7222 results about "Protection layer" patented technology

The invention discloses a primary and secondary fusion pole-mounted intelligent circuit breaker. The primary and secondary fusion pole-mounted intelligent circuit breaker comprises a fault detection module, a protection action module, a reclosing module and an information reporting module, the fault detection module collects multi-dimensional electrical quantity through a current transformer and a voltage transformer, and judges a fault and identifies the type in combination with a dynamic normal range and a duration threshold. The protection action module calculates the fault distance based on the correction impedance, judges whether to act or not by combining the current flow direction and the protection range, and selects a protection level according to the fault severity; the reclosing module dynamically sets an observation time window, distinguishes instantaneous or permanent faults through a retest verification mechanism, and adaptively adjusts a reclosing strategy; and the information reporting module uploads fault related information. According to the method, the problems of high misjudgment rate, poor protection selectivity, rigid reclosing logic and the like of a traditional circuit breaker are solved, and the accuracy, quickness and self-healing capability of power distribution network fault processing are remarkably improved.

The invention discloses a rigid-flex circuit board slotting process based on a laser depth control technology. The rigid-flex circuit board slotting process comprises the steps that the surface of a rigid layer of a rigid-flex circuit board is pretreated, and a laser sensitive layer is sprayed; cNC depth-controlled milling is adopted to form a grooved rough blank structure on the surface of the pretreated rigid layer; positioning laser is used for scanning, a three-dimensional model is established through collected reflected signals, then layered depth-controlled ablation is conducted, second-power laser is sequentially adopted for fine cutting, third-power laser is sequentially adopted for depth calibration, and a groove body structure is formed; cleaning an interface, scanning a groove bottom area and synchronously introducing low-temperature gas; performing morphology repairing treatment, and generating a periodic micro-nano structure on the groove wall by adopting short pulse laser to form a stress concentration resistant surface; depositing an insulating medium layer, and forming a continuous packaging protection layer on the groove wall and the bottom through a vacuum coating process; the high-precision depth-controlled slotting of the rigid-flex circuit board is realized, and meanwhile, the ultra-low thermal damage and anti-fatigue structure and long-acting environmental stability are realized.

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

An adaptive modular multimodal communication and computing panel includes a multilayer stack with a protective layer transmissive in selected bands, a reconfigurable communication layer operable in phased array, reflectarray, hybrid phased reflector, free space optical, or quantum modes, and electronics with heterogeneous processors. A multi scale interconnect and input and output fabric couples electrical, radio frequency, guided optical, and free space optical domains through interfaces including electro optic transduction and RF or baseband conversion. The fabric may implement programmable true time delay, resonators, and comb referenced timing. A management system coordinates beamforming, sensing, routing, calibration, workload placement, and security. Panels tessellate and connect by electrical, radio frequency, and fiber optic interfaces, supporting hot swappable modules, blind mate connectors, robotic servicing, and anti tamper features. Power and thermal subsystems harvest, store, regulate, and dissipate energy. The architecture scales from chip level modules to vehicle, airborne, maritime, orbital, and deployable systems.

A manufacturing method of a semiconductor structure and the semiconductor structure, the manufacturing method of the semiconductor structure comprising: providing a substrate comprising a first region and a second region; forming a laminated structure formed by alternately stacking a plurality of first material layers and a plurality of second material layers on the first region; first etching is executed, a groove is formed in one end of the laminated structure, and the second area is exposed out of the bottom of the groove; executing second etching, removing part of the plurality of second material layers through the grooves and keeping the plurality of first material layers arranged at intervals; wherein before the second etching is executed, a protection layer is formed on the surface of the second area, and the protection layer at least extends towards the surface of the first area. According to the method, the semiconductor device with relatively high reliability can be obtained.

The invention provides a manufacturing method of an MEMS device and the MEMS device, and the manufacturing method comprises the steps: providing a first wafer which is provided with a groove; a protective layer is arranged in the groove; providing a second wafer, and bonding the second wafer and the first wafer to seal the groove to obtain a first cavity; the second wafer is etched to form a comb tooth structure, and the protection layer is used for protecting the comb tooth structure. According to the embodiment of the invention, the protection layer is arranged in the first cavity of the first wafer as a buffer layer, so that when the second wafer is etched to form the comb tooth structure, the plasma backwash in the over-etching stage can be reduced, the comb tooth structure is further protected, the damage to the bottom of the comb tooth caused by the backwash of etching particles is reduced and solved, and the service life of the comb tooth structure is prolonged. Therefore, the mechanical strength and the anti-failure capability of the device are enhanced.

The embodiment of the invention provides a chip carrier plate and a manufacturing method thereof, a chip packaging structure, and a manufacturing method of the chip carrier plate, and the method comprises the steps: forming a first protection layer on a first surface of a glass substrate, forming a plurality of first through holes in the first protection layer, carrying out the laser induction of the glass substrate through the first through holes, and forming a plurality of induction regions, and in the induction area, etching the glass substrate to form a plurality of second through holes penetrating through the glass substrate, and forming conductive connection parts in the second through holes. The first protection layer with the first through hole is manufactured on one side of the glass substrate, the first protection layer exposes the area, needing laser induction, on the glass substrate, the area, not needing laser induction, on the glass substrate is protected, and it is avoided that when the glass substrate is etched subsequently, etching damage is caused to other positions of the surface of the glass substrate. Therefore, the thickness of the glass substrate can be ensured, and the surface quality such as roughness of the surface of the glass substrate can be ensured.

The invention belongs to the technical field of semiconductor devices, and particularly relates to an optical waveguide device based on a glass substrate, which comprises the glass substrate and a transition layer, an X silicon-based waveguide layer is arranged on the first surface of the transition layer, a heterogeneous material chip layer is integrated on the X silicon-based waveguide layer, the first surface of the X silicon-based waveguide layer is coated with a protective layer, and the protective layer is arranged on the first surface of the transition layer. The protective layer covers the glass substrate, the X silicon-based waveguide layer and the heterogeneous material chip layer at the same time; wherein the transition layer comprises an X element which is the same as that of the X silicon-based waveguide layer, through the above structure, the optical waveguide device with multiple layers of transition function areas is provided, the problems that the surface roughness of a large glass substrate is high, and the warping possibility is higher due to size effect amplification can be solved, and the optical waveguide device is suitable for large glass substrates. On the premise of fully utilizing the advantages of low cost and high performance of the glass substrate, the design of a large-size optical waveguide device for inhibiting packaging warping is realized.

The invention discloses a high-entropy alloy silicon carbide nanofiber composite material and a preparation method and application thereof, a high-entropy alloy is loaded on silicon carbide nanofibers, compared with a carbon fiber material carrier, SiC fibers can form a compact SiO2 protective layer in a high-temperature aerobic environment, further oxidation failure of the internal structure can be prevented, and the high-entropy alloy silicon carbide nanofiber composite material is prepared. And meanwhile, SiC also has relatively high high-temperature stability and weather resistance, so that the high-entropy alloy silicon carbide nanofiber composite material can stably work in an extreme high-temperature oxidation environment (such as a spacecraft thermal protection system and an engine tail gas pipeline) of over 1000 DEG C, and perfectly adapts to a high-temperature wave-absorbing scene.

The invention relates to the field of electromagnetic functional composite materials, and particularly discloses a multi-layer composite structure flexible frequency selective surface material and a preparation method thereof. The ultra-high molecular weight polymer fiber-reinforced polymer-based composite material thin-film mechanical enhanced band-pass frequency selection array sequentially comprises an acrylic acid polyvinylidene fluoride organic polymer coating environment-resistant layer, a metal oxide organic film isolation layer, an ultra-high molecular weight polymer fiber-reinforced polymer-based composite material thin-film mechanical enhanced layer, a band-pass frequency selection layer and a packaging protection layer from top to bottom, and the band-pass frequency selection layer is a hexagonal / circular ring nested band-pass frequency selection pattern array. The packaging protection layer is formed by printing a conductive coating composed of conductive filler / polymer resin matrix, and the packaging protection layer is an ink coating. The flexible frequency selective surface material has the characteristics of light weight, high strength, salt fog / rain / ultraviolet and other severe environments, frequency selective wave transmission and multiple functions, has good gas barrier property, is beneficial to maintaining the shape of an inflatable hangar made of a skin and ensuring normal operation of radar equipment, and has good practical engineering application value.

The utility model discloses a mute floor which comprises a surface treatment layer, a protection layer, a decoration layer, a first carrier, a first buffer layer and a second carrier. The surface treatment layer is arranged on one side of the protection layer, the decoration layer is arranged on the other side of the protection layer, the first carrier is arranged between the decoration layer and the first buffer layer, the first buffer layer is arranged between the first carrier and the second carrier, and the first buffer layer is of a porous structure and / or a net structure. A buffer groove is formed in at least one side face of the first buffer layer and extends to the two ends of the side face. By arranging the floor with the first buffer layer with the porous and / or honeycomb structure, noise is reflected and refracted for multiple times in the porous and / or honeycomb structure, so that sound is attenuated, a sound wave propagation path is prolonged, and the effect of more effectively reducing noise propagation is achieved.

A magnetic data cable is disclosed, including cable body and a data interface connected to both ends of the cable body. The cable body includes a cored wire group and an external protective layer wrapped outside of the cored wire group, a flexible magnetic strip is provided in the outer protective layer, and the flexible magnetic strip is located alongside of the cored wire group and extends parallel to the cored wire group. It is convenient to adjust diameter of the coil after the data cable has been coiled so as to facilitate storing of the data cable, and it is easy to operate.

The invention relates to the technical field of cables, and particularly discloses a high-performance halogen-free flame-retardant flexible power cable. The high-performance halogen-free flame-retardant flexible power cable comprises a core layer, an insulating layer, a flame-retardant layer, a shielding layer and a protective layer which are arranged in sequence, the flame-retardant layer is prepared from the following raw material components in parts by weight: 30 to 40 parts of ethylene-vinyl acetate copolymer, 10 to 20 parts of polyolefin elastomer, 8 to 10 parts of microencapsulated ammonium polyphosphate, 2.5 to 4.5 parts of pentaerythritol, 20 to 30 parts of inorganic flame retardant, 5 to 8 parts of expansible graphite, 2 to 3 parts of diatomite, 0.5 to 1.5 parts of nano kaolin, 2 to 3 parts of zinc borate, 0.1 to 0.5 part of antioxidant and 0.5 to 1.0 part of lubricant. The cable provided by the invention not only has good flame retardant property, but also has certain flexibility.

Provided in the present invention are a flip light-emitting diode chip and a manufacturing method therefor. The flip light-emitting diode chip comprises: a substrate, and an N-type semiconductor layer, an active light-emitting layer, a P-type semiconductor layer, a current spreading layer, a first insulating layer, a Bragg reflective layer, a metal reflective layer, a second insulating layer, a connection metal layer, a third insulating layer and a bonding pad layer, which are sequentially deposited on the substrate. The connection metal layer comprises a reflective layer and a protective layer that are sequentially arranged from bottom to top; the protective layer comprises a first protective parent layer, a second protective parent layer, and a third protective parent layer that are sequentially arranged from bottom to top, the second protective parent layer comprising n first protective sublayers and second protective sublayers that are periodically stacked, the thicknesses of the first protective sublayers gradually increasing linearly toward the third insulating layer, and the thicknesses of the second protective sublayers gradually decreasing linearly toward the third insulating layer.

The invention relates to the technical field of power cables, and discloses an anti-termite fireproof power cable. The cable sequentially comprises a plurality of conductors, a filling layer, a conductor shielding layer and a mica tape fireproof layer from inside to outside, wherein the conductors are wrapped by insulating layers to form insulating wire cores; the filling layer wraps the insulating wire cores to form a circular cable core; the conductor shielding layer wraps the filling layer; the protective assembly comprises a protective layer spirally wound outside the fireproof layer and an expansion strip embedded in the protective layer, a buffer layer wrapping the protective assembly, a steel tape armoring layer wrapping the buffer layer and an outer sheath wrapping the steel tape armoring layer; the protective layer is formed by spirally connecting a plurality of fan-shaped retainers in the axial direction, the retainers are provided with grooves for containing the expansion strips, the outer walls of the retainers are provided with guide strips matched with the guide grooves to achieve stable connection, the expansion strips are heated to expand to fill gaps and insulate heat in a fire disaster, and the fireproof layer maintains insulation. The protection layer, the steel tape armoring and the outer sheath cooperate to achieve termite prevention and stable structure, and the operation safety and reliability of the cable are guaranteed.

The invention discloses a high-strength cable protection tube and a preparation method thereof, and relates to the technical field of cable protection tubes, the high-strength cable protection tube sequentially comprises a protection layer and a deformation heat conduction layer from outside to inside, and the protection layer comprises, by weight, 60-80 parts of polypropylene, 5-8 parts of an anti-wear agent, 3-5 parts of an antioxidant, 5-8 parts of external oxide powder, 5-8 parts of a toughening agent and 3-5 parts of talcum powder. The deformation heat conduction layer comprises the following components in parts by weight: 30-40 parts of a supporting material, 5-8 parts of internal oxide powder, 20-30 parts of silicone oil, 20-30 parts of zirconium tungstate and 10-20 parts of a supporting material. The deformation heat conduction layer is arranged on the inner wall of the protection layer, and the deformation heat conduction layer is composed of silicone oil, a supporting material and the like and can deform to make large-area contact with the cable placed in the protection layer, so that heat of the cable can be transmitted to the protection layer more quickly, and the heat can be transmitted to the outside more quickly; and the heat transfer efficiency to the outside is higher.

The invention discloses an anti-bending flexible cable, which belongs to the technical field of cables, and comprises a protective layer positioned on the outermost layer, an insulating layer positioned on the inner layer of the protective layer, and a plurality of or a plurality of strands of conductors positioned on the inner layer of the insulating layer and distributed along the circumferential direction of the insulating layer in an array manner, the spacing pieces penetrate through the conductors and are distributed in an array mode in the axial direction of the conductors, and all the conductors are distributed at intervals in an array mode in the circumferential direction of the spacing pieces; the cable further comprises arc-shaped anti-bending strips which are located between every two adjacent spacing pieces and penetrate through each conductor or each strand of conductors arrayed in the circumferential direction, and all the arc-shaped anti-bending strips are synchronously bent towards the axis of the cable or synchronously bent back to the axis of the cable. According to the cable, through the collaborative design of the arc-shaped anti-bending strips and the spacing pieces, the anti-bending performance and the supporting strength are guaranteed, meanwhile, light weight, high flexibility and low cost are achieved, the problems that a traditional metal armored cable is large in weight, poor in flexibility and high in cost are effectively solved, and the cable adapts to long-term stable operation in the outdoor complex environment.

The invention provides an inner and outer layer compression-resistant flexible cable. The inner and outer layer compression-resistant flexible cable comprises an inner protective layer, an electric unit, an outer protective layer, a buffer assembly and a supporting assembly, the electric unit is positioned in the inner protective layer; the outer protection layer is arranged on the periphery of the inner protection layer at intervals; the buffer assembly is located between the outer protection layer and the inner protection layer and comprises an outer sliding part and a transverse moving part, one end of the outer sliding part is elastically connected to the first area part of the inner protection layer, and the other end of the outer sliding part is slidably connected to the outer protection layer; the supporting assembly is located in the inner protection layer and comprises a supporting piece, an inner sliding piece and a swinging piece, the electric unit is clamped between the supporting piece and the swinging piece, one end of the inner sliding piece is slidably connected to the supporting piece, the other end of the inner sliding piece abuts against the second area part of the inner protection layer, and the swinging piece is rotatably connected to the inner sliding piece; when the outer sliding part slides towards the side close to the inner protection layer, the outer sliding part can abut against the transverse moving part to slide around the inner protection layer and provide inner pressure for the inner sliding part, and the inner sliding part slides towards the side away from the inner protection layer based on the inner pressure.

An electronic device is provided. The electronic device includes a carrier and a protection layer. The carrier has a predetermined region and includes a pad disposed in the predetermined region. The protection layer is disposed over the carrier and defines the predetermined region. The protection layer is configured to block an encapsulation layer from covering the pad.

The utility model discloses a template embedded type dam face permanent heat preservation protection module. Comprising a heat preservation core layer, a facing anti-seepage protection layer is arranged on the side, close to a concrete pouring formwork, of the heat preservation core layer, an internal pressure-bearing protection layer is arranged on the side, close to dam surface layer crack limiting steel bars, of the heat preservation core layer, and a thermal broken bridge supporting keel is arranged in the heat preservation core layer; an anchoring device is arranged in the area between the internal pressure-bearing protection layer and the dam surface layer crack limiting steel bars. The modular prefabrication and construction method is adopted, the prefabrication and installation method of a single module is simple and efficient, details such as anchoring protection measures are fully considered, the engineering construction operability is high, convenience and high efficiency are achieved, and the construction time of the heat preservation layer is greatly saved.

A display panel can include a first substrate and a second substrate having a display region and a non-display region adjacent to the display region, a thin film transistor and a light emitting element arranged in each of a plurality of subpixels included in the display region, a dam arranged at the non-display region and an end of the display region between the first substrate and the second substrate, and a protective layer disposed on a side surface of the non-display region and a side surface of the end of the display region.

The invention provides a precision manufacturing method of a special-shaped lens, a convex spherical surface and a concave aspheric surface are formed on the front and back surfaces of the special-shaped lens respectively, a chord plane is formed on each of the two sides of the special-shaped lens, and the method comprises the following steps: S1, performing rough grinding forming on set fitting spherical surfaces of the convex spherical surface and the concave aspheric surface of the special-shaped lens; s2, turning a concave aspheric surface; s3, after turning is completed, whether the concave aspheric surface is qualified or not is detected, if yes, the step S4 is executed, and if not, the step S2 is repeated; s4, discharging from the disc, cleaning the special-shaped lens, and protecting the concave aspheric surface by using a protective layer; s5, starting the numerical control machining center, and machining two chord planes by taking the convex spherical surface and the concave surface platform as positioning references; s6, a machine tool is started, the protected concave aspheric surface and the special-shaped matching tool are placed into a vacuum adsorption tool together, a polishing disc is installed, and a polishing program is started; and S7, detecting the surface shape precision and the surface smoothness of the convex spherical surface. According to the method, the edge breaking phenomenon during machining is effectively avoided, and the machining difficulty is reduced.

The invention discloses a colored photovoltaic module which comprises a transparent colored glaze panel, a transparent bonding layer A, a battery layer, a bonding layer B and a back plate which are sequentially packaged in a stacked mode. The transparent colored glaze panel comprises a glass substrate, a transparent colored coating covering the outer side surface of the glass substrate, and a transparent glaze layer covering the outer side surface of the transparent colored coating; the transparent glaze layer is combined with the transparent colored coating through a covalent bond; the main component of the transparent glaze layer is silicon dioxide. The transparent colored coating of the colored photovoltaic module is positioned on the outer surface of the glass panel of the photovoltaic module, so that the defect of glass texture of a traditional photovoltaic module serving as a building material product is overcome; a transparent glaze layer with silicon dioxide as a main component is further arranged outside the transparent colored coating to serve as a protective layer, the adhesion fastness is high, the excellent performance of high hardness, high transparency, super weather resistance, acid and alkali resistance, scratch resistance and stain resistance is achieved, and the colored coating is effectively protected against color fading, falling off and external erosion such as acid rain, ultraviolet and sand wind.

The invention relates to the technical field of packaging structures, in particular to a copper pipe finished product packaging device and method.The copper pipe finished product packaging device comprises a machine table and a winding packaging part installed on one side of the machine table, a round hole allowing a copper pipe to penetrate through is formed in the middle of the machine table, and the winding packaging part is used for winding a packaging belt on the outer wall of the copper pipe in a conveying state; the end portion of the copper pipe is packaged through the redundant packaging belt generated when the copper pipe is wound and packaged, comprehensive packaging work of the copper pipe can be achieved, packaging work of the end portion of the copper pipe and packaging work of the outer wall of the copper pipe can be conveniently completed on one device, the packaging mode and packaging steps are simplified, and the automation degree is improved; the top plate is utilized to extrude and gather the redundant packaging tape and extrude the redundant packaging tape into the copper pipe, so that effective protection layers can be conveniently formed at the end part and the interior of the copper pipe.

The present disclosure describes a method for forming a nitrogen-rich protective layer within a low-k layer of a metallization layer to prevent damage to the low-k layer from subsequent processing operations. The method includes forming, on a substrate, a metallization layer having conductive structures in a low-k dielectric. The method further includes forming a capping layer on the conductive structures, where forming the capping layer includes exposing the metallization layer to a first plasma process to form a nitrogen-rich protective layer below a top surface of the low-k dielectric, releasing a precursor on the metallization layer to cover top surfaces of the conductive structures with precursor molecules, and treating the precursor molecules with a second plasma process to dissociate the precursor molecules and form the capping layer. Additionally, the method includes forming an etch stop layer to cover the capping layer and top surfaces of the low-k dielectric.

The invention relates to the technical field of power transmission and cable monitoring cables, in particular to an anti-interference optical fiber monitoring cross-linked cable and a forming and manufacturing method, and the cable sequentially comprises a cable core layer, a monitoring function layer, an electromagnetic shielding layer, an insulation protection layer and an outer protection layer from inside to outside; the monitoring function layer is tightly wound on the outer surface of the cable core layer in a spiral shape, the electromagnetic shielding layer is located between the monitoring function layer and the insulation protection layer, the electromagnetic shielding layer is of a multi-layer structure, the inner layer of the electromagnetic shielding layer is a permalloy belt, and the outer layer of the electromagnetic shielding layer is a tinned copper woven mesh. And a plurality of rat-proof and ant-proof composite layers are arranged on the outer side wall of the outer protective layer at intervals along the length direction of the outer protective layer. The monitoring function layer is spirally and tightly wound on the outer surface of the cable core layer, the design enables the optical fiber and the cable core layer to be tightly attached, it is ensured that the temperature change and mechanical deformation of the cable core layer can be rapidly transmitted to the optical fiber, and the problem of monitoring lag caused by gaps in a traditional loose tube structure is solved.

The invention relates to the technical field of petroleum well logging, and discloses a fusing type releasing device and method for a well logging headstall, a split brake block is arranged in a second cavity of a lower connector and an outer shell, a heating rod is arranged on the split brake block in a surrounding mode, and the surface of the split brake block is wrapped with a fusing protection layer; the heating rod is attached to the fusing protection layer, the driving end of the high-voltage connector is connected with the power supply end of the heating rod through the lower connector, the heating rod is driven to heat and fuse the fusing protection layer, and after the fusing protection layer is fused, the split braking blocks are separated. The elastic ejector rod assembly abutting against the split brake block integrally moves towards the side of the split brake block, the brake hook is separated from the outer shell, headstall release is achieved, the whole operation can be completed only by opening the high-voltage connector, the operation process is simple, and unified treatment can be conducted on different cables and well depths.

The utility model discloses a reinforcing steel bar protective layer thickness detection device for engineering construction supervision, which comprises two symmetrically arranged brackets, two guide rods arranged between the two brackets, a sliding seat slidably arranged on the two guide rods, and a mounting frame for fixing a reinforcing steel bar protective layer tester, a downward pressing assembly is arranged between the sliding base and the mounting frame, the mounting frame is of a U-shaped structure, the downward pressing assembly comprises a first sliding column fixed to the mounting frame and a first spring arranged on the first sliding column in a sleeving mode, the first sliding column is slidably connected with the sliding base, the two ends of the first spring abut against the sliding base and the mounting frame respectively, and a check block is arranged at the tail end of the first sliding column; according to the reinforcing steel bar protective layer thickness detection device for engineering construction supervision provided by the utility model, in the whole measurement process, the reinforcing steel bar protective layer tester is always kept to be attached to a detection surface and moves along a preset route, so that errors are avoided, and the accuracy of a measurement result is further ensured.

The metasurface array antenna housing comprises a plurality of array units of the same structure, each array unit sequentially comprises a first lightning protection layer from top to bottom, and each first lightning protection layer comprises four copper metal cylinders and a lightning protection top layer drainage metal patch; the second metasurface wave absorbing and transmitting layer comprises a first dielectric substrate, and four quasi-rectangular patches, four lumped resistors, four quasi-triangular patches and four quasi-square rings which are arranged on the upper surface of the first dielectric substrate; the third metasurface wave-transparent layer comprises a square metal patch, and a first circular ring and a second circular ring are etched on the square metal patch. Lightning is guided to the third metasurface wave-transparent layer through the first lightning protection layer, the lightning is conducted to other areas through the metal patch, damage of the lightning to the antenna housing is effectively avoided, and the antenna housing can directly replace a lightning protection strip for use; the structural size is greatly reduced, the angle stability is improved, and integration is facilitated; the copper-clad surface of the third metasurface wave-transparent layer can be used as a metal back plate of the second metasurface wave-absorbing layer, and structural multiplexing is achieved.

An embodiment of the present disclosure relates to the field of photovoltaics, and provides a solar cell and a manufacturing method thereof. The manufacturing method includes the steps of: providing a substrate having a first surface and a second surface facing each other; performing a doping process on at least the first surface to form a doped layer having a first doping element; performing a first laser process on a portion of the doped layer to form an activated portion and leaving the remaining doped layer as a doped portion; performing a first etching process on the first surface, using the remaining doped layer as a dead layer, to remove the activated portion and form a first textured surface; forming a doped polysilicon layer and a silicate glass layer having a second doping element at least on a side of the substrate away from the doped portion; performing a second laser process on at least a portion of the silicate glass layer to form a sparse portion; and performing a second etching process on at least the second surface, using the remaining silicate glass layer as a protective layer, to remove the sparse portion and the doped polysilicon layer facing the sparse portion and form a second textured surface. The first laser process and the second laser process use different laser types, thereby simplifying at least the manufacturing process.