn table by a stretch-holding technique without adhesive bonding.

A handheld instrument for minimizing pain during administration by injection of a liquid, such as, an anesthetic that has a main body, a vibration unit mounted in the main body when initiated to cause the main body to vibrate, and a detachable tip cantilever mounted on the main body to vibrate with it, the tip having a free end characterized by a bifurcation to form two spaced projections defining a space between them, whereby the spaced projections can be placed in proximity to, adjacent to and bracketing a preselected injection site on a human or animal and the tissue at said preselected injection site and vibrated while an injection is given.