2660results about "Acceleration measurement in multiple dimensions" patented technology

A device comprised of at least a pair of accelerometers and a tilt sensor mounted in fixed relation to a datum plane defining surface (sole of a shoe) may be used for extracting kinematic variables including linear and rotational acceleration, velocity and position. These variables may be resolved into a selected direction thereby permitting both relative and absolute kinematic quantities to be determined. The acceleration is determined using a small cluster of two mutually perpendicular accelerometers mounted on a shoe. Angular orientation of the foot may be determined by double integration of the foot's angular acceleration (which requires a third accelerometer substantially parallel to one of the two orthogonal accelerometers). The two orthogonal accelerations are then resolved into a net horizontal acceleration or other selected direction which may be integrated to find the foot velocity in the selected direction. The average of the foot velocity corresponds to the subject's gait speed.

An electronic component includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a cavity that penetrates from the first surface to the second surface of the semiconductor substrate, and an electrical mechanical element that has a movable portion formed above the first surface of the semiconductor substrate so that the movable portion is arranged above the cavity. The electronic component further includes an electric conduction plug, which penetrates from the first surface to the second surface of the semiconductor substrate, and which is electrically connected to the electrical mechanical element.

An improved apparatus and methods of posture and physical activity monitoring. The apparatus is physically mountable to or associated with an object or person, includes a multi-axis accelerometer, and derives measurements of posture and of acceleration. Methods are disclosed which provide improved estimations of posture, acceleration, energy expenditure, movement characteristics and physical activity, detect the influence of externally-caused motion, and permit automatic calibration of the apparatus in the field.

A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

A six degree-of-freedom micro-machined multi-sensor that provides 3-axes of acceleration sensing, and 3-axes of angular rate sensing, in a single multi-sensor device. The six degree-of-freedom multi-sensor device includes a first multi-sensor substructure providing 2-axes of acceleration sensing and 1-axis of angular rate sensing, and a second multi-sensor substructure providing a third axis of acceleration sensing, and second and third axes of angular rate sensing. The first and second multi-sensor substructures are implemented on respective substrates within the six degree-of-freedom multi-sensor device.

A micromachined inertial sensor with a single proof-mass for measuring 6-degree-of-motions. The single proof-mass includes a frame, an x-axis proof mass section attached to the frame by a first flexure, and a y-axis proof mass section attached to the frame by a second flexure. The single proof-mass is formed in a micromachined structural layer and is adapted to measure angular rates about three axes with a single drive motion and linear accelerations about the three axes.

A driving mass of an integrated microelectromechanical structure is moved with a rotary motion about an axis of rotation, and a sensing mass is connected to the driving mass via elastic supporting elements so as to perform a detection movement in the presence of an external stress. The driving mass is anchored to a first anchorage arranged along the axis of rotation by first elastic anchorage elements. The driving mass is also coupled to a pair of further anchorages positioned externally thereof and coupled to opposite sides with respect to the first anchorage by further elastic anchorage elements; the elastic supporting elements and the first and further elastic anchorage elements render the driving mass fixed to the first sensing mass in the rotary motion, and substantially decoupled from the sensing mass in the detection movement, the detection movement being a rotation about an axis lying in a plane.

A system and method in accordance with the present invention provides for a low cost, bulk micromachined accelerometer integrated with electronics. The accelerometer can also be integrated with rate sensors that operate in a vacuum environment. The quality factor of the resonances is suppressed by adding dampers. Acceleration sensing in each axis is achieved by separate structures where the motion of the proof mass affects the value of sense capacitors differentially. Two structures are used per axis to enable full bridge measurements to further reduce the mechanical noise, immunity to power supply changes and cross axis coupling. To reduce the sensitivity to packaging and temperature changes, each mechanical structure is anchored to a single anchor pillar bonded to the top cover.

A driving mass of an integrated microelectromechanical structure is moved with a rotary motion about an axis of rotation, and a first sensing mass is connected to the driving mass via elastic supporting elements so as to perform a first detection movement in a presence of a first external stress. The driving mass is anchored to an anchorage arranged along the axis of rotation by elastic anchorage elements. An opening is provided within the driving mass and the first sensing mass is arranged within the opening. The elastic supporting and anchorage elements render the first sensing mass fixed to the driving mass in the rotary motion, and substantially decoupled from the driving mass in the first detection movement. A second sensing mass is connected to the driving mass so as to perform a second detection movement in a presence of a second external stress. A first movement is a rotation about an axis lying in a plane, and a second movement is a linear movement along an axis of the plane.

A portable medical device is provided with an internal accelerometer device. The medical device includes a circuit board, the accelerometer device, and a response module coupled to the accelerometer device. The accelerometer device is mechanically and electrically coupled to the circuit board, and it includes a plurality of mass-supporting arms for a plurality of electrically distinct sensor electrodes, piezoelectric material for the mass-supporting arm, and a proof mass supported by the mass-supporting arms. Each of the mass-supporting arms has one of the sensor electrodes located thereon. Acceleration of the proof mass causes deflection of the piezoelectric material, which generates respective sensor signals at one or more of the sensor electrodes. The response module is configured to initiate an acceleration-dependent operation of the portable medical device in response to generated sensor signals present at the sensor electrodes.

A micromachined sensor and a process for fabrication and vertical integration of a sensor and circuitry at wafer-level. The process entails processing a first wafer to incompletely define a sensing structure in a first surface thereof, processing a second wafer to define circuitry on a surface thereof, bonding the first and second wafers together, and then etching the first wafer to complete the sensing structure, including the release of a member relative to the second wafer. The first wafer is preferably a silicon-on-insulator (SOI) wafer, and the sensing structure preferably includes a member containing conductive and insulator layers of the SOI wafer. Sets of capacitively coupled elements are preferably formed from a first of the conductive layers to define a symmetric capacitive full-bridge structure.

A microelectromechanical systems (MEMS) sensor device (184) includes a sensor portion (180) and a sensor portion (182) that are coupled together to form a vertically integrated configuration having a hermetically sealed chamber (270). The sensor portions (180, 182) can be formed utilizing different micromachining techniques, and are subsequently coupled utilizing a wafer bonding technique to form the sensor device (184). The sensor portion (180) includes one or more sensors (186, 188), and the sensor portion (182) includes one or more sensors (236, 238). The sensors (186, 188) are located inside the chamber (270) facing the sensors (236, 238) also located inside the chamber (270). The sensors (186, 188, 236, 238) are configured to sense different physical stimuli, such as motion, pressure, and magnetic field.

An inertial input apparatus with six-axial detection ability, structured with a gyroscope and an acceleration module capable of detecting accelerations of X, Y, Z axes defined by a 3-D Cartesian coordinates, which is operable either being held to move on a planar surface or in a free space. When the inertial input apparatus is being held to move and operate on a planar surface by a user, a two-dimensional detection mode is adopted thereby that the gyroscope is used for detection rotations of the inertial input apparatus caused by unconscious rolling motions of the user and thus compensating the erroneous rotations, by which the technical disadvantages of prior-art inertial input apparatuses equipped with only accelerometer can be overcame and thus control smoothness of using the input apparatus is enhanced. In addition, when the inertial input apparatus is being held to operate in a free space by a user, a three-dimensional detection mode is adopted for enabling the inertial input apparatus to detect movements of the same with respect to at most six axes defined by the 3-D Cartesian coordinates of X, Y, Z axes, that is, the rotations with respect to the X, Y, Z axes and the movements with respect to the X, Y, Z axes, and thus the inertial input apparatus is adapted to be used as an input device for interactive computer games, In a preferred aspect, when the inertial input apparatus is acting as a 3-D mouse suitable to be used for briefing or in a remote control environment, only the detections with respect to the X and Y axes acquired by the accelerometer along with that of the gyroscope are adopts and used as control signals for controlling cursor displayed on a screen, but the detection with respect to the Z-axis acquired by the accelerometer is used as a switch signal for directing the inertial input apparatus to switch between its two-dimensional detection mode and three-dimensional detection mode.

A solid state silicon micromachined acceleration and Coriolis (MAC) sensor that measures linear and angular motion. The MAC sensor is a single device that performs the functions of a conventional accelerometer and a gyroscope simultaneously. The MAC sensor is unique in that it is a differential dual stage device using only one micromachined proof mass to measure both linear and angular motions. The single proof mass is connected to opposing electromechanical resonators in a monolithic microstructure made from single crystal silicon. This unique design offers improvements in measurement performance and reductions in fabrication complexity that are beyond the state the art of earlier micromachined inertial sensors.

Multi-axis micromachined accelerometer and rate sensor having first and second generally planar masses disposed side-by-side and connected together along adjacent edge portions thereof for torsional movement about axes parallel to a first axis in response to acceleration along a second axis and for rotational motion about axes parallel to the second axis in response to acceleration along the first axis. The masses are driven to oscillate about the axes parallel to the second axis so that Coriolis forces produced by rotation about a third axis result in torsional movement of the masses about the axes parallel to the first axis. Sensors monitor the movement of the mass about the axes, and signals from the sensors are processed to provide output signals corresponding to acceleration along the first and second axes and rotation about the third axis.

An apparatus having an arrangement of two or more identical accelerometers with aligned sensitivity axes. Each of the accelerometers senses motion over at least one axis. The accelerometer readings include a component corresponding to gravitational force that is the same for each accelerometer in the arrangement. Logic circuitry in communication with the accelerometer arrangement couples accelerometer signals to a processor to compute motion variables.

A micro-machined multi-sensor that provides 1-axis of acceleration sensing and 2-axes of angular rate sensing. The multi-sensor includes a plurality of accelerometers, each including a mass anchored to and suspended over a substrate by a plurality of flexures. Each accelerometer further includes acceleration sense electrode structures disposed along lateral and longitudinal axes of the respective mass. The multi-sensor includes a fork member coupling the masses to allow relative antiphase movement, and to resist in phase movement, of the masses, and a drive electrode structure for rotationally vibrating the masses in antiphase. The multi-sensor provides electrically independent acceleration sense signals along the lateral and longitudinal axes of the respective masses, which are added and/or subtracted to obtain 1-axis of acceleration sensing and 2-axes of angular rate sensing.