The invention relates to a hollow
silicon dioxide
microsphere and a preparation method and application thereof, the hollow
silicon dioxide
microsphere has a
dielectric constant less than or equal to 2.5, a
dielectric loss tangent angle less than or equal to 0.001, a purity greater than 95%, a
sphericity rate greater than or equal to 99%, a wall thickness greater than 0 and less than or equal to 0.42 [mu] m, and an
average diameter of 0.1 [mu] m-5 [mu] m, and the hollow rate, the wall thickness and the average particle size satisfy a relational expression, eta is the hollow rate, t is the wall thickness, and R is 1 / 2 of the average particle size. The hollow
silicon dioxide microspheres provided by the invention are high in spherical rate, firm in wall thickness, uniform in
particle size distribution, high in purity, relatively excellent in
dielectric property and extremely low in content of
metal impurities, and can meet the application requirements of high-speed and high-frequency substrates, in addition, the preparation method provided by the invention is few in adopted raw materials, simple in preparation process, low in cost and high in efficiency.