The invention discloses a heat dissipation shielding device packaging structure and a process thereof. The process comprises the following steps: mounting a film block on a substrate, stacking a
metal block on the film block, integrally packaging and
grinding to
expose the
metal block,
etching a packaging material to form a groove, and exposing the surface of the substrate at the bottom of the groove; an
adhesive layer is coated on the etched covering surface, and an
adhesive layer is also coated in the groove;
electroplating a circuit:
electroplating a circuit layer on the surface of the
adhesive layer along the adhesive layer
coating path, and continuing to encapsulate the adhesive layer and the circuit layer; turning over the whole packaging body up and down, exposing the adhesive layer at the position of the film block and the groove, removing the film block, horizontally
grinding the surface until the circuit layer at the groove is exposed, and exposing the
metal block at the same time; according to the invention, the circuit layer is used as an internal shielding structure, the
displacement current is absorbed and guided to the ground, the near-
field intensity is reduced, the internal parasitic
coupling is inhibited, the distribution of a local
electric field is controlled, and a first barrier is formed.