Radio module (100, 150, 160, 200, 250, 300, 400, 600), which includes the following: a
semiconductor package (102, 202, 402, 602) on which at least one
chip (120, 208, 308, 404, 606) and a first
coupling pad (124) are arranged, wherein the
semiconductor package comprises a first
dielectric material (108, 110, 112); and An antenna housing (126, 162, 220, 314, 406, 614) attached to a
semiconductor package, comprising at least one radiative element (140, 224) and a second
coupling pad (138, 166, 222, 318) communicatively coupled to the first
coupling pad, wherein the at least one radiative element is designed to wirelessly transmit or receive a
signal, wherein the antenna housing comprises a second
dielectric material (132, 134, 164), wherein the first coupling pad is inductively or capacitively coupled to the second coupling pad, and wherein the radiative element is connected to the second coupling pad via an
electrically conductive path.