45 results about "Bonded interface" patented technology

The invention relates to the technical field of composite material detection, in particular to a fiber-reinforced thermosetting thermoplastic composite structure interface quality detection method and system.The method comprises the steps that vibration excitation is applied to a target area of the surface of a to-be-detected sample, and the amplitude of the excitation is lower than the damage critical value of a weak bonding interface; a dynamic response signal perpendicular to the interface is collected in a vibration field non-diffusion area of the excitation point of the target area; performing frequency domain transformation on the dynamic response signal, and separating a fundamental frequency component and at least one high-order harmonic frequency component; according to the nonlinear enhancement effect of the high-order harmonic frequency component relative to the fundamental wave frequency component, whether the weak bonding defect exists in the target area or not is judged. According to the method, the technical bottleneck that the dynamic evolution process of the weak bonding defect of the composite material interface is difficult to capture in real time is effectively solved, sensitive response to the microdefect is realized through a nonlinear harmonic characteristic enhancement effect, and the recognition precision of traditional ultrasonic detection is improved.

The invention relates to a preparation, regulation and control method of a thermoplastic elastomer encapsulating material in the technical field of new materials, which comprises the following steps: realizing an in-situ reaction process by controlling the concentration and reaction temperature of reactive functional groups in the encapsulating material according to an interface reaction rate constant and active group distribution density; if the reaction conversion rate reaches a preset value, a chemically bonded interface bonding layer is formed; monitoring the stress distribution state in the rubber coating layer by adopting a stress analysis algorithm, and when detecting that local stress concentration exceeds the yield strength of the material, dispersing a stress concentration area by adjusting the length of a flexible chain segment and the density of a rigid cross-linking point in a cross-linking network; and deformation data and a bonding strength change trend of the interface bonding layer in the temperature cycling process are obtained, if the bonding strength attenuation rate exceeds a preset threshold value, a dynamic cross-linking mechanism is activated, and the dynamic equilibrium state of interface bonding is maintained through fracture and recombination of a reversible covalent bond.

The present invention relates to the technical field of composite materials, and solves the technical problem that it is difficult to prepare a diamond / aluminum composite material with a tightly bonded interface while ensuring high thermal conductivity in the prior art. In particular, it relates to a diamond / aluminum composite material with a nano-gradient interface and a preparation method thereof. The present invention introduces a carburizing method on the basis of the magnetron sputtering method, and realizes the in-situ generation of new phases in each modified layer from the outermost metal element layer to the diamond surface through adsorption and diffusion, promotes the transformation of the metal modified elements on the diamond particle surface into carbides, and constructs a nano-gradient interface carbide layer. While the nano-scale interface layer improves the interface bonding between diamond and aluminum, it minimizes the introduced interface thermal resistance to the greatest extent. The present invention combines magnetron sputtering deposition with the carburizing method to prepare a nano-gradient multi-carbide interface layer with precisely controllable thickness, enhances the degree of interfacial diffusion reaction between diamond and aluminum, weakens the interfacial phonon scattering, and can give full play to the high thermal conductivity of diamond particles more fully.

The utility model provides a fiber grid rib constraint UHPC (Ultra High Performance Concrete) thin layer for reinforcing an underwater structure of a bridge. The fiber grid rib constraint UHPC thin layer comprises a jet UHPC thin layer, FRP (Fiber Reinforce Plastic) grid ribs and FRP embedded steel bars for positioning the FRP grid ribs, the UHPC thin layer is arranged on the outer layer of the existing damaged bridge underwater structure, the FRP grid ribs are arranged in the UHPC thin layer, the FRP embedded steel bars are partially embedded in the existing damaged bridge underwater structure, and the FRP embedded steel bars are partially embedded in the spraying UHPC thin layer. According to the utility model, common concrete which damages the underwater structure of the bridge can be effectively isolated from water, so that the common concrete is prevented from being directly scoured and permeated by the water; meanwhile, the UHPC prepared on the basis of the maximum compactness theory can form a compact interface with excellent bonding performance with the existing common concrete; due to the existence of the FRP embedded steel bars and the FRP grid steel bars, the bonding performance of the sprayed UHPC thin layer-existing concrete interface can be further improved, and then the cooperative work capacity of the sprayed UHPC thin layer and an existing damaged bridge underwater structure is effectively improved.

A method for forming a direct hybrid bond and a device resulting from a direct hybrid bond including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, capped by a conductive barrier, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads capped by a second conductive barrier, aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads capped by conductive barriers formed by contact bonding of the first non-metallic region to the second non-metallic region.

This invention discloses a method for metal hot-press bonding and its application. The method specifically includes: providing a first substrate and a second substrate, the first substrate having a first metal bonding surface and the second substrate having a second metal bonding surface; aligning the first and second substrates to bring the first and second metal bonding surfaces into contact; and performing hot-press bonding by controlling temperature and applying pressure. The hot-press bonding includes a heating and high-pressure stage, a heat-holding and low-pressure stage, and a cooling and pressure-releasing stage; the temperature of the heat-holding and low-pressure stage is the bonding temperature. This invention achieves hot-press bonding of metals in an air environment through coordinated temperature and pressure control, resulting in a well-bonded interface that is free of oxidation, dense, and pore-free.

In a general aspect, gettering elements are disclosed for absorbing gas species from a cavity of a vapor cell. In certain aspects, a vapor cell includes a dielectric body having interior and exterior surfaces. The interior surface defines a cavity in the dielectric body, and the exterior surface defines an opening to the cavity. The dielectric body also includes a channel having a porous layer that is configured to absorb a gas species from the cavity. The vapor cell also includes a vapor or a source of vapor residing in the cavity as well as an optical window that covers the opening to the cavity. The optical window has a surface bonded to the exterior surface of the dielectric body to form a bonded interface of the vapor cell. The bonded interface includes a seal around the opening, and the vapor or the source of vapor includes alkali metal atoms.

The invention relates to the technical field of liquid silicone rubber, and particularly discloses a wear-resistant liquid silicone rubber composite material and a preparation method thereof. The composite material comprises a component A and a component B, wherein the component A comprises vinyl-terminated silicone oil, nano aluminum oxide double-modified by a polyhydroxy polymer and a vinyl silane coupling agent, and a platinum catalyst; the component B comprises vinyl-terminated silicone oil, hydrogen-containing silicone oil, an inhibitor and active polysilazane, the active polysilazane is modified polysilazane containing vinyl or epoxy group, and the active group of the active polysilazane can chemically react with the active group on the surface of the modified nano aluminum oxide to form a chemically bonded interface transition layer. According to the invention, through a dual modification strategy and introduction of active polysilazane, a chemically bonded rigid-flexible bicontinuous network structure is constructed, so that the wear resistance of the composite material is improved while excellent tensile strength, tear strength and elongation at break are maintained.

To efficiently manufacture a bonded substrate by ultrasonically inspecting the bonded state of the bonded substrate without deteriorating the bonded state. [Solution] A method for manufacturing a bonded substrate, comprising: a bonding step of bonding two substrates to form a bonded substrate; a sealing step of sealing the bonded interface exposed on the outer periphery of the bonded substrate from the atmosphere; and an inspection step of inspecting the bonded substrate. In the inspection step, ultrasonic inspection is carried out using an ultrasonic inspection unit having an ultrasonic sensor including an ultrasonic oscillator and an ultrasonic receiver, and a supply nozzle that supplies a medium that transmits ultrasonic waves between the ultrasonic sensor and the bonded substrate. In the ultrasonic inspection, the medium is supplied from the supply nozzle to the underside of the bonded substrate, and ultrasonic waves are sent from the ultrasonic oscillator to the bonded substrate via the medium supplied to the underside of the bonded substrate, and the ultrasonic waves returning from the bonded substrate are received by the ultrasonic receiver.

The invention discloses formaldehyde-free plywood based on a polyolefin composite adhesive film and a manufacturing method of the formaldehyde-free plywood. The formaldehyde-free plywood is obtained by performing hot press molding on multiple layers of wood veneers and hot melt adhesive films arranged among the multiple layers of wood veneers; the hot melt adhesive film is a polymer three-layer composite hot melt adhesive film and is composed of a bonding layer, a supporting layer and a bonding layer, the supporting layer is made of non-polar polyolefin, and the bonding layer is made of modified polyolefin hot melt adhesive. According to the application, the polymer three-layer composite hot melt adhesive film is composed of a bonding layer-supporting layer-bonding layer three-layer structure, the bonding layer is directionally bonded with a wood component hydroxyl group through an active group to construct a chemical bonding interface, and the supporting layer plays mechanical supporting and hydrophobic barrier functions, so that the limitation that a traditional thermoplastic adhesive only depends on physical bonding is broken through; the plywood is endowed with excellent damp-heat aging resistance, the problem of adhesive layer stripping failure easily caused by traditional physical bonding is avoided, and meanwhile, the water-resistant stability of the plywood is remarkably improved.

Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint that have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy having an alloy composition consisting of, by mass %, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.2 to 5.00% of Bi, 0.005 to 0.09% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.013≤(Ag+Cu+Ni+Bi)×Ge≤0.027 (1), Sn×Cu×Ni≤5.0 (2). Ag, Cu, Ni, Bi, Ge, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

The application belongs to the field of material mechanical property experiment, and discloses a universal clamp for a testing machine for mixed adhesive interface testing, which comprises two clamp assemblies with the same structure, each clamp assembly comprising a clamp, upper and lower pins and symmetrically arranged gaskets; the clamp is connected with the testing machine through threads and locked by a nut; the main body of the clamp is provided with a pin through hole, the pin passes through the pin through hole on one side of the clamp, the pin hole on the gasket, the pin hole on the test piece, the pin hole on the gasket arranged on the other side, and the pin through hole on the other side of the clamp, and then the test piece is limited and installed; and the gasket and the test piece are locked by a bolt, and the positioning of the test piece is realized. The application can be installed on a universal tensile testing machine and an electric fatigue testing machine, and the designed upper and lower clamps, pins and gaskets can realize the mechanical testing of the mixed lap joint interface.

In a general aspect, gettering elements are disclosed for absorbing gas species from a cavity of a vapor cell. In certain aspects, a vapor cell includes a dielectric body having interior and exterior surfaces. The interior surface defines a cavity in the dielectric body, and the exterior surface defines an opening to the cavity. The dielectric body also includes a channel having a porous layer that is configured to absorb a gas species from the cavity. The vapor cell also includes a vapor or a source of vapor residing in the cavity as well as an optical window that covers the opening to the cavity. The optical window has a surface bonded to the exterior surface of the dielectric body to form a bonded interface of the vapor cell. The bonded interface includes a seal around the opening, and the vapor or the source of vapor includes alkali metal atoms.

This invention discloses a high-strength carbon fiber modified plastic and its preparation method. By weight, it comprises the following raw materials: 90-100 parts polypropylene, 8-12 parts modified carbon fiber, 3-5 parts maleic anhydride-grafted polypropylene, 2-4 parts toughening agent, 0.7-1.1 parts antioxidant, and 0.5-0.8 parts lubricant. This high-strength carbon fiber modified plastic achieves its goal by subjecting the carbon fiber surface to specific multi-step modification, sequentially introducing an aminosilane coupling layer, a gallic acid amide bond linking layer, and an itaconic acid active double bond functional layer. This forms an inside-out covalently bonded interface system, transforming the simple physical contact between the carbon fiber and the polypropylene matrix into a chemical bond. Furthermore, by combining maleic anhydride-grafted polypropylene as an interface compatibilizer and ethylene-octene copolymer as a toughening agent, the formulation design ensures both high strength and material toughness, resulting in a high-strength carbon fiber modified polypropylene composite material with balanced mechanical properties.

This invention discloses a wear-resistant self-lubricating resin for composite surface layer structures and its preparation method, belonging to the field of composite surface layer technology. It includes a matrix resin component A, a lubricating component B, a curing agent component C, and a coupling agent component D. Reactive functional groups are introduced onto the surface of solid lubricating particles through coupling agent component D. This invention uses a silane coupling agent to perform surface grafting modification on PTFE and MoS₂, introducing reactive functional groups onto the particle surface. These functional groups participate in the curing and crosslinking network of the epoxy resin, forming a "chemically bonded interface." This structure allows the lubricating particles to wear uniformly in the form of a "molecular brush" during friction, while deep lubricating particles are continuously exposed and replenished to the friction interface, achieving a long-term mechanism of lubrication reserve and continuous release. The low surface energy of PTFE fills the gaps in the transfer film, forming a "continuous, dense, low surface energy" composite lubricating film on the mating surface. This synergistic effect significantly reduces the coefficient of friction.

A hybrid bonded interface structure includes a primary conduction path constructed of a first material layer. A second material layer for stress-absorption and void reduction is arranged along a perimeter of the first material layer. A crack stop and diffusion barrier formed of a third material layer is arranged along a perimeter of the second material. A Young's modulus of the third material layer is greater than a Young's modulus of the second material layer and a Young's Modulus of the first material layer.

The invention relates to the technical field of dental materials, in particular to a pattern printing diaphragm for a dental appliance and a manufacturing method of the pattern printing diaphragm. The diaphragm comprises at least two thermoplastic polymer layers, and polymer materials are selected from various thermoplastic materials or blending modifiers of the thermoplastic materials. And at least one pattern layer sandwiched between adjacent polymer layers, the pattern layer having an entity thickness of 5 [mu] m to 150 [mu] m and made of a curable pattern material, forming a three-dimensional pattern structure after curing, and forming a chemical bonding interface with the upper and lower polymer layers, thereby forming the packaged sandwich structure. The invention also provides a manufacturing method, which adopts the steps of pattern preforming, curing treatment, pulse hot-pressing compounding and the like, so that the film can obtain the embedded pattern with a stable interface and an integrated structure. The diaphragm has good bonding strength, biological suitability and pattern definition, and is suitable for personalized dental orthodontic application.

A drill bit is provided having a tip segment, a shaft, and an interface feature. The tip segment includes a cutting end, an attachment end, and a body. The attachment end defines an attachment surface facing in a direction away from the cutting end. A cross-sectional area perpendicular to the central axis is defined by an outer perimeter of the body. The shaft includes a first end coupled to the attachment end. The interface feature is located on the attachment surface and positioned between the attachment end and the first end. An outer surface of the interface feature and the attachment surface define an interface surface. The interface surface has a surface area greater than the cross-sectional area of the tip segment. In various embodiments, the interface feature includes at least one protrusion and / or at least one recess.

Capacitive couplings in a direct-bonded interface for microelectronic devices are provided. In an implementation, a microelectronic device includes a first die and a second die direct-bonded together at a bonding interface, a conductive interconnect between the first die and the second die formed at the bonding interface by a metal-to-metal direct bond, and a capacitive interconnect between the first die and the second die formed at the bonding interface. A direct bonding process creates a direct bond between dielectric surfaces of two dies, a direct bond between respective conductive interconnects of the two dies, and a capacitive coupling between the two dies at the bonding interface. In an implementation, a capacitive coupling of each signal line at the bonding interface comprises a dielectric material forming a capacitor at the bonding interface for each signal line. The capacitive couplings result from the same direct bonding process that creates the conductive interconnects direct-bonded together at the same bonding interface.

This invention discloses a flexible PPy@Ni-CAT composite film, its preparation method, and its applications. The method first involves depositing an Al2O3 nanolayer on the surface of a polyester fiber fabric using ALD (Al2O3 deposition), leveraging the self-limiting reaction properties to form a dense chemically bonded interface, enhancing interfacial adhesion and providing abundant nucleation sites. Secondly, lightweight polyester fiber is selected as the substrate, and in-situ growth technology is employed to maintain the material's lightweight and flexible properties. Finally, a Ni-CAT framework and an interpenetrating network of PPy are constructed: hydrothermal self-assembly forms the Ni-CAT conductive framework, followed by in-situ polymerization of pyrrole initiated by FeCl3. The π-π conjugated backbone of PPy interacts with Ni-CAT to create a continuous conductive pathway. Combined with charge optimization of the Al2O3 layer, the conductivity of the composite film is significantly improved, achieving a balance between lightweight, high adhesion, and high conductivity.

The invention discloses a diamond coating composite material, a copper composite material and a preparation method thereof. Belongs to the technical field of diamond composite materials. The preparation method of the diamond coating composite material comprises the following steps: depositing an amorphous carbon film on the surface of cleaned diamond particles and carrying out first heat treatment to obtain amorphous carbon coated diamond, plating a metal layer on the surface of the amorphous carbon coated diamond and carrying out second heat treatment to obtain coated diamond, and carrying out third heat treatment on the coated diamond to obtain the diamond coating composite material. And the diamond coating composite material is obtained. According to the preparation method, damage to the diamond body can be remarkably reduced, a uniform and active surface is provided for metallization treatment of the diamond body, and the diamond-copper composite material which is tight and uniform in interface bonding and excellent in comprehensive performance is obtained.

A method for forming a direct hybrid bond and a device resulting from a direct hybrid bond including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, capped by a conductive barrier, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads capped by a second conductive barrier, aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads capped by conductive barriers formed by contact bonding of the first non-metallic region to the second non-metallic region.

This invention relates to the field of polymer materials technology, specifically to a weather-resistant rubber material for sealing strips and its preparation method: It is made from the following raw materials in parts by weight: 60-80 parts rubber matrix, 5-10 parts silica, 20-40 parts composite weather-resistant filler, 1-3 parts dioxane, 0.5-1.5 parts triallyl isocyanurate, 5-10 parts paraffin oil, 1-2 parts phenolic antioxidant, and 0.5-1.5 parts lubricant. In this invention, the modified filler uses cerium-doped zirconium phosphate as the core component. The variable valence of cerium ions continuously captures and passivates the active free radicals generated during the thermo-oxidative aging of rubber. Simultaneously, the layered structure of zirconium phosphate forms a physical barrier against oxygen and ozone. The modified filler inhibits the oxidation chain reaction at its source, while the chemically bonded interface prevents filler detachment during aging, thus preventing protective failure and maintaining material stability in long-term thermo-oxidative and ozone environments.

This copper / ceramic assembly includes: a copper member consisting of copper or a copper alloy; and a ceramic member consisting of silicon nitride, wherein the copper member and the ceramic member are bonded. At a bonded interface between the ceramic member and the copper member, an active metal nitride layer is formed on a side of the ceramic member. In a region extending by 10 μm from the active metal nitride layer toward a side of the copper member, an area rate of an active metal compound containing Si and an active metal is 10% or less. A ratio PA / PB of an area rate PA of the active metal compound in a peripheral part region of the copper member to an area rate PB of the active metal compound in a central part region of the copper member is in a range of 0.7 or more and 1.4 or less.

The invention discloses a recoverable composite film material and application thereof in dry food packaging, the recoverable composite film material comprises a protective layer, a high barrier layer and a heat sealing inner layer which are sequentially arranged from outside to inside, reversible weak bonding interface layers are arranged between the protective layer and the high-barrier layer and between the high-barrier layer and the heat-sealing inner layer; the reversible weak bonding interface layer has bonding force for bonding the layers in an initial state, and the bonding force of the reversible weak bonding interface layer is remarkably reduced or disappears under specific external stimulation, so that physical separation of the functional layers is realized. According to the recoverable composite membrane material, the reversible weak bonding interface layer is arranged between the layers, so that the unification of high-performance packaging and easy recoverability is realized; the material can be rapidly separated into a single material component under specific physical stimulation while meeting the requirements of dry food on barrier property, strength and heat sealability, and is compatible with an existing polyolefin recovery system; complicated chemical treatment is not needed in the separation process.

In a general aspect, a bonded interface in a vapor cell is formed using plasma- activated surfaces. In some aspects, manufacturing a vapor cell includes obtaining a dielectric body and an optical window. The dielectric body has a surface that defines an opening to a cavity in the dielectric body, and the cavity is configured to contain a vapor. The surface of the dielectric body and a surface of the optical window are contacted to form a seal around the opening to the cavity. The seal includes a metal oxynitride layer that is disposed along an interface between the surfaces of the dielectric body and the optical window. In certain cases, the seal is formed at a temperature no greater than 150 °C.

The copper / ceramic bonded body according to the present invention is a copper / ceramic bonded body obtained by bonding copper members consisting of copper or a copper alloy to a ceramic member, where at a bonded interface between the ceramic member and each of the copper members, the distance between the ceramic member and each of the copper members in an end portion of each of the copper members is in a range of 3 μm or more and 30 μm or less, and a void ratio in an end portion region (E) of each of the copper members is 10% or less.

A first switch port receives a first control packet, a header having a source media access control (MAC) address of a first MAC of a first interface of a sending device and a payload containing a second MAC of a second interface of the same sending device. The first and second interfaces form a bonded interface for failover purposes on the sending device. A second switch port receives a second control packet, a header having the second MAC as its source MAC and a payload containing the first MAC. The switch associates the first and second MAC addresses as related MAC addresses associated with the bonded interface. The switch facilitates failover between the secure interfaces via multiple uplinks while maintaining the port security on the switch by allowing transmission of data from either the first or second MAC address, associated as related MAC addresses, without triggering a port security violation.

The present invention belongs to the technical field of damage detection, in particular to a method and device for detecting damage to the bonded interface of a wind turbine blade and a storage medium. The method for detecting damage to the bonded interface of a wind turbine blade includes: S1. A pulsed excitation ultrasonic probe generates ultrasonic waves, and the ultrasonic waves act on the wind turbine blade; S2. The ultrasonic probe receives the echo signal of the wind turbine blade; S3. After filtering and amplifying the echo signal, the filtered and amplified echo signal is processed to obtain sub-harmonics; S4. Fourier transform is performed on the sub-harmonics, and imaging is performed on the transformed sub-harmonics; S5. The bonded interface damage is detected by using the imaging signal. The present invention has the advantages of fast detection speed, high reliability, and being unaffected by the nonlinear interference of experimental instruments, and is sensitive to minor damage and has little impact on testing equipment.

The invention discloses a packaging substrate lamination manufacturing method with a temperature detection function, and the method comprises the following steps: bonding a multi-layer ceramic substrate with a copper foil through a gradient brazing technology, embedding a temperature sensor in a ceramic insulating layer through a series of technologies, and completing the manufacturing of a lamination packaging substrate with the temperature detection function. The melting points of the adopted brazing filler metal are sequentially reduced, and the difference value of the melting points of the brazing filler metal used in two adjacent brazing processes is not smaller than 60 DEG C, so that the phenomenon that a bonded interface is remelted in the subsequent brazing process is avoided. The temperature sensor is only subjected to a high-temperature environment in the brazing process with the lowest melting point, the harsh requirement for the high-temperature resistance of the temperature sensor in the manufacturing process is remarkably lowered, it is ensured that in the subsequent bonding process, a bonding interface formed previously cannot be remelted through the design of the gradient melting point, and interface degradation caused by process cyclic heating is avoided.