This invention relates to the field of
microwave absorbing materials, specifically disclosing a high-entropy
alloy FeCoNiCuW
microwave absorbing material and its preparation method. This invention uses different porous materials as conductive substrates, and through the synergistic reduction and in-situ
assembly of multiple
metal ions (Fe, Co, Ni, Cu, W) during electrodeposition, forms a tightly
bonded interface between the
alloy layer with a high-entropy structure and the substrate. The resulting
composite material combines the magnetic loss of the high-entropy
alloy with the conductive network advantages of the substrate, effectively improving
impedance matching and interface polarization capabilities, thereby achieving wide-bandwidth, high-efficiency, and stable
electromagnetic wave absorption performance. This invention achieves in-situ bonding of the high-entropy alloy and the substrate through a low-temperature electrodeposition method. The preparation process can be completed at
ambient pressure and low temperature, is simple to operate, and has good
repeatability. This invention not only simplifies the preparation process and improves the
bonding strength, but also provides a new technical path for the design and
engineering application of high-performance electromagnetic protection materials.