135results about How to "Improve bonding efficiency" patented technology

The invention provides a chip bonding device and method. The chip bonding device comprises a bonding head used for adsorbing a chip to be bonded and adjusting the pose of the chip; the infrared vision system is used for penetrating through the chip so as to acquire images of the first mark on the back surface of the chip and the second mark at the target bonding position of the chip; and a controller configured to: acquire, via the infrared vision system, an image with the first marker and the second marker; analyzing the image to determine the poses of the first mark and the second mark in the image; adjusting the pose of the bonding head according to the pose difference of the first mark and the second mark in the image, so that the chip is aligned with the target bonding position; and bonding the chip to the target bonding position through the bonding head. According to the invention, extra errors caused by using a calibration sheet as an intermediate medium in the bonding process can be avoided, the bonding precision is improved, and the bonding process is simplified, so that the bonding efficiency is improved, and the productivity of equipment is improved.

The utility model discloses TPU (thermoplastic polyurethane) composite fabric composite processing equipment which comprises a first mounting frame, a guide rod is slidably connected to the middle of the first mounting frame, a limiting plate is fixedly connected to the top end of the guide rod, and a gluing assembly is fixedly connected to the bottom end of the guide rod; and the gluing assembly comprises a gluing box, the front face of the gluing box is fixedly connected with a first motor, the output end of the first motor is fixedly connected with a rotating shaft, and the surface of the rotating shaft is fixedly sleeved with a gluing roller. According to the glue spreading device, the glue scraping plates are additionally arranged in the glue spreading box, when the glue spreading plates spread glue on the surface of the glue spreading roller, the first motor is started, the rotating shaft drives the glue spreading roller to rotate, and due to the fact that the glue scraping plates are arranged on the left side and the right side of the glue spreading roller respectively, glue can be flattened through the glue scraping plates while the glue spreading roller rotates; and meanwhile, the scraped glue is stored in a glue storage cavity formed by the gluing box and the glue scraping plate, and recycling is facilitated.

The invention relates to a double-camera precision positioning method and device in a bonding system, equipment and a storage medium, and the method comprises the steps: collecting and continuously monitoring a bonding tool and a bonding interface through a first camera and a second camera, and obtaining a bonding image; carrying out image processing on the bonding image and extracting features, and obtaining the position and posture of a bonding tool and geometric features of a bonding area; obtaining a current moving path of the bonding tool through a pre-constructed bonding path planning model, and outputting an instruction for controlling the bonding tool to carry out chip bonding according to the current moving path; and the first camera and the second camera are utilized to monitor the bonding process of the bonding tool executing the bonding operation according to the current moving path in real time, so that the purpose of performing high-precision and high-efficiency positioning and completing chip bonding through the double cameras in a bonding system in a complex temperature environment is achieved.

The invention provides a preparation method of an LED chip structure and the LED chip structure. The preparation method comprises the following steps: providing an LED epitaxial wafer; pixel isolation is carried out on the LED epitaxial layer; the top surface of the electrode leading-out structure is higher than the first semiconductor layer; the bottom surface is in contact with an electrode leading-out position of the pixel unit; bonding a first temporary substrate on the electrode lead-out structure; stripping the substrate; based on the LED chip unit area, the LED epitaxial layer and the first temporary substrate are cut into a plurality of separated LED chip units; providing a second temporary substrate, wherein the material of the second temporary substrate is the same as that of the driving substrate; the LED chip unit is bonded to the second temporary substrate; the first temporary substrate is removed. According to the technical scheme, Die to wafer is realized, wafer to wafer bonding is carried out, the two substrates are made of the same material, and offset caused by thermal expansion difference in the bonding process is avoided; and moreover, the waste of Die is reduced, and the performance is improved.

The invention belongs to the technical field of garment production, and discloses a bonding tool and a bonding method for garments. The bonding tool for the clothes comprises a bottom plate, a cover plate and a positioning assembly, and the bottom plate and the cover plate are arranged in a stacked mode; the positioning assembly is movably arranged between the bottom plate and the cover plate, the positioning assembly is provided with a bonding position stacked with the bottom plate and an installation position separated from the bottom plate, when the bonding position is located, the outer layer fabric is flatly laid between the bottom plate and the positioning assembly, and the liner cloth is flatly laid between the positioning assembly and the cover plate; a plurality of positioning holes in one-to-one correspondence with the rubber strips are formed in the positioning assembly, and the rubber strips are placed in the corresponding positioning holes; in the mounting position, a placing opening is formed in the positioning assembly, and the outer-layer fabric is placed on the bottom plate through the placing opening. According to the bonding tool and the bonding method for the clothes, the bonding efficiency of the outer-layer fabric and the liner cloth is improved, the production quality of the clothes is guaranteed, and the requirement for the bonding skills of workers is reduced.

The invention discloses power cable protection pipe hot connection processing equipment, and relates to the technical field of cable protection pipe hot connection. The cable protection pipe conveying device comprises a supporting mechanism, two transmission mechanisms for conveying cable protection pipes are arranged on the supporting mechanism in a sliding mode, two clamping mechanisms are arranged on the transmission mechanisms, deflection mechanisms are arranged on the clamping mechanisms, the deflection mechanisms and the clamping mechanisms can clamp and fix the cable protection pipes, and a steering mechanism is arranged in the middle of the supporting mechanism. The supporting mechanism is used for driving the transmission mechanism, the clamping mechanism and the deflection mechanism to work, automatic hot melting butt joint of the power cable protection pipe is achieved through cooperation of the supporting mechanism and the hot melting butt joint machine, the supporting mechanism is used for driving the deflection mechanism to work, and butt joint of the power cable protection pipe is achieved. The end face of the power cable protection pipe can be deflected slightly during hot melting butt joint, the fitting efficiency of the end face of the power cable protection pipe is improved, and then the hot melting butt joint efficiency of the power cable protection pipe is improved.

The invention provides a visual system of a bonding device, a method for determining the pose of a part to be bonded and a computer readable storage medium. The visual system of the bonding device comprises a plurality of imaging modules and a view field adjusting mechanism. And the plurality of imaging modules are used for collecting images of a plurality of marks on a to-be-bonded piece so as to represent the position and / or posture of the to-be-bonded piece. And the field-of-view adjusting mechanism is used for rotating at least one imaging module and adjusting the field-of-view position of the imaging module so as to cover the plurality of marks on the to-be-bonded piece. According to the invention, the visual field positions of the plurality of imaging modules can be rotated and adjusted, so that images of a plurality of marks on to-be-bonded pieces with various sizes can be acquired, and the bonding efficiency of a wafer bonding process can be improved.

The invention provides a wafer-level hybrid bonding method, which comprises the following steps of: sequentially forming a semiconductor device layer, an interconnection layer, a first passivation layer and a first bonding metal layer in the first passivation layer on a first wafer, and performing first chemical mechanical grinding on the first passivation layer and the first bonding metal layer, increasing the grinding speed of the first bonding metal layer relative to the first passivation layer to form a curved concave surface structure of the first bonding metal layer; sequentially forming a semiconductor device layer, an interconnection layer, a second passivation layer and a second bonding metal layer in the second passivation layer on a second wafer, and performing second chemical mechanical grinding on the second passivation layer and the second bonding metal layer to improve the grinding speed of the second passivation layer relative to the second bonding metal layer, and forming a curved surface bump structure of the second bonding metal layer. And bonding the curved surface convex point structures into the corresponding curved surface concave surface structures so as to realize bonding of the first wafer and the second wafer. The bonding surface is a curved surface, so that the bonding strength is improved.

The invention discloses a flexible color filter attaching method and system, and relates to the technical field of optical filter manufacturing, and the method comprises the steps: firstly shooting a back plate surface of a selected substrate, and calculating the size of the substrate according to a mark point attached to the substrate in a picture; judging whether the width of the color filter is equal to the width of the substrate or not according to the size of the substrate and the width of the existing coiled color filter; cutting the color filter according to the judgment result; absorbing the cut color filter by utilizing an adsorption gripper, and attaching the cut color filter to the front plate surface of the substrate; rolling and laminating the color filter and the substrate by adopting a laminating roller; and finally, the substrate attached with the color filter is blanked. And the production cost is low, and the production efficiency can be improved.

The utility model discloses a packaging piece. The packaging piece comprises a carrier plate; a redistribution layer disposed on the substrate, the redistribution layer including a conductive layer, a dielectric layer disposed on the conductive layer, and a bump disposed on the dielectric layer, the bump connected to the conductive layer via a conductive via penetrating the dielectric layer, the conductive via including an adhesive layer in contact with the dielectric layer, the projection range of the bottom surface of the bump on the dielectric layer is smaller than the coverage range of the bonding layer. According to the technical scheme, higher-strength adhesive force and bonding capacity can be provided at the interface between the bonding layer and the dielectric layer, and the problem of bump inversion or falling off is avoided.

The invention relates to the field of micro-nano chip manufacturing, and particularly discloses a polymer chip bonding device. The upper substrate posture turnover mechanism and the lower substrate bearing workbench are arranged, the upper substrate posture turnover mechanism can fix the upper substrate and drive the upper substrate to turn over, and the lower substrate bearing workbench can fix the lower substrate and adjust the position of the lower substrate. A plasma modification unit is used for carrying out plasma modification operation on the surface of a substrate during overturning of the substrate, whether the upper substrate and the lower substrate are aligned or not is observed through a microscopic observation unit, the position of the lower substrate is adjusted through a lower substrate bearing workbench, and the lower substrate is lifted to be bonded with the upper substrate. The whole device realizes integrated operation of polymer chip surface modification, alignment of the upper substrate and the lower substrate and compression bonding, realizes pose change of the upper substrate between a plasma modification station and a bonding station, and is simple in structure, low in cost, automatic in the whole substrate bonding process, good in alignment precision and high in bonding efficiency.

The utility model discloses automatic bonding equipment, which relates to the technical field of assembly equipment and comprises a workbench and a turntable conveying device arranged on the workbench, the workbench is provided with a gluing station and a plug-in mounting pressure maintaining station, the gluing station is provided with a lifting rotary device and a gluing device, and the plug-in mounting pressure maintaining station is provided with a plug-in mounting pressure maintaining device; the turntable conveying device is used for bearing the positioning seat and rotationally conveying the positioning seat to each station, and the positioning seat is used for positioning the first product assembly; the lifting and rotating device is used for jacking and rotating a positioning seat on the turntable conveying device or descending the jacked positioning seat onto the turntable conveying device; the gluing device is used for gluing the first product assembly driven by the lifting rotation device to rotate. The insertion pressure maintaining device is used for inserting the positioning jig provided with the second product assembly to the first product assembly and maintaining the pressure of the inserted positioning jig. According to the utility model, automatic bonding between product components is realized, and the bonding quality and the bonding efficiency are improved.

The utility model discloses a luminous display board, and relates to the technical field of luminous display boards, the luminous display board comprises a seat body, the main body of the seat body is a box body structure with a one-way opening at the front end, and the outer side surface of the seat body is fixedly connected with a mounting plate; according to the advertisement pasting device, the guide roller which can be detached from the two inserting blocks is arranged, so that when an advertisement attached to the outer side of the guide roller is subjected to pasting operation, the inserting blocks can be rotationally driven by starting a motor B installed on the top end face of the bottom plate; by arranging the guide roller, the advertisement wound on the outer side of the guide roller can be automatically pasted and attached to the front end of the closing plate through rotation of the guide roller so as to be automatically assembled, and by arranging the movable base capable of moving along the base body, when the movable base is used, the advertisement can be automatically pasted and attached to the front end of the closing plate; and the automatic displacement pasting operation of the advertisement can be realized by matching with a motor B arranged at the top end of the bottom plate.

The present invention belongs to the technical field of polymer materials and chromatographic separation, and discloses a polysaccharide derivative bonded solvent-resistant chromatographic column and its preparation method and application. The preparation method is: after the polysaccharide derivative is subjected to an alkalization reaction, an allyl epoxy-terminated polyether is added to carry out an etherification reaction to obtain an allyl polyether-substituted polysaccharide derivative; after the silica microspheres are subjected to an activation treatment, a triethoxysilane modification reaction is used to obtain a silicosilane sphere; the allyl polyether-substituted polysaccharide derivative is subjected to a silicohydrogenation bonding reaction with the silicosilane sphere to obtain a polysaccharide derivative-bonded silicon sphere; and finally, the chromatographic column is filled with the chromatographic column to obtain a polysaccharide derivative-bonded solvent-resistant chromatographic column. The preparation method of the present invention has the advantages of high bonding efficiency and simple preparation process. The obtained chromatographic column has the advantages of good solvent resistance and good separation effect.

The utility model discloses a door plate handrail machining alignment tool which comprises a bottom plate, two stand columns in mirror symmetry are perpendicularly fixed to the top face of the bottom plate, the top face of each stand column is movably connected with a swing arm, the tail ends of the two swing arms are jointly connected with a cross beam in a telescopic mode, and the bottom face of the cross beam is connected with an indentation piece in a lifting mode. A cushion block is arranged below the creasing piece and fixed to the top face of the bottom plate, and the front side and the rear side of the cushion block are each horizontally and telescopically connected with a clamping plate. The two swing arms are movably connected to the top face of the bottom plate, the tail ends of the two swing arms are jointly connected with the cross beam in a telescopic mode, the pressing block and the pressing strip are connected to the bottom face of the cross beam in a telescopic mode, leather can be conveniently pressed into a groove outside a plastic part, the leather does not need to be manually pressed into the groove, the attaching efficiency of the leather and the plastic part is improved, and the labor intensity of workers is reduced. And meanwhile, the flatness and the attractiveness of the leather adhered to the plastic part are also improved.

The utility model discloses a polishing structure for building construction, which is characterized in that an auxiliary polishing plate body is detachably arranged on one side of a main polishing plate body, the lower end of the auxiliary polishing plate body is flush with the lower end of the main polishing plate body, and the upper end of the auxiliary polishing plate body is higher than the upper end of the main polishing plate body; the abrasive paper is connected with the main polishing plate body and the auxiliary polishing plate body at the same time, and a holding piece is arranged at the upper end of the main polishing plate body. Two positioning pieces are arranged on the main polishing plate body and comprise telescopic rods, the telescopic rods are movably arranged on the main polishing plate body in a penetrating mode, the telescopic rods are sleeved with return springs, the upper end of the main polishing plate body is connected with the lower ends of the return springs, the upper ends of the return springs are connected with the lower ends of limiting rings, and the upper half sections of the telescopic rods are sleeved with the limiting rings; the abrasive paper is provided with two openings used in cooperation with the telescopic rods. The polishing device has the advantages of being high in polishing efficiency, capable of reducing bonding difficulty, wide in applicability, simple in structure, low in manufacturing cost, not prone to damage and the like.

The application discloses a computer simulation and optimization method for oriented rubber and meat close fitting, and belongs to the technical field of computer aided engineering and virtual simulation. A three-dimensional model of rubber and meat is constructed and material properties are defined, a virtual contact interface is constructed and is discretized into multiple contact units; a finite element analysis engine is used to simulate the rubber deformation process under different candidate pressure distribution modes, and corresponding deformation sequences are generated; the relative displacement between the rubber nodes and the meat nodes at each contact unit is extracted, and the overall fitting degree coefficient is calculated; the candidate pressure distribution mode is iteratively optimized until the optimized pressure distribution mode meeting the convergence condition is obtained, and is output as the target pressure application scheme. The application can automatically find the optimal pressure application scheme for the closest fitting of rubber and meat, effectively replace the traditional process debugging mode relying on experience and repeated experiments, significantly improve the fitting quality and efficiency, and provide accurate computer guidance for the formulation of actual production processes.

The utility model relates to an electric energy meter bar code binding machine which comprises a frame body, a conveying belt arranged on the frame body, a first rotating roller and a second rotating roller, the first rotating roller and the second rotating roller are arranged on the frame body, a motor used for driving the second rotating roller to rotate is further arranged on the frame body, and a supporting plate is further arranged on the frame body. The distance between the end of the supporting plate and the surface of the conveying belt ranges from 1 mm to 3 mm, a third rotating roller is further rotationally connected to the frame body, a brush is arranged on the third rotating roller, and the brush abuts against the supporting plate and the conveying belt. The bar code pasting method has the effect of improving the bar code pasting efficiency.

The utility model relates to the technical field of dispensing equipment, and provides an adsorption device which comprises a suction head, one end of the suction head is an adsorption end, the adsorption end of the suction head is arranged in a rectangular block shape and is uniformly provided with a plurality of air suction holes, one side of the suction head is provided with a plurality of vent holes, and the vent holes are used for being communicated with an air extractor. And each air suction hole is communicated with one of the vent holes. Therefore, the adsorption stability of the magnetic block can be improved. In addition, the utility model further provides a dispensing machine.

The invention relates to a production device for an electrode frame and ion exchange membrane integrated structure. The production device comprises a membrane material unfolding assembly, a laminating platform, a cutting assembly, a tensioning assembly, a pressing assembly, a mechanical arm and a hot pressing assembly, the film material unfolding assembly is used for unfolding a film roll and outputting a film material; the laminating platform is used for placing a first electrode frame; the cutting assembly is used for cutting the size of the ion exchange membrane; the film material is tensioned through the tensioning assembly; the pressing assembly and the laminating platform are oppositely arranged, and the pressing assembly enables the ion exchange membrane to abut against the first electrode frame; the mechanical arm is used for clamping and moving the second electrode frame; and the hot pressing assembly is used for integrally heating and pressing the electrode frame and ion exchange membrane integrated structure. According to the invention, automatic lamination of the ion exchange membrane and the electrode frame is realized, the problems of pollution, uneven stress and the like of the ion exchange membrane in a manual operation process are avoided, and the lamination efficiency and the lamination quality of the ion exchange membrane are effectively improved.

The invention relates to a seven-in-one preparation method and equipment. The seven-in-one preparation equipment comprises a sheet preparation assembly, a plurality of processing assemblies and a control assembly, wherein the sheet preparation assembly is used for cutting a GDL layer on a GDL material belt into a plurality of GDL sheets; the first conveying assembly and the second conveying assembly are used for receiving and conveying the GDL; the first unwinding assembly is used for unwinding and outputting a five-in-one material belt; the dispensing assembly is used for dispensing on the upper side surface of the five-in-one material belt; the laminating assembly is used for simultaneously sucking the M GDLs on the first conveying assembly and laminating the M GDLs to the upper side surface of the five-in-one material belt; the dispensing and laminating assembly is used for bearing the M GDLs and carrying out dispensing on the upper side surfaces of the M GDLs; the dispensing and laminating assembly can be controllably moved to the lower part of the five-in-one material belt, and the M GDLs are laminated to the lower side surface of the five-in-one material belt; the hot pressing assembly is used for carrying out hot pressing on the five-in-one material belt attached with the GDL sheet and forming a seven-in-one material belt; and the cutting assembly is used for cutting the seven-in-one material belt into a plurality of seven-in-one assemblies.

This application provides a bonding device for optical components, used to bond optical components to a bonding mold. The bonding device includes: a frame, vertically arranged; a support platform, mounted on the frame and used to connect the bonding mold, the bonding mold being rotatable on the support platform; a calibration support frame, mounted on the frame and located above the support platform, and having an adjustment cavity; and multiple adjusting members, adjustablely arranged on the calibration support frame and distributed around the central axis of the adjustment cavity, the adjusting members being radially movable along the adjustment cavity; the optical component is bonded to the bonding mold by hot melt wax and placed within the adjustment cavity, and the optical component is pushed horizontally by the multiple adjusting members to make the optical component coaxial with the bonding mold. This solves the problems of low mounting accuracy and large positioning accuracy error of optical components caused by manual mounting in the prior art.

The invention relates to the technical field of honeycomb ceramics, in particular to a thickness control material, a preparation method, application and silicon carbide honeycomb ceramics. The thickness control material comprises the following components: silicon carbide powder, hydroxypropyl methyl cellulose, redispersible latex powder, inorganic sol, water and a lubricant, the silicon carbide powder comprises coarse-grained powder and fine-grained powder, the granularity D50 of the coarse-grained powder is 20-30 [mu] m, and the granularity D50 of the fine-grained powder is 1-2 [mu] m. The thickness control material can be used for preparing silicon carbide honeycomb ceramics. The thickness-controlled pug has proper rigidity and good thickness consistency, the heat conductivity coefficient of the thickness-controlled pug is closer to that of a silicon carbide honeycomb ceramic unit block, and the heat shock resistance of silicon carbide honeycomb ceramic can be excellent; the silicon carbide honeycomb ceramic is good in splicing mud thickness control effect, stable in back pressure and good in thermal shock resistance.

The application relates to the field of semiconductors and discloses a multi-source heterogeneous material wafer and wafer synchronous bonding method, which comprises the following steps: thinning and cutting each wafer to be bonded to obtain a plurality of heterogeneous material wafers; forming a temporary bonding glue layer on the surface of a carrier wafer and softening the temporary bonding glue layer; pasting the plurality of heterogeneous material wafers on the soft temporary bonding glue layer, and adjusting the pasting pressure according to target parameters of the plurality of heterogeneous material wafers, so that the plurality of heterogeneous material wafers are coplanarized and fixed on the surface of the carrier wafer; aligning the carrier wafer with the plurality of heterogeneous material wafers fixed thereon with a target wafer, and one-time synchronous bonding of the plurality of heterogeneous material wafers and the target wafer is realized through a bonding process. The wafer to be cut is thinned, the thickness of the plurality of heterogeneous material wafers is compensated by softening the temporary bonding glue layer and adjusting the pasting pressure, the surfaces of the heterogeneous material wafers tend to be coplanar, an intermediate layer is not needed, and one-time synchronous bonding to the target wafer is realized, so that the time is shortened.

The invention provides a preparation method and device of a flexible circuit board for new energy. The method comprises the following steps: acquiring a coiling demand of a user and an image of a reinforcing steel sheet; preprocessing the image of the reinforcing steel sheet to obtain a preprocessed image; determining grabbing point location data according to the preprocessed image; according to the material rolling requirement of the user, grabbing parameters are determined; according to the grabbing point position data and the grabbing parameters, material rolling treatment is conducted on the reinforcing steel sheet, and a reinforcing steel sheet roll material is obtained; and applying the reinforcing steel sheet roll material to the substrate of the flexible circuit board to obtain the flexible circuit board for new energy. According to the invention, not only can the efficiency of making the reinforcing steel sheet into the roll material be improved so as to facilitate storage and transportation, but also the reinforcing steel sheet roll material is used for producing and manufacturing the flexible circuit board, so that the fitting efficiency of the reinforcing steel sheet and the flexible circuit board is improved, and the large-batch requirement of the flexible circuit board is met.

The invention relates to the technical field of firework cylinders, in particular to a firework mold pressing cylinder based on cassava flour pregelatinization and a preparation method thereof, and the mold pressing cylinder is prepared from the following raw materials in parts by weight: a framework material compounded by crystal transformation method II type anhydrous gypsum and calcium carbonate stone powder, pregelatinized cassava flour, wood fibers, stearic acid and a proper amount of water. The tapioca flour is pre-gelatinized by warm water at 40-60 DEG C, and the pre-gelatinization degree is greater than or equal to 80 The crystal transformation method II type anhydrous gypsum is prepared from ardealite through a low-temperature crystal transformation method. The preparation method comprises the following steps: pre-gelatinizing the tapioca flour, pulping, mixing with other dry blends and hot water, and finally carrying out high-temperature compression molding. Through the synergistic effect of the pre-gelatinized tapioca flour and the crystal transformation method gypsum, the dry basis dosage of the tapioca flour is remarkably reduced, meanwhile, the compressive strength and the falling resistance of the mold pressing barrel are greatly improved, the multiple purposes of reducing the cost, improving the performance and absorbing industrial solid waste phosphogypsum are achieved, the product quality is stable, and the mold pressing barrel is suitable for industrial production.

The embodiment of the utility model belongs to the technical field of double-sided adhesive tape. The utility model further relates to a spliced double-sided adhesive structure which comprises a double-sided adhesive main body, the double-sided adhesive main body is arranged in a frame shape, and the double-sided adhesive main body is formed by splicing the two first double-sided adhesive strips and the two second double-sided adhesive strips, so that the double-sided adhesive main body is used in a one-time attaching mode. According to the double-sided adhesive tape, the double-sided adhesive tape main body is arranged in the frame shape, and the double-sided adhesive tape main body is formed by splicing the two first double-sided adhesive tapes and the two second double-sided adhesive tapes, so that when the double-sided adhesive tape main body reaches a client side from a manufacturer, the client side can directly paste the double-sided adhesive tape main body at a time; and the whole double-sided adhesive main body can be adhered to the back surface of the cover plate at one time without manual operation one by one, so that the adhering efficiency is greatly improved.

The utility model relates to a fuel cell bipolar plate glue line rapid pasting positioning tool which comprises a tool base and a cover plate covering the positioning base, and the upper surface of the tool base is sunken downwards to form a glue line positioning groove used for containing a sealing glue line. The depth of the rubber line positioning groove is smaller than the thickness of the portion, protruding out of the surface of the bipolar plate, of the sealing rubber line after the sealing rubber line is bonded to the bipolar plate, and positioning structures are formed between the tool base and the bipolar plate and between the tool base and the cover plate respectively. And the positioning structure is configured to enable the sealing glue line to be bonded in the glue line bonding groove of the bipolar plate when the cover plate covers and presses the bipolar plate. The tool base is provided with the glue line positioning groove for accommodating and fixing the sealing glue line so as to facilitate dispensing on the upper surface of the sealing glue line, and the bipolar plate is pressed and covered on the tool base through the cover plate, so that bonding of the sealing glue line and the bipolar plate is realized, the bonding difficulty of the sealing glue line and the bipolar plate is simplified, and the bonding efficiency is improved.

The present invention discloses a mobile phone back cover film tearing, laminating and pressurizing machine and its laminating and pressurizing process, including a material tray circulating feeding part and a laminating and pressurizing film tearing part, the material tray circulating feeding part is used for circulating the material tray, taking and loading materials and collecting the material tray; the laminating and pressurizing film tearing part is arranged on the side of the material tray circulating feeding part; the laminating and pressurizing process of the mobile phone back cover film tearing, laminating and pressurizing machine includes the following process steps: placing the tray; automatically taking and placing materials; rotating taking and placing materials; material box installation; taking film and multi-piece detection; film tearing and transfer; film laminating; transportation after laminating; laminating and pressurizing; secondary film tearing; transfer unloading; closing and storing. The present invention realizes automatic feeding before laminating the mobile phone back cover and automatic unloading and storage after laminating, effectively improving the material transfer efficiency, and realizing automatic feeding of adhesive, multi-piece detection, film tearing transfer and automatic laminating, adopts detachable material replacement, effectively improves the adhesive supply and replacement and laminating efficiency, has laminating and pressurizing function, and effectively guarantees the laminating quality.