35 results about "Bonded interface" patented technology

The invention relates to the technical field of composite material detection, in particular to a fiber-reinforced thermosetting thermoplastic composite structure interface quality detection method and system.The method comprises the steps that vibration excitation is applied to a target area of the surface of a to-be-detected sample, and the amplitude of the excitation is lower than the damage critical value of a weak bonding interface; a dynamic response signal perpendicular to the interface is collected in a vibration field non-diffusion area of the excitation point of the target area; performing frequency domain transformation on the dynamic response signal, and separating a fundamental frequency component and at least one high-order harmonic frequency component; according to the nonlinear enhancement effect of the high-order harmonic frequency component relative to the fundamental wave frequency component, whether the weak bonding defect exists in the target area or not is judged. According to the method, the technical bottleneck that the dynamic evolution process of the weak bonding defect of the composite material interface is difficult to capture in real time is effectively solved, sensitive response to the microdefect is realized through a nonlinear harmonic characteristic enhancement effect, and the recognition precision of traditional ultrasonic detection is improved.

The invention relates to a preparation, regulation and control method of a thermoplastic elastomer encapsulating material in the technical field of new materials, which comprises the following steps: realizing an in-situ reaction process by controlling the concentration and reaction temperature of reactive functional groups in the encapsulating material according to an interface reaction rate constant and active group distribution density; if the reaction conversion rate reaches a preset value, a chemically bonded interface bonding layer is formed; monitoring the stress distribution state in the rubber coating layer by adopting a stress analysis algorithm, and when detecting that local stress concentration exceeds the yield strength of the material, dispersing a stress concentration area by adjusting the length of a flexible chain segment and the density of a rigid cross-linking point in a cross-linking network; and deformation data and a bonding strength change trend of the interface bonding layer in the temperature cycling process are obtained, if the bonding strength attenuation rate exceeds a preset threshold value, a dynamic cross-linking mechanism is activated, and the dynamic equilibrium state of interface bonding is maintained through fracture and recombination of a reversible covalent bond.

This invention discloses a method for metal hot-press bonding and its application. The method specifically includes: providing a first substrate and a second substrate, the first substrate having a first metal bonding surface and the second substrate having a second metal bonding surface; aligning the first and second substrates to bring the first and second metal bonding surfaces into contact; and performing hot-press bonding by controlling temperature and applying pressure. The hot-press bonding includes a heating and high-pressure stage, a heat-holding and low-pressure stage, and a cooling and pressure-releasing stage; the temperature of the heat-holding and low-pressure stage is the bonding temperature. This invention achieves hot-press bonding of metals in an air environment through coordinated temperature and pressure control, resulting in a well-bonded interface that is free of oxidation, dense, and pore-free.

In a general aspect, gettering elements are disclosed for absorbing gas species from a cavity of a vapor cell. In certain aspects, a vapor cell includes a dielectric body having interior and exterior surfaces. The interior surface defines a cavity in the dielectric body, and the exterior surface defines an opening to the cavity. The dielectric body also includes a channel having a porous layer that is configured to absorb a gas species from the cavity. The vapor cell also includes a vapor or a source of vapor residing in the cavity as well as an optical window that covers the opening to the cavity. The optical window has a surface bonded to the exterior surface of the dielectric body to form a bonded interface of the vapor cell. The bonded interface includes a seal around the opening, and the vapor or the source of vapor includes alkali metal atoms.

The invention relates to the technical field of liquid silicone rubber, and particularly discloses a wear-resistant liquid silicone rubber composite material and a preparation method thereof. The composite material comprises a component A and a component B, wherein the component A comprises vinyl-terminated silicone oil, nano aluminum oxide double-modified by a polyhydroxy polymer and a vinyl silane coupling agent, and a platinum catalyst; the component B comprises vinyl-terminated silicone oil, hydrogen-containing silicone oil, an inhibitor and active polysilazane, the active polysilazane is modified polysilazane containing vinyl or epoxy group, and the active group of the active polysilazane can chemically react with the active group on the surface of the modified nano aluminum oxide to form a chemically bonded interface transition layer. According to the invention, through a dual modification strategy and introduction of active polysilazane, a chemically bonded rigid-flexible bicontinuous network structure is constructed, so that the wear resistance of the composite material is improved while excellent tensile strength, tear strength and elongation at break are maintained.

To efficiently manufacture a bonded substrate by ultrasonically inspecting the bonded state of the bonded substrate without deteriorating the bonded state. [Solution] A method for manufacturing a bonded substrate, comprising: a bonding step of bonding two substrates to form a bonded substrate; a sealing step of sealing the bonded interface exposed on the outer periphery of the bonded substrate from the atmosphere; and an inspection step of inspecting the bonded substrate. In the inspection step, ultrasonic inspection is carried out using an ultrasonic inspection unit having an ultrasonic sensor including an ultrasonic oscillator and an ultrasonic receiver, and a supply nozzle that supplies a medium that transmits ultrasonic waves between the ultrasonic sensor and the bonded substrate. In the ultrasonic inspection, the medium is supplied from the supply nozzle to the underside of the bonded substrate, and ultrasonic waves are sent from the ultrasonic oscillator to the bonded substrate via the medium supplied to the underside of the bonded substrate, and the ultrasonic waves returning from the bonded substrate are received by the ultrasonic receiver.

The application belongs to the field of material mechanical property experiment, and discloses a universal clamp for a testing machine for mixed adhesive interface testing, which comprises two clamp assemblies with the same structure, each clamp assembly comprising a clamp, upper and lower pins and symmetrically arranged gaskets; the clamp is connected with the testing machine through threads and locked by a nut; the main body of the clamp is provided with a pin through hole, the pin passes through the pin through hole on one side of the clamp, the pin hole on the gasket, the pin hole on the test piece, the pin hole on the gasket arranged on the other side, and the pin through hole on the other side of the clamp, and then the test piece is limited and installed; and the gasket and the test piece are locked by a bolt, and the positioning of the test piece is realized. The application can be installed on a universal tensile testing machine and an electric fatigue testing machine, and the designed upper and lower clamps, pins and gaskets can realize the mechanical testing of the mixed lap joint interface.

In a general aspect, gettering elements are disclosed for absorbing gas species from a cavity of a vapor cell. In certain aspects, a vapor cell includes a dielectric body having interior and exterior surfaces. The interior surface defines a cavity in the dielectric body, and the exterior surface defines an opening to the cavity. The dielectric body also includes a channel having a porous layer that is configured to absorb a gas species from the cavity. The vapor cell also includes a vapor or a source of vapor residing in the cavity as well as an optical window that covers the opening to the cavity. The optical window has a surface bonded to the exterior surface of the dielectric body to form a bonded interface of the vapor cell. The bonded interface includes a seal around the opening, and the vapor or the source of vapor includes alkali metal atoms.

This invention discloses a high-strength carbon fiber modified plastic and its preparation method. By weight, it comprises the following raw materials: 90-100 parts polypropylene, 8-12 parts modified carbon fiber, 3-5 parts maleic anhydride-grafted polypropylene, 2-4 parts toughening agent, 0.7-1.1 parts antioxidant, and 0.5-0.8 parts lubricant. This high-strength carbon fiber modified plastic achieves its goal by subjecting the carbon fiber surface to specific multi-step modification, sequentially introducing an aminosilane coupling layer, a gallic acid amide bond linking layer, and an itaconic acid active double bond functional layer. This forms an inside-out covalently bonded interface system, transforming the simple physical contact between the carbon fiber and the polypropylene matrix into a chemical bond. Furthermore, by combining maleic anhydride-grafted polypropylene as an interface compatibilizer and ethylene-octene copolymer as a toughening agent, the formulation design ensures both high strength and material toughness, resulting in a high-strength carbon fiber modified polypropylene composite material with balanced mechanical properties.

This invention discloses a wear-resistant self-lubricating resin for composite surface layer structures and its preparation method, belonging to the field of composite surface layer technology. It includes a matrix resin component A, a lubricating component B, a curing agent component C, and a coupling agent component D. Reactive functional groups are introduced onto the surface of solid lubricating particles through coupling agent component D. This invention uses a silane coupling agent to perform surface grafting modification on PTFE and MoS₂, introducing reactive functional groups onto the particle surface. These functional groups participate in the curing and crosslinking network of the epoxy resin, forming a "chemically bonded interface." This structure allows the lubricating particles to wear uniformly in the form of a "molecular brush" during friction, while deep lubricating particles are continuously exposed and replenished to the friction interface, achieving a long-term mechanism of lubrication reserve and continuous release. The low surface energy of PTFE fills the gaps in the transfer film, forming a "continuous, dense, low surface energy" composite lubricating film on the mating surface. This synergistic effect significantly reduces the coefficient of friction.

A hybrid bonded interface structure includes a primary conduction path constructed of a first material layer. A second material layer for stress-absorption and void reduction is arranged along a perimeter of the first material layer. A crack stop and diffusion barrier formed of a third material layer is arranged along a perimeter of the second material. A Young's modulus of the third material layer is greater than a Young's modulus of the second material layer and a Young's Modulus of the first material layer.

Capacitive couplings in a direct-bonded interface for microelectronic devices are provided. In an implementation, a microelectronic device includes a first die and a second die direct-bonded together at a bonding interface, a conductive interconnect between the first die and the second die formed at the bonding interface by a metal-to-metal direct bond, and a capacitive interconnect between the first die and the second die formed at the bonding interface. A direct bonding process creates a direct bond between dielectric surfaces of two dies, a direct bond between respective conductive interconnects of the two dies, and a capacitive coupling between the two dies at the bonding interface. In an implementation, a capacitive coupling of each signal line at the bonding interface comprises a dielectric material forming a capacitor at the bonding interface for each signal line. The capacitive couplings result from the same direct bonding process that creates the conductive interconnects direct-bonded together at the same bonding interface.

This invention discloses a flexible PPy@Ni-CAT composite film, its preparation method, and its applications. The method first involves depositing an Al2O3 nanolayer on the surface of a polyester fiber fabric using ALD (Al2O3 deposition), leveraging the self-limiting reaction properties to form a dense chemically bonded interface, enhancing interfacial adhesion and providing abundant nucleation sites. Secondly, lightweight polyester fiber is selected as the substrate, and in-situ growth technology is employed to maintain the material's lightweight and flexible properties. Finally, a Ni-CAT framework and an interpenetrating network of PPy are constructed: hydrothermal self-assembly forms the Ni-CAT conductive framework, followed by in-situ polymerization of pyrrole initiated by FeCl3. The π-π conjugated backbone of PPy interacts with Ni-CAT to create a continuous conductive pathway. Combined with charge optimization of the Al2O3 layer, the conductivity of the composite film is significantly improved, achieving a balance between lightweight, high adhesion, and high conductivity.

The invention discloses a diamond coating composite material, a copper composite material and a preparation method thereof. Belongs to the technical field of diamond composite materials. The preparation method of the diamond coating composite material comprises the following steps: depositing an amorphous carbon film on the surface of cleaned diamond particles and carrying out first heat treatment to obtain amorphous carbon coated diamond, plating a metal layer on the surface of the amorphous carbon coated diamond and carrying out second heat treatment to obtain coated diamond, and carrying out third heat treatment on the coated diamond to obtain the diamond coating composite material. And the diamond coating composite material is obtained. According to the preparation method, damage to the diamond body can be remarkably reduced, a uniform and active surface is provided for metallization treatment of the diamond body, and the diamond-copper composite material which is tight and uniform in interface bonding and excellent in comprehensive performance is obtained.

A method for forming a direct hybrid bond and a device resulting from a direct hybrid bond including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, capped by a conductive barrier, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads capped by a second conductive barrier, aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads capped by conductive barriers formed by contact bonding of the first non-metallic region to the second non-metallic region.

This invention relates to the field of polymer materials technology, specifically to a weather-resistant rubber material for sealing strips and its preparation method: It is made from the following raw materials in parts by weight: 60-80 parts rubber matrix, 5-10 parts silica, 20-40 parts composite weather-resistant filler, 1-3 parts dioxane, 0.5-1.5 parts triallyl isocyanurate, 5-10 parts paraffin oil, 1-2 parts phenolic antioxidant, and 0.5-1.5 parts lubricant. In this invention, the modified filler uses cerium-doped zirconium phosphate as the core component. The variable valence of cerium ions continuously captures and passivates the active free radicals generated during the thermo-oxidative aging of rubber. Simultaneously, the layered structure of zirconium phosphate forms a physical barrier against oxygen and ozone. The modified filler inhibits the oxidation chain reaction at its source, while the chemically bonded interface prevents filler detachment during aging, thus preventing protective failure and maintaining material stability in long-term thermo-oxidative and ozone environments.

This copper / ceramic assembly includes: a copper member consisting of copper or a copper alloy; and a ceramic member consisting of silicon nitride, wherein the copper member and the ceramic member are bonded. At a bonded interface between the ceramic member and the copper member, an active metal nitride layer is formed on a side of the ceramic member. In a region extending by 10 μm from the active metal nitride layer toward a side of the copper member, an area rate of an active metal compound containing Si and an active metal is 10% or less. A ratio PA / PB of an area rate PA of the active metal compound in a peripheral part region of the copper member to an area rate PB of the active metal compound in a central part region of the copper member is in a range of 0.7 or more and 1.4 or less.

The invention discloses a recoverable composite film material and application thereof in dry food packaging, the recoverable composite film material comprises a protective layer, a high barrier layer and a heat sealing inner layer which are sequentially arranged from outside to inside, reversible weak bonding interface layers are arranged between the protective layer and the high-barrier layer and between the high-barrier layer and the heat-sealing inner layer; the reversible weak bonding interface layer has bonding force for bonding the layers in an initial state, and the bonding force of the reversible weak bonding interface layer is remarkably reduced or disappears under specific external stimulation, so that physical separation of the functional layers is realized. According to the recoverable composite membrane material, the reversible weak bonding interface layer is arranged between the layers, so that the unification of high-performance packaging and easy recoverability is realized; the material can be rapidly separated into a single material component under specific physical stimulation while meeting the requirements of dry food on barrier property, strength and heat sealability, and is compatible with an existing polyolefin recovery system; complicated chemical treatment is not needed in the separation process.

In a general aspect, a bonded interface in a vapor cell is formed using plasma- activated surfaces. In some aspects, manufacturing a vapor cell includes obtaining a dielectric body and an optical window. The dielectric body has a surface that defines an opening to a cavity in the dielectric body, and the cavity is configured to contain a vapor. The surface of the dielectric body and a surface of the optical window are contacted to form a seal around the opening to the cavity. The seal includes a metal oxynitride layer that is disposed along an interface between the surfaces of the dielectric body and the optical window. In certain cases, the seal is formed at a temperature no greater than 150 °C.

The copper / ceramic bonded body according to the present invention is a copper / ceramic bonded body obtained by bonding copper members consisting of copper or a copper alloy to a ceramic member, where at a bonded interface between the ceramic member and each of the copper members, the distance between the ceramic member and each of the copper members in an end portion of each of the copper members is in a range of 3 μm or more and 30 μm or less, and a void ratio in an end portion region (E) of each of the copper members is 10% or less.

A first switch port receives a first control packet, a header having a source media access control (MAC) address of a first MAC of a first interface of a sending device and a payload containing a second MAC of a second interface of the same sending device. The first and second interfaces form a bonded interface for failover purposes on the sending device. A second switch port receives a second control packet, a header having the second MAC as its source MAC and a payload containing the first MAC. The switch associates the first and second MAC addresses as related MAC addresses associated with the bonded interface. The switch facilitates failover between the secure interfaces via multiple uplinks while maintaining the port security on the switch by allowing transmission of data from either the first or second MAC address, associated as related MAC addresses, without triggering a port security violation.

The invention discloses a packaging substrate lamination manufacturing method with a temperature detection function, and the method comprises the following steps: bonding a multi-layer ceramic substrate with a copper foil through a gradient brazing technology, embedding a temperature sensor in a ceramic insulating layer through a series of technologies, and completing the manufacturing of a lamination packaging substrate with the temperature detection function. The melting points of the adopted brazing filler metal are sequentially reduced, and the difference value of the melting points of the brazing filler metal used in two adjacent brazing processes is not smaller than 60 DEG C, so that the phenomenon that a bonded interface is remelted in the subsequent brazing process is avoided. The temperature sensor is only subjected to a high-temperature environment in the brazing process with the lowest melting point, the harsh requirement for the high-temperature resistance of the temperature sensor in the manufacturing process is remarkably lowered, it is ensured that in the subsequent bonding process, a bonding interface formed previously cannot be remelted through the design of the gradient melting point, and interface degradation caused by process cyclic heating is avoided.

This invention relates to a weather-resistant and anti-aging protective layer for offshore wind power facilities and its preparation method, belonging to the field of anti-corrosion coating technology. The preparation method includes: preparing a latent reactive conductive primer slurry; applying the latent reactive conductive primer slurry to a substrate surface and allowing it to semi-cure, followed by electrophoretic penetration treatment to obtain an electrophoretic latent reactive conductive primer layer; subjecting the electrophoretic latent reactive conductive primer layer to thermal curing treatment to obtain a cured primer layer; and applying a topcoat to the cured primer layer and curing it to obtain a weather-resistant and anti-aging protective layer. This invention improves the interfacial bonding strength and wet adhesion of the coating system by constructing a chemically bonded interface instead of a traditional physical interface; and effectively fills coating defects through electrophoretic penetration, improving the long-term protective performance of the coating under damaged conditions.

Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint, which have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy has an alloy composition consisting of, by mass %, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.005 to 0.090% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.006≤(Ag+Cu+Ni)×Ge<0.023 (1), (Sn / Cu)×(Ni×Ge) / (Ni+Ge)<0.89 (2). Ag, Cu, Ni, Ge, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

This invention discloses an MPCVD growth method for peelable polycrystalline diamond with a weakly bonded interface structure, belonging to the field of diamond material preparation technology. By constructing a slow-release interface layer, low-temperature high-methane concentration nucleation, and high-temperature low-methane gradient growth, a diamond film thickness of 100-1000 µm can be achieved. By controlling the cooling stress through a mechanical model and supplementing it with laser cutting or thermal pulse induction, the diamond film can be automatically peeled from the silicon substrate with a peel surface roughness ≤1 nm, requiring no polishing. This process eliminates the need for chemical etching of the silicon wafer, is simple, environmentally friendly, and produces a self-supporting thick diamond film with high thermal conductivity and high surface quality, suitable for applications such as chip heat dissipation, optical windows, and quantum devices.

In a general aspect, a bonded interface in a vapor cell is formed using plasma-activated surfaces. In some aspects, manufacturing a vapor cell includes obtaining a dielectric body and an optical window. The dielectric body has a surface that defines an opening to a cavity in the dielectric body, and the cavity is configured to contain a vapor. The surface of the dielectric body and a surface of the optical window are contacted to form a seal around the opening to the cavity. The seal includes a metal oxynitride layer that is disposed along an interface between the surfaces of the dielectric body and the optical window. In certain cases, the seal is formed at a temperature no greater than 150° C.

The present invention relates to a bonding sheet, a bonded assembly, and preparation methods therefor. The bonding sheet comprises: a copper substrate having opposing first and second surfaces; and at least one nano-metal layer deposited on at least one of the first and second surfaces of the copper substrate, the yield strength of the bonding sheet is not greater than 100 MPa. The bonded assembly comprises: a first substrate; a second substrate; and a bonding portion located between the first substrate and the second substrate to connect the two, the bonding portion comprises a copper substrate, a first bonded interface on a first side of the copper substrate, and a second bonded interface on a second side of the copper substrate opposite to the first side, the first bonded interface and the second bonded interface are formed by bonding nano-metal on opposite sides of the copper substrate to the first substrate and the second substrate, respectively; and the shear strength of the bonded assembly is not less than 40 MPa.

The application discloses a kind of wear-resistant thermal shock resistance alumina honeycomb ceramic and its preparation method, the alumina honeycomb ceramic of the application includes: dense sintered alumina matrix;Electric melting corundum aggregate uniformly dispersed in matrix, and surface is pretreated to form weakly bonded interface;Spherical alumina aggregate uniformly dispersed in matrix, to form another weakly bonded interface with its inert surface;And uniformly dispersed spherical closed pores formed by pore-forming agent.Its dense matrix guarantees excellent wear resistance, and weakly bonded interface cooperates with spherical closed pores, by inducing controllable microcracks to release stress when thermal shock, thereby significantly improving thermal shock resistance.Its preparation method includes surface modification of electric melting corundum, mixing with spherical alumina, alumina powder and pore-forming agent, extrusion molding, drying, and high-temperature sintering at 1500-1680 DEG C.The honeycomb ceramic prepared by the application has excellent comprehensive performance, and service life is greatly improved.

A copper-ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of silicon nitride, the copper member and the ceramic member being bonded to each other, in which a maximum length of a Mg—N compound phase which is present at a bonded interface between the copper member and the ceramic member is less than 100 nm, and in a unit length along the bonded interface, the number density of the Mg—N compound phase in a range of a length of 10 nm or more and less than 100 nm is less than 8 pieces / μm.

The invention discloses a nanosecond laser-sand blasting composite pretreatment method for repairing a thermal spraying local coating, and belongs to the technical field of surface engineering and remanufacturing. According to the method, high-precision selective removal of a local damaged coating is realized by introducing nanosecond pulse laser, and a geometric transition boundary morphology beneficial to gentle release of stress is constructed; and then impurity removal and roughening treatment are carried out on the surface subjected to the laser action with the assistance of a sand blasting process, so that the repaired matrix obtains ideal macroscopic structure transition, a microscopic rough structure and high surface cleanliness. According to the method, a laser morphology precise regulation and control technology is combined with a sand blasting surface strengthening mechanism, so that the size precision and the position controllability in the coating removing process are greatly improved, the industrial problem that'coating edge connection 'and'interface combination' are difficult to consider by a single process is effectively solved from the two dimensions of structure and interface physical characteristics, and the method is suitable for industrial production. And finally, a firm and stable mechanical embedding interface can be formed in the local repairing area in the subsequent thermal spraying process.