459 results about "Stripline" patented technology

The invention relates to a miniaturized millimeter wave filtering magnetoelectric dipole antenna with high out-of-band rejection, and relates to the technical field of communication antennae, and the miniaturized millimeter wave filtering magnetoelectric dipole antenna with the high out-of-band rejection effect comprises a strip line feed structure which is used for generating a lower stop band radiation zero point; the n-shaped feed structure is used for feeding the magnetoelectric dipole; according to the magnetoelectric dipole radiator, a U-shaped groove is etched in a dipole patch, so that the size of the antenna is reduced; the parasitic metal strips are used for enhancing the radiation suppression effect of the upper stop band; the folding split rings are folded to reduce the size of the split rings and enhance the radiation suppression effect of the lower stop band at the same time; the inverted L-shaped short circuit branch is used for enhancing the radiation suppression effect of the upper stop band, the absolute bandwidth of the antenna is 21.1 GHz to 31.0 GHz, the relative bandwidth is 37.0%, the lowest gain is 5.0 dBi, the highest gain can reach 7.8 dBi, the suppression level from the in-band highest gain to the radiation zero point of the upper stop band is larger than 40 dBi, and the suppression level from the in-band highest gain to the radiation zero point of the lower stop band is larger than 50.0 dBi.

The invention provides a tri-polarization meter-wave antenna unit which is composed of five dielectric layers and six metal layers. Wherein the six metal layers comprise a top-layer square parasitic patch surrounded by a metal decoupling square ring, a middle square radiation patch, a bottom-layer circular patch loaded by an annular metal short circuit column, a ground plane 1, a feed strip line and a ground plane 2 in sequence from top to bottom. Wherein the lower layer is a circular patch antenna loaded with an annular metal column, and provides a monopole-like vertical polarization horizontal omnidirectional radiation pattern. In the structural design of the upper-layer horizontal polarization radiator, in order to realize the characteristic of horizontal polarization, an edge-fed square microstrip patch antenna structure is adopted, and the antenna is simple in structure, easy to realize and capable of generating two polarized orthogonal directional diagrams in the zenith direction. Meanwhile, a capacitive parasitic patch and a dielectric layer are loaded above the square microstrip patch antenna, so that the Q value can be further reduced, and double resonance points are introduced, so that the bandwidth of the antenna is further expanded.

The invention discloses a broadband multi-level three-dimensional vertical interconnection structure based on an HTCC technology, and belongs to the field of radio frequency front-end system integration. The structure comprises a PCB mother board, a ball grid array and an SiP module which are sequentially arranged from bottom to top, in the SiP module, the chips are distributed among different levels, and a connection mode of the chips among the different levels is set; a radio frequency signal is transmitted upwards through the PCB mother board, and after flowing through the lower-layer bare chip, the radio frequency signal is orderly transmitted upwards through the strip line and the signal via hole in the HTCC and finally transmitted to the surface-layer chip, so that a complete and efficient vertical interconnection signal transmission system is formed. According to the invention, the layout flexibility of interconnection lines among the chips is improved, the wiring crosstalk among the chips is reduced, the three-dimensional integration scene of bare chips in the HTCC is greatly widened, high-density SiP packaging is realized, and the strict technical requirements on radio frequency signal transmission, processing and chip interconnection under a complex circuit architecture can be met.

The invention discloses a differential signal transmission link, a high-speed differential signal transmission composite chip and an intra-core differential signal transmission link configuration method. A strip line is arranged in a perforated cylinder in a penetrating manner, two differential microstrip lines are horizontally arranged at two ends of the perforated cylinder, one end of one differential microstrip line is connected with the upper end of the strip line, and one end of the other differential microstrip line is connected with the lower end of the strip line; the conductor strip and the two grounding strips in each differential microstrip line are arranged on the total slide glass side by side in the length direction of the total slide glass, the conductor strip is arranged between the two grounding strips, and the multiple capacitors and the multiple inductors are alternately arranged on the conductor strip in the length direction of one side of the conductor strip. The plurality of conductive blocks are uniformly arranged on the conductor belt along the length direction of the other side of the conductor belt; a high-bandwidth storage chip and a GPU chip in the high-speed differential signal transmission composite chip are horizontally arranged on a PCB composite board in parallel, and a differential signal transmission system is arranged among the PCB composite board, the high-bandwidth storage chip and the GPU chip in a penetrating mode.

The utility model discloses a millimeter wave chip packaging structure based on a substrate integrated waveguide and an artificial magnetic conductor, which relates to the technical field of millimeter wave chip packaging, and comprises a chip, a cover plate and a base, the cover plate is in sealing fit with the base, the chip is arranged in the base, and the cover plate comprises a metal flat plate and a plurality of metal columns connected below the metal flat plate and distributed in an array. The metal column is not contacted with the base; the base comprises a frame, an SIW substrate, a direct current feed terminal and a heat sink, a first groove is formed in the center of the upper surface of the heat sink, and second grooves are formed in the two sides of the first groove and communicated with the first groove. According to the utility model, the SIW substrate is adopted to replace a traditional strip line terminal to serve as the millimeter wave input end and the millimeter wave output end of the shell, and the conductive materials on the upper surface and the lower surface of the SIW substrate are titanium tungsten / nickel / gold in sequence, so that the structure is simple, the processing technology is simple, the assembly technology is simple, the price is low, and the like; and the cable also has the advantages of wide working frequency band, large bearing power, small reflection loss, small transmission loss and the like, and also has the advantages of static electricity prevention and lightning protection.

Disclosed is a packaged semiconductor device comprising a semiconductor die comprising a MMIC having a differential output; a package substrate, comprising first second and third metal layers, and electrically connected to the semiconductor die by a plurality of pillars between the semiconductor die and the first metal layer, wherein the first and third metal layers comprise a ground plane, and the second metal layer, therebetween, comprises a single-ended stripline; wherein the differential output is galvanically connected to the first metal layer by a pair of pillars aligned along a first axis; wherein the packaged semiconductor device comprises a balun coupler between the differential output, and the single-ended stripline aligned along a second axis; wherein the balun coupler comprises an opening in the first metal layer, the opening comprising two arms extending in a first direction parallel to the second axis.

A dual-frequency and dual-circularly-polarized transmit-array antenna with independently controllable beams includes a planar broadband circularly polarized feed array and a planar transmit-array, the planar broadband circularly polarized feed array being placed near a focal plane of the planar transmit-array. The planar broadband circularly polarized feed array includes K-band left / right-handed circularly polarized feeds and Ka-band left / right-handed circularly polarized feeds that are integrated in the same plane. The planar transmit-array includes K-band and Ka-band dual-circularly-polarized phase shifting cells that are periodically staggered in a shared-aperture manner and based on an architecture of receiving antenna-phase shifting stripline-transmitting antenna. The antenna realize independent adjustment of right-handed and left-handed circularly polarized transmit phases in the K-band and the Ka-band, and it possesses the advantages such as miniaturization, low profile, and easy integration, and so on, thus having significant application prospects in fields such as satellite communications.

The invention discloses a broadband millimeter wave magnetoelectric dipole filtering antenna unit and a filtering array, the antenna is realized by adopting a multi-layer printed circuit board, and the antenna comprises a radiation layer printed circuit board and a feed layer printed circuit board. The radiation layer printed circuit board is provided with a magnetoelectric dipole radiator, and an electric dipole patch etched with an H-shaped gap reduces the size of the radiator while achieving low-frequency good filtering. A substrate integrated waveguide (SIW) cavity is arranged around the magnetoelectric dipole radiator, so that surface waves are suppressed, and the overall suppression effect of a stop band is enhanced. A strip line fed by a coaxial probe and a shielding SIW cavity structure are integrated on a feed layer printed circuit board, and the feed structure generates two radiation zero points at high frequency, so that good filtering response is realized. The antenna provided by the invention has the advantages of wide frequency band, small size, high out-of-band rejection level and frequency selectivity.

Disclosed is a packaged semiconductor device, comprising: a semiconductor die comprising an MMIC, the MMIC having a differential output; a package substrate including a first metal layer, a second metal layer, and a third metal layer, and electrically connected to the semiconductor die through a plurality of pillars between the semiconductor die and the first metal layer, where the first metal layer and the third metal layer include a ground plane, the second metal layer between the first metal layer and the second metal layer comprises a single-ended strip line; wherein the differential output is galvanically connected to the first metal layer through a pair of struts aligned along a first axis; wherein the packaged semiconductor device comprises a balun coupler between the differential output and the single-ended stripline aligned along a second axis; wherein the balun coupler comprises an opening in the first metal layer, the opening comprising two arms extending in a first direction parallel to the second axis.

The invention relates to the technical field of reconfigurable communication antenna equipment, and particularly discloses a liquid crystal-based high-aperture efficiency low-profile reconfigurable folding transmission array antenna design. The invention aims to solve the problems of insufficient aperture efficiency and high profile height in the existing reconfigurable folding array. The invention designs a novel transmission unit, and the unit integrates upper and lower layers of radiation and receiving patches with a polarization selection function, and a strip line-based liquid crystal phase shifter for realizing phase compensation. In order to minimize the profile height, the main transmission array is composed of a novel transmission unit, the auxiliary reflection array adopts a polarization conversion unit, and the interaction between the main transmission array and the auxiliary reflection array is used for folding the transmission path of electromagnetic waves. Meanwhile, the microstrip patch antenna replaces a traditional horn antenna to serve as an array feed source, so that the overall profile is reduced. In order to improve the aperture efficiency, the liquid crystal phase shifter is elaborately optimized to meet the requirement of 2-bit phase quantization, so that the phase modulation precision and the accuracy of array plane phase distribution are improved. Compared with a traditional space feed antenna and a folding array, the overall outline of the design is reduced by 2 / 3, meanwhile, the aperture efficiency is remarkably improved, and excellent two-dimensional beam scanning performance is kept.

The invention discloses a PCB wiring design method and system considering a pulse current fusing effect, and relates to the technical field of PCB design. The method comprises the following steps: based on a differential impedance design principle, including design rules of a differential microstrip line and a differential strip line, determining parameters such as the width, the thickness, the line spacing and the medium thickness of a wire so as to meet the impedance value requirement; based on the heat balance equation of the current-carrying conductor, a current conductor heating model and a current-carrying conductor heat dissipation model are established; on the basis of differential impedance design and in combination with the proposed binary particle swarm optimization algorithm, the electromagnetic compatibility factor can be comprehensively considered, the problems of low efficiency and electromagnetic compatibility existing in large-scale wiring design are effectively solved, rapid and accurate design of large-scale wiring can be achieved through an efficient calculation process, and the method is suitable for large-scale wiring design. The design efficiency and quality are remarkably improved, and the design requirement for the routing pulse fusing effect of a high-speed PCB signal is met.

The invention provides a filtering patch antenna based on three-dimensional packaging integration, which mainly comprises five layers of dielectric substrates, four layers of bonding plates and an integral circuit structure, the whole circuit structure comprises a signal transmission metal column, a coupling strip line, a quarter-wavelength strip line resonator, an open-circuit strip line branch knot, a feed strip line, a microstrip patch, a grounding metal column and a grounding plate. The novel filtering antenna provided by the invention has the characteristics of high integration level, miniaturization, high selectivity, wide stop band and packaging, and can be well applied to the field of wireless communication systems.

The embodiment of the invention provides a base station antenna and communication equipment. The base station antenna comprises at least one antenna array, and the at least one antenna array comprises a strip line and at least one radiation unit. The stripline includes a stripline inner conductor and a cavity for accommodating the stripline inner conductor. The at least one radiation unit is fixedly connected to the outer surface of the cavity. The cavity in the at least one antenna array is used for receiving the driving force output by the driving part, and when the cavity receives the driving force, the antenna array corresponding to the cavity rotates around a rotating axis parallel to the length direction of the strip line. According to the base station antenna and the communication equipment provided by the embodiment of the invention, the azimuth angle of the antenna array can be flexibly adjusted, and the use requirements are met.

The invention relates to a radiation unit and a base station antenna. The radiation unit comprises a radiator, a feed assembly and a balun structure, the radiator comprises at least one polarization, and one polarization comprises at least two radiation arms; the feed assembly comprises a feed core, and the feed core is used for being connected with a feed network so as to feed the radiator; the balun structure is located at the bottom of the radiator, a first balun and a second balun are correspondingly arranged below two radiation arms of one polarization respectively, the first balun comprises at least one first balun cavity, and the feed core and the first balun cavity jointly form a strip line structure. According to the radiation unit provided by the embodiment of the invention, the space dimension can be fully utilized, and the anti-interference capability of the antenna is improved.

The invention discloses an integrated low-profile broadband programmable metasurface antenna which comprises an antenna cover, an integrated low-profile programmable metasurface and a structural frame. The integrated low-profile programmable metasurface comprises an integrated low-profile programmable metasurface array surface; the integrated low-profile programmable metasurface array surface comprises a plurality of integrated low-profile programmable metasurface units; the integrated low-profile programmable metasurface unit is sequentially provided with a metal radiation patch, an upper dielectric substrate, a bias control line layer, a semi-cured bonding sheet layer and a strip line feed network layer; the metal radiation patch is printed on the front side of the upper dielectric substrate, the bias control line layer is printed on the rear side of the upper dielectric substrate, and the upper dielectric substrate is bonded with the strip line feed network layer through the semi-cured bonding sheet layer. The invention has the advantages of low profile, low power consumption and light weight; the antenna is high in radiation efficiency, and is suitable for the military fields of satellite communication, navigation, unmanned aerial vehicle data link terminals and the like with beam scanning and tracking capabilities.

The present disclosure relates to flexible printed circuit boards (FPCBs) for augmented reality (AR) eyewear. Disclosed examples provide an FPCB with air gaps for enhanced bending flexibility and an Electromagnetic Interference (EMI) film for consistent ground reference, enabling high-speed signal transmission with controlled impedance. The FPCB may include asymmetrical dielectric thicknesses and a crosshatch pattern in the ground reference layer to further support signal integrity and mechanical durability.

The invention provides a dual-frequency common-caliber antenna radiation unit and a dual-frequency common-caliber antenna, and relates to the communication and antenna technology, and each radiation unit comprises a K-frequency-band folded dipole, four Ka-frequency-band microstrip patches, and two groups of feed baluns in orthogonal layout. The Ka frequency band microstrip patch is coupled with the feed network layer through two H-shaped Ka frequency band coupling gaps which are arranged in an orthogonal mode, an orthogonal feed balun is adopted to achieve selectable K frequency band dual-linear polarization, left-hand circular polarization or right-hand circular polarization, and an orthogonal H-shaped gap is adopted to achieve selectable Ka frequency band dual-linear polarization, left-hand circular polarization or right-hand circular polarization. The dual-frequency common-caliber antenna comprises an antenna layer, a feed network layer, a strip line and a waveguide switching layer, the antenna layer comprises radiation units in a periodic array, and through the technical means of bridging, vertical conductive via holes and the like, the number of layers of PCBs is reduced, meanwhile, the high-density feed network layout is achieved, and the overall performance of the antenna is improved. The K frequency band / Ka frequency band common aperture design and the polarization-selectable multi-polarization application are effectively realized.

The invention relates to a strip line short section directional coupler, relates to the technical field of communication, and is used for improving the directivity of the strip line short section directional coupler. The strip line short section directional coupler comprises a radio frequency main line, a strip line coupling circuit and a capacitance compensation circuit, the strip line coupling circuit comprises a coupling line, two beveled edge corners and two vertical lead-out strip lines, two ends of the coupling line are respectively connected with one end of one beveled edge corner, and the other end of the beveled edge corner is connected with one end of one vertical lead-out strip line; the radio frequency main line comprises an input end, a coupling main line and an output end, and the coupling main line and the coupling line are coplanar and parallel to each other; the capacitance compensation circuit comprises a metal cylinder group which is connected with an upper-layer ground wire and a lower-layer ground wire of the strip line coupling circuit, and the metal cylinder group is located on the outer side of the bevel cut edges of the two bevel cut edge corners at the two ends of the coupling line and is in bilateral symmetry about the perpendicular bisector.

The invention discloses a battery connection module, a battery connection assembly and a battery connection system. The battery connection module comprises a busbar and a connector. The busbar is used for being electrically connected to a battery cell. A connector is mounted on the busbar for electrically connecting the busbar to the wires of the ribbon cable. The connector includes: a first housing; and a first terminal disposed in the first housing. The bottom of the first terminal is exposed out of the bottom of the first shell and is welded to the busbar, the first terminal is provided with a wire clamping structure, and the wire clamping structure is used for clamping a wire so as to be electrically connected with the wire. According to the invention, the battery connection module or the temperature detection module can be independently replaced without replacing the whole battery connection assembly or the whole battery connection system, so that the repair and maintenance cost can be saved. In addition, an expensive flexible printed circuit board does not need to be used, and only a cheap strip-shaped cable needs to be used, so that the cost can be greatly reduced.

The invention provides an HTCC-based capacitance compensation type three-dimensional compact power divider, which is characterized in that an input end and an output end are in a microstrip line tap feed mode, but when 1 / 4 wavelength impedance matching is carried out, through quasi-coaxial transmission and strip line transmission, the longitudinal distance is increased through quasi-coaxial transmission, and the width of a transmission line is reduced through strip line transmission, so that the transverse size is reduced; the chip capacitors are additionally arranged at the two ends of the output radio frequency, the chip capacitors are connected to radio frequency signals through the metal blocks, impedance matching of the signals is carried out by changing the capacitance values of the chip capacitors, phase compensation is carried out at the same time, and phase control is more accurate. The chip capacitor is welded between the metal block and the radio-frequency signal, impedance matching and phase compensation are achieved, the welding difficulty is lower than that of gold wire welding, the welding area is large, the connectivity with the radio-frequency signal is guaranteed, the possibility of pseudo soldering is reduced, the requirement of the device for air tightness is lowered, meanwhile, the capacitance value of the chip capacitor is conveniently replaced, and the cost is reduced. Impedance matching and phase compensation are realized.

The invention discloses an onboard transmission and storage method suitable for inclined aerial remote sensing equipment, and belongs to the technical field of aerial remote sensing. The airborne array adopts a full SSD disk, a ground downloading disk array selects a full mechanical hard disk (HDD) and an RAI D5 level as the core configuration of the disk array, the RAI D5 divides data into a plurality of small blocks, distributes and stores the small blocks on the plurality of hard disks in the array, adds parity check information on each hard disk, and adopts the RAI D5 level data-containing stripline storage, and the RAI D5 level data-containing stripline storage is carried out on the RAI D5 level data-containing stripline storage, so that the RAI D5 level data-containing stripline storage and the RAI D5 level data-containing stripline storage. Read-write operation is carried out on the multiple hard disks, parallel processing is achieved, and the data access speed is increased. According to the method, a large amount of data generated in unit time is acquired according to the requirement of live-action three-dimensional for the ground resolution of the image, onboard oblique aerial remote sensing data are effectively transmitted and stored, the onboard storage speed and storage safety of the oblique aerial photography system are improved, and therefore the working efficiency and the data safety are effectively improved.

The utility model discloses a radio frequency interconnection transmission structure based on SIP packaging. The radio frequency interconnection transmission structure comprises an HTCC substrate, a PCB substrate, a first vertical interconnection structure arranged in the HTCC substrate, and a second vertical interconnection structure arranged between the HTCC substrate and the PCB substrate. The HTCC substrate comprises a microstrip line and a first strip line, and a radio frequency signal is transmitted to the second vertical interconnection structure through the microstrip line, the first vertical interconnection structure and the first strip line in sequence and is transmitted to the PCB substrate through the second vertical interconnection structure; the HTCC substrate, the first vertical interconnection structure and the second vertical interconnection structure are packaged in a shell through an SIP packaging technology. The utility model has the advantages of simple packaging and small signal loss.

Provided herein are various enhancements for aperture antenna arrays and electronically steered arrays (ESAs). A modular subarray is provided that includes horn apertures coupled to corresponding waveguide polarizers coupled to transmit waveguide filters and receive waveguide filters that establish transmit ports and receive ports. The transmit ports and the receive ports are coupled through a waveguide adapter plate to individual isolation cavities each formed in a body of an amplifier-filter module that houses amplifier / filter elements and couple transmit radio frequency signaling and receive radio frequency signaling to coaxial connections penetrating the isolation cavities. The subarray also includes a circuit card assembly comprising the coaxial connections coupled to stripline links formed by a printed circuit board, wherein the stripline links couple to beamforming circuitry, and a high-density digital connector mounted to the circuit card assembly and configured to carry input / output radio frequency signaling for the subarray to / from the beamforming circuitry.

The invention discloses a one-to-eight power division network based on ceramic packaging, which adopts a Wilkinson power divider in a three-stage framework strip line form, and comprises a top metal layer, a middle strip wiring metal layer, a bottom metal layer and a ball mounting metal layer from top to bottom, and a dielectric substrate is clamped between every two metal layers. The top metal layer is provided with an input end and a plurality of isolation resistors, the middle strip-shaped wiring metal layer is provided with power divider network wiring, the input end and the plurality of isolation resistors are respectively connected with the power divider network wiring through metalized through holes, and the ball mounting metal layer is provided with a plurality of output ends. And each output end is connected with the power divider network routing through a metalized through hole. Through the multi-layer structure design, the Wilkinson power divider design, the metalized through hole and isolation resistor design and the optimization of packaging and connecting modes, the problems of miniaturization, high integration level, high reliability and low manufacturing cost of the power division network are successfully solved, and the power division network is suitable for various ceramic packaging applications.

The invention relates to an antenna system. The antenna system comprises a phase shifter cavity, at least one radiation unit and a transmission network arranged in the phase shifter cavity. The radiation unit comprises a radiation surface and a balun, and the balun comprises a feed part electrically connected with the radiation surface and a balun ground; the feed part is electrically connected with the transmission network; one feed piece corresponds to one balun ground, the feed piece and the corresponding balun ground form a strip line transmission line, and the balun ground comprises a first feed balun and a second feed balun which are arranged at an interval; the feed part comprises a first feed part and a second feed part which are connected with each other, the first feed part is in coupling connection with the first feed balun of the corresponding balun ground, and the second feed part is electrically connected with the second feed balun of the balun ground; wherein the first feed balun and the second feed balun in each balun ground and the phase shifter cavity are constructed into an integrated part. The antenna system provided by the invention has the advantages of few welding spots, low loss and better intermodulation stability.

The invention belongs to the technical field of electronic reconnaissance, and discloses an ultra-wideband radio frequency receiving front-end SIP module system based on HTCC, which comprises a three-dimensional package for signal transmission, and the three-dimensional package comprises a BGA layer, a package internal signal transmission layer, a top microstrip wiring and a device placement layer; the miniaturization advantage is obvious: the packaging substrate is formed by sintering aluminum oxide ceramic at high temperature, and the packaging substrate has 12 layers and is small in size. And the system integration degree is high: a single SIP module can be integrated with radio frequency front-end systems such as an amplitude limiter, a radio frequency switch, a filter, a low noise amplifier, a digital control attenuator and the like, so that related function indexes are realized. According to the radio frequency transmission line and power supply structure design, the structure comprises a radio frequency signal transmission line and a power supply distribution line. Wherein the routing of the radio frequency layer adopts a quasi-coaxial-strip line-quasi-coaxial structure, and good signal transmission can be realized in a frequency band of 2-10GHz.

The invention discloses a non-uniform compression high-order mode + / -45-degree dual-polarized base station antenna. The non-uniform compression high-order mode + / -45-degree dual-polarized base station antenna comprises a single-layer dielectric substrate, two pairs of non-uniform compression five-order mode dipoles and two pairs of fundamental mode dipoles, wherein the two pairs of non-uniform compression five-order mode dipoles are printed on the single-layer dielectric substrate; a balun coupling feeding mode is adopted, and SMA is used for exciting a high-order mode dipole and a fundamental mode dipole to generate radiation. According to the non-uniform compression high-order mode + / -45-degree dual-polarized antenna, due to the introduction of the non-uniform compression high-order mode dipole, the gain is effectively improved, the phase of an electric field is adjusted through the bending of the coplanar strip line, the amplitude of the electric field is adjusted through the adjustment of the size of the coplanar strip line and the design of the reflecting plate, and the cross polarization ratio is effectively improved.

The invention belongs to the technical field of microwave antennas, and particularly provides an ultra-low-profile wide-angle scanning ultra-wideband tight coupling phased-array antenna based on double mountain-shaped dipoles. The ultra-wideband antenna comprises an ultra-low-profile wide-angle scanning ultra-wideband radiation structure (I) based on double-E-shaped dipoles, namely an improved double-E-shaped dipole radiation structure; a feed strip line and a balun structure (II), namely a strip line feeder using a gradually changed defected ground on a vertical plane and a balun structure at the tail end; and the feed microstrip line structure (III) is a microstrip line feeder line on a horizontal plane. According to the invention, the improved double-E-shaped radiation structure is applied to the tightly-coupled antenna, which is equivalent to the introduction of a plurality of LC parallel matching branches in a unit aperture, so that the impedance matching of an array can be greatly improved, especially the impedance matching of low frequency is improved, the low-frequency bandwidth is expanded, and the scanning capability is improved at the same time.

The invention provides a multi-band composite high-integration TR assembly. The multi-band composite high-integration TR assembly comprises a shell, a front multi-layer board, a back multi-layer board, a C / X / Ku band receiving and transmitting circuit, a C / X / Ku band single receiving circuit and a Ka band receiving and transmitting circuit, wherein the front multi-layer board and the back multi-layer board are connected in the shell, the C / X / Ku band receiving and transmitting circuit is connected with the front multi-layer board, and the Ka band receiving and transmitting circuit is connected with the back multi-layer board. The low-cost scheme design of an all-solid-state microwave multilayer board suitable for batch production and testing is adopted, ports and transmission line layout are reasonably designed, multi-band composite mode transmission is achieved in the form of the front face and the back face, a C / X / Ku-band transmitting circuit and an H-polarization receiving circuit are integrated on the front face, and the transmission efficiency is improved. A C / X / Ku frequency band V polarization receiving circuit and a Ka frequency band receiving and transmitting circuit are integrated on the reverse side, different functional circuits are respectively transmitted through a microstrip line and a strip line through an interface circuit structure covering 1-40 GHz and an in-board vertical transition structure, the isolation degree of different circuits is improved, mutual crosstalk between different signals is avoided, and the transmission efficiency is improved. And the functions of high integration, high consistency, ultra wide band, numerical control phase shift, numerical control attenuation and the like of the assembly are realized.

The invention relates to an ultra-wideband sum-difference device applied to an X wave band and a Ku wave band. The ultra-wideband sum-difference device comprises a PCB, a sum port, a pitch difference port, an azimuth difference port, a one-to-four power divider, four one-to-three power dividers, four one-to-two power dividers, two bridges and a jumper. Wherein the one-to-four power divider is connected with the sum port and each one-to-three power divider; and each one-to-three power divider is respectively connected with two adjacent one-to-two power dividers and the quadrant port of the adjacent four-quadrant feed network. The first one-to-two power divider is connected with a first electric bridge; the second one-to-two power divider is connected with a second electric bridge; the third one-to-two power divider is connected with a jumper; the fourth one-to-two power divider is connected with a jumper; the jumper is also connected with the first bridge and the second bridge; the first bridge is also connected with the pitch difference port; and the second bridge is also connected with the azimuth difference port. By means of the design, the relative bandwidth of the ultra-wideband sum-difference device can be 100% and is greatly higher than the relative bandwidth of an existing waveguide sum-difference device and the relative bandwidth of an existing strip line sum-difference device.