106 results about "Electronic assemblies" patented technology

This application belongs to the field of electronic device technology, specifically relating to a stylus and electronic components. This application aims to solve the problem of low positioning accuracy in related styluses. The stylus and electronic components of this application coordinate the positioning of the stylus through a dual electric field link. The motherboard, a first conductive component, a conductive elastic component, a conductive support, and the pen tip constitute the first electric field link, with the pen tip acting as a transmitter to emit a first electric field signal. The motherboard, a second conductive component, and the electric field transmitter constitute the second electric field link, with the electric field transmitter emitting a second electric field signal. The second electric field signal is radiated onto the touchscreen. The touch chip can calculate the distance between the second and first electric field signals in real time. Based on the calculated distance, it calculates the tilt angle or degree of tilt of the stylus relative to the touchscreen, and then corrects the landing position of the pen tip, further improving the accuracy of the pen tip's position displayed on the touchscreen and making the stylus trajectory less prone to deviation during writing.

This utility model discloses a novel electric screwdriver with a modular design, including a screwdriver body and a handle mechanism. The screwdriver body includes a main body shell, a screwdriver head, and a drive assembly. The rear end of the main body shell has a T-shaped or dovetail-shaped locking groove, within which a conductive groove electrically connected to the drive assembly is embedded. The handle mechanism includes a handle housing containing a battery module and a control module. The housing has a slide rail boss that matches the locking groove, and a conductive plate on the boss. When inserted into the locking groove, the plate forms an interference contact with the conductive groove, achieving stable power supply. The contact surface between the conductive groove and the conductive plate is plated with a silver-nickel alloy layer to enhance oxidation resistance. The side of the locking groove has a positioning hole for fixed connection via a limit screw. This utility model has advantages such as convenient assembly and disassembly, stable conductivity, and strong vibration resistance, solving the problems of inconvenient maintenance, limited battery life, and poor versatility of traditional electric screwdrivers. It is suitable for various scenarios such as electronic assembly and mechanical repair.

A method includes removing an oxide layer from select areas of a surface of a metal structure of a lead frame to create openings that extend through the oxide layer to expose portions of the surface of the metal structure. The method further includes attaching a semiconductor die to the lead frame, performing an electrical connection process that electrically couples an exposed portion of the surface of the metal structure to a conductive feature of the semiconductor die, enclosing the semiconductor die in a package structure, and separating the electronic device from the lead frame. In one example, the openings are created by a laser ablation process. In another example, the openings are created by a chemical etch process using a mask. In another example, the openings are created by a plasma process.

The application belongs to the technical field of equipment element combination optimization and intelligent matching, and discloses a waveform feature clustering guided arrayed electronic equipment element combination optimization method and device. The method is a collaborative optimization mechanism with waveform feature clustering as the core, which is proposed for arrayed electronic assembly under the condition of multiple product parallel assembly and complex working conditions of multiple temperatures and multiple frequency points. In the initial stage of population initialization, the performance response characteristics of signal channels under complex working conditions are analyzed, and clustering analysis is performed to identify channel main clustering clusters with consistency potential, and the initial population is generated based on the channel main clustering clusters to lay the foundation for structural consistency. In the evolution process, a cross mechanism based on clustering structure reservation is designed to lock and inherit the high-quality channel combination structure and strengthen the genetic transmission of good genes. In combination with suspicious channel identification and directional disturbance means, the key influence channel is precisely fine-tuned. The application can significantly improve the waveform consistency and assembly efficiency of the multi-channel equipment.

Method for adjusting process parameters for a process for manufacturing electronic assemblies by means of automated manufacturing on a production line (100), comprising the method (A) Performing a correlation procedure to correlate different data sets that are assigned to one and the same printed circuit board (470) on which an electronic assembly with several electronic components is built up by means of automated manufacturing, the correlation procedure comprising Providing a first data set from a first machine (110), wherein the first data set is assigned to the first machine (110), controls an operation of the first machine (110) and features: first position information and first characteristic information about characteristic target properties of a product characteristic structure of the printed circuit board (470) at several positions of the printed circuit board (470); Providing a second data set from a second machine (160), wherein the second data set is assigned to the second machine (160), controls an operation of the second machine (160) and features: second position information and second characteristic information about characteristic target properties of the product characteristic structure of the printed circuit board (470) at the multiple positions of the printed circuit board (470); geometric superimposition of the first position information with the second position information; Repositioning the first position information and / or the second position information such that the totality of distances between each pair of associated position information, i.e., a first position information and an associated second position information, from each of the same locations on the printed circuit board (470), is reduced; and Providing a third data set from a third machine (130), wherein the third data set is assigned to the third machine (130), controls an operation of the third machine (130) and has third position information and third characteristic information about characteristic target properties of the product characteristic structure of the printed circuit board (470) at the multiple positions of the printed circuit board (470); wherein the geometric overlay further comprises a geometric overlay of the third position information with the first position information and / or the second position information; and wherein the repositioning further comprises repositioning the third position information such that an entirety of the sum of the three distances between each set of three mutually associated position information, i.e. the sum of (i) a first distance between the first position information and the associated second position information, (ii) a second distance between the associated second position information and a third position information which is associated with the first position information and the second position information, and (iii) a third distance between the third position information and the first position information, from each of the same location on the printed circuit board (470), is reduced; wherein the first machine is a first processing machine (110) and the first data record contains a first process data record; wherein the second machine is a first inspection machine (160) and the second data set contains a first inspection data set; wherein the third machine is a second processing machine (130) and the third data set contains a second process data set; and wherein the method for adjusting process parameters further comprises (B) Determine, using the first inspection machine (160), a first deviation between an actual property and a target property of the product characteristic structure in a first area of ​​the printed circuit board (470), which is assigned to a first location on a surface of the printed circuit board (470); (C) Creating a first combination data set (375) based on (i) at least one first part of each of the first process data set, the second process data set and the first inspection data set, wherein the first part is assigned to the first area of ​​the printed circuit board (470) and further based on (ii) the repositioned first position information and / or the repositioned second position information and / or the repositioned third position information; and (D) Adjusting first process parameters of the first processing machine (110) and / or second process parameters of the second processing machine (130) based on the created first combination data set (375) and the determined first deviation.

This invention relates to the field of solder powder technology, specifically to an antioxidant solder powder and its preparation method. The solder powder uses SAC305 tin-silver-copper alloy solder powder as a matrix, and its surface has an antioxidant treatment layer formed by segmented anchoring of single-terminated phosphate-based polyether oligomers and spacer regulation by polyethylene glycol monomethyl ether. During preparation, under nitrogen protection, the following steps are performed sequentially: ethyl acetate pre-cleaning, aqueous isopropanol water-limited hydroxylation, two-stage single-terminated phosphate-based polyether anchoring, polyethylene glycol monomethyl ether sacrificial spacer treatment, washing, drying, and sieving. The resulting solder powder exhibits low total oxygen increment after 168 hours of open aging at 40°C and 75% RH. Solder paste made from this powder exhibits low viscosity drift, high spreadability, and low solder joint void ratio, making it suitable for high-reliability electronic assembly solder paste.

The invention relates to an electronic assembly comprising: - a main housing (5), - at least one electronic board (6A) housed in the main housing (5), - a cover (7) configured to close the main housing (5), the cover (7) being configured to bear a base of an external connector comprising electrical connection elements to be connected to an interconnector on the electronic board (6A), - a plurality of centering pins (14) configured to center both the electronic board (6A) and the cover (7) with respect to the main housing (5).

The invention relates to an electronic assembly, in particular configured to be integrated in an electronic device such as an onboard vehicle charger, comprising: - a main circuit board (30), which carries an electrical connector element (32), - a transverse circuit board (15), which carries a complementary electrical connector element (33) configured to cooperate with the connector element (32) of the main circuit board (30), these connector elements in particular forming a floating connector (35), - a main housing (5), in particular produced as a casting, comprising an insertion slot (36) for receiving the transverse circuit board (15) and at least two guide ribs (37) configured to guide the transverse circuit board (15) into the insertion slot (36).

A docking system for an electronic device assembly is provided. The docking system can include a first assembly and a second assembly. The first assembly can include a base and a first plurality of electrical connections that extend through the base. The second assembly can be configured to be removably coupled to the first assembly. The second assembly can include a turntable that is configured to rotate from a first position to a second position, a second plurality of electrical connections that extend through the turntable, and an electronic assembly that includes a printed circuit board assembly (PCBA) that is coupled to the turntable such that the PCBA is rotatable with the turntable.

An apparatus and method for transferring electronic components from a first carrier to a second carrier, wherein the first carrier carries a plurality of discrete components and the second carrier carries a plurality of electronic assemblies, and one of the components from the first carrier is transferred to each electronic assembly. The device and method provide the following functions: accommodating a first carrier in or on a first receiving portion; accommodating a second carrier in or on a second receiving portion; conveying the second carrier along its longitudinal direction toward the second receiving portion or above, wherein the first carrier is accommodated in or on the first receiving portion such that the components it carries are oriented toward the second receiving portion; separating one of the components from the first carrier in a contact or non-contact manner to convey the component to the second carrier at a mounting position; conveying the second carrier with its orientation relative to the mounting position such that electronic components on the second carrier reach the mounting position; detecting the component mounting position on the electronic components on the second carrier upstream of the mounting position using a first image acquisition device, and notifying the control unit with image acquisition signaling to determine the positioning and / or orientation of the electronic components on the second carrier; applying a portion of adhesive to the electronic components on the second carrier downstream of the first image acquisition device using an adhesive application unit; detecting the positioning and / or orientation of this portion of adhesive on the electronic components downstream of the adhesive application unit using a second image acquisition device, and notifying the control unit with image acquisition signaling to determine the positioning and / or orientation of this portion of adhesive.

The application provides a food processor. The food processor comprises a base, a stirring cup assembly and a cover. The base is internally provided with a first electronic assembly, and the stirring cup assembly is detachably assembled to the base. The cover is assembled to the top of the base, and the cover is internally provided with a second electronic assembly. The cover can be lowered to a low position and raised to a high position along the height direction of the base. In the low position, the cover is arranged above the stirring cup assembly, the first electronic assembly is electrically connected with the second electronic assembly. In the high position, the first electronic assembly is disconnected with the second electronic assembly, and a disassembly space is formed between the cover and the stirring cup assembly, so that the stirring cup assembly can be detached. The stirring cup assembly in the food processor can be freely taken, and the safety of the food processor can be ensured.

A module-socket-dependent assembly design process is provided which includes obtaining, by an assembly design engine, socket-dependent substitution rules indicating where a different electronic module type can be used for another electronic module type at a particular socket in an electronic module assembly configuration absent violating a power constraint of a respective electronic assembly design. The assembly design includes multiple electronic module sockets to accommodate multiple electronic modules of the electronic module assembly configuration. The process further includes automatically generating an updated electronic module assembly configuration using at least one substitution rule of the socket-dependent substitution rules, where the other electronic module type of the electronic module assembly configuration is replaced at the particular socket of the multiple sockets with the different electronic module type. Further, the process includes initiating fabricating of an electronic assembly using the updated electronic module assembly configuration of the electronic assembly design.

Title: Electronic assembly comprising at least one electronic component and a cooling device including a positioning member. The invention relates to an electronic assembly comprising at least one electronic component (6), a cooling device (2) for said electronic component comprising a cooling plate (4), said electronic component (6) being disposed on said cooling plate (4) in at least one heat exchange zone (Z, Z1, Z2, Z3), the heat exchange zone (Z, Z1, Z2, Z3) being a flat portion (10) of the cooling plate (4), the electronic assembly further comprising at least one thermal attachment means (8) interposed between the heat exchange zone (Z, Z1, Z2, Z3) and the electronic component (6),the cooling plate (4) being characterized in that centering means (12) are arranged on the periphery of the heat exchange zone (Z) so as to maintain the thermal attachment means (8) and / or the electronic component (6) within the heat exchange zone (Z). (figure 2),

The embodiment of the invention provides a connector module, an electronic assembly and electronic equipment, the connector module is used for being connected to a circuit board, and the connector module comprises an elastic contact piece, a fixing device and a cable; the elastic contact piece is used for being in elastic contact with the circuit board; the fixing device is used for being fixed to the circuit board and limiting the elastic contact part to the circuit board. The fixing device is fixedly connected with the cable, and enables the cable to be in elastic contact with the elastic contact piece. According to the embodiment of the invention, miniaturization, high density and high bandwidth of the connector module can be realized, and design requirements are met.

This disclosure relates to a power electronic assembly having embedded power electronic devices. The power electronic assembly includes a circuit board assembly comprising a first electrically insulating layer, an electrically insulating substrate, a laminate disposed between the first electrically insulating layer and the electrically insulating substrate, and one or more conductive layers disposed within the electrically insulating substrate. The laminate includes a power electronic device assembly comprising an S-cell and power electronic devices. The S-cell includes a graphite layer and a metal layer covering the graphite layer. A groove is formed in the outer surface of the metal layer, and the power electronic devices are disposed within the groove on the outer surface of the S-cell.

Disclosed is an electronic assembly (EA) comprising: - a circuit carrier (ST), - a semiconductor device (HB) embedded in the circuit carrier (ST) and having an electrical contact surface (KF1), - wherein the contact surface (KF1) of the semiconductor device (HB) is physically and electrically contacted by means of a microvia (MV), wherein the microvia (MV) is sintered onto the contact surface (KF1) of the semiconductor device (HB) in a sintering process using a metallic, in particular copper-containing, sintering paste (SP). Furthermore, an inverter with a specified electronic assembly (EA) and a method for manufacturing the specified electronic assembly (EA) are described.

Present invention relates to a needle-free glucose measurement system which enable measurement of blood glucose level using concentration value of N2O molecule available in breath air, which comprises an electronic assembly (1.1) which stabilizes the temperature and flow of wavelength-adjustable laser light source (1.2) and controls wavelength, a laser-based sensor (1) which determines concentration values of N2O molecule by measuring the adsorption amount of detector (1.5) wherein beams coming from laser light source (1.2) are adsorbed by N2O molecules in the breath air in the adsorption cell (1.4), and a processor (2) which determine glucose values in the blood using the concentration data coming from laser-based sensor (1).

This disclosure provides a composite electronic component. The composite electronic component includes: a capacitor including a body and an external electrode disposed on the body; and a bump disposed on a lower surface side of the body and connected to the external electrode, wherein the external electrode includes: an electrode layer in contact with an inner electrode; a Ni plating layer disposed on the electrode layer; a first compound layer disposed on the Ni plating layer; a first Sn plating layer disposed on the first compound layer; a second compound layer disposed on the first Sn plating layer; and a second Sn plating layer disposed on the second compound layer. The bump includes: a main portion including a conductive metal; a bump Ni plating layer disposed on the main portion; a first bump compound layer disposed on the bump Ni plating layer; a first bump Sn plating layer disposed on the first bump compound layer; a second bump compound layer disposed on the first bump Sn plating layer; and a second bump Sn plating layer disposed on the second bump compound layer.

This disclosure provides a multilayer electronic component and a method for manufacturing the multilayer electronic component. The multilayer electronic component includes: a body comprising a dielectric layer and inner electrodes alternately disposed with respect to the dielectric layer in a first direction; a first side edge portion and a second side edge portion disposed on a fifth surface and a sixth surface of the body, respectively; and a first external electrode and a second external electrode disposed on a third surface and a fourth surface of the body, respectively. Each of the first side edge portion and the second side edge portion has an upper portion in the first direction that is asymmetrical relative to the lower portion in the first direction, and the width of the upper portion of each of the first side edge portion and the second side edge portion in the first direction in the third direction increases with increasing distance from the second surface.

An electronic assembly includes a first electronic component, a second electronic component, and a seal assembly. The first electronic component includes a substrate and a first electrical connecting portion secured to the substrate, and the second electronic component includes a second electrical connecting portion connected to the first electrical connecting portion forming an electronic connection between the first and second electronic components. The seal assembly includes a housing and an encapsulate. The housing defines a cavity and has one or more open sides. The housing is positioned over the electronic connection and is mated to the substrate resulting in a single open side. The encapsulate is disposed within the cavity of the housing and covers the electronic connection. The encapsulate seals closed the single open side of the housing.

An electronics assembly is provided for use with a tire. The assembly includes a plurality of printed circuit boards, each of which includes an electronic device configured to sense a condition of the tire. Attachment pegs are provided to attach the printed circuit boards together in stacked positions that are spaced apart by the attachment pegs. Each attachment peg has a lower end portion configured to attach to any one of the printed circuit boards. Each attachment peg further has an upper end portion configured to attach to any other one of the printed circuit boards. This enables the printed circuit boards to be attached interchangeably between the stacked positions.

A connector module, an electronic assembly and an electronic device. The connector module is configured to be connected to a circuit board, and comprises an elastic contact member, a fixing device and a cable, wherein the elastic contact member is configured to be in contact with the circuit board; and the fixing device is configured to be fixed to the circuit board and limit the elastic contact member to the circuit board, and the fixing device is fixedly connected to the cable, and causes the cable to be in elastic contact with the elastic contact member. The electronic assembly comprises a circuit board and the connector module. The electronic device comprises a housing and the electronic assembly. The connector module in the present application can achieve miniaturization, high density and high bandwidth, thereby meeting design requirements.

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a frontal shell having a rear edge, a rear shell having a frontal edge, and an electronics assembly. The electronics assembly includes various components and devices used in the operation of the humanoid robot.

Provided in the present application are a connector, an electronic assembly, an electronic device, and a signal transmission method. The connector comprises a fixing structure and a plurality of first terminals, the plurality of first terminals comprising signal terminals and ground terminals, wherein the signal terminals are configured to transmit signals, and the ground terminals are configured to be grounded. Specifically, the signals transmitted by the signal terminals may be high-speed signals, and the ground terminals are configured to serve as return grounds, reference grounds, and / or shielding structures for the signal terminals. The fixing structure comprises a body and separation portions located on the body, and the relative dielectric constant of the separation portions is lower than the relative dielectric constant of the body. The first terminals are fixed to the body, and the separation portions are provided between the signal terminals and the ground terminals. Since the relative dielectric constant of the separation portions is relatively low, mutual capacitance values between the signal terminals and the ground terminals are relatively small, so that crosstalk can be reduced. The solution is conducive to increasing the signal transmission rate and bandwidth of the connector.

The application discloses an electronic pen holder, which comprises a main shell and a first magnetic suction member, wherein the main shell comprises a mounting surface and at least one receiving surface, and a placing groove suitable for receiving an electronic pen is arranged on the side of the receiving surface; the first magnetic suction member is suitable for being adsorbed and fixed to the surface of a display device; the first magnetic suction member is arranged on the side of the mounting surface, and a clamping inner angle is formed between the first magnetic suction member and the mounting surface, and the clamping inner angle is suitable for clamping cooperation with the corner of the display device. The electronic pen holder can be easily adsorbed to any position of the metal surface of the display device through the built-in first magnetic suction member, and the user can adjust the position of the electronic pen holder at will according to actual needs, which greatly improves the flexibility and convenience of use, and the user does not need to worry about the loss of the electronic pen, and the electronic pen can also be quickly taken when needed.

A body implantable reservoir assembly has a reservoir body adapted to contain the liquid and an electronic assembly disposed in the reservoir body and adapted to move the liquid between the reservoir body and an implantable prosthesis. The electronic assembly has a printed circuit board and a battery hermetically sealed inside a canister, a pump assembly having a motor electrically coupled with the printed circuit board and the battery, a pump coupled with the motor, and a valve assembly coupled with the pump. When the reservoir body contains the liquid, the motor, the pump, and the valve assembly are immersed in the liquid.

Dopant complexes are disclosed. The dopant complexes can be formed from a dopant ion component encapsulated in a polymer matrix, wherein the dopant ion component is a metal triflate, a metal halide, a metal antimonate, or any combination thereof, and the polymer matrix comprises or consists of a hydroxyl-containing polymer. Electronic assemblies and uses of the dopant complexes are also disclosed.