265 results about "Stripline" patented technology

The invention discloses a differential signal transmission link, a high-speed differential signal transmission composite chip and an intra-core differential signal transmission link configuration method. A strip line is arranged in a perforated cylinder in a penetrating manner, two differential microstrip lines are horizontally arranged at two ends of the perforated cylinder, one end of one differential microstrip line is connected with the upper end of the strip line, and one end of the other differential microstrip line is connected with the lower end of the strip line; the conductor strip and the two grounding strips in each differential microstrip line are arranged on the total slide glass side by side in the length direction of the total slide glass, the conductor strip is arranged between the two grounding strips, and the multiple capacitors and the multiple inductors are alternately arranged on the conductor strip in the length direction of one side of the conductor strip. The plurality of conductive blocks are uniformly arranged on the conductor belt along the length direction of the other side of the conductor belt; a high-bandwidth storage chip and a GPU chip in the high-speed differential signal transmission composite chip are horizontally arranged on a PCB composite board in parallel, and a differential signal transmission system is arranged among the PCB composite board, the high-bandwidth storage chip and the GPU chip in a penetrating mode.

The invention discloses a PCB wiring design method and system considering a pulse current fusing effect, and relates to the technical field of PCB design. The method comprises the following steps: based on a differential impedance design principle, including design rules of a differential microstrip line and a differential strip line, determining parameters such as the width, the thickness, the line spacing and the medium thickness of a wire so as to meet the impedance value requirement; based on the heat balance equation of the current-carrying conductor, a current conductor heating model and a current-carrying conductor heat dissipation model are established; on the basis of differential impedance design and in combination with the proposed binary particle swarm optimization algorithm, the electromagnetic compatibility factor can be comprehensively considered, the problems of low efficiency and electromagnetic compatibility existing in large-scale wiring design are effectively solved, rapid and accurate design of large-scale wiring can be achieved through an efficient calculation process, and the method is suitable for large-scale wiring design. The design efficiency and quality are remarkably improved, and the design requirement for the routing pulse fusing effect of a high-speed PCB signal is met.

The invention discloses a battery connection module, a battery connection assembly and a battery connection system. The battery connection module comprises a busbar and a connector. The busbar is used for being electrically connected to a battery cell. A connector is mounted on the busbar for electrically connecting the busbar to the wires of the ribbon cable. The connector includes: a first housing; and a first terminal disposed in the first housing. The bottom of the first terminal is exposed out of the bottom of the first shell and is welded to the busbar, the first terminal is provided with a wire clamping structure, and the wire clamping structure is used for clamping a wire so as to be electrically connected with the wire. According to the invention, the battery connection module or the temperature detection module can be independently replaced without replacing the whole battery connection assembly or the whole battery connection system, so that the repair and maintenance cost can be saved. In addition, an expensive flexible printed circuit board does not need to be used, and only a cheap strip-shaped cable needs to be used, so that the cost can be greatly reduced.

The invention belongs to the technical field of microwave antennas, and particularly provides an ultra-low-profile wide-angle scanning ultra-wideband tight coupling phased-array antenna based on double mountain-shaped dipoles. The ultra-wideband antenna comprises an ultra-low-profile wide-angle scanning ultra-wideband radiation structure (I) based on double-E-shaped dipoles, namely an improved double-E-shaped dipole radiation structure; a feed strip line and a balun structure (II), namely a strip line feeder using a gradually changed defected ground on a vertical plane and a balun structure at the tail end; and the feed microstrip line structure (III) is a microstrip line feeder line on a horizontal plane. According to the invention, the improved double-E-shaped radiation structure is applied to the tightly-coupled antenna, which is equivalent to the introduction of a plurality of LC parallel matching branches in a unit aperture, so that the impedance matching of an array can be greatly improved, especially the impedance matching of low frequency is improved, the low-frequency bandwidth is expanded, and the scanning capability is improved at the same time.

The invention provides a multi-band composite high-integration TR assembly. The multi-band composite high-integration TR assembly comprises a shell, a front multi-layer board, a back multi-layer board, a C / X / Ku band receiving and transmitting circuit, a C / X / Ku band single receiving circuit and a Ka band receiving and transmitting circuit, wherein the front multi-layer board and the back multi-layer board are connected in the shell, the C / X / Ku band receiving and transmitting circuit is connected with the front multi-layer board, and the Ka band receiving and transmitting circuit is connected with the back multi-layer board. The low-cost scheme design of an all-solid-state microwave multilayer board suitable for batch production and testing is adopted, ports and transmission line layout are reasonably designed, multi-band composite mode transmission is achieved in the form of the front face and the back face, a C / X / Ku-band transmitting circuit and an H-polarization receiving circuit are integrated on the front face, and the transmission efficiency is improved. A C / X / Ku frequency band V polarization receiving circuit and a Ka frequency band receiving and transmitting circuit are integrated on the reverse side, different functional circuits are respectively transmitted through a microstrip line and a strip line through an interface circuit structure covering 1-40 GHz and an in-board vertical transition structure, the isolation degree of different circuits is improved, mutual crosstalk between different signals is avoided, and the transmission efficiency is improved. And the functions of high integration, high consistency, ultra wide band, numerical control phase shift, numerical control attenuation and the like of the assembly are realized.

A millimeter-wave antenna module includes a circuit board and a plurality of millimeter-wave antenna structures. Each of the millimeter-wave antenna structures includes a substrate assembly, a feeding opening structure, a feeding stripline, and a shielding cover. The feeding opening structure and the feeding stripline are each disposed in the substrate assembly, and a portion of the feeding stripline is exposed in the feeding opening structure. The feeding opening structure is covered by the shielding cover, a side of the shielding cover has an opening, and a height of the shielding cover is increased along a direction toward the opening. The feeding stripline is configured to emit an electromagnetic wave signal in a single and horizontal direction through the feeding opening structure and the shielding cover.

The invention relates to the technical field of satellite communication, in particular to a high-gain phased array receiving antenna system for low-orbit satellite communication, which comprises a radiation feed integration module, a beam phase mapping module, a digital beam forming module, a signal amplification module, a protection packaging module and a performance verification module. Stacking strip line feed networks and performing electromagnetic coupling to obtain an initial radiation channel; receiving and analyzing a beam control instruction through an embedded circuit, extracting a target beam pointing angle and mapping the target beam pointing angle into a phase offset; generating a digital phase control word according to the phase offset, and applying the digital phase control word to the radio frequency signal to complete phase calibration; a transistor with a low-noise amplification structure is used for enhancing the calibrated signal energy; the wave-transparent front cover covers the radiator, and the electromagnetic shielding rear cover wraps the internal components to form an assembly in a sealing manner; and verifying the gain and beam switching rate of the assembly in the typical frequency band of the low-orbit satellite. According to the invention, the low-orbit satellite communication signal receiving efficiency can be improved.

A magneto-electric dipole antenna array includes a substrate and at least one antenna unit. Each of the at least one antenna unit includes an electric-dipole component, a magnetic-dipole component, a first feeding probe, a second feeding probe and a stripline. The electric-dipole component is disposed on an upper surface of the substrate. The magnetic-dipole component is disposed in the substrate and between the upper surface and a lower surface of the substrate, and is electrically connected to the electric-dipole component. The first feeding probe is disposed on the upper surface of the substrate for vertical polarization. The second feeding probe is disposed in the substrate and between the upper surface and the lower surface of the substrate for horizontal polarization. The stripline is disposed in the substrate and between the first feeding probe and the second feeding probe for capacitive coupling.

The invention provides a strip line microwave sensor with an electromagnetic shielding structure, and relates to the technical field of microwave sensing, the sensor comprises a dielectric substrate, a strip line structure, at least one sensing resonance unit and a plurality of conductive connecting pieces, the strip line structure is arranged in the dielectric substrate and comprises a central conductor located in the dielectric substrate, a top-layer grounding plane arranged on the top surface of the dielectric substrate and a bottom-layer grounding plane arranged on the bottom surface of the dielectric substrate; the sensing resonance unit is arranged on the top-layer grounding plane and generates electromagnetic coupling with the central conductor; the plurality of conductive connecting pieces penetrate through the dielectric substrate so as to electrically connect the top layer grounding plane with the bottom layer grounding plane; and the plurality of conductive connecting pieces are arranged along the edge of the dielectric substrate so as to form an electromagnetic shielding structure for restraining an electromagnetic field between the top-layer grounding plane and the bottom-layer grounding plane. According to the invention, the environment robustness of the microwave sensor can be improved while high sensitivity is maintained.

To provide a bond ply capable of combining low dielectric tangent and dimensional stability.SOLUTION: A bond ply comprises a first adhesive layer, a polyimide layer and a second adhesive layer, in which a) a thickness of an entire bond ply is in the range of 50 μm or more and 300 μm or less, and a ratio of the thickness of the polyimide layer to the thickness of the entire bond ply is 0.2 or more and 0.9 or less, b) after drying at 80°C for 1 hour, the moisture absorption measured after conditioning for 24 hours under constant temperature and humidity at 23°C and 50% RH is 0.4 wt.% or less, and c) the storage elastic moduli at 50°C of the first adhesive layer and the second adhesive layer are each independently 1800 MPa or lower, and the maximum value of the storage elastic moduli at 180 to 260°C are each independently 800 MPa or less.SELECTED DRAWING: None

The invention discloses a testing device for a multichannel millimeter wave radio frequency chip, and relates to the technical field of radio frequency chip testing. The device comprises a structural body, a multilayer circuit board fixed on the structural body, and a waveguide cover plate combined with the structural body to form a waveguide. A substrate integrated waveguide and a strip line are integrated in the multilayer circuit board, and vertical conversion between a waveguide signal and an onboard signal is realized through a waveguide-microstrip transition structure. Through the integrated and double-sided design of the structural body, the multilayer board and the radio frequency link, the substrate integrated waveguide is used for vertical transmission of radio frequency signals, and the strip line is used for transmitting power supply and control signals, so that the problems that a traditional testing device is large in size, and ports of a W-waveband multichannel chip are dense and not easy to test are effectively solved; miniaturization, high integration and test convenience of the test device are realized.

The invention discloses a small broadband cavity-backed radiator, which belongs to the technical field of electromagnetic fields and microwaves and comprises a reflection cavity, a loading medium, a printed balun, a printed oscillator, a low-density medium support and double leads. The low-density medium support is used for supporting the printed oscillator; the printed balun and the printed oscillator are electrically connected through double leads; the loading medium is used for adjusting the impedance frequency characteristic of the printed oscillator in the reflection cavity; the printed Balun adopts a strip line-flat plate line-parallel double-line structure and is used for realizing unbalanced-balanced transmission mode conversion and impedance conversion of 3: 1 bandwidth; and the printed oscillator is used for radiating electromagnetic energy and is matched with the multi-ring-groove loading medium and the printed Balun to realize impedance-frequency characteristic balance within a 3: 1 bandwidth range. The small broadband back cavity radiator can effectively solve the problems that in the prior art, the caliber of a reflection cavity of a traditional broadband back cavity radiator is large, the loading effect is not ideal when the bandwidth of a directional diagram is 4 GHz or above, and directional diagram distortion occurs.

The utility model aims to provide a strip line broadband phase shifter. The strip line broadband phase shifter comprises a substrate I, a substrate II and a substrate III, the top surface of the substrate I is integrally covered with a metal layer I, and the bottom surface of the substrate III is integrally covered with a metal layer II; a main line I, a main line II and a Port2 port are respectively arranged on the bottom surface of the substrate I and the top surface of the substrate II; and a main line III, a main line IV, a reference line, a Port 1 port, a Port 3 port and a Port 4 port are respectively arranged on the bottom surface of the substrate II and the top surface of the substrate III. The antenna is small in electromagnetic radiation, is low in radiation loss, is high in anti-interference capability, and can be suitable for occasions where a phased array radar is high in anti-interference capability.

The present disclosure relates to a stripline radio frequency device, comprising: an annular side wall, a bottom wall, and a cavity formed by the annular side wall and the bottom wall, wherein two filters are provided in the cavity, and the two filters respectively comprise metal conduction strips, the two metal conduction strips are connected via a common conduction strip, and the two metal conduction strips are respectively suspended and mounted on the bottom wall. In the technical solution provided by the embodiment of the present disclosure, a cavity is provided by the bottom wall and the annular side wall, and two filters are provided in the cavity, and respectively comprise metal conduction strips, the two metal conduction strips are respectively suspended and mounted on the bottom wall, and are connected via a common conduction strip, thereby simplifying the device structure and reducing the difficulty of assembly.

An interconnect substrate includes a first interconnect layer, a first insulating layer covering a side surface and a lower surface of the first interconnect layer, a second insulating layer disposed on the first insulating layer and covering an upper surface of the first interconnect layer, a second interconnect layer formed on a lower surface of the first insulating layer, and a third interconnect layer formed on an upper surface of the second insulating layer, wherein the second interconnect layer includes a first ground plane, wherein the third interconnect layer includes a second ground plane, and wherein the first ground plane, the first insulating layer, the first interconnect layer, the second insulating layer, and the second ground plane constitute a stripline.

The invention discloses a high-isolation low-loss filtering structure and method for a PCB strip line. According to the high-isolation low-loss filtering structure provided by the invention, the main transmission strip line, the filtering auxiliary strip line with the spur line structure and the grounding layer with the hollowed-out area are integrated in the PCB, so that external discrete filter elements and welding procedures and shielding separation cavities required by the external discrete filter elements are effectively omitted, and therefore, the size of a module is remarkably reduced; weight and complexity. Meanwhile, due to the integrated design, impedance discontinuity and signal reflection caused by the fact that signals are converted between the inner layer and the surface layer of the PCB through the via holes are avoided, and signal integrity is guaranteed. And finally, on the premise of not introducing additional elements, high-performance filtering is realized, and an effective solution is provided for miniaturization and high performance of the radio frequency front-end module.

The application discloses a transition structure from a stripline transmission line to a coaxial transmission line, which comprises a stripline, an upper shielding cavity communicated above the stripline, a lower shielding cavity communicated below the stripline, and a multilayer circuit board in which the upper shielding cavity, the stripline and the lower shielding cavity are arranged together, one side of the multilayer circuit board being electrically connected with a transition interface, the other side of the transition interface being electrically connected with a coaxial line, the transition interface comprising an interface floor, the middle part of the interface floor being provided with an insulating gap, the insulating gap being communicated with the upper shielding cavity, the stripline, the lower shielding cavity and the coaxial line. The transition interface is designed to realize the transition from the stripline inside the multilayer circuit board to the coaxial line on the sidewall of the multilayer circuit board; the insulating gap is arranged at the transition interface, and the transition gaps are arranged at the positions close to the transition interface between the upper inner floor and the lower inner floor to guide the electromagnetic field type to smoothly transit from the stripline field type to the coaxial field type, so that the advantages of good transmission standing wave and low loss are obtained.

The application discloses a Ku-band four-channel TR assembly, and relates to the technical field of TR assemblies, which comprises a shell and a radio frequency board arranged in the shell; a power supply, a control module and radio frequency lines of the TR assembly are arranged on the radio frequency board; the radio frequency lines are composed of a transition structure of a microstrip line - a strip line - a microstrip line; the strip line is arranged in a stepped form; and the control module is arranged above the step. The application adopts a multifunctional integrated TR chip combined with a final-stage amplifier, the assembly can keep a high level of 40dBm (10W) of the transmitting output power, ensure a small size of the assembly, and adopt a multilayer high-frequency composite board for pressing, integrate the power supply control and the radio frequency lines, and use the transition form of the microstrip line to the strip line to paste the chip on the step on the board, so that the assembly difficulty and the manufacturing cost are further reduced.

The utility model discloses a quantum chip and a quantum computer. The quantum chip comprises a strip line integrated with a plurality of first signal lines; a plurality of sub-chips, wherein each sub-chip comprises a quantum bit wafer integrated with quantum bits and an interposer wafer integrated with control lines; the interposer wafer is provided with a second signal line, a first conductive column and a second conductive column. Two ends of the first conductive column are electrically connected with the quantum bit and one end of the second signal line; one end of the second conductive column is electrically connected with the other end of the second signal line; a strip line is arranged between any two adjacent sub-chips, and the two ends of each first signal line in the same strip line are electrically connected with the other end of one second conductive column in the two adjacent sub-chips respectively, so that the two quantum bits on the two sub-chips are electrically connected; the first signal line is provided with a first coupler. The quantum chip is formed by effectively connecting a plurality of sub-chips, so that the processing accuracy of a single sub-chip can be effectively improved, and the quality of the quantum chip is ensured.

An apparatus includes an interposer (112, 200) configured to be electrically coupled to one or more semiconductor devices (102, 104). The interposer includes a core having a substrate (202) and first vias (204) through the substrate, a first stackup (206) of layers over a first side of the core, and a second stackup (208) of layers over a second side of the core. The first stackup of layers includes first redistribution layers (210a-210e) and first dielectric layers (212a, 214a-214d). The first redistribution layers are electrically coupled together using second vias (216) through the first dielectric layers, and the first stackup of layers forms a first and a second stripline. The second stackup of layers includes second redistribution layers (210f-210h) and second dielectric layers (212b, 214e-214f). The second redistribution layers are electrically coupled together using third vias (216) through the second dielectric layers, and the second stackup of layers forms a third stripline.

A signal switch for a power tool has a paddle supported by a rocker that extends into the switch housing to pivot an actuating member. A circuit board is attached to the bottom of the switch. Depending on the position of the paddle, at least one microswitch extends from the circuit board into the switch in a position to be actuated by the actuating member. The circuit board includes a connector configured to connect to a cable (e.g., a ribbon cable). Circuit traces on the circuit board are electrically connected to the microswitch and the electrical connector. The interior of the switch housing is sealed from the external environment so that the mechanical components of the switch are protected from the environment.

The present invention discloses a broadband magnetoelectric dipole antenna with second harmonic suppression. The antenna comprises: an antenna feed structure comprising a bottom dielectric substrate, a rod-shaped stripline, and an H-shaped slot. The bottom dielectric substrate is provided with an upper floor and a lower floor, respectively, on both surfaces thereof. The H-shaped slot is etched into the upper floor, and the rod-shaped stripline is disposed within the bottom dielectric substrate. An antenna radiator structure comprises a top dielectric substrate, a main patch disposed on the top surface of the top dielectric substrate, and the main patch is connected to the upper floor via a grounded metal post. An antenna filter structure comprises an open resonant ring, a grounded metal branch, and a feeder branch. The open resonant ring is printed on the top surface of the top dielectric substrate. The grounded metal branch is located within the top dielectric substrate and connected to the upper floor. The feeder branch is printed on the top surface of the bottom dielectric substrate and connected to the rod-shaped stripline. This antenna can achieve second harmonic suppression without increasing the antenna volume and without affecting in-band matching.

The invention relates to the field of near-field electromagnetic measurement, and discloses a broadband low-cost magnetic field probe capable of coaxially rotating and a magnetic field measurement device. The magnetic field probe is based on a low-cost FR-4 material and a conventional four-layer printed circuit board process. The magnetic field probe at least comprises a shielding ring, an isosceles cone ladder transmission structure, a fence type isolation via hole array, a non-metal mounting hole, a 50-ohm strip line, a multi-stage impedance joint matching structure and a side insertion type radio frequency connector. And an isosceles cone ladder transmission structure and a multi-stage impedance matching structure are adopted, so that the impedance continuity is improved, and the gain flatness is improved. The magnetic field measuring device comprises a magnetic field probe, a hollow rotating table, a micrometer, a magnetic field probe clamp, a metal connecting rod, a micrometer, a hollow rotating table, a three-dimensional mechanical arm, a driver module, a controller module, a computer and upper computer software, and magnetic field components in different directions can be accurately detected in the horizontal direction. The method is simple in scheme, low in cost and suitable for multi-component near-field magnetic field testing application.

The application discloses a kind of ultra-wideband high-performance radio frequency interconnection structure, including laminated structure, radio frequency signal feed-in structure, first coaxial structure, strip line transmission structure, second coaxial structure, solder ball feed-out structure and ground via.The application is applied to ultra-wideband, through the design and key parameter optimization of coaxial structure and strip line transmission structure, so that radio frequency interconnection structure can be applied to DC~40GHz frequency band range;Gold wire bonding model is introduced, by increasing rectangular metal area in signal feed-in disc, to compensate the parasitic inductance effect introduced by bonding gold wire, improve the accuracy of simulation data.By configuring the key parameters of coaxial structure port and strip line port, the circuit design can be adjusted and adapted automatically by adjusting the number of metal layers and dielectric layers, as well as adjusting the length of strip line, reducing the circuit design time and complexity.The strip line transmission structure has no matching branch, reducing the processing difficulty.

A probe coupling adjusting device relates to the field of dielectric property testing of dielectric materials, and relates to microwave testing methods such as a resonant cavity method, a quasi-optical cavity method and a strip line method which need to adjust probe coupling, and comprises a probe fixing block (1), an indexing ring (2) and a fixing bottom block (3), the probe fixing block (1) is movably connected with the indexing ring (2) through an external thread (8) and an internal thread (9), and the position of the probe fixing block (1) is adjusted by rotating the indexing ring (2), so that the coupling amount is controlled; the indexing ring (2) is movably connected with the fixed bottom block (3), and the indexing ring (2) can rotate relative to the fixed bottom block (3); by rotating the indexing ring (2), the probe fixing block (1) can drive the probe to move back and forth along the X axis so as to adjust the coupling strength. The device is small in size, easy to install and high in adjusting precision.

The 6G satellite communication terminal system comprises a grounding layer, a substrate layer, a feed layer and a radiation metal patch, the grounding layer is arranged at the lower end of the substrate layer, the feed layer is arranged at the upper end of the substrate layer, the radiation metal patch is of a square structure, and the radiation metal patch is arranged on the substrate layer. The radiation metal patches are arranged at the upper end of the feed layer in a matrix mode, cross-shaped gaps are etched in the upper end walls of the radiation metal patches, the radiation metal patches and the feed layer are electromagnetically coupled through the cross-shaped gaps, and the feed layer is provided with a T-shaped strip line matching network. According to the technical scheme of the invention, the electromagnetic decoupling of the Ku / Ka dual-frequency transceiving coplanar phased array can be realized (the isolation degree gt; 45 dB), and a broadband impedance modulation type power amplification technology (24-30 GHz relative bandwidth gt; 25%), a multilayer microwave composite board integrated framework (the thickness is lt; 2 mm, the interconnection loss lt; therefore, the requirement for light weight is met, scanning at a wide angle of + / -60 degrees is supported, and the consistency of a directional diagram of the antenna is also improved.

The application discloses a kind of dual-frequency dual-circular polarization phased array antennas, using Q frequency band, V frequency band co-array face form is designed, dual-frequency dual-circular polarization phased array antenna includes alternately arranged Q frequency band array and V frequency band array;Q frequency band array includes multiple Q frequency band units, V frequency band array includes multiple V frequency band units;Dual-frequency dual-circular polarization phased array antenna includes metal plate and PCB board;Each Q frequency band unit and each V frequency band unit include radiator and feed layer;Feed layer is arranged on PCB board, metal plate is connected with PCB board, for avoiding electromagnetic wave leakage on feed layer;Metal plate is equipped with metal cavity, metal cavity is used to fix radiator;Wherein, feed layer is made into 90 ° bridge circuit using strip line, to realize dual-circular polarization.The application uses Q, V frequency band co-array face form, alternately arranged, by increasing the way of array element spacing, to reduce the number of array elements.The application can be widely applied in the field of antenna technology.

A quantum computing system with structures for wiring superconducting qubits between varying thermal regimes is presented. This system enables the control of many thousands to millions of qubits operated at typical qubit operating temperatures, while the control electronics operate at much higher temperatures, such as 3-4 K, 50-77 K, or 300 K. The system includes a qubit substrate with one or more qubits, a metallization layer, a wiring substrate comprising superconducting striplines, a mechanical mount, and a quantum computing device. The system includes structures disposed throughout that connect a lower temperature section for qubit operation to a higher temperature section for control operations. The system also employs flex circuit boards for achieving dense and scalable connectivity. Methods for fabricating the quantum computing system are also disclosed.

This invention discloses a multilayer stripline 90-degree bridge, belonging to the field of microwave passive device technology. The bridge includes a first metal base and a second metal base arranged opposite each other and each having a groove; a multilayer dielectric substrate sealed and sandwiched between the two bases, completely filling the grooves; and a first stripline and a second stripline disposed on different layers within the multilayer dielectric substrate. The first and second striplines are parallel to each other and DC isolated from each other, with their central coupling units corresponding to the groove positions in their vertical projection. The bridge also includes an input port, a through output port, a coupled output port, and an isolation port. This invention, through the sandwich sealing structure of the metal base grooves and the multilayer dielectric substrate, enhances the electromagnetic coupling between the striplines, allowing for the use of wider and thicker coupling lines, thereby achieving low insertion loss, high power capacity, and good amplitude and phase balance over a wide frequency band, and exhibiting excellent low-temperature environmental adaptability.

A directional coupler of present invention includes a waveguide, a substrate, two first slits, and two second slits. The substrate is having a strip line and ground layers opposed to each other at a side surface of the waveguide. The two first slits are provided in the side surface of the waveguide along a propagation direction of an electromagnetic waves in the waveguide, and the two second slits are provided in the first ground layer of the substrate opposed to the two first slits.