The invention relates to the technical field of
ultrasonic bonding, in particular to an ultrasonic adjusting method of a bonding
system, which comprises the following steps of: acquiring
voltage and displacement waveforms, analyzing a power trend, shielding a main window if a rising proportion is high and displacement exceeds a limit, extracting a
maximum displacement point frequency to divide a standby window, and generating standby configuration by combining an impedance
library. And monitoring peak
time difference fluctuation and offset, calling configuration and matching a displacement
time sequence generation instruction, monitoring displacement stability to be matched with pressure, setting a standby window as a main window if the condition is met, and generating a reconstruction mark. According to the method, the driving
voltage and the
transducer displacement waveform are continuously monitored, the power trend and the displacement fluctuation are analyzed in real time, the peak
time difference fluctuation is synchronously monitored, the abnormal working conditions are screened to trigger the driving
strategy switching, and the main
frequency band is reconstructed according to the steady-state displacement characteristics. Pseudo
soldering and material damage are avoided, the vibration energy
utilization rate is improved, and the bonding
pressure control precision and the connection strength are guaranteed.