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33 results about "Charge-carrier density" patented technology

Charge carrier density, also known as carrier concentration, denotes the number of charge carriers in per volume. In SI units, it is measured in m⁻³. As with any density, in principle it can depend on position. However, usually carrier concentration is given as a single number, and represents the average carrier density over the whole material.

MOS junction barrier Schottky diode

ActiveCN119947140BPower semiconductor deviceCharge-carrier density
MOS junction barrier Schottky diode relates to the technical field of power semiconductor device. N-type substrate, N-type epitaxial layer, deep P region, slot gate, slot gate oxide layer, conductive enhancement region and isolation oxide layer are arranged between cathode metal and anode metal, the lower surface of the N-type substrate is in contact with the cathode metal, the upper surface is in contact with the lower surface of the N-type epitaxial layer, the upper surface of the N-type epitaxial layer is in contact with the P region, the conductive enhancement region is arranged on the outer surface of the slot gate oxide layer and is in contact with the N-type epitaxial layer, part of the slot gate oxide layer, the conductive enhancement region, the isolation oxide layer and part of the deep P region are respectively in contact with part of the anode metal. The MOS junction barrier Schottky diode structure of the application improves the carrier density at the channel, reduces the channel resistance, and further improves the reverse leakage current characteristics and the forward voltage drop by inserting a slot gate MOS structure in the adjacent P region of the traditional junction barrier Schottky (JBS) diode.
Owner:BEIJING UNIV OF TECH

Thin-film transistor, method for manufacturing the same and display device comprising it

ActiveDE102023125283B4Non-linear opticsCharge-carrier densityDisplay device
Thin-film transistor (100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500) which has: an active layer (ACT); a gate electrode (150) that overlaps at least partially with the active layer (ACT); and a source electrode (160) and a drain electrode (170) spaced apart from each other and each connected to the active layer (ACT); wherein the active layer (ACT) has a first active layer (130), and the first active layer (130) has: a channel section (130n) that overlaps with the gate electrode (150); a first connecting section (CON1) which is connected to a first side of the channel section (130n); and a second connecting section (CON2) which is connected to a second side of the channel section (130n), wherein the channel section (130n) has a crystalline structure, wherein the first connecting section (CON1) has a first amorphous section (130a) which is in contact with the channel section (130n), and wherein the second connecting section (CON2) has a second amorphous section (130b) which is in contact with the channel section (130n), wherein the active layer (ACT) further comprises an active barrier layer (140) which overlaps with and is in contact with the first active layer (130), the active barrier layer (140) comprises: a channel section (140n) that overlaps with the gate electrode (150), a first amorphous section (140a) connected to a first side of the channel section (140n) of the active barrier layer (140); and a second amorphous section (140b) connected to a second side of the channel section (140n) of the active barrier layer (140); wherein the channel section (140n) of the active barrier layer (140) has a crystalline structure, wherein the first amorphous section (140a) and the second amorphous section (140b) of the active barrier layer (140) each have an amorphous structure, and where the charge carrier density of the channel section (140n) of the active barrier layer (140) is lower than the charge carrier density of the channel section (130n) of the first active layer (130), and the active barrier layer (140) further comprises: a first active barrier layer (141) that is in contact with the first active layer (130); and a second active barrier layer (142) which is in contact with the first active layer (130), wherein the first active barrier layer (141) and the second active barrier layer (142) are arranged on opposite sides of the first active layer (130).
Owner:LG DISPLAY CO LTD

Van der waals heterostructure transport device for gate-tunable quantum anomalous hall state

PCT designated stage expiredWO2025188343A3Quantum computersNanoinformaticsMolybdenum tellurideFerroics
A multiple gate system for realizing the quantum anomalous Hall effect, including a top channel electrode which controls carrier density and electric field in a conduction channel, a first dielectric layer for the top channel gate, a patterned contact gate electrode which controls earner density on the contact and screens the top channel electrode's electric field on the contact, and a second dielectric layer for the contact gate, an electrically tunable material comprising semiconducting molybdenum ditelluride in the form of a first atomic sheet and a second atomic sheet, wherein first atomic sheet is rotated planarly from the second atomic sheet by about 2.5 to about 5 degrees, to form a geometrically stacked homobilayer moiré superlattice configured to host ferromagnetic states that spontaneously break time-reversal symmetry, where a perpendicular electric field is applied to the electrically tunable material, tuning the quantum anomalous Hall effect.
Owner:UNIV OF WASHINGTON

Van der waals heterostructure transport device for gate-tunable quantum anomalous hall state

PCT designated stage expiredWO2025188343A2NanoinformaticsMolybdenum tellurideFerroics
A multiple gate system for realizing the quantum anomalous Hall effect, including a top channel electrode which controls carrier density and electric field in a conduction channel, a first dielectric layer for the top channel gate, a patterned contact gate electrode which controls earner density on the contact and screens the top channel electrode's electric field on the contact, and a second dielectric layer for the contact gate, an electrically tunable material comprising semiconducting molybdenum ditelluride in the form of a first atomic sheet and a second atomic sheet, wherein first atomic sheet is rotated planarly from the second atomic sheet by about 2.5 to about 5 degrees, to form a geometrically stacked homobilayer moiré superlattice configured to host ferromagnetic states that spontaneously break time-reversal symmetry, where a perpendicular electric field is applied to the electrically tunable material, tuning the quantum anomalous Hall effect.
Owner:UNIV OF WASHINGTON

Near-ultraviolet microled array with novel quantum well design

PendingUS20260182088A1Electron holeCharge-carrier density
A new design for a near-UV emitting quantum well structure exhibits a small electron-hole wavefunction overlap. The small electron-hole overlap is beneficial for near UV-microLEDs because small overlap results in a high carrier density even at low current densities. Due to the higher carrier density, non-radiative recombination centers are saturated at relatively low current density in the newly disclosed design. The new design is therefore more robust against non-recombination losses at both intrinsic and surface defects, and capable of higher efficiency than conventional designs at low current densities.
Owner:LUMILEDS LLC

Device aging simulation method, device and equipment

The invention discloses a device aging simulation method, device and equipment, relates to the technical field of microelectronic semiconductor device reliability evaluation, and is used for solving the problems of low model precision, poor universality, low calculation efficiency and weak compatibility with device multi-physical field simulation of a semiconductor device reliability evaluation method in the prior art. Comprising the following steps: performing first electrothermal simulation on a target device structure model to generate carrier temperature distribution information and carrier density distribution information in a target device; the target device structure model is a corrected device model; based on the carrier temperature distribution information and the carrier density distribution information, establishing a defect physical model and a gate medium trap capture model by combining a rate equation; determining defect distribution information including spatial distribution in the target device according to the established model; and performing second electrothermal simulation on the target device structure model based on the defect distribution information, and determining aging electrical characteristic information of the target device.
Owner:SEMICON TECH INNOVATION CENT(BEIJING) CORP +1

Preparation method of visible light region LSPR (Localized Surface Plasmon Resonance) catalyst for absorbing and degrading organophosphorus pesticide

The invention belongs to the technical field of photocatalysis, and discloses a preparation method of a visible light region LSPR (Localized Surface Plasmon Resonance) catalyst for absorbing and degrading organophosphorus pesticides. According to the invention, a plasma semiconductor MoO3-x is used as a precursor, shows a strong LSPR effect under incident light, and has high charge carrier density and large specific surface area. Sulfides such as sulfur indium zinc, sulfur indium cadmium and the like are loaded on the surface of the MoO3-x nanosheet through in-situ synthesis. The catalyst forms a Z-type heterojunction structure, not only can preserve photo-generated electrons with high reduction ability, but also can preserve photo-generated holes with high oxidation ability, effectively separates electron-hole pairs, and expands the photoresponse range. The method is suitable for degrading various organophosphorus pesticides such as amidothion, parathion-methyl and the like. The composite material is low in cost, simple to prepare, rich in active sites, large in specific surface area, high in degradation rate and good in stability, and the visible light utilization rate is increased by virtue of the LSPR effect.
Owner:JIANGSU UNIV

Optoelectronic device and method for processing the same

PendingUS20260255730A1Charge-carrier densityContact layer
In an embodiment an optoelectronic device includes a semiconductor layer stack having a planar first semiconductor layer of a first doping type, an active layer and a second semiconductor layer of a second doping type, wherein the second semiconductor layer has a main emission surface layer portion, a contact layer arranged on the first semiconductor layer opposite at least a first portion of the active layer, and a structured contact layer arranged on the second semiconductor layer opposite a second portion of the active layer, wherein the first portion and the second portion are spatially offset in a lateral direction to each other and configured to increase a local charge carrier density in an active region of the active layer partially common to or adjacent to the first and second portions of the active layer, and wherein the active region is defined by a projection of an overlapping section of the first and second portions onto the active layer.
Owner:AMS OSRAM INT GMBH

Method for changing carrier density and electronic device manufactured according to method

PendingCN121773744AElectrolytic capacitorsCharge-carrier densityPhysical chemistry
A method of manufacturing an electronic device, the method comprising: varying a charge carrier density of a conductive material, the conductive material comprising an ionic material, where varying the charge carrier density of the conductive material comprises: varying the charge carrier density of the conductive material when the conductive material is in a state in which ion motion of the ionic material is frozen; and changing the charge carrier density. An electronic device is also described.
Owner:CAMBRIDGE ENTERPRISE LTD

A method of modeling a mos device

The application relates to the technical field of semiconductors, and discloses a modeling method of a MOS device, which comprises discretizing the geometric structure of the MOS device into a three-dimensional cell grid, and defining a state vector containing multi-physical field information for each cell in the three-dimensional cell grid, wherein the state vector at least comprises: carrier density and local electric potential for representing electrical characteristics, carrier average energy for representing quantum effects, local temperature for representing thermal effects, and defect state for representing reliability effects; and for simulating process variability of the device, the initial defect state of each cell in the three-dimensional cell grid is randomly set when the state vector is defined. A double-layer adaptive evolution rule system composed of a meta-learning rule layer and a basic rule layer is set, and the meta-learning rule layer can dynamically adjust the basic rule parameter set used by the basic rule layer according to the local macro state in the neighborhood of each cell.
Owner:SHANGHAI LEWA MICROELECTRONICS TECHNOLOGY CO LTD

Thermoelectric device

UndeterminedDE112024003740T5Charge-carrier densityConductive materials
A method for manufacturing an electronic device, wherein the method comprises: modifying the charge carrier density of an electrically conductive material, wherein the electrically conductive material comprises an ionic material, and wherein the modification of the charge carrier density of the electrically conductive material comprises modifying the charge carrier density while the electrically conductive material is in a state in which the ion motion of the ionic material is frozen. An electronic device is also described.
Owner:CAMBRIDGE ENTERPRISE LTD

Two-dimensional photonic crystal lasers

The two-dimensional photonic crystal laser comprises: a substrate composed of an n-type semiconductor; a p-type cladding layer (p-type semiconductor layer) disposed on the upper side of the substrate and composed of a p-type semiconductor; an active layer disposed on the upper side of the p-type cladding layer; a two-dimensional photonic crystal layer disposed on the upper side of the active layer and formed by periodically disposing different refractive index regions composed of a material having a refractive index different from that of the base material in a plate-shaped base material composed of an n-type semiconductor; a first tunneling layer disposed between the substrate and the p-type cladding layer and composed of an n-type semiconductor having a carrier density higher than that of the substrate; a second tunneling layer disposed between the first tunneling layer and the p-type cladding layer in contact with the first tunneling layer and composed of a p-type semiconductor having a carrier density higher than that of the p-type semiconductor layer; a first electrode disposed on the lower side of or within the substrate; and a second electrode disposed on the upper side of the two-dimensional photonic crystal layer.
Owner:KYOTO UNIV +1

Comsol-based method and device for predicting bubble formation mediated by black phosphorus quantum dots via optical perforation

The application discloses a bubble formation prediction method and device based on COMSOL-mediated black phosphorus quantum dot-mediated optical perforation, and the method comprises the following steps: based on COMSOL, a two-dimensional axisymmetric transient model of solid heat transfer and fluid heat transfer is constructed to obtain a solid heat transfer module and a fluid heat transfer module; a coefficient form partial differential equation interface is set to construct a carrier density equation; according to the carrier density equation, intermediate physical parameters are pre-set; according to the intermediate physical parameters, a heat source condition is pre-set, the solid heat transfer module and the fluid heat transfer module are coupled according to the heat source condition, and a target simulation model is obtained; according to the target simulation model, nanobubble generation is predicted to obtain a bubble formation time, a nanobubble area and a threshold laser flux. The application can improve the accuracy of optical perforation nanobubble generation prediction and can be widely applied to the fields of photo-induced perforation technology and nanobubble technology.
Owner:SOUTH CHINA NORMAL UNIV

Carrier transport simulation method, device, medium, and electronic device

The application discloses a carrier transport simulation method and device, a medium and an electronic device. The application determines initial conditions and / or boundary conditions of carrier transport in a semiconductor device, and determines a Poisson equation and a Schrodinger equation corresponding to a closed quantum model. The carrier density in the semiconductor device is determined based on the initial conditions and / or the boundary conditions, the Poisson equation and the Schrodinger equation, so as to realize simulation of the carrier transport in the semiconductor device, and further realize research on the carrier transport in the semiconductor device.
Owner:ORIGIN QUANTUM COMPUTING TECH (HEFEI) CO LTD

Laminated piezoelectric body and manufacturing method therefor

PCT designated stageWO2025192633A1Vacuum evaporation coatingSputtering coatingIndiumCharge-carrier density
A laminated piezoelectric body according to the present invention comprises: a polymer piezoelectric film; and a transparent conductive layer that is disposed on at least one surface of the polymer piezoelectric film and contains an indium-tin composite oxide as a main component. The ratio of the content of tin atoms to the total amount of indium and tin atoms in the transparent conductive layer is 1-6 mass%, the hole mobility of the transparent conductive layer is 10 cm2 / (V⋅s) to 20 cm2 / (V⋅s), and the carrier density is 1.0 × 1021 cm−3 to 3.0 × 1021 cm−3.
Owner:KUREHA CORPORATION

Van der waals heterostructure transport device for gate-tunable quantum anomalous hall state

PCT designated stage expiredWO2025188343A8Quantum computersNanoinformaticsMolybdenum tellurideFerroics
A multiple gate system for realizing the quantum anomalous Hall effect, including a top channel electrode which controls carrier density and electric field in a conduction channel, a first dielectric layer for the top channel gate, a patterned contact gate electrode which controls earner density on the contact and screens the top channel electrode's electric field on the contact, and a second dielectric layer for the contact gate, an electrically tunable material comprising semiconducting molybdenum ditelluride in the form of a first atomic sheet and a second atomic sheet, wherein first atomic sheet is rotated planarly from the second atomic sheet by about 2.5 to about 5 degrees, to form a geometrically stacked homobilayer moiré superlattice configured to host ferromagnetic states that spontaneously break time-reversal symmetry, where a perpendicular electric field is applied to the electrically tunable material, tuning the quantum anomalous Hall effect.
Owner:UNIV OF WASHINGTON

Multi-layer topological interconnect with proximal doping layer

An interconnect structure including conducting layers of topological semi-metals and / or topological insulators. To increase charge carrier density in the conducting layers, a charge carrier doping layer present on at least one surface of the one or more conductive layers of topological semi-metals. The charge carrying doping layers have a charge carrier density greater than the topological semi-metals and / or topological insulators of the one or more conductive layers.
Owner:INTERNATIONAL BUSINESS MACHINE CORPORATION

Method for porosifying a material and semiconductor structure

A method for porosifying a III-nitride material in a semiconductor structure is provided, the semiconductor structure comprising a sub-surface structure of a first III-nitride material, having a charge carrier density greater than 5×1017 cm−3, beneath a surface layer of a second III-nitride material, having a charge carrier density of between 1×1014 cm−3 and 1×1017 cm−3. The method comprises the steps of exposing the surface layer to an electrolyte, and applying a potential difference between the first III-nitride material and the electrolyte, so that the sub-surface structure is porosified by electrochemical etching, while the surface layer is not porosified. A semiconductor structure and uses thereof are further provided.
Owner:CAMBRIDGE ENTERPRISE LTD

Preparation method of self-doped titanium dioxide nanotube electrode material

The invention relates to the technical field of photoelectric catalytic materials, and discloses a preparation method of a self-doped titanium dioxide nanotube electrode material. The method comprises the following steps: (1) forming a titanium dioxide nanotube array on the surface of a titanium mesh by adopting an anodic oxidation method to obtain a material I; (2) preheating the material I to obtain a material II; (3) in the presence of an ammonium sulfate solution, performing electrochemical reduction reaction by taking the material II as an anode to obtain a product I; and (4) carrying out annealing treatment on the product I at 400-500 DEG C to obtain the self-doped titanium dioxide nanotube electrode material. According to the self-doped titanium dioxide nanotube electrode material prepared by the method, the light response range can be expanded, the carrier density and charge transfer are increased, and the conductivity is improved.
Owner:CHINA UNIV OF PETROLEUM (BEIJING)

Thin film transistor

PendingCN120786938ALow mobilityCharge-carrier density
Various embodiments herein include a thin film transistor (TFT) including a channel layer stack having layers of different mobility. Since the carrier density in the high mobility channel layer and / or the plurality of high mobility channel layers is higher, the TFTs disclosed herein transport a higher total current through the low mobility and high mobility channel layers, which increases the response speed of the TFTs. The TFT further includes a gate structure disposed over the channel layer stack. The gate structure includes one or more gate electrodes, and thus the TFT is a top gate (TG), dual gate (DG), or bottom gate (BG) TFT. The channel layer stack includes a plurality of layers having different mobility. Layers with different mobility impart various benefits to the TFT. The high mobility layer increases the response speed of the TFT.
Owner:APPLIED MATERIALS INC

A doped uiO-66(zr) metal-organic framework material, and methods of making and using the same

The application belongs to the technical field of water treatment, and particularly relates to a doped UiO-66(Zr) metal organic framework material and a preparation method and application thereof. The application changes the energy band structure by doping iron ions on the basis of the UiO-66(Zr) metal organic framework material, increases the carrier density, reduces the electron hole recombination rate, and thus improves the photocatalytic performance. The doped UiO-66(Zr) metal organic framework material is prepared by using a zirconium source, an iron source and terephthalic acid in a polar solvent through a one-step solvothermal method. The doped UiO-66(Zr) metal organic framework material has excellent anti-interference performance and cycle performance, can be applied to photocatalytic removal of heavy metals such as uranyl ions, lead ions and copper ions, and organic pollutants such as antibiotics and pesticides in wastewater, and has a very high removal rate and effect.
Owner:NANHUA UNIV

Laser-surface-treated separator plate, method for producing same, and methods for characterizing same

A metal separator plate for an electrochemical system, having at least a first laser-surface-treated region with a first passivation layer and a second region with a native or reconstructed passivation layer, wherein, as a result of the laser surface treatment, the first passivation layer has: a charge carrier density that is increased by at least 10%, and a surface area that is no more than 5% larger in relation to the native or reconstructed passivation layer. The present disclosure further relates to methods for producing and characterizing such a separator plate.
Owner:REINZ DICHTUNGS G M B H

Near-ultraviolet microled array with novel quantum well design

PCT designated stageWO2026142811A1Electron holeCharge-carrier density
A new design for a near-UV emitting quantum well structure exhibits a small electron-hole wavefunction overlap. The small electron-hole overlap is beneficial for near UV-microLEDs because small overlap results in a high carrier density even at low current densities. Due to the higher carrier density, non-radiative recombination centers are saturated at relatively low current density in the newly disclosed design. The new design is therefore more robust against non-recombination losses at both intrinsic and surface defects, and capable of higher efficiency than conventional designs at low current densities.
Owner:LUMILEDS SINGAPORE PTE LTD +1

Semiconductor device

To suppress variation in electrical characteristics and to improve reliability in a transistor including an oxide semiconductor.SOLUTION: One embodiment of the present invention is a semiconductor device including a transistor. The transistor includes a first conductive film functioning as a first gate electrode, a first gate insulating film, a first oxide semiconductor film including a channel region, a second gate insulating film, and a second oxide semiconductor film and a second conductive film functioning as a second gate electrode. The second oxide semiconductor film includes a region having a higher carrier density than the first oxide semiconductor film. The second conductive film includes a region in contact with the first conductive film.SELECTED DRAWING: Figure 1
Owner:SEMICON ENERGY LAB CO LTD

Integrated optical amplification with continuous-wave light injection

Described herein are optical systems that reduce channel crosstalk in semiconductor optical amplifiers (SOAs) without sacrificing suppression of noise due to amplified spontaneous emission, thereby overcoming trade-offs existing in conventional amplifiers. These schemes involve injection of continuous wave (CW) light into the SOA. The CW assist light may be provided at a wavelength within the transparency region of an SOA. Injecting CW assist light in the transparency region results in a speed-up of the carrier lifetime and gain recovery. Application of CW assist light in the transparency region establishes a feedback mechanism by which the more carriers are depleted, the faster the carrier recovery. Furthermore, the injection of CW light results in pinning of the carrier density and constant gain. CW light injection can be used in SOAs that use bulk, quantum-well, and quantum dot gain material.
Owner:LIGHTMATTER INC

POWER SEMICONDUCT COMPONENTS AND SEMICONDUCT TRANSISTORS PROTECTED FROM HOT LOAD CARRIERS, AND A MANUFACTURING METHOD FOR THEM

ActiveDE102011051670B4Semiconductor/solid-state device manufacturingDielectricCharge-carrier density
Semiconductor transistor (100, 200, 201, 207, 250, 300, 400, 401, 402, 403), comprising: a semiconductor body (40), comprising: a first semiconductor region (1) comprising majority charge carriers of a first charge type; and a dielectric region (30, 31, 81) comprising a first charged dielectric section (81) and a second charged dielectric section (30), wherein the second charged dielectric section (30) comprises solid charges of the first charge type, the first charged dielectric section (81) comprises a first maximum charge carrier density per area, and the second charged dielectric section (30) comprises a second maximum charge carrier density per area of ​​the solid charges, which is greater than the first maximum charge carrier density per area. wherein the first semiconductor region (1) forms an insulator-semiconductor interface (25) with at least the second charged dielectric section (30), and wherein the dielectric region (30, 33, 81) is arranged between the first semiconductor region (1) and a gate electrode (11) and between the first semiconductor region (1) and a field plate (12).
Owner:INFINEON TECH AUSTRIA AG

Semiconductor light-receiving element and method of producing same

PendingUS20250344546A1Final product manufactureImpurity diffusionCharge-carrier density
Provided is a semiconductor light-receiving element having high light reception sensitivity and high ESD withstand voltage. The semiconductor light-receiving element (100) includes an n-type InP substrate (110), an n-type InGaAs light-absorbing layer (130), and an InP window layer (140). A p-type impurity diffusion region (150) that reaches an upper part of the n-type InGaAs light-absorbing layer (130) is formed in the InP window layer (140). The n-type InGaAs light-absorbing layer (130) has a thickness of 2.2 μm or more and a carrier density due to an n-type impurity of 2.5×1015 / cm3 or more.
Owner:DOWA ELECTRONICS MATERIALS CO LTD

Method, computer program, and system for determining respective transport properties of majority as well as minority charge carriers in a sample

The invention relates to method for determining respective transport properties of majority as well as minority charge carriers in a sample (107) comprising the majority and the minority charge carriers that correspond to electrons and holes or vice versa. The method particularly allows to determine the charge carrier density of the majority charge carriers and the charge carrier density of the minority charge carriers. For the method, a plurality of Hall measurement trials is performed on the sample (107), wherein during each Hall measurement trial, the sample (107) is exposed to an illumination intensity I, wherein a Hall coefficient and a conductivity are acquired from each Hall measurement trial, wherein in a first Hall measurement trial, the sample (107) is exposed to a first illumination intensity I1, in the range of zero to 0.02 suns, particularly wherein the first illumination intensity is zero, and a first Hall coefficient RH(I1) and a first conductivity σ(I1) are acquired, wherein from the first Hall coefficient and the first conductivity, a carrier mobility μ1 is determined, wherein in a second measurement trial, the sample (107) is exposed to a second illumination intensity I2 and a second Hall coefficient RH(I2) and a second conductivity σ(I2) are acquired, wherein from the second Hall coefficient and the second conductivity, a second carrier mobility μ2 is determined, wherein the second illumination intensity I2 is so high that a charge carrier density of electrons and a charge carrier density of holes in the sample (107) are identical, that the second Hall coefficient asymptotically approaches zero and that a second Hall mobility obtained from the product of the second Hall coefficient and the second conductivity asymptotically approaches a constant value, wherein a third carrier mobility μ3 is determined from the first and the second carrier mobility, particularly by subtracting the second carrier mobility from the first carrier mobility if the Hall coefficient has the same sign for the first and the second illumination intensity or by adding the second carrier mobility to the first carrier mobility if the Hall coefficient changes its sign for the first and the second illumination intensity, wherein the first carrier mobility μ1 is assigned to, particularly corresponds to a mobility of the majority charge carriers, μ2 is assigned to, particularly corresponds the absolute value of the difference between hole and electron mobility, and the third carrier mobility μ3 is assigned to, particularly corresponds to a mobility of the minority charge carriers in the sample (107). The invention also relates to a computer program and a system for determining respective transport properties of majority as well as minority charge carriers in a sample (107).
Owner:HELMHOLTZ-ZENTRUM BERLIN FÜR MATERIALIEN UND ENERGIE

Ultrafast electro-optical modulation device and method

ActiveCN114488573BNon-linear opticsPotential differenceCharge-carrier density
The present invention relates to the field of information technology, and discloses an ultrafast electro-optical modulation device and method thereof. The device includes a first conductor, a second conductor, and a third conductor. The first conductor and the second conductor form an antenna structure; the antenna structure receives an external modulated electrical signal. The third conductor is located within the antenna structure; the third conductor is a micro-nano structure, and there is a portion on the micro-nano structure with a curvature radius of less than 10 nanometers; the modulation method is that the light to be modulated is enhanced by the antenna structure and then excited at the third conductor to generate a localized spatial light field; the potential difference caused by the modulated electrical signal between the first conductor and the second conductor affects the carrier density distribution in the micro-nano structure; the change in the carrier density distribution changes the properties of the spatial light field, thereby achieving modulation of the input light. The present invention is suitable for modulation of light in the visible and infrared bands, has the advantages of ultrafast modulation speed and ultra-low power consumption, and has a simple structure, which is conducive to secondary design optimization and integrated manufacturing.
Owner:HUAZHONG UNIV OF SCI & TECH

Method for electrochemically etching a semiconductor structure

A method for etching a semiconductor structure is provided, the semiconductor structure includes a sub-surface quantum structure of a first III-V semiconductor material, beneath a surface layer of a second III-V semiconductor material having a charge carrier density of less than 5×1017 cm−3. The sub-surface quantum structure may include, for example, a quantum well, or a quantum wire, or a quantum dot. The method includes the steps of exposing the surface layer to an electrolyte, and applying a potential difference between the first III-V semiconductor material and the electrolyte, to electrochemically etch the sub-surface quantum structure to form a plurality of nanostructures, while the surface layer is not etched. A semiconductor structure, uses thereof, and devices incorporating such semiconductor structures are further provided.
Owner:CAMBRIDGE ENTERPRISE LTD