3768results about How to "Fast heat conduction" patented technology

Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink to provide increased cooling for electronic equipment, such as power converters. In one embodiment, a heatsink includes at least one fluid cooled portion and at least one heat pipe disposed adjacent to the fluid cooled portion. The heat pipe improves the conduction of heat away from heat sources.

An apparatus and method for a low voltage drop and thermally enhanced integrated circuit (IC) package are described. A substantially planar substrate having a plurality of contact pads on a first surface is electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate. An IC die having a first surface is mounted to the first surface of the substrate. The IC die has a plurality of I / O pads electrically connected to the plurality of contact pads on the first surface of the substrate. A heat sink assembly is coupled to a second surface of the IC die and to a first contact pad on the first surface of the substrate to provide a thermal path from the IC die to the first surface of the substrate. The heat sink assembly can also provide an electrical path from the IC die to the first surface of the substrate. The heat sink assembly may have one or two heat sink elements to provide thermal and / or electrical connectivity between the IC die and the substrate.

An apparatus and method for a low voltage drop and thermally enhanced integrated circuit (IC) package are described. A substantially planar substrate having a plurality of contact pads on a first surface is electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate. An IC die having a first surface is mounted to the first surface of the substrate. The IC die has a plurality of I / O pads electrically connected to the plurality of contact pads on the first surface of the substrate. A heat sink assembly is coupled to a second surface of the IC die and to a first contact pad on the first surface of the substrate to provide a thermal path from the IC die to the first surface of the substrate. The heat sink assembly can also provide an electrical path from the IC die to the first surface of the substrate. The heat sink assembly may have one or two heat sink elements to provide thermal and / or electrical connectivity between the IC die and the substrate.

Devices for generating and releasing vapor comprising a mouthpiece for providing vapor for inhalation to a user including a tubular casing containing a heater for heating a vaporizable substance at a substantially constant low temperature having means for visual indication of the operation of the device.

In an assembling structure for LED road lamp and heat dissipating module, the LED road lamp includes a partition board, an upper casing, a light transmitting lens and an LED lamp set. The upper casing and the light transmitting lens are set separately on upper and lower sides of the partition board. Each LED lamp set is contained in a space enclosed by the partition board and the light transmitting lens. The partition board has a plurality of through holes, and the LED lamp set includes a frame body and an LED module. The heat dissipating module includes a heat dissipating body, a heat pipe and an isothermal board. The heat dissipating body is set in a space enclosed by the partition board and the upper casing, and the heat pipe has a heat discharging end passing through and connecting the partition board and the heat dissipating body and a heat receiving end forming the bottom of the partition board. The isothermal board is fixed onto a frame body of the LED lamp and has two planes separately attached onto the heat receiving end and the LED module, so as to significantly enhance the overall heat conducting and dissipating performance, drive an LED to emit light at a lower temperature, and extend the life expectancy of the LED.

Disclosed is an electroconductive fiber comprising synthetic fibers and an electroconductive layer covering the surface of the synthetic fibers and containing carbon nanotubes. Not less than 60% (particularly not less than 90%) of the total surface of the synthetic fibers is covered with the electroconductive layer, and the electric resistance of the electroconductive fiber is in the range of 1*10<-2> to 1*10<10> Omega / cm, and the standard deviation of the logarithm of the electric resistance is less than 1.0. The thickness of the electroconductive layer is in the range of 0.1 to 5 micrometers, and the amount of the carbon nanotubes may be 0.1 to 50 parts by mass based on 100 parts by mass of the synthetic fiber. The electroconductive fiber may contain a binder. The electroconductive fiber may be produced by immersing the synthetic fibers in a dispersion while applying vibration to the synthetic fibers to deposit an electroconductive layer on the surface of the synthetic fibers. In the electroconductive fiber, the carbon nanotubes are deposited evenly and strongly onto substantially the whole area of the surface of the fibers, and, thus, the electroconductive fiber is electroconductive and flexible.

Disclosed is a quick ice-making control method of an ice-maker for a refrigerator, in which an ejector for extracting obtained ice stirs supplied water to be frozen so as to promote thermal transmission of the water. The quick ice-making control method includes the steps of (a) supplying water into an ice-maker mold, (b) quickly freezing the water by rotating an ejector for a predetermined time after the step (a), and (c) separating the obtained ice from the ice-maker mold in case that a temperature of the ice-maker mold is lower than a predetermined temperature after the step (b).