The invention provides an inverted laser chip based on an SiC substrate and a manufacturing method of the inverted laser chip. The inverted laser chip based on the SiC substrate comprises a conventional laser chip structure and the SiC substrate. The conventional laser chip structure sequentially comprises a substrate, a buffer layer, an N limit layer, an active area, a P limit layer, a P-type ohm contact layer, a current retaining layer and a metal ohm contact layer from bottom to top. A metal ohm contact layer is plated at the bottom of the SiC substrate, and a metal bonding layer is plated on the other side. The metal ohm contact layer of the conventional laser chip is bonded with the SiC substrate through the metal bonding layer of the SiC substrate. The N electrode metal layer is evaporated on the buffer layer, with original substrate being removed, of the conventional laser chip. The pole N of the manufactured SiC substrate is at the top, and the pole P of the manufactured SiC substrate is at the bottom. Compared with conventional lasers, the inverted laser chip based on the SiC substrate has the advantages of good radiation, good stability, long service life and the like.