24 results about "Bonded interface" patented technology

This invention discloses a method for metal hot-press bonding and its application. The method specifically includes: providing a first substrate and a second substrate, the first substrate having a first metal bonding surface and the second substrate having a second metal bonding surface; aligning the first and second substrates to bring the first and second metal bonding surfaces into contact; and performing hot-press bonding by controlling temperature and applying pressure. The hot-press bonding includes a heating and high-pressure stage, a heat-holding and low-pressure stage, and a cooling and pressure-releasing stage; the temperature of the heat-holding and low-pressure stage is the bonding temperature. This invention achieves hot-press bonding of metals in an air environment through coordinated temperature and pressure control, resulting in a well-bonded interface that is free of oxidation, dense, and pore-free.

In a general aspect, gettering elements are disclosed for absorbing gas species from a cavity of a vapor cell. In certain aspects, a vapor cell includes a dielectric body having interior and exterior surfaces. The interior surface defines a cavity in the dielectric body, and the exterior surface defines an opening to the cavity. The dielectric body also includes a channel having a porous layer that is configured to absorb a gas species from the cavity. The vapor cell also includes a vapor or a source of vapor residing in the cavity as well as an optical window that covers the opening to the cavity. The optical window has a surface bonded to the exterior surface of the dielectric body to form a bonded interface of the vapor cell. The bonded interface includes a seal around the opening, and the vapor or the source of vapor includes alkali metal atoms.

The invention relates to the technical field of liquid silicone rubber, and particularly discloses a wear-resistant liquid silicone rubber composite material and a preparation method thereof. The composite material comprises a component A and a component B, wherein the component A comprises vinyl-terminated silicone oil, nano aluminum oxide double-modified by a polyhydroxy polymer and a vinyl silane coupling agent, and a platinum catalyst; the component B comprises vinyl-terminated silicone oil, hydrogen-containing silicone oil, an inhibitor and active polysilazane, the active polysilazane is modified polysilazane containing vinyl or epoxy group, and the active group of the active polysilazane can chemically react with the active group on the surface of the modified nano aluminum oxide to form a chemically bonded interface transition layer. According to the invention, through a dual modification strategy and introduction of active polysilazane, a chemically bonded rigid-flexible bicontinuous network structure is constructed, so that the wear resistance of the composite material is improved while excellent tensile strength, tear strength and elongation at break are maintained.

To efficiently manufacture a bonded substrate by ultrasonically inspecting the bonded state of the bonded substrate without deteriorating the bonded state. [Solution] A method for manufacturing a bonded substrate, comprising: a bonding step of bonding two substrates to form a bonded substrate; a sealing step of sealing the bonded interface exposed on the outer periphery of the bonded substrate from the atmosphere; and an inspection step of inspecting the bonded substrate. In the inspection step, ultrasonic inspection is carried out using an ultrasonic inspection unit having an ultrasonic sensor including an ultrasonic oscillator and an ultrasonic receiver, and a supply nozzle that supplies a medium that transmits ultrasonic waves between the ultrasonic sensor and the bonded substrate. In the ultrasonic inspection, the medium is supplied from the supply nozzle to the underside of the bonded substrate, and ultrasonic waves are sent from the ultrasonic oscillator to the bonded substrate via the medium supplied to the underside of the bonded substrate, and the ultrasonic waves returning from the bonded substrate are received by the ultrasonic receiver.

The application belongs to the field of material mechanical property experiment, and discloses a universal clamp for a testing machine for mixed adhesive interface testing, which comprises two clamp assemblies with the same structure, each clamp assembly comprising a clamp, upper and lower pins and symmetrically arranged gaskets; the clamp is connected with the testing machine through threads and locked by a nut; the main body of the clamp is provided with a pin through hole, the pin passes through the pin through hole on one side of the clamp, the pin hole on the gasket, the pin hole on the test piece, the pin hole on the gasket arranged on the other side, and the pin through hole on the other side of the clamp, and then the test piece is limited and installed; and the gasket and the test piece are locked by a bolt, and the positioning of the test piece is realized. The application can be installed on a universal tensile testing machine and an electric fatigue testing machine, and the designed upper and lower clamps, pins and gaskets can realize the mechanical testing of the mixed lap joint interface.

In a general aspect, gettering elements are disclosed for absorbing gas species from a cavity of a vapor cell. In certain aspects, a vapor cell includes a dielectric body having interior and exterior surfaces. The interior surface defines a cavity in the dielectric body, and the exterior surface defines an opening to the cavity. The dielectric body also includes a channel having a porous layer that is configured to absorb a gas species from the cavity. The vapor cell also includes a vapor or a source of vapor residing in the cavity as well as an optical window that covers the opening to the cavity. The optical window has a surface bonded to the exterior surface of the dielectric body to form a bonded interface of the vapor cell. The bonded interface includes a seal around the opening, and the vapor or the source of vapor includes alkali metal atoms.

This invention discloses a high-strength carbon fiber modified plastic and its preparation method. By weight, it comprises the following raw materials: 90-100 parts polypropylene, 8-12 parts modified carbon fiber, 3-5 parts maleic anhydride-grafted polypropylene, 2-4 parts toughening agent, 0.7-1.1 parts antioxidant, and 0.5-0.8 parts lubricant. This high-strength carbon fiber modified plastic achieves its goal by subjecting the carbon fiber surface to specific multi-step modification, sequentially introducing an aminosilane coupling layer, a gallic acid amide bond linking layer, and an itaconic acid active double bond functional layer. This forms an inside-out covalently bonded interface system, transforming the simple physical contact between the carbon fiber and the polypropylene matrix into a chemical bond. Furthermore, by combining maleic anhydride-grafted polypropylene as an interface compatibilizer and ethylene-octene copolymer as a toughening agent, the formulation design ensures both high strength and material toughness, resulting in a high-strength carbon fiber modified polypropylene composite material with balanced mechanical properties.

This invention discloses a wear-resistant self-lubricating resin for composite surface layer structures and its preparation method, belonging to the field of composite surface layer technology. It includes a matrix resin component A, a lubricating component B, a curing agent component C, and a coupling agent component D. Reactive functional groups are introduced onto the surface of solid lubricating particles through coupling agent component D. This invention uses a silane coupling agent to perform surface grafting modification on PTFE and MoS₂, introducing reactive functional groups onto the particle surface. These functional groups participate in the curing and crosslinking network of the epoxy resin, forming a "chemically bonded interface." This structure allows the lubricating particles to wear uniformly in the form of a "molecular brush" during friction, while deep lubricating particles are continuously exposed and replenished to the friction interface, achieving a long-term mechanism of lubrication reserve and continuous release. The low surface energy of PTFE fills the gaps in the transfer film, forming a "continuous, dense, low surface energy" composite lubricating film on the mating surface. This synergistic effect significantly reduces the coefficient of friction.

A method for forming a direct hybrid bond and a device resulting from a direct hybrid bond including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, capped by a conductive barrier, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads capped by a second conductive barrier, aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads capped by conductive barriers formed by contact bonding of the first non-metallic region to the second non-metallic region.

This invention relates to the field of polymer materials technology, specifically to a weather-resistant rubber material for sealing strips and its preparation method: It is made from the following raw materials in parts by weight: 60-80 parts rubber matrix, 5-10 parts silica, 20-40 parts composite weather-resistant filler, 1-3 parts dioxane, 0.5-1.5 parts triallyl isocyanurate, 5-10 parts paraffin oil, 1-2 parts phenolic antioxidant, and 0.5-1.5 parts lubricant. In this invention, the modified filler uses cerium-doped zirconium phosphate as the core component. The variable valence of cerium ions continuously captures and passivates the active free radicals generated during the thermo-oxidative aging of rubber. Simultaneously, the layered structure of zirconium phosphate forms a physical barrier against oxygen and ozone. The modified filler inhibits the oxidation chain reaction at its source, while the chemically bonded interface prevents filler detachment during aging, thus preventing protective failure and maintaining material stability in long-term thermo-oxidative and ozone environments.

This copper / ceramic assembly includes: a copper member consisting of copper or a copper alloy; and a ceramic member consisting of silicon nitride, wherein the copper member and the ceramic member are bonded. At a bonded interface between the ceramic member and the copper member, an active metal nitride layer is formed on a side of the ceramic member. In a region extending by 10 μm from the active metal nitride layer toward a side of the copper member, an area rate of an active metal compound containing Si and an active metal is 10% or less. A ratio PA / PB of an area rate PA of the active metal compound in a peripheral part region of the copper member to an area rate PB of the active metal compound in a central part region of the copper member is in a range of 0.7 or more and 1.4 or less.

The invention discloses a recoverable composite film material and application thereof in dry food packaging, the recoverable composite film material comprises a protective layer, a high barrier layer and a heat sealing inner layer which are sequentially arranged from outside to inside, reversible weak bonding interface layers are arranged between the protective layer and the high-barrier layer and between the high-barrier layer and the heat-sealing inner layer; the reversible weak bonding interface layer has bonding force for bonding the layers in an initial state, and the bonding force of the reversible weak bonding interface layer is remarkably reduced or disappears under specific external stimulation, so that physical separation of the functional layers is realized. According to the recoverable composite membrane material, the reversible weak bonding interface layer is arranged between the layers, so that the unification of high-performance packaging and easy recoverability is realized; the material can be rapidly separated into a single material component under specific physical stimulation while meeting the requirements of dry food on barrier property, strength and heat sealability, and is compatible with an existing polyolefin recovery system; complicated chemical treatment is not needed in the separation process.

In a general aspect, a bonded interface in a vapor cell is formed using plasma- activated surfaces. In some aspects, manufacturing a vapor cell includes obtaining a dielectric body and an optical window. The dielectric body has a surface that defines an opening to a cavity in the dielectric body, and the cavity is configured to contain a vapor. The surface of the dielectric body and a surface of the optical window are contacted to form a seal around the opening to the cavity. The seal includes a metal oxynitride layer that is disposed along an interface between the surfaces of the dielectric body and the optical window. In certain cases, the seal is formed at a temperature no greater than 150 °C.

The copper / ceramic bonded body according to the present invention is a copper / ceramic bonded body obtained by bonding copper members consisting of copper or a copper alloy to a ceramic member, where at a bonded interface between the ceramic member and each of the copper members, the distance between the ceramic member and each of the copper members in an end portion of each of the copper members is in a range of 3 μm or more and 30 μm or less, and a void ratio in an end portion region (E) of each of the copper members is 10% or less.

This invention relates to a weather-resistant and anti-aging protective layer for offshore wind power facilities and its preparation method, belonging to the field of anti-corrosion coating technology. The preparation method includes: preparing a latent reactive conductive primer slurry; applying the latent reactive conductive primer slurry to a substrate surface and allowing it to semi-cure, followed by electrophoretic penetration treatment to obtain an electrophoretic latent reactive conductive primer layer; subjecting the electrophoretic latent reactive conductive primer layer to thermal curing treatment to obtain a cured primer layer; and applying a topcoat to the cured primer layer and curing it to obtain a weather-resistant and anti-aging protective layer. This invention improves the interfacial bonding strength and wet adhesion of the coating system by constructing a chemically bonded interface instead of a traditional physical interface; and effectively fills coating defects through electrophoretic penetration, improving the long-term protective performance of the coating under damaged conditions.

Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint, which have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy has an alloy composition consisting of, by mass %, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.005 to 0.090% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.006≤(Ag+Cu+Ni)×Ge<0.023 (1), (Sn / Cu)×(Ni×Ge) / (Ni+Ge)<0.89 (2). Ag, Cu, Ni, Ge, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

This invention discloses an MPCVD growth method for peelable polycrystalline diamond with a weakly bonded interface structure, belonging to the field of diamond material preparation technology. By constructing a slow-release interface layer, low-temperature high-methane concentration nucleation, and high-temperature low-methane gradient growth, a diamond film thickness of 100-1000 µm can be achieved. By controlling the cooling stress through a mechanical model and supplementing it with laser cutting or thermal pulse induction, the diamond film can be automatically peeled from the silicon substrate with a peel surface roughness ≤1 nm, requiring no polishing. This process eliminates the need for chemical etching of the silicon wafer, is simple, environmentally friendly, and produces a self-supporting thick diamond film with high thermal conductivity and high surface quality, suitable for applications such as chip heat dissipation, optical windows, and quantum devices.

In a general aspect, a bonded interface in a vapor cell is formed using plasma-activated surfaces. In some aspects, manufacturing a vapor cell includes obtaining a dielectric body and an optical window. The dielectric body has a surface that defines an opening to a cavity in the dielectric body, and the cavity is configured to contain a vapor. The surface of the dielectric body and a surface of the optical window are contacted to form a seal around the opening to the cavity. The seal includes a metal oxynitride layer that is disposed along an interface between the surfaces of the dielectric body and the optical window. In certain cases, the seal is formed at a temperature no greater than 150° C.

The application discloses a kind of wear-resistant thermal shock resistance alumina honeycomb ceramic and its preparation method, the alumina honeycomb ceramic of the application includes: dense sintered alumina matrix;Electric melting corundum aggregate uniformly dispersed in matrix, and surface is pretreated to form weakly bonded interface;Spherical alumina aggregate uniformly dispersed in matrix, to form another weakly bonded interface with its inert surface;And uniformly dispersed spherical closed pores formed by pore-forming agent.Its dense matrix guarantees excellent wear resistance, and weakly bonded interface cooperates with spherical closed pores, by inducing controllable microcracks to release stress when thermal shock, thereby significantly improving thermal shock resistance.Its preparation method includes surface modification of electric melting corundum, mixing with spherical alumina, alumina powder and pore-forming agent, extrusion molding, drying, and high-temperature sintering at 1500-1680 DEG C.The honeycomb ceramic prepared by the application has excellent comprehensive performance, and service life is greatly improved.

The invention discloses a nanosecond laser-sand blasting composite pretreatment method for repairing a thermal spraying local coating, and belongs to the technical field of surface engineering and remanufacturing. According to the method, high-precision selective removal of a local damaged coating is realized by introducing nanosecond pulse laser, and a geometric transition boundary morphology beneficial to gentle release of stress is constructed; and then impurity removal and roughening treatment are carried out on the surface subjected to the laser action with the assistance of a sand blasting process, so that the repaired matrix obtains ideal macroscopic structure transition, a microscopic rough structure and high surface cleanliness. According to the method, a laser morphology precise regulation and control technology is combined with a sand blasting surface strengthening mechanism, so that the size precision and the position controllability in the coating removing process are greatly improved, the industrial problem that'coating edge connection 'and'interface combination' are difficult to consider by a single process is effectively solved from the two dimensions of structure and interface physical characteristics, and the method is suitable for industrial production. And finally, a firm and stable mechanical embedding interface can be formed in the local repairing area in the subsequent thermal spraying process.

This disclosure provides a method for controlling the interfacial microstructure and properties of TiAl / Ti2AlNb alloy diffusion-bonded joints, comprising: subjecting the TiAl / Ti2AlNb alloy diffusion-bonded joints to electro-pulse treatment and thermomechanical treatment respectively; wherein the electro-pulse parameters are: pulse voltage of 30~50V, pulse frequency of 120~180Hz, and pulse time of 10~30s; the thermomechanical treatment parameters are: deformation temperature of 1050℃~1150℃, holding time of 20~40min, and deformation controlled below 15%, wherein the deformation direction during the thermomechanical treatment is parallel to the alloy diffusion-bonded interface. This invention employs an integrated technology of post-weld electro-pulse and thermomechanical coupling treatment, which can eliminate the defect of equal brittleness at the interface of the TiAl / Ti2AlNb alloy joint, while simultaneously allowing for more complete microstructure evolution, a more uniform and finer diffusion layer microstructure, and ultimately resulting in better strength and toughness at the TiAl / Ti2AlNb alloy joint, yielding a bi-alloy material with excellent comprehensive mechanical properties.

This copper / ceramic assembly includes: a copper member consisting of copper or a copper alloy; and a ceramic member, wherein the copper member and the ceramic member are bonded to each other. At a bonded interface between the ceramic member and the copper member, an active metal compound layer is formed on a side of the ceramic member. In a region extending by 10 μm from the active metal compound layer toward a side of the copper member, an area rate of an active metal carbide is 8% or less.

This invention relates to the field of microwave absorbing materials, specifically disclosing a high-entropy alloy FeCoNiCuW microwave absorbing material and its preparation method. This invention uses different porous materials as conductive substrates, and through the synergistic reduction and in-situ assembly of multiple metal ions (Fe, Co, Ni, Cu, W) during electrodeposition, forms a tightly bonded interface between the alloy layer with a high-entropy structure and the substrate. The resulting composite material combines the magnetic loss of the high-entropy alloy with the conductive network advantages of the substrate, effectively improving impedance matching and interface polarization capabilities, thereby achieving wide-bandwidth, high-efficiency, and stable electromagnetic wave absorption performance. This invention achieves in-situ bonding of the high-entropy alloy and the substrate through a low-temperature electrodeposition method. The preparation process can be completed at ambient pressure and low temperature, is simple to operate, and has good repeatability. This invention not only simplifies the preparation process and improves the bonding strength, but also provides a new technical path for the design and engineering application of high-performance electromagnetic protection materials.

The invention relates to a preparation method of a metal coating with a layering defect, belongs to the technical field of nondestructive testing, and solves the problems that the defect position is limited, a thin coating is easy to damage and the parameter control precision is poor in the existing insertion piece pulling method. Comprising the following steps: determining target geometric parameters of a preset defect; pulse laser is adopted to etch a blind hole type groove matched with the metal matrix in the designated position of the metal matrix, and the depth precision is controlled; preparing a solid filling material sheet matched with the groove and placing the solid filling material sheet; the surface is subjected to flattening treatment, so that the filling piece and the surface of the base body are coplanar, and a to-be-sprayed composite surface is formed; depositing a metal coating on the surface by adopting a thermal spraying process; and finally, curing treatment is conducted, and the metal coating part with the preset layering defect is obtained. Wherein the selected filling material sheet can form a weak bonding interface or a non-bonding interface with the metal coating and the substrate under the thermal spraying condition. The controllable layering defect suitable for the thin coating is prepared at any position (including the center) of the base body in a high-precision mode.