Parallel compound ultrasonic energy transmission device

An energy transmission and composite technology, applied in the field of processing tools, can solve problems such as difficult to output and difficult to realize, and achieve the effects of ensuring consistency, increasing coverage area, and compact overall structure

Inactive Publication Date: 2007-10-17
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main problem existing in the existing ultrasonic energy transmission device is: the vibration frequency of the ultrasonic system of the wire bonding machine is usually between 64kHz and 120kHz, and the output power is about 2.5W
Due to the limitations of the performance of the power amplifier circuit, it is difficult to output electric power above 2.5W at 128kHz or even higher frequency
This makes it difficult to realize the idea of ​​improving bonding efficiency from the perspective of increasing frequency

Method used

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  • Parallel compound ultrasonic energy transmission device
  • Parallel compound ultrasonic energy transmission device
  • Parallel compound ultrasonic energy transmission device

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Embodiment Construction

[0027] The present invention is described in more detail below in conjunction with accompanying drawing example:

[0028] Combining Figures 1, 8, 9 and 10, the composition of the parallel composite ultrasonic energy transmission device includes a parallel composite ultrasonic horn 1, a working chopper 7 is installed at the end of the horn, and a The piezoelectric ultrasonic transducer 2 and the working ends of two sets of unidirectional vibration horns are rigidly connected in parallel, and the horns are fixed on the moving platform 3 of the voice coil motor 4 through the elastic beam 5 . The section of the horn is rectangular or square. The piezoelectric ultrasonic transducer is piezoelectric ceramic wafers stacked in parallel, a pre-tightening wedge is arranged in the middle of the parallel stacking piezoelectric ceramic wafers, and a pre-tightening bolt 6 is provided on the pre-tightening wedge. There are three pre-tightening wedges, namely wedge 10, wedge 11 and wedge 12,...

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Abstract

The invention provides a parallel connection combined type ultrasonic energy transferring device, which comprises a parallel connection combined type supersonic wave amplitude transformer, a piezoelectricity ultrasonic transducer as well as a working cleaver on front end of the amplitude transformer. Two sets of unidirectional vibration amplitude transformer are rigidly connected with each other on working end, and the parallel connection combined type supersonic wave amplitude transformer is fixed on a movable flatform via an elastic beam. The invention provides a novel parallel connection combined type ultrasonic energy transferring device, which is used to increase lead bond efficiency, wherein, the requirement of increasing supersonic wave lamplitude transformer end cleaver track cover area is satisfied, at the same time, ultrasonic energy density is increased, bond time is reduced, and bond efficiency is increased.

Description

1. Technical field [0001] The invention relates to a processing tool for micro-processing technology, in particular to an ultrasonic energy transmission device for a wire bonding machine. 2. Background technology [0002] Advanced manufacturing technologies such as microelectronics, optoelectronics, and micro-electromechanical systems combine silicon micro-processing technology and micro-machining technology to manufacture micro-devices or systems with small size, low power consumption, high integration, and low cost. Packaging plays an important role in the manufacturing process of micro devices or systems, which can provide effective mechanical support, environmental protection, interface with external media and electrical connection with other systems. [0003] Ultrasonic wire bonding machines are widely used in the field of packaging to realize the interconnection of electrical signals, that is, to use ultrasonic vibration technology to remove impurities such as oxide la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B06B3/02B06B1/06B23K20/10H01L21/607
Inventor 刘延杰孙立宁张乐敏
Owner HARBIN INST OF TECH
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