160 results about "Stripline" patented technology

The invention discloses a battery connection module, a battery connection assembly and a battery connection system. The battery connection module comprises a busbar and a connector. The busbar is used for being electrically connected to a battery cell. A connector is mounted on the busbar for electrically connecting the busbar to the wires of the ribbon cable. The connector includes: a first housing; and a first terminal disposed in the first housing. The bottom of the first terminal is exposed out of the bottom of the first shell and is welded to the busbar, the first terminal is provided with a wire clamping structure, and the wire clamping structure is used for clamping a wire so as to be electrically connected with the wire. According to the invention, the battery connection module or the temperature detection module can be independently replaced without replacing the whole battery connection assembly or the whole battery connection system, so that the repair and maintenance cost can be saved. In addition, an expensive flexible printed circuit board does not need to be used, and only a cheap strip-shaped cable needs to be used, so that the cost can be greatly reduced.

The invention belongs to the technical field of microwave antennas, and particularly provides an ultra-low-profile wide-angle scanning ultra-wideband tight coupling phased-array antenna based on double mountain-shaped dipoles. The ultra-wideband antenna comprises an ultra-low-profile wide-angle scanning ultra-wideband radiation structure (I) based on double-E-shaped dipoles, namely an improved double-E-shaped dipole radiation structure; a feed strip line and a balun structure (II), namely a strip line feeder using a gradually changed defected ground on a vertical plane and a balun structure at the tail end; and the feed microstrip line structure (III) is a microstrip line feeder line on a horizontal plane. According to the invention, the improved double-E-shaped radiation structure is applied to the tightly-coupled antenna, which is equivalent to the introduction of a plurality of LC parallel matching branches in a unit aperture, so that the impedance matching of an array can be greatly improved, especially the impedance matching of low frequency is improved, the low-frequency bandwidth is expanded, and the scanning capability is improved at the same time.

The invention provides a multi-band composite high-integration TR assembly. The multi-band composite high-integration TR assembly comprises a shell, a front multi-layer board, a back multi-layer board, a C / X / Ku band receiving and transmitting circuit, a C / X / Ku band single receiving circuit and a Ka band receiving and transmitting circuit, wherein the front multi-layer board and the back multi-layer board are connected in the shell, the C / X / Ku band receiving and transmitting circuit is connected with the front multi-layer board, and the Ka band receiving and transmitting circuit is connected with the back multi-layer board. The low-cost scheme design of an all-solid-state microwave multilayer board suitable for batch production and testing is adopted, ports and transmission line layout are reasonably designed, multi-band composite mode transmission is achieved in the form of the front face and the back face, a C / X / Ku-band transmitting circuit and an H-polarization receiving circuit are integrated on the front face, and the transmission efficiency is improved. A C / X / Ku frequency band V polarization receiving circuit and a Ka frequency band receiving and transmitting circuit are integrated on the reverse side, different functional circuits are respectively transmitted through a microstrip line and a strip line through an interface circuit structure covering 1-40 GHz and an in-board vertical transition structure, the isolation degree of different circuits is improved, mutual crosstalk between different signals is avoided, and the transmission efficiency is improved. And the functions of high integration, high consistency, ultra wide band, numerical control phase shift, numerical control attenuation and the like of the assembly are realized.

The invention relates to the technical field of satellite communication, in particular to a high-gain phased array receiving antenna system for low-orbit satellite communication, which comprises a radiation feed integration module, a beam phase mapping module, a digital beam forming module, a signal amplification module, a protection packaging module and a performance verification module. Stacking strip line feed networks and performing electromagnetic coupling to obtain an initial radiation channel; receiving and analyzing a beam control instruction through an embedded circuit, extracting a target beam pointing angle and mapping the target beam pointing angle into a phase offset; generating a digital phase control word according to the phase offset, and applying the digital phase control word to the radio frequency signal to complete phase calibration; a transistor with a low-noise amplification structure is used for enhancing the calibrated signal energy; the wave-transparent front cover covers the radiator, and the electromagnetic shielding rear cover wraps the internal components to form an assembly in a sealing manner; and verifying the gain and beam switching rate of the assembly in the typical frequency band of the low-orbit satellite. According to the invention, the low-orbit satellite communication signal receiving efficiency can be improved.

A magneto-electric dipole antenna array includes a substrate and at least one antenna unit. Each of the at least one antenna unit includes an electric-dipole component, a magnetic-dipole component, a first feeding probe, a second feeding probe and a stripline. The electric-dipole component is disposed on an upper surface of the substrate. The magnetic-dipole component is disposed in the substrate and between the upper surface and a lower surface of the substrate, and is electrically connected to the electric-dipole component. The first feeding probe is disposed on the upper surface of the substrate for vertical polarization. The second feeding probe is disposed in the substrate and between the upper surface and the lower surface of the substrate for horizontal polarization. The stripline is disposed in the substrate and between the first feeding probe and the second feeding probe for capacitive coupling.

To provide a bond ply capable of combining low dielectric tangent and dimensional stability.SOLUTION: A bond ply comprises a first adhesive layer, a polyimide layer and a second adhesive layer, in which a) a thickness of an entire bond ply is in the range of 50 μm or more and 300 μm or less, and a ratio of the thickness of the polyimide layer to the thickness of the entire bond ply is 0.2 or more and 0.9 or less, b) after drying at 80°C for 1 hour, the moisture absorption measured after conditioning for 24 hours under constant temperature and humidity at 23°C and 50% RH is 0.4 wt.% or less, and c) the storage elastic moduli at 50°C of the first adhesive layer and the second adhesive layer are each independently 1800 MPa or lower, and the maximum value of the storage elastic moduli at 180 to 260°C are each independently 800 MPa or less.SELECTED DRAWING: None

The invention discloses a testing device for a multichannel millimeter wave radio frequency chip, and relates to the technical field of radio frequency chip testing. The device comprises a structural body, a multilayer circuit board fixed on the structural body, and a waveguide cover plate combined with the structural body to form a waveguide. A substrate integrated waveguide and a strip line are integrated in the multilayer circuit board, and vertical conversion between a waveguide signal and an onboard signal is realized through a waveguide-microstrip transition structure. Through the integrated and double-sided design of the structural body, the multilayer board and the radio frequency link, the substrate integrated waveguide is used for vertical transmission of radio frequency signals, and the strip line is used for transmitting power supply and control signals, so that the problems that a traditional testing device is large in size, and ports of a W-waveband multichannel chip are dense and not easy to test are effectively solved; miniaturization, high integration and test convenience of the test device are realized.

The invention discloses a small broadband cavity-backed radiator, which belongs to the technical field of electromagnetic fields and microwaves and comprises a reflection cavity, a loading medium, a printed balun, a printed oscillator, a low-density medium support and double leads. The low-density medium support is used for supporting the printed oscillator; the printed balun and the printed oscillator are electrically connected through double leads; the loading medium is used for adjusting the impedance frequency characteristic of the printed oscillator in the reflection cavity; the printed Balun adopts a strip line-flat plate line-parallel double-line structure and is used for realizing unbalanced-balanced transmission mode conversion and impedance conversion of 3: 1 bandwidth; and the printed oscillator is used for radiating electromagnetic energy and is matched with the multi-ring-groove loading medium and the printed Balun to realize impedance-frequency characteristic balance within a 3: 1 bandwidth range. The small broadband back cavity radiator can effectively solve the problems that in the prior art, the caliber of a reflection cavity of a traditional broadband back cavity radiator is large, the loading effect is not ideal when the bandwidth of a directional diagram is 4 GHz or above, and directional diagram distortion occurs.

The invention discloses a high-isolation low-loss filtering structure and method for a PCB strip line. According to the high-isolation low-loss filtering structure provided by the invention, the main transmission strip line, the filtering auxiliary strip line with the spur line structure and the grounding layer with the hollowed-out area are integrated in the PCB, so that external discrete filter elements and welding procedures and shielding separation cavities required by the external discrete filter elements are effectively omitted, and therefore, the size of a module is remarkably reduced; weight and complexity. Meanwhile, due to the integrated design, impedance discontinuity and signal reflection caused by the fact that signals are converted between the inner layer and the surface layer of the PCB through the via holes are avoided, and signal integrity is guaranteed. And finally, on the premise of not introducing additional elements, high-performance filtering is realized, and an effective solution is provided for miniaturization and high performance of the radio frequency front-end module.

The application discloses a transition structure from a stripline transmission line to a coaxial transmission line, which comprises a stripline, an upper shielding cavity communicated above the stripline, a lower shielding cavity communicated below the stripline, and a multilayer circuit board in which the upper shielding cavity, the stripline and the lower shielding cavity are arranged together, one side of the multilayer circuit board being electrically connected with a transition interface, the other side of the transition interface being electrically connected with a coaxial line, the transition interface comprising an interface floor, the middle part of the interface floor being provided with an insulating gap, the insulating gap being communicated with the upper shielding cavity, the stripline, the lower shielding cavity and the coaxial line. The transition interface is designed to realize the transition from the stripline inside the multilayer circuit board to the coaxial line on the sidewall of the multilayer circuit board; the insulating gap is arranged at the transition interface, and the transition gaps are arranged at the positions close to the transition interface between the upper inner floor and the lower inner floor to guide the electromagnetic field type to smoothly transit from the stripline field type to the coaxial field type, so that the advantages of good transmission standing wave and low loss are obtained.

The application discloses a Ku-band four-channel TR assembly, and relates to the technical field of TR assemblies, which comprises a shell and a radio frequency board arranged in the shell; a power supply, a control module and radio frequency lines of the TR assembly are arranged on the radio frequency board; the radio frequency lines are composed of a transition structure of a microstrip line - a strip line - a microstrip line; the strip line is arranged in a stepped form; and the control module is arranged above the step. The application adopts a multifunctional integrated TR chip combined with a final-stage amplifier, the assembly can keep a high level of 40dBm (10W) of the transmitting output power, ensure a small size of the assembly, and adopt a multilayer high-frequency composite board for pressing, integrate the power supply control and the radio frequency lines, and use the transition form of the microstrip line to the strip line to paste the chip on the step on the board, so that the assembly difficulty and the manufacturing cost are further reduced.

An apparatus includes an interposer (112, 200) configured to be electrically coupled to one or more semiconductor devices (102, 104). The interposer includes a core having a substrate (202) and first vias (204) through the substrate, a first stackup (206) of layers over a first side of the core, and a second stackup (208) of layers over a second side of the core. The first stackup of layers includes first redistribution layers (210a-210e) and first dielectric layers (212a, 214a-214d). The first redistribution layers are electrically coupled together using second vias (216) through the first dielectric layers, and the first stackup of layers forms a first and a second stripline. The second stackup of layers includes second redistribution layers (210f-210h) and second dielectric layers (212b, 214e-214f). The second redistribution layers are electrically coupled together using third vias (216) through the second dielectric layers, and the second stackup of layers forms a third stripline.

The application discloses a kind of dual-frequency dual-circular polarization phased array antennas, using Q frequency band, V frequency band co-array face form is designed, dual-frequency dual-circular polarization phased array antenna includes alternately arranged Q frequency band array and V frequency band array;Q frequency band array includes multiple Q frequency band units, V frequency band array includes multiple V frequency band units;Dual-frequency dual-circular polarization phased array antenna includes metal plate and PCB board;Each Q frequency band unit and each V frequency band unit include radiator and feed layer;Feed layer is arranged on PCB board, metal plate is connected with PCB board, for avoiding electromagnetic wave leakage on feed layer;Metal plate is equipped with metal cavity, metal cavity is used to fix radiator;Wherein, feed layer is made into 90 ° bridge circuit using strip line, to realize dual-circular polarization.The application uses Q, V frequency band co-array face form, alternately arranged, by increasing the way of array element spacing, to reduce the number of array elements.The application can be widely applied in the field of antenna technology.

A quantum computing system with structures for wiring superconducting qubits between varying thermal regimes is presented. This system enables the control of many thousands to millions of qubits operated at typical qubit operating temperatures, while the control electronics operate at much higher temperatures, such as 3-4 K, 50-77 K, or 300 K. The system includes a qubit substrate with one or more qubits, a metallization layer, a wiring substrate comprising superconducting striplines, a mechanical mount, and a quantum computing device. The system includes structures disposed throughout that connect a lower temperature section for qubit operation to a higher temperature section for control operations. The system also employs flex circuit boards for achieving dense and scalable connectivity. Methods for fabricating the quantum computing system are also disclosed.

This invention discloses a multilayer stripline 90-degree bridge, belonging to the field of microwave passive device technology. The bridge includes a first metal base and a second metal base arranged opposite each other and each having a groove; a multilayer dielectric substrate sealed and sandwiched between the two bases, completely filling the grooves; and a first stripline and a second stripline disposed on different layers within the multilayer dielectric substrate. The first and second striplines are parallel to each other and DC isolated from each other, with their central coupling units corresponding to the groove positions in their vertical projection. The bridge also includes an input port, a through output port, a coupled output port, and an isolation port. This invention, through the sandwich sealing structure of the metal base grooves and the multilayer dielectric substrate, enhances the electromagnetic coupling between the striplines, allowing for the use of wider and thicker coupling lines, thereby achieving low insertion loss, high power capacity, and good amplitude and phase balance over a wide frequency band, and exhibiting excellent low-temperature environmental adaptability.

A directional coupler of present invention includes a waveguide, a substrate, two first slits, and two second slits. The substrate is having a strip line and ground layers opposed to each other at a side surface of the waveguide. The two first slits are provided in the side surface of the waveguide along a propagation direction of an electromagnetic waves in the waveguide, and the two second slits are provided in the first ground layer of the substrate opposed to the two first slits.

The application discloses a novel broadband quadrature phase shift topology and specific application thereof, comprising a signal source, a matching structure, an open circuit coupling output and a short circuit coupling output; energy output by the signal source is transmitted to the open circuit coupling output and the short circuit coupling output in two paths respectively after the matching structure, and the open circuit coupling output and the short circuit coupling output are coupled with the matching structure respectively, and the matching structure is used for realizing impedance matching; the realization mode of the topology comprises but is not limited to microstrip line, slot line, coplanar strip line and other transmission line forms, the realization mode of the matching structure comprises but is not limited to quarter wavelength impedance conversion line, multi-section matching structure and other matching structures, and the coupling form comprises but is not limited to side edge coupling, multi-layer coupling and other coupling structures.The 90-degree phase shifter provided by the application has the advantages of compact structure, stable 90-degree phase difference and wide phase bandwidth, and is very suitable for modern wireless communication systems.

The invention relates to a common-cavity phase shifter loaded with a bridge and an array antenna. The common-cavity phase shifter comprises a metal cavity and a circuit board. The circuit board comprises a dielectric substrate and a strip line circuit; the strip line circuit comprises a first phase-shifting circuit and a second phase-shifting circuit, and the first phase-shifting circuit and the second phase-shifting circuit each comprise a circuit body, a common input port and a plurality of output ports arranged in the second direction; and at least one pair of output ports in the first phase-shifting circuit and the second phase-shifting circuit are coupled and connected through the corresponding bridge structures. Thus, the bridge structure is integrated into the wiring of the first phase shift circuit and the second phase shift circuit of the strip line circuit, a connection interface between the bridge structure and the phase shift circuits is eliminated, and insertion loss and passive intermodulation risks possibly introduced by additional welding spots or connecting pieces are reduced fundamentally. And the electrical performance and the long-term reliability of the whole feed network are improved.

The application discloses a stripline broadband two-dimensional hybrid network and a multifunctional hybrid network, the two-dimensional hybrid network comprising, from top to bottom, an upper dielectric plate, an upper half-cured sheet, an intermediate dielectric plate, a lower half-cured sheet and a lower dielectric plate, and further comprising metallized through holes penetrating through the whole two-dimensional hybrid network, characterized in that the upper surface of the upper dielectric plate is covered by an upper anti-interference layer, the lower surface of the lower dielectric plate is covered by a lower anti-interference layer, and the metallized through holes penetrate through the upper anti-interference layer and the lower anti-interference layer; the upper and lower surfaces of the intermediate dielectric plate are both provided with a conducting band, the conducting band and the edge overlapping part of the intermediate dielectric plate form a port, the conducting band parts overlap, and the overlapping area forms four constant offset couplers, and the four constant offset couplers are cascaded to form the stripline broadband two-dimensional hybrid network. The application provides a stripline broadband two-dimensional hybrid network and a multifunctional hybrid network with high integration, wide bandwidth and easy integration with an antenna and a radio frequency circuit.

The invention discloses a double-filtering circular polarization phased-array antenna unit and array, and belongs to the technical field of phased-array antennas. The dual-filtering circularly polarized phased-array antenna unit comprises a parasitic patch layer, a first dielectric substrate layer, a coupled feed layer, a semi-cured layer, a second dielectric substrate layer, a strip-shaped feeder line layer and a third dielectric substrate layer which are sequentially arranged from top to bottom, the strip-shaped feeder line layer comprises a feed strip-shaped line and a filtering branch knot located on the feed strip-shaped line. The parasitic patch layer comprises a central patch and a zero-order filtering resonator located on the periphery of the central patch. According to the invention, the limitation of narrow bandwidth of the existing antenna is solved, and the antenna is low in cost, low in profile and high in efficiency.

The application relates to the technical field of radio frequency front ends, and particularly discloses a radio frequency connecting structure based on a multilayer SiP package of a glass substrate, which comprises, from top to bottom, a ground metal layer one, a dielectric layer one, a signal metal layer, a dielectric layer two and a ground metal layer two which are stacked; the signal metal layer comprises a microstrip line, a strip line and a cut-angle microstrip; the strip line and the cut-angle microstrip are arranged on the same side and are connected with the microstrip line respectively; and a metal through hole is arranged on the dielectric layer two and located on the outer side of the cut-angle microstrip. The application meets the required line width of a bonding pad, reduces the transmission loss of the microstrip line to the strip line, and improves the transmission performance of signals in a link.

A high rectangular coefficient strip line low pass filter is arranged in a cavity, comprising two parallel arranged dielectric substrates and a strip line clamped between the two dielectric substrates; the strip line comprises a wave-shaped microstrip line in a rectangular wave shape, one end of which is connected with an input microstrip line and the other end is connected with an output microstrip line; the wave-shaped microstrip line is arranged along the length direction of the dielectric substrate, comprising continuously staggered concave parts and convex parts, the width of the thick microstrip line at the bottom of the concave part is greater than the width of the thin microstrip line at the top of the convex part; each thick microstrip line is spaced apart in the width direction and arranged with a plurality of interdigital microstrip lines on the side facing the adjacent thick microstrip line, and the two rows of interdigital microstrip lines between the adjacent two thick microstrip lines are arranged in turn and cross each other. The wave-shaped microstrip line is arranged between the two parallel dielectric substrates, the elliptic function topology structure formed by the thick-thin transformation of the convex part and the concave part of the wave-shaped microstrip line, and the staggered arrangement of the interdigital microstrip lines optimize the rectangular coefficient, realize high suppression and reduce the volume of the filter.

A quantum computing system with structures for wiring superconducting qubits between varying thermal regimes is presented. This system enables the control of many thousands to millions of qubits operated at typical qubit operating temperatures, while the control electronics operate at much higher temperatures, such as 3-4 K, 50-77 K, or 300 K. The system includes a qubit substrate with one or more qubits, a metallization layer, a wiring substrate comprising superconducting striplines, a mechanical mount, and a quantum computing device. The system includes structures disposed throughout that connect a lower temperature section for qubit operation to a higher temperature section for control operations. The system also employs flex circuit boards for achieving dense and scalable connectivity. Methods for fabricating the quantum computing system are also disclosed.

The invention relates to the technical field of mobile communication and antennas, in particular to a stripline medium phase shifting system for a base station antenna, which comprises a data acquisition step of acquiring vector network parameter flow and mechanical displacement feedback data of a phase shifter; a virtual reconstruction step: constructing a lossless ideal transmission line model, and generating a theoretical defect-containing S parameter based on an air gap perturbation equivalent model; a double-track difference step: calculating a theoretical residual feature vector and a real residual feature vector; a coupling verification step: calculating topological similarity, and generating a fault attribution result and a production control instruction according to the similarity; according to the invention, through difference comparison of physical measurement and virtual reconstruction, the bottleneck of traditional threshold determination is broken through, the physical cause of the fault can be intelligently identified, the fault diagnosis resolution is significantly improved, and the production cost is reduced.

The application discloses a high-frequency selective dual-polarization conversion metasurface based on a stripline filter, comprising a plurality of dual-polarization conversion metasurface units; the dual-polarization conversion metasurface unit comprises a dielectric plate, a resonant unit and a metal via; the dielectric plates are provided with a metal ground layer therebetween, the resonant unit is embedded in the second layer of dielectric plate, the surface of the dielectric plate is provided with an upper metal patch, and the back of the dielectric plate is provided with a lower metal patch; the metal via is connected with the metal patch, the dielectric plate and the resonant unit in sequence; the type of the resonant unit adopts a second-order resonant unit or a third-order resonant unit; for the transmission type dual-polarization conversion metasurface, the filter structure can overcome the problem that the frequency selectivity of the dual-polarization conversion metasurface in the prior art is not high, can realize the dual-polarization conversion function of the incident wave, and has high frequency selectivity.

A coil forming apparatus, when forming a strip coil with side ends at both ends of multiple straight sections into a wound state, during the process of rotating and conveying the strip coil along the outer periphery of a coil winding fixture using a coil conveying mechanism, clamps the side ends using shaping portions of guide members arranged near both axial ends of the coil winding fixture, shaping the strip coil into an arc shape in the first half of the rotating conveying, and guiding the side ends to a reduced diameter in the second half of the rotating conveying, so that multiple straight sections are respectively inserted into multiple comb-shaped grooves. At least in the shaping portion, for the stable stacked portion of the strip coil where the bending portion connecting the straight section to the side end does not locally produce a difference in the number of coil layers, a convex pressing portion is used to press while sliding contact to prevent the coil conductor from scattering. As a result, the strip coil can be easily and accurately formed into a wound state.

The invention discloses an antenna device. The antenna device comprises a substrate assembly, a metal structure, a plastic package material structure and a coating layer. The substrate assembly comprises a strip line feed-in end for receiving an antenna signal. The metal structure is arranged on one side of the substrate assembly. The plastic package material structure covers one side of the metal structure. The coating layer is arranged on one outer surface of the plastic packaging material structure. And antenna signals are transmitted through the substrate assembly, the metal structure, the plastic package material structure and the coating layer.

Micro stripline array antenna (1, 10, 40, 50) with a dielectric substrate (12) on the back of which a conductive grounding plate (11) is formed, and a stripline (13) formed on the dielectric substrate (12), wherein the strip conductor (13) comprises a feed strip line (3, 15, 43, 51) which is linear and extends in a predetermined direction of extension, and at least two radiating antenna elements (6a - 6d; 22a - 22v; 42a - 42c, 5a - 5d; 21a - 21v; 41a - 41c) of a predetermined length, wherein at least one of the radiating antenna elements (6a - 6d; 22a - 22v; 42a - 42c, 5a - 5d; 21a - 21v; 41a - 41c) is connected to one side of the feed strip line (3, 15, 43, 51) and at least one of the radiating antenna elements (6a - 6d; 22a - 22v; 42a - 42c, 5a - 5d; 21a - 21v; 41a - 41c) is connected to the other side of the feed line (3, 15, 43, 51), the longitudinal directions of the radiating antenna elements (6a - 6d; 22a - 22v; 42a - 42c, 5a- 5d; 21a - 21v; 41a - 41c) are parallel to each other and are arranged at an angle other than 90° with respect to the direction of extension, the feed line (3, 15, 43, 51) has a partially or completely curved shape and extends completely in the direction of extension, so that the radiating antenna elements (6a - 6d; 22a - 22v; 42a - 42c, 5a - 5d; 21a - 21v; 41a - 41c) are connected to the feed line (3, 15, 43, 51) at the same angle, and each of the sides of the feed line (3, 15, 43, 51) is connected to a plurality of the radiating antenna elements (6a - 6d; 22a - 22v; 42a - 42c, 5a- 5d; 21a - 21v; 41a - 41c), characterized by the fact that the radiating antenna elements (6a - 6d; 22a - 22v; 42a - 42c, 5a- 5d; 21a - 21v; 41a - 41c) which are connected to one side of the feed line (3, 15, 43, 51), are connected to areas of the feed line which correspond to the middle areas between adjacent two of the radiating antenna elements (6a - 6d; 22a - 22v; 42a - 42c, 5a- 5d; 21a - 21v; 41a - 41c) which are connected to the other side of the feed line (3, 15, 43, 51).

An apparatus includes an interposer configured to be electrically coupled to one or more semiconductor devices. The interposer includes a core having a substrate and first vias through the substrate, a first stackup of layers over a first side of the core, and a second stackup of layers over a second side of the core. The first stackup of layers includes first redistribution layers and first dielectric layers. The first redistribution layers are electrically coupled together using second vias through the first dielectric layers, and the first stackup of layers forms a first and a second stripline. The second stackup of layers includes second redistribution layers and second dielectric layers. The second redistribution layers are electrically coupled together using third vias through the second dielectric layers, and the second stackup of layers forms a third stripline.

A bandpass filter (includes a dielectric substrate, a first strip line formed on the dielectric substrate, resonators coupled to the first strip line, and a second strip line formed on the dielectric substrate coupled to the resonators. The resonators include a plurality of inductor elements formed on the dielectric substrate and composed of rectangular conductors having a long side direction and a short side direction, and a capacitor element for coupling the plurality of inductor elements and include a series resonance circuit composed of the plurality of inductor elements and the capacitor element. The length in the long side direction of the inductor element is less than half wavelength of the electromagnetic wave transmitted by the filter.