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3650results about "Speed/acceleration/shock instrument details" patented technology

Monitoring activity of a user in locomotion on foot

In one embodiment, a method includes steps of: (a) identifying an average foot contact time of a user during a first outing; (b) identifying an average pace of the user during the first outing; (c) defining a relationship between foot contact times of the user and corresponding paces of the user, wherein the relationship is based upon the average foot contact time and the average pace identified during the first outing, and wherein no other average foot contact times and no other average paces identified during any different outings by the user are used to define the relationship; and (d) calibrating at least one device that monitors activity of the user in locomotion on foot based upon the defined relationship between foot contact times of the user and corresponding paces of the user. In another embodiment, a method includes steps of: (a) determining a single user-specific calibration constant that defines a relationship between foot contact times of a user and corresponding paces of the user, wherein no other user-specific calibration constants are used to define the relationship; and (b) calibrating at least one device that monitors activity of the user in locomotion on foot based upon the relationship between foot contact times of the user and corresponding paces of the user that is defined by the single user-specific calibration constant.
Owner:NIKE INC +1

Product integrity systems and associated methods

The invention provides a smart sensor in the form of an adhesive bandage. The sensor may be used in many applications such as within sports, the shipping industry and medical and health industries. The sensor sticks to people and objects and wirelessly communicates with remote receivers. Internal detectors sense conditions associated with movement and / or the environment of the sensor. In one example, an accelerometer detects impact and drop distance of a package in transit; the sensor is either within a label or attached to a product within the package. The sensor may also prevent theft and assist in tracking package disposition so as to reduce lost packages. The sensors of the invention may also be used in fitness and health, such as to monitor body functions of heart rate and respiration; these sensors also may initiate immediate wireless warnings for improper functions so that persons may obtain immediate assistance. Sensors of the invention are also useful for sports media broadcasts; multiple sensors may attach to athletes so that wireless performance data is made available, in near real time, to audiences and media observers. Data from sensors of the invention may also change the computer gaming community; that is, certain sensors tracking real performance data may relay information used within gaming so as to govern computer gaming motions. Typically, sensors of the invention communicate by an RF transmitter or transceiver. Groups of sensors may be combined within a common canister that imparts date and time information and “power on” when dispensed.
Owner:TVIPR

Sensor package arrangement

A highly sensitive silicon micro-machined sensor package is provided for use in a micro-g environment that can also resist high shock in excess of 5000 g. The sensor is provided to measure acceleration in cooperation with associated electronics which are required to have electrical contact with sensor elements. The sensor is sealed in a high vacuum environment, and is arranged and designed to be free of temperature induced stress to the sensor. The sensor die package assembly comprises a silicon micro-machined sensor die, a ceramic package, two contact springs, a shorting clip, solder preform, a metal lid and a getter foil for ensuring a good vacuum for an extended period. The sensor die comprises a moving mass with eight supporting flexures on both sides of the proof mass. The proof mass's movement is protected on both sides by a top and a bottom cap. Acceleration applied to the package and the die causes the proof mass to move vertically in relation with the adjacent caps. The changes in distance between the proof mass and the caps in turn generate a change in an electrical signal which corresponds to the capacitance changes between the gaps. The sensor die package arrangement provides that the sensor die be secured within an evacuated ceramic case. Electrical connections made between external contacts of the case and contacts of the sensor die within the case are made through conductive springs, thereby minimizing materials in the interior of the case which would outgass in the vacuum environment.
Owner:I O SENSORS
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