366 results about "Stripline" patented technology

The invention discloses a differential signal transmission link, a high-speed differential signal transmission composite chip and an intra-core differential signal transmission link configuration method. A strip line is arranged in a perforated cylinder in a penetrating manner, two differential microstrip lines are horizontally arranged at two ends of the perforated cylinder, one end of one differential microstrip line is connected with the upper end of the strip line, and one end of the other differential microstrip line is connected with the lower end of the strip line; the conductor strip and the two grounding strips in each differential microstrip line are arranged on the total slide glass side by side in the length direction of the total slide glass, the conductor strip is arranged between the two grounding strips, and the multiple capacitors and the multiple inductors are alternately arranged on the conductor strip in the length direction of one side of the conductor strip. The plurality of conductive blocks are uniformly arranged on the conductor belt along the length direction of the other side of the conductor belt; a high-bandwidth storage chip and a GPU chip in the high-speed differential signal transmission composite chip are horizontally arranged on a PCB composite board in parallel, and a differential signal transmission system is arranged among the PCB composite board, the high-bandwidth storage chip and the GPU chip in a penetrating mode.

The utility model discloses a millimeter wave chip packaging structure based on a substrate integrated waveguide and an artificial magnetic conductor, which relates to the technical field of millimeter wave chip packaging, and comprises a chip, a cover plate and a base, the cover plate is in sealing fit with the base, the chip is arranged in the base, and the cover plate comprises a metal flat plate and a plurality of metal columns connected below the metal flat plate and distributed in an array. The metal column is not contacted with the base; the base comprises a frame, an SIW substrate, a direct current feed terminal and a heat sink, a first groove is formed in the center of the upper surface of the heat sink, and second grooves are formed in the two sides of the first groove and communicated with the first groove. According to the utility model, the SIW substrate is adopted to replace a traditional strip line terminal to serve as the millimeter wave input end and the millimeter wave output end of the shell, and the conductive materials on the upper surface and the lower surface of the SIW substrate are titanium tungsten / nickel / gold in sequence, so that the structure is simple, the processing technology is simple, the assembly technology is simple, the price is low, and the like; and the cable also has the advantages of wide working frequency band, large bearing power, small reflection loss, small transmission loss and the like, and also has the advantages of static electricity prevention and lightning protection.

Disclosed is a packaged semiconductor device comprising a semiconductor die comprising a MMIC having a differential output; a package substrate, comprising first second and third metal layers, and electrically connected to the semiconductor die by a plurality of pillars between the semiconductor die and the first metal layer, wherein the first and third metal layers comprise a ground plane, and the second metal layer, therebetween, comprises a single-ended stripline; wherein the differential output is galvanically connected to the first metal layer by a pair of pillars aligned along a first axis; wherein the packaged semiconductor device comprises a balun coupler between the differential output, and the single-ended stripline aligned along a second axis; wherein the balun coupler comprises an opening in the first metal layer, the opening comprising two arms extending in a first direction parallel to the second axis.

A dual-frequency and dual-circularly-polarized transmit-array antenna with independently controllable beams includes a planar broadband circularly polarized feed array and a planar transmit-array, the planar broadband circularly polarized feed array being placed near a focal plane of the planar transmit-array. The planar broadband circularly polarized feed array includes K-band left / right-handed circularly polarized feeds and Ka-band left / right-handed circularly polarized feeds that are integrated in the same plane. The planar transmit-array includes K-band and Ka-band dual-circularly-polarized phase shifting cells that are periodically staggered in a shared-aperture manner and based on an architecture of receiving antenna-phase shifting stripline-transmitting antenna. The antenna realize independent adjustment of right-handed and left-handed circularly polarized transmit phases in the K-band and the Ka-band, and it possesses the advantages such as miniaturization, low profile, and easy integration, and so on, thus having significant application prospects in fields such as satellite communications.

The invention discloses a broadband millimeter wave magnetoelectric dipole filtering antenna unit and a filtering array, the antenna is realized by adopting a multi-layer printed circuit board, and the antenna comprises a radiation layer printed circuit board and a feed layer printed circuit board. The radiation layer printed circuit board is provided with a magnetoelectric dipole radiator, and an electric dipole patch etched with an H-shaped gap reduces the size of the radiator while achieving low-frequency good filtering. A substrate integrated waveguide (SIW) cavity is arranged around the magnetoelectric dipole radiator, so that surface waves are suppressed, and the overall suppression effect of a stop band is enhanced. A strip line fed by a coaxial probe and a shielding SIW cavity structure are integrated on a feed layer printed circuit board, and the feed structure generates two radiation zero points at high frequency, so that good filtering response is realized. The antenna provided by the invention has the advantages of wide frequency band, small size, high out-of-band rejection level and frequency selectivity.

Disclosed is a packaged semiconductor device, comprising: a semiconductor die comprising an MMIC, the MMIC having a differential output; a package substrate including a first metal layer, a second metal layer, and a third metal layer, and electrically connected to the semiconductor die through a plurality of pillars between the semiconductor die and the first metal layer, where the first metal layer and the third metal layer include a ground plane, the second metal layer between the first metal layer and the second metal layer comprises a single-ended strip line; wherein the differential output is galvanically connected to the first metal layer through a pair of struts aligned along a first axis; wherein the packaged semiconductor device comprises a balun coupler between the differential output and the single-ended stripline aligned along a second axis; wherein the balun coupler comprises an opening in the first metal layer, the opening comprising two arms extending in a first direction parallel to the second axis.

The invention discloses a PCB wiring design method and system considering a pulse current fusing effect, and relates to the technical field of PCB design. The method comprises the following steps: based on a differential impedance design principle, including design rules of a differential microstrip line and a differential strip line, determining parameters such as the width, the thickness, the line spacing and the medium thickness of a wire so as to meet the impedance value requirement; based on the heat balance equation of the current-carrying conductor, a current conductor heating model and a current-carrying conductor heat dissipation model are established; on the basis of differential impedance design and in combination with the proposed binary particle swarm optimization algorithm, the electromagnetic compatibility factor can be comprehensively considered, the problems of low efficiency and electromagnetic compatibility existing in large-scale wiring design are effectively solved, rapid and accurate design of large-scale wiring can be achieved through an efficient calculation process, and the method is suitable for large-scale wiring design. The design efficiency and quality are remarkably improved, and the design requirement for the routing pulse fusing effect of a high-speed PCB signal is met.

The invention provides a filtering patch antenna based on three-dimensional packaging integration, which mainly comprises five layers of dielectric substrates, four layers of bonding plates and an integral circuit structure, the whole circuit structure comprises a signal transmission metal column, a coupling strip line, a quarter-wavelength strip line resonator, an open-circuit strip line branch knot, a feed strip line, a microstrip patch, a grounding metal column and a grounding plate. The novel filtering antenna provided by the invention has the characteristics of high integration level, miniaturization, high selectivity, wide stop band and packaging, and can be well applied to the field of wireless communication systems.

The present disclosure relates to flexible printed circuit boards (FPCBs) for augmented reality (AR) eyewear. Disclosed examples provide an FPCB with air gaps for enhanced bending flexibility and an Electromagnetic Interference (EMI) film for consistent ground reference, enabling high-speed signal transmission with controlled impedance. The FPCB may include asymmetrical dielectric thicknesses and a crosshatch pattern in the ground reference layer to further support signal integrity and mechanical durability.

The invention discloses a battery connection module, a battery connection assembly and a battery connection system. The battery connection module comprises a busbar and a connector. The busbar is used for being electrically connected to a battery cell. A connector is mounted on the busbar for electrically connecting the busbar to the wires of the ribbon cable. The connector includes: a first housing; and a first terminal disposed in the first housing. The bottom of the first terminal is exposed out of the bottom of the first shell and is welded to the busbar, the first terminal is provided with a wire clamping structure, and the wire clamping structure is used for clamping a wire so as to be electrically connected with the wire. According to the invention, the battery connection module or the temperature detection module can be independently replaced without replacing the whole battery connection assembly or the whole battery connection system, so that the repair and maintenance cost can be saved. In addition, an expensive flexible printed circuit board does not need to be used, and only a cheap strip-shaped cable needs to be used, so that the cost can be greatly reduced.

The invention provides an HTCC-based capacitance compensation type three-dimensional compact power divider, which is characterized in that an input end and an output end are in a microstrip line tap feed mode, but when 1 / 4 wavelength impedance matching is carried out, through quasi-coaxial transmission and strip line transmission, the longitudinal distance is increased through quasi-coaxial transmission, and the width of a transmission line is reduced through strip line transmission, so that the transverse size is reduced; the chip capacitors are additionally arranged at the two ends of the output radio frequency, the chip capacitors are connected to radio frequency signals through the metal blocks, impedance matching of the signals is carried out by changing the capacitance values of the chip capacitors, phase compensation is carried out at the same time, and phase control is more accurate. The chip capacitor is welded between the metal block and the radio-frequency signal, impedance matching and phase compensation are achieved, the welding difficulty is lower than that of gold wire welding, the welding area is large, the connectivity with the radio-frequency signal is guaranteed, the possibility of pseudo soldering is reduced, the requirement of the device for air tightness is lowered, meanwhile, the capacitance value of the chip capacitor is conveniently replaced, and the cost is reduced. Impedance matching and phase compensation are realized.

The invention discloses a non-uniform compression high-order mode + / -45-degree dual-polarized base station antenna. The non-uniform compression high-order mode + / -45-degree dual-polarized base station antenna comprises a single-layer dielectric substrate, two pairs of non-uniform compression five-order mode dipoles and two pairs of fundamental mode dipoles, wherein the two pairs of non-uniform compression five-order mode dipoles are printed on the single-layer dielectric substrate; a balun coupling feeding mode is adopted, and SMA is used for exciting a high-order mode dipole and a fundamental mode dipole to generate radiation. According to the non-uniform compression high-order mode + / -45-degree dual-polarized antenna, due to the introduction of the non-uniform compression high-order mode dipole, the gain is effectively improved, the phase of an electric field is adjusted through the bending of the coplanar strip line, the amplitude of the electric field is adjusted through the adjustment of the size of the coplanar strip line and the design of the reflecting plate, and the cross polarization ratio is effectively improved.

The invention belongs to the technical field of microwave antennas, and particularly provides an ultra-low-profile wide-angle scanning ultra-wideband tight coupling phased-array antenna based on double mountain-shaped dipoles. The ultra-wideband antenna comprises an ultra-low-profile wide-angle scanning ultra-wideband radiation structure (I) based on double-E-shaped dipoles, namely an improved double-E-shaped dipole radiation structure; a feed strip line and a balun structure (II), namely a strip line feeder using a gradually changed defected ground on a vertical plane and a balun structure at the tail end; and the feed microstrip line structure (III) is a microstrip line feeder line on a horizontal plane. According to the invention, the improved double-E-shaped radiation structure is applied to the tightly-coupled antenna, which is equivalent to the introduction of a plurality of LC parallel matching branches in a unit aperture, so that the impedance matching of an array can be greatly improved, especially the impedance matching of low frequency is improved, the low-frequency bandwidth is expanded, and the scanning capability is improved at the same time.

The invention provides a multi-band composite high-integration TR assembly. The multi-band composite high-integration TR assembly comprises a shell, a front multi-layer board, a back multi-layer board, a C / X / Ku band receiving and transmitting circuit, a C / X / Ku band single receiving circuit and a Ka band receiving and transmitting circuit, wherein the front multi-layer board and the back multi-layer board are connected in the shell, the C / X / Ku band receiving and transmitting circuit is connected with the front multi-layer board, and the Ka band receiving and transmitting circuit is connected with the back multi-layer board. The low-cost scheme design of an all-solid-state microwave multilayer board suitable for batch production and testing is adopted, ports and transmission line layout are reasonably designed, multi-band composite mode transmission is achieved in the form of the front face and the back face, a C / X / Ku-band transmitting circuit and an H-polarization receiving circuit are integrated on the front face, and the transmission efficiency is improved. A C / X / Ku frequency band V polarization receiving circuit and a Ka frequency band receiving and transmitting circuit are integrated on the reverse side, different functional circuits are respectively transmitted through a microstrip line and a strip line through an interface circuit structure covering 1-40 GHz and an in-board vertical transition structure, the isolation degree of different circuits is improved, mutual crosstalk between different signals is avoided, and the transmission efficiency is improved. And the functions of high integration, high consistency, ultra wide band, numerical control phase shift, numerical control attenuation and the like of the assembly are realized.

A millimeter-wave antenna module includes a circuit board and a plurality of millimeter-wave antenna structures. Each of the millimeter-wave antenna structures includes a substrate assembly, a feeding opening structure, a feeding stripline, and a shielding cover. The feeding opening structure and the feeding stripline are each disposed in the substrate assembly, and a portion of the feeding stripline is exposed in the feeding opening structure. The feeding opening structure is covered by the shielding cover, a side of the shielding cover has an opening, and a height of the shielding cover is increased along a direction toward the opening. The feeding stripline is configured to emit an electromagnetic wave signal in a single and horizontal direction through the feeding opening structure and the shielding cover.

The invention relates to the technical field of satellite communication, in particular to a high-gain phased array receiving antenna system for low-orbit satellite communication, which comprises a radiation feed integration module, a beam phase mapping module, a digital beam forming module, a signal amplification module, a protection packaging module and a performance verification module. Stacking strip line feed networks and performing electromagnetic coupling to obtain an initial radiation channel; receiving and analyzing a beam control instruction through an embedded circuit, extracting a target beam pointing angle and mapping the target beam pointing angle into a phase offset; generating a digital phase control word according to the phase offset, and applying the digital phase control word to the radio frequency signal to complete phase calibration; a transistor with a low-noise amplification structure is used for enhancing the calibrated signal energy; the wave-transparent front cover covers the radiator, and the electromagnetic shielding rear cover wraps the internal components to form an assembly in a sealing manner; and verifying the gain and beam switching rate of the assembly in the typical frequency band of the low-orbit satellite. According to the invention, the low-orbit satellite communication signal receiving efficiency can be improved.

A magneto-electric dipole antenna array includes a substrate and at least one antenna unit. Each of the at least one antenna unit includes an electric-dipole component, a magnetic-dipole component, a first feeding probe, a second feeding probe and a stripline. The electric-dipole component is disposed on an upper surface of the substrate. The magnetic-dipole component is disposed in the substrate and between the upper surface and a lower surface of the substrate, and is electrically connected to the electric-dipole component. The first feeding probe is disposed on the upper surface of the substrate for vertical polarization. The second feeding probe is disposed in the substrate and between the upper surface and the lower surface of the substrate for horizontal polarization. The stripline is disposed in the substrate and between the first feeding probe and the second feeding probe for capacitive coupling.

The invention provides a strip line microwave sensor with an electromagnetic shielding structure, and relates to the technical field of microwave sensing, the sensor comprises a dielectric substrate, a strip line structure, at least one sensing resonance unit and a plurality of conductive connecting pieces, the strip line structure is arranged in the dielectric substrate and comprises a central conductor located in the dielectric substrate, a top-layer grounding plane arranged on the top surface of the dielectric substrate and a bottom-layer grounding plane arranged on the bottom surface of the dielectric substrate; the sensing resonance unit is arranged on the top-layer grounding plane and generates electromagnetic coupling with the central conductor; the plurality of conductive connecting pieces penetrate through the dielectric substrate so as to electrically connect the top layer grounding plane with the bottom layer grounding plane; and the plurality of conductive connecting pieces are arranged along the edge of the dielectric substrate so as to form an electromagnetic shielding structure for restraining an electromagnetic field between the top-layer grounding plane and the bottom-layer grounding plane. According to the invention, the environment robustness of the microwave sensor can be improved while high sensitivity is maintained.

To provide a bond ply capable of combining low dielectric tangent and dimensional stability.SOLUTION: A bond ply comprises a first adhesive layer, a polyimide layer and a second adhesive layer, in which a) a thickness of an entire bond ply is in the range of 50 μm or more and 300 μm or less, and a ratio of the thickness of the polyimide layer to the thickness of the entire bond ply is 0.2 or more and 0.9 or less, b) after drying at 80°C for 1 hour, the moisture absorption measured after conditioning for 24 hours under constant temperature and humidity at 23°C and 50% RH is 0.4 wt.% or less, and c) the storage elastic moduli at 50°C of the first adhesive layer and the second adhesive layer are each independently 1800 MPa or lower, and the maximum value of the storage elastic moduli at 180 to 260°C are each independently 800 MPa or less.SELECTED DRAWING: None

The invention discloses a testing device for a multichannel millimeter wave radio frequency chip, and relates to the technical field of radio frequency chip testing. The device comprises a structural body, a multilayer circuit board fixed on the structural body, and a waveguide cover plate combined with the structural body to form a waveguide. A substrate integrated waveguide and a strip line are integrated in the multilayer circuit board, and vertical conversion between a waveguide signal and an onboard signal is realized through a waveguide-microstrip transition structure. Through the integrated and double-sided design of the structural body, the multilayer board and the radio frequency link, the substrate integrated waveguide is used for vertical transmission of radio frequency signals, and the strip line is used for transmitting power supply and control signals, so that the problems that a traditional testing device is large in size, and ports of a W-waveband multichannel chip are dense and not easy to test are effectively solved; miniaturization, high integration and test convenience of the test device are realized.

The invention discloses a small broadband cavity-backed radiator, which belongs to the technical field of electromagnetic fields and microwaves and comprises a reflection cavity, a loading medium, a printed balun, a printed oscillator, a low-density medium support and double leads. The low-density medium support is used for supporting the printed oscillator; the printed balun and the printed oscillator are electrically connected through double leads; the loading medium is used for adjusting the impedance frequency characteristic of the printed oscillator in the reflection cavity; the printed Balun adopts a strip line-flat plate line-parallel double-line structure and is used for realizing unbalanced-balanced transmission mode conversion and impedance conversion of 3: 1 bandwidth; and the printed oscillator is used for radiating electromagnetic energy and is matched with the multi-ring-groove loading medium and the printed Balun to realize impedance-frequency characteristic balance within a 3: 1 bandwidth range. The small broadband back cavity radiator can effectively solve the problems that in the prior art, the caliber of a reflection cavity of a traditional broadband back cavity radiator is large, the loading effect is not ideal when the bandwidth of a directional diagram is 4 GHz or above, and directional diagram distortion occurs.

The utility model aims to provide a strip line broadband phase shifter. The strip line broadband phase shifter comprises a substrate I, a substrate II and a substrate III, the top surface of the substrate I is integrally covered with a metal layer I, and the bottom surface of the substrate III is integrally covered with a metal layer II; a main line I, a main line II and a Port2 port are respectively arranged on the bottom surface of the substrate I and the top surface of the substrate II; and a main line III, a main line IV, a reference line, a Port 1 port, a Port 3 port and a Port 4 port are respectively arranged on the bottom surface of the substrate II and the top surface of the substrate III. The antenna is small in electromagnetic radiation, is low in radiation loss, is high in anti-interference capability, and can be suitable for occasions where a phased array radar is high in anti-interference capability.

The present disclosure relates to a stripline radio frequency device, comprising: an annular side wall, a bottom wall, and a cavity formed by the annular side wall and the bottom wall, wherein two filters are provided in the cavity, and the two filters respectively comprise metal conduction strips, the two metal conduction strips are connected via a common conduction strip, and the two metal conduction strips are respectively suspended and mounted on the bottom wall. In the technical solution provided by the embodiment of the present disclosure, a cavity is provided by the bottom wall and the annular side wall, and two filters are provided in the cavity, and respectively comprise metal conduction strips, the two metal conduction strips are respectively suspended and mounted on the bottom wall, and are connected via a common conduction strip, thereby simplifying the device structure and reducing the difficulty of assembly.

An interconnect substrate includes a first interconnect layer, a first insulating layer covering a side surface and a lower surface of the first interconnect layer, a second insulating layer disposed on the first insulating layer and covering an upper surface of the first interconnect layer, a second interconnect layer formed on a lower surface of the first insulating layer, and a third interconnect layer formed on an upper surface of the second insulating layer, wherein the second interconnect layer includes a first ground plane, wherein the third interconnect layer includes a second ground plane, and wherein the first ground plane, the first insulating layer, the first interconnect layer, the second insulating layer, and the second ground plane constitute a stripline.

The present invention discloses a millimeter-wave frequency band stripline probe antenna based on a microwave PCB. The antenna comprises a tapered horn, an air waveguide, a microwave PCB upper core board, a prepreg sheet (PP), a microwave PCB lower core board, and metalized vias. The microwave PCB upper core board, the prepreg sheet (PP), the microwave PCB lower core board, and the metalized vias are sequentially stacked and pressed together to form a microwave multilayer PCB. The tapered horn is connected to the air waveguide and then fixed to the upper surface of the microwave multilayer PCB by screws, forming a millimeter-wave frequency band stripline probe antenna. The present invention has the advantages of large relative bandwidth, low insertion loss, small standing wave, and adjustable antenna gain. Furthermore, the antenna has a simple and compact structure, low cost, and is easily integrated with a millimeter-wave chip on a microwave PCB.

The invention discloses a high-isolation low-loss filtering structure and method for a PCB strip line. According to the high-isolation low-loss filtering structure provided by the invention, the main transmission strip line, the filtering auxiliary strip line with the spur line structure and the grounding layer with the hollowed-out area are integrated in the PCB, so that external discrete filter elements and welding procedures and shielding separation cavities required by the external discrete filter elements are effectively omitted, and therefore, the size of a module is remarkably reduced; weight and complexity. Meanwhile, due to the integrated design, impedance discontinuity and signal reflection caused by the fact that signals are converted between the inner layer and the surface layer of the PCB through the via holes are avoided, and signal integrity is guaranteed. And finally, on the premise of not introducing additional elements, high-performance filtering is realized, and an effective solution is provided for miniaturization and high performance of the radio frequency front-end module.

The application discloses a transition structure from a stripline transmission line to a coaxial transmission line, which comprises a stripline, an upper shielding cavity communicated above the stripline, a lower shielding cavity communicated below the stripline, and a multilayer circuit board in which the upper shielding cavity, the stripline and the lower shielding cavity are arranged together, one side of the multilayer circuit board being electrically connected with a transition interface, the other side of the transition interface being electrically connected with a coaxial line, the transition interface comprising an interface floor, the middle part of the interface floor being provided with an insulating gap, the insulating gap being communicated with the upper shielding cavity, the stripline, the lower shielding cavity and the coaxial line. The transition interface is designed to realize the transition from the stripline inside the multilayer circuit board to the coaxial line on the sidewall of the multilayer circuit board; the insulating gap is arranged at the transition interface, and the transition gaps are arranged at the positions close to the transition interface between the upper inner floor and the lower inner floor to guide the electromagnetic field type to smoothly transit from the stripline field type to the coaxial field type, so that the advantages of good transmission standing wave and low loss are obtained.

The application discloses a Ku-band four-channel TR assembly, and relates to the technical field of TR assemblies, which comprises a shell and a radio frequency board arranged in the shell; a power supply, a control module and radio frequency lines of the TR assembly are arranged on the radio frequency board; the radio frequency lines are composed of a transition structure of a microstrip line - a strip line - a microstrip line; the strip line is arranged in a stepped form; and the control module is arranged above the step. The application adopts a multifunctional integrated TR chip combined with a final-stage amplifier, the assembly can keep a high level of 40dBm (10W) of the transmitting output power, ensure a small size of the assembly, and adopt a multilayer high-frequency composite board for pressing, integrate the power supply control and the radio frequency lines, and use the transition form of the microstrip line to the strip line to paste the chip on the step on the board, so that the assembly difficulty and the manufacturing cost are further reduced.

The present invention relates to a novel structure for vertical conversion from a microstrip line to a coaxial line. An arch-shaped strip line is designed at the connection between the microstrip line and the coaxial line. The metal pin of the coaxial line passes through the arch-shaped strip line and is welded to the upper printed circuit board. An isolation hole with the same diameter as the metal outer skin of the coaxial line is opened on the lower printed circuit board. The size of the arch-shaped strip line is adjusted to make the vertical conversion from the microstrip line to the coaxial line match. Seven metallized vias are drilled around the center of the metal pin of the coaxial line on the printed circuit board, and the metallized vias are spaced 45 degrees apart. The size and surrounding radius of the metallized vias are adjusted to achieve low-loss and smooth vertical conversion from the microstrip line to the coaxial line. The present invention has the characteristics of low insertion loss, simple and compact structure, and easy processing. After adding this conversion structure, efficient, compact, and low-loss feeding of the antenna by the microstrip line network can be realized, thereby improving the overall performance of the array antenna system.

The utility model discloses a quantum chip and a quantum computer. The quantum chip comprises a strip line integrated with a plurality of first signal lines; a plurality of sub-chips, wherein each sub-chip comprises a quantum bit wafer integrated with quantum bits and an interposer wafer integrated with control lines; the interposer wafer is provided with a second signal line, a first conductive column and a second conductive column. Two ends of the first conductive column are electrically connected with the quantum bit and one end of the second signal line; one end of the second conductive column is electrically connected with the other end of the second signal line; a strip line is arranged between any two adjacent sub-chips, and the two ends of each first signal line in the same strip line are electrically connected with the other end of one second conductive column in the two adjacent sub-chips respectively, so that the two quantum bits on the two sub-chips are electrically connected; the first signal line is provided with a first coupler. The quantum chip is formed by effectively connecting a plurality of sub-chips, so that the processing accuracy of a single sub-chip can be effectively improved, and the quality of the quantum chip is ensured.