990 results about "Electronic assemblies" patented technology

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a frontal shell having a rear edge, a rear shell having a frontal edge, and an electronics assembly. The electronics assembly includes various components and devices used in the operation of the humanoid robot.

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a rear shell, and a frontal shell coupled to the rear shell to define a head volume between the frontal shell and the rear shell, and an electronics assembly with a display located in the head volume between the frontal shell and the rear shell. The frontal shell of the head housing assembly includes: a first arc length at a first location below the display, a second arc length at a second location aligned with a portion of the display, and wherein said second arc length is greater than the first arc length, and a third arc length at a third location above the display, and wherein said third arc length is greater than both the first arc length and the second arc length.

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a frontal shell having a rear edge, a rear shell having a frontal edge, and an electronics assembly. The electronics assembly includes various components and devices used in the operation of the humanoid robot.

A head and neck assembly for a humanoid robot, including a head portion having an exterior surface defining an overall shape resembling a human head; a neck portion extending from the head portion; a head housing assembly enclosing the head portion and neck portion; an electronics assembly contained within the head housing assembly; and a head actuator assembly configured to move the head portion relative to a torso of the humanoid robot.

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a frontal shell having a rear edge, a rear shell having a frontal edge, and an electronics assembly. The electronics assembly includes various components and devices used in the operation of the humanoid robot.

The invention provides an intelligent electronic assembly quality control system based on AOI (automatic optical inspection) and SPI (solder paste printing inspection) integration, and belongs to the field of electronic information equipment flexible production lines. Comprising an AOI module, an SPI module, a data integration module, a feedback control module and a data storage and transmission module. All the modules carry out high-frequency data transmission through an industrial Ethernet; according to the system provided by the invention, the precision of quality detection is improved, and the accurate recognition of defects is realized through the data association of the AOI and the SPI module and the anomaly detection of the SVM and the CNN algorithm. Real-time process optimization is achieved, the feedback control module automatically adjusts printing and mounting process parameters according to the quality data model, and the product consistency is remarkably improved. The method improves the traceability and safety of the data, achieves the efficient storage and safety access of the detection data through distributed cloud storage and data encryption transmission, and supports the quality problem traceability.

An electronic candle, including an inner housing, a light element disposed on the inner housing, a candle tube sleeved outside the inner housing and an electronic assembly, the candle tube is light-transmissive and non-transparent, the lighting element emits light that passes through the candle tube; and the electronic assembly includes a printed circuit board assembly (PCBA) and a lamp head, at least a portion of the PCBA is arranged within the inner housing, the PCBA is electrically connected to both the light element and the lamp head, and the lamp head extends through the candle tube.

A thermal management system defines a thermal management system flowpath to provide a flow of a fluid to an electric machine and a power electronics assembly electrically connected to the electric machine. The thermal management system includes a first heat exchanger thermally connected to the thermal management system flowpath and to the electric machine, and a second heat exchanger thermally connected to the thermal management system flowpath downstream of the first heat exchanger. The second heat exchanger is thermally connected to the power electronics assembly.

The invention relates to a cooling device for cooling an electrical and / or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component having a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40) a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5) along the longitudinal direction (11), the cooling device (1) also comprising at least one turbulator (6) that is arranged inside a turbulator section (56) of the cooling channel (5). According to the invention, a turbulence portion (61) for generating local turbulence in the flow of the cooling fluid and a blocking region (62) for locally blocking the flow of the cooling fluid are formed on the turbulator (6).

A trans-inductor voltage regulator (TLVR) inductor module includes: a magnetic core; a first winding embedded in the magnetic core; a second winding embedded in the magnetic core and inductively coupled to the first winding; a third winding embedded in the magnetic core; a fourth winding embedded in the magnetic core and inductively coupled to the third winding; and a first integrated metallic connector that connects the second winding and the fourth winding in a series loop. A power electronics assembly that includes the TLVR inductor module is also described.

Disclosed herein are embodiments of a wound treatment apparatus with electronic components integrated within a wound dressing. In some embodiments, a wound dressing apparatus can comprise a wound dressing. The wound dressing can comprise an absorbent material, an electronics unit comprising a negative pressure source, the electronics unit integrated within the wound dressing and at least partially encapsulated by a flexible film. The flexible film can comprise a window or aperture configured to permit fluid communication between the absorbent material and the negative pressure source. In some embodiments, a wound dressing apparatus can comprise a wound contact layer, an absorbent layer over the wound contact layer, the absorbent layer comprising one or more apertures, a cover layer configured to cover and form a seal over the wound contact layer and the absorbent layer, and an electronics assembly comprising a negative pressure source. A portion of the cover layer overlying the one or more apertures in the absorbent layer can be configured to be compressed within the aperture in the absorbent layer when negative pressure is applied to the wound dressing apparatus. The compressed cover layer can indicate a level of negative pressure below the cover layer. In some embodiments, the wound dressing apparatus can comprise an indicator material layer and a cover layer configured to cover and form a seal over the wound contact layer and the indicator material layer. The indicator material layer can be configured to protrude relative to a surrounding surface of an upper surface of the wound dressing apparatus when negative pressure is applied to the wound dressing apparatus and the protruding indicator material layer indicates a level of negative pressure below the cover layer.

Cooling arrangement (7) for cooling an electrical unit (10), wherein the cooling arrangement comprises: a heat sink (5), a substrate (6), wherein the heat sink comprises: a cooling channel (35) through which coolant can flow in a predetermined direction, a cooling wall (50) on the side of the cooling channel facing the electrical unit (10) to be cooled, wherein the substrate is positively connected to the heat sink at the cooling wall, and is designed so that the electrical unit can be mechanically fixed to it on the side facing away from the heat sink, wherein the cooling arrangement is designed so that, in operation, the coolant is guided through the cooling channel at a predetermined operating pressure which is higher than the ambient pressure which is present on the substrate on the side of the electrical unit to be cooled, and wherein a distance (D) between the cooling channel (35) and the cooling wall (50) is selected to be so small,that the heat sink, without the positively connected substrate, cannot ensure sufficient dimensional stability and / or sealing at the specified operating pressure, and the substrate and its positively connected connection to the heat sink on the cooling wall are designed such that the cooling arrangement can ensure this sufficient dimensional stability and sealing, and wherein the heat sink is monolithic. Also disclosed are an electronic assembly with such a cooling arrangement, an electrical power converter with such an electronic assembly, and methods for assembling these devices.

Liquid metal thermal interface materials and their uses in electronics assembly are described. In one implementation, a semiconductor assembly includes: a semiconductor die; a heat exchanger; and a thermal interface material (TIM) alloy bonding the semiconductor die to the heat exchanger without using a separate metallization layer on a surface of the semiconductor die or a surface of the heat exchanger. The TIM alloy may be formed by placing a TIM material between the semiconductor die and the heat exchanger, the TIM material comprising a first liquid metal foam in touching relation with the surface of the semiconductor die, a second liquid metal foam in touching relation with the surface of the heat exchanger.

A luminous frame assembly includes a support frame and a pod light device detachably mounted on the support frame. The pod light device includes a housing, light guide bars, and an electronic assembly. The light guide bars are connected to the housing at intervals along a radial direction, with one end of each of the light guide bars, away from the housing, protruding upward and / or downward from the housing. The electronic assembly includes a main board and light-emitting components, with the light-emitting components connected to the light guide bars. When the light-emitting components emit light, a unique visual effect is produced, and top and / or bottom of the support frame are illuminated for providing a clear target to facilitate nighttime play or sports, thereby improving user experience and practicality.

Solid metal foam thermal interface materials and their uses in electronics assembly are described. In one implementation, a method includes: applying a thermal interface material (TIM) between a first device and a second device to form an assembly having a first surface of the TIM in in touching relation with a surface of the first device, and a second surface of the TIM opposite the first surface in touching relation with a surface of the second device, the TIM comprising a solid metal foam and a first liquid metal; and compressing the assembly to form an alloy from the TIM that bonds the first device to the second device.

An electronic assembly is provided. The electronic assembly includes a first circuit structure including a transistor, a through via and a conductive structure, a plurality of electronic elements disposed on the first circuit structure, a first pad disposed between the first circuit structure and one of the plurality of electronic elements, a second circuit structure disposed on the first circuit structure, and a second pad disposed between the second circuit structure and one of the plurality of electronic elements. At least a portion of the conductive structure is disposed in the through via. The conductive structure is electrically connected to the first pad and the transistor.

The invention relates to a cooling device for cooling an electrical and / or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component comprising a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40), a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5), the cooling device (1) further comprising at least one turbulator (6) arranged inside the depression (40) of the cooling channel (5), the turbulator (6) adjoining a bottom surface (44) in the depression (40) of the bottom plate (4) and the bottom surface (44) facing the top plate (3). According to the invention, the bottom plate (4) comprises an embossment (7) in a bending region (43) on the edge of the bottom surface (44).

A device with exchangeable electronics assemblies of a motor vehicle. The device includes a housing to at least partially enclose the electronics assemblies exchangeable in an insertion direction, an insertion mechanism for receiving the exchangeable electronics assemblies, a front side which is at least partially detachably connected to the housing and via which access to the exchangeable electronics assemblies arranged inside the housing is possible. A rear housing cover and a circuit board which is aligned transversely to an insertion direction of the electronics assemblies and serves to contact the exchangeable electronics assemblies are provided. The electronics assemblies respectively include an electronics component to be cooled and at least one heat-conducting element which is in thermal contact with the electronics component, and for thermally connecting a cooler, the heat-conducting element has a contact surface oriented transversely to the insertion direction, and the cooler arranged in front of the circuit board, when viewed in the insertion direction, for cooling a plurality of electronics assemblies.

An electronic assembly includes a socket assembly including a cage mounted to a circuit board and a socket connector received in a cavity of the cage. The socket connector includes a substrate holding interposer contacts with compressible upper and lower contact portions. The electronic assembly includes a cable connector module received in the cavity of the cage and coupled to the socket connector. The cable connector module includes a housing coupled to the cage, a circuit card received in the cavity of the housing, and cable assemblies coupled to the circuit card. The circuit card is coupled to the socket connector.

The invention provides an electronic assembly, electronic equipment and a chip structure, relates to the technical field of packaging, and is used for improving the heat dissipation capability of the electronic assembly. The electronic assembly comprises a circuit board, a first chip, a second chip and a heat transfer plate. The heat transfer plate is located on one side of the circuit board. The first chip is located between the heat transfer plate and the circuit board, and the first chip is connected with the circuit board and the heat transfer plate. The second chip is located on the side, away from the circuit board, of the heat transfer plate and connected with the heat transfer plate. The chip structure can be applied to an electronic component, and the electronic component can be applied to electronic equipment.

An electronic assembly is disclosed. The electronic assembly can include an assembly substrate of one or more electrical connections and an electronic device mounted to a first surface of the assembly substrate. The electronic device can include a plurality electronic modules mounted on and electrically connected to a first surface of a device substrate. The device substrate can have one or more traces. The electronic device can further include a busbar having a first portion extending along at least a portion of a lateral dimension of the substrate and a second portion having at least two fins extending non-parallel and away from the first portion and between the plurality of electronic modules to electrically and mechanically connect to the one or more traces disposed on the first surface of the substrate. The one or more fins can include a thermal conductive material.

A connector that enables electronic assemblies to be efficiently configured for any of multiple power requirements. The connector may have multiple interfaces such that when the connector is mounted to a printed circuit board (PCB), it may receive power through an interface and distribute it to components on the PCB through another interface. The connector may also have an interface that supports a connection to a conductive interconnect, which may distribute power to a second connector mounted to the same PCB. Power may be distributed to components mounted to the PCB without passing through the mounting interface of the first connector. As a result, the current density in the PCB adjacent the first connector is reduced relative to current density required to supply current to all components through the mounting interface of the first connector. The PCB may have fewer layers than a conventional PCB assembly supporting comparable functionality.

A shielded electric plug. The electric plug includes a plug housing and a data line arranged within the plug housing for transmitting data in the Gbit / s range. A plug side of the data line electrically contacts the plug with a complementary mating plug and a connection side of the data line for electrically contacting with a circuit carrier. The data line is enclosed by a metal shielding housing. The plug housing includes a connection element with a press-in pin for mechanically contacting the plug with the circuit carrier using a press-in connection. The connection element includes a spring contact element to resiliently abut the circuit carrier so as to contact same when the electric plug is pressed in. The press-in pin is in the form of a first ground connection, and the spring contact element is designed is in the form of a second ground connection.

The invention provides a target object 6D pose estimation method and system oriented to electronic equipment AR assembly guidance. The method comprises the steps of electronic part coarse positioning based on improved YOLOv5s-CBAM, multi-mode (RGB-point cloud) feature fusion fine registration and LSTM dynamic motion prediction compensation. The system is developed based on an ROS framework and a PyTorch platform, and depends on an Open3D point cloud library and a TensorRT acceleration engine. According to the method, the problems of small target detection, metal reflection and shielding in an electronic assembly scene are solved through a cascaded visual positioning technology, the problem of insufficient precision caused by dependence on mark points or general SLAM in a traditional AR guide system is avoided, and the pose estimation robustness in a complex working condition is improved. Compared with an existing assembling method depending on manual calibration or two-dimensional drawings, the assembling efficiency and the first-pass yield are remarkably improved.

The invention relates to an integrated GaN power device including PFC and QR flyback controllers. An electronic component. The electronic component includes: a base; a first semiconductor device attached to the base and having: a first gallium nitride (GaN)-based switch having a first gate, a first source, and a first drain, the first gate being arranged to control a current flow between the first source and the first drain; and a second GaN-based switch having a second source, a second gate, and a second drain, the second gate coupled to the first gate, and the second drain coupled to the first drain. In one aspect, the electronic assembly also includes a second semiconductor device attached to the base and having: a logic circuit coupled to the second source and arranged to detect an amplitude of the current flow; and a drive circuit coupled to the first gate and the second gate, the drive circuit arranged to control on and off states of the first GaN-based switch and the second GaN-based switch.

A load sensing assembly for a medical implant is disclosed. The medical implant may include an upper surface, a side surface, a bottom surface, and a cavity housing various sensors and microelectronics. In other embodiments, the medical implant may include a port that is accessible through at least one of the bottom surface, side surface, and the upper surface. The port may be configured to receive an electronics assembly, package, or hermetically sealed enclosure. The electronics package may have a size and shape generally corresponding to the port. In various embodiments, electronic components and sensors may be powered by a local power source. In various embodiments, sensors may be chosen from: accelerometers, gyroscope, strain gauge, pressure sensor, pH sensor, impedance sensor, optical sensor, and / or a temperature sensor. In various embodiments, the medical implant may be chosen from: an interbody spinal implant, a pedicle screw, a connector, and / or a cross-link.

The present invention relates to an electronic assembly, an electronic component comprising the electronic assembly, and a method for embedding and protecting electronic components, particularly for protection against temperature effects. A more uniform heat distribution within the injection mold can be ensured through an interaction between the geometric design of the injection mold in combination with its chemical composition.

This application provides an electronic assembly and an electronic device. At least two antennas are formed on a metal frame of the electronic assembly, a circuit board and an electronic component are located on one side of the metal frame, and there is a gap between the metal frame and each of the circuit board and the electronic component. An orthographic projection of the electronic component on the metal frame covers a first antenna, a slit between the first antenna and a second antenna, and a part of the second antenna. One end of a first extension member is connected to one end of the first antenna which is close to the second antenna, the other end of the first extension member is electrically connected to a first feed point on the circuit board. The second antenna is electrically connected to a second feed point on the circuit board.

An electronic assembly component may comprise at least one fan-out device comprising a first encapsulant disposed around a memory device or function and a processor device or function, and a fan-out interconnect structure disposed over the first encapsulant and the at least one fan-out device. Input output pads may be disposed over the fan-out interconnect structure. A structural support may comprise electrical routing and structural support pads, the structural support further comprising at least one mounting site to which the at least one fan-out device is coupled. An electrical connector may be configured to electrically couple the input output pads of the at least one fan-out device to the structural support pads. A second encapsulant may be disposed over at least a portion of the at least one fan-out device and the structural support.

A protection device for metal insulator metal (MIM) capacitors are described. In an example, an electronic assembly includes a semiconductor substrate. A dielectric layer is on the semiconductor substrate. A conductive via is in an opening in the dielectric layer, the conductive via in direct contact with the semiconductor substrate. A metal-insulator-metal (MIM) capacitor structure is electrically coupled to the conductive via.