The utility model discloses a
semiconductor rectifier injection molding packaging device which comprises an upper mold, a lower mold, a base, a supporting column, a protective cover, a material injection
pipe, a first air cylinder, a
piston, a sealing plate, an upper cylinder body, a lower cylinder body, a
metal telescopic sleeve, an annular hanging frame, a connecting rod, a second air cylinder and a circulating cooling
water pipe. The four supporting columns are distributed in a rectangular mode, the upper ends and the lower ends of the supporting columns are fixedly connected with the upper mold and the base respectively, the lower mold is slidably installed on the supporting columns, and the lower mold and the upper mold are matched to form a
plastic packaging mold cavity. Hot resin in the lower cylinder body is extruded through downward expansion of the
metal telescopic sleeve and is injected into the
plastic packaging mold cavity through the material injection
pipe and the pouring gate for
plastic packaging operation, the requirement for the
machining precision of the
piston, the inner hole of the upper cylinder body and the inner hole of the lower cylinder body can be lowered, and therefore the
machining cost can be lowered; the
piston cannot be blocked when the piston moves up and down and the
metal telescopic sleeve does stretching / contracting movement, and the piston has the advantages of being high in use reliability and long in service life.