Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

340 results about "Temperature induced" patented technology

Sensor package arrangement

A highly sensitive silicon micro-machined sensor package is provided for use in a micro-g environment that can also resist high shock in excess of 5000 g. The sensor is provided to measure acceleration in cooperation with associated electronics which are required to have electrical contact with sensor elements. The sensor is sealed in a high vacuum environment, and is arranged and designed to be free of temperature induced stress to the sensor. The sensor die package assembly comprises a silicon micro-machined sensor die, a ceramic package, two contact springs, a shorting clip, solder preform, a metal lid and a getter foil for ensuring a good vacuum for an extended period. The sensor die comprises a moving mass with eight supporting flexures on both sides of the proof mass. The proof mass's movement is protected on both sides by a top and a bottom cap. Acceleration applied to the package and the die causes the proof mass to move vertically in relation with the adjacent caps. The changes in distance between the proof mass and the caps in turn generate a change in an electrical signal which corresponds to the capacitance changes between the gaps. The sensor die package arrangement provides that the sensor die be secured within an evacuated ceramic case. Electrical connections made between external contacts of the case and contacts of the sensor die within the case are made through conductive springs, thereby minimizing materials in the interior of the case which would outgass in the vacuum environment.
Owner:I O SENSORS

Collapsible shape memory alloy (SMA) nose cones for air vehicles, method of manufacture and use

A nose cone formed from a shape memory alloy (SMA) having a recoverable strain of at least 2% collapses about the dome for storage, deploys at launch to protect the sensor dome and reduce drag during atmospheric flight and is shed to allow sensing for terminal maneuvers. The SMA is shape-set at elevated temperatures in its Austenite phase with a memorized shape having a radius of curvature greater than that of the sensor dome to reduce aerodynamic drag. The temperature is reduced and the SMA collapsed to conform to the curvature of the sensor dome within the recoverable strain for storage. A first mechanism is configured to return the collapsed SMA to its memorized shape at launch or prior to going supersonic. In one embodiment, the SMA is stored below its Martensite finish temperature in a temperature-induced Martensite phase in which case the mechanism heats the SMA above the Austenite finish temperature to return the material to its memorized shape. In another embodiment, the SMA is stored above its Austenite finish temperature in which case collapsing the SMA places the material in a strain-induced Martensite phase. The mechanism holds the collapsed SMA in place and the releases the stored energy allowing the SMA to return to the memorized shape.
Owner:RAYTHEON CO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products