The invention relates to a gyroscope with a vibrating structure, produced by micromachining in a thin wafer, which comprises a movable inertial assembly (1) comprising at least one movable mass (50) able to vibrate in the plane of the wafer along a drive axis x and along a sense axis y roughly perpendicular to the x-axis, an interdigital sensor comb (90) and an interdigital drive comb (70). It furthermore comprises at least one additional interdigital comb (10a), called the quadrature-error compensation comb, connected to the mass (50) and which has two asymmetric air gaps e and λe, λ being a positive real number, for subjecting the mass to an adjustable electrostatic stiffness due to coupling between the x-axis and the y-axis by applying a variable DC voltage V to this comb, the adjustable stiffness allowing compensation for the quadrature error of the gyroscope.