2198 results about "Electronic assemblies" patented technology

CPR systems that provide guidance to a CPR provider are presented. Contemplated CPR systems include sensors that collect a victim's biometric data during CPR. The data is processed by an electronic assembly which provides feedback to the CPR provider. The electronic assembly can be packaged within a cranio-cervical extension device having language independent instructions encoded on a surface of the device.

High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and / or the use of a crosstalk mitigation structure.

A magnetic latch mechanism for latching a first electronic assembly to a second electronic assembly. The magnetic latch mechanism includes a Halbach array captured by the first electronic assembly. The Halbach array is configured to provide a first magnetic flux in a first direction. The magnetic latch mechanism further includes an attraction plate captured by the second electronic assembly. The attraction plate is configured to be coupled with the first magnetic flux when the first electronic assembly is in a closed position with respect to the second electronic assembly such that there is mutual attraction between the attraction plate and the Halbach array in the closed position.

Apparatuses and methods for forming displays are claimed. One embodiment of the invention includes a contact smart card wherein fluidic self assembly is used to build the microelectronic structures on the display such that a contact smart data is transmitted unidirectionally. A contact smart card is inserted directly into a device that transfers data to a display coupled to the smart card. Another embodiment of the invention relates to a contactless smart card in which fluidic self assembly is also used here to build the display. Data is transmitted to an antenna that is embedded in the contactless card in which a plurality of blocks were deposited thereon.

A method for fabricating semiconductor components and interconnects includes the steps of providing a substrate, such as a semiconductor die, forming external contacts on opposing sides of the substrate by laser drilling vias through the substrate, and forming conductive members in the vias. The conductive members include enlarged terminal portions that are covered with a non-oxidizing metal. The method can be used to fabricate stackable semiconductor packages having integrated circuits in electrical communication with the external contacts. The method can also be used to fabricate interconnects for electrically engaging packages, dice and wafers for testing or for constructing electronic assemblies.

A modular electronic assembly for integration with a pneumatic tire includes a mounting patch, a power source, and at least one electronic device supported by a substrate. The mounting patch is preferably adapted for positioning on the inner liner of a pneumatic tire, and the power source is at least partially embedded in the mounting patch. Such embedded positioning of the battery results in an overall structure with a lower center of gravity than previous tire electronics assemblies, thus having increased mechanical stability and survivability in a tire environment. Electronic device(s) supported on the substrate may receive power from the power source, which in some embodiments corresponds to one or more batteries. The substrate supporting the at least one electronic device may be attached to the mounting patch by a variety of fashions. Exemplary attachment configurations may correspond to an adhesive layer, a hook and loop tape combination, or physical interconnection via terminals extending from the power source through the support substrate. Exemplary electronic devices may include such components as condition-responsive devices including transducers, acoustic devices, sensors, etc. for sensing certain environmental conditions such as temperature and / or pressure, tire revolution counters, vehicle speed sensors, sidewall deflection sensors, tire displacement sensors, microprocessors, memory modules, RFID transponders, light assemblies, data transmitters and / or receivers, and power, supply components. Selected of the electronic devices (including one or more antennas associated with any RF devices) may be encapsulated by a non-conductive rubber or elastic material to facilitate effective transmission characteristics. Conductive springs, flexible conductive elastomer or fatigue-resistance metal may be used to interconnect various electronic components (such as an RF device to an antenna).

An electromechanical surgical assembly includes a surgical device, an adapter, and a filter. The surgical device includes a connecting portion having a distal facing recess including an electrical plug. The adapter includes a proximal facing cap configured to mate with the recess of the surgical device, the proximal facing cap including an electronic assembly including a plurality of electrical contact pins configured for electrical connection with the electrical plug. The filter is removably positioned within the recess of the surgical device. The plurality of electrical contact pins extend through the filter when the adapter is connected to the surgical device.

In one embodiment, this invention discloses a device that is a lamp on the one hand, and also a speaker on the other, comprising a light-emitting element, a surface that acts as a sound-emitting element, and a base socket that can fit to an ordinary household lamp socket. The surface can be translucent and act as a lamp cover at the same time. There is also an electronic assembly in the lamp that controls both the light-emitting and sound-emitting elements, as well as communicates with an external host or other devices. In another embodiment, the lamp cover can also couple with an acoustic-wave transducer unit so that the audio lamp device becomes a light and a microphone. Various sensors can also be equipped within the audio lamp, and the results can be sent to the external host through the electronic assembly.

A cooling assembly for a dual electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of a pair of electronic image assemblies and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the electronic image assembly (optionally a backlight). The cooling assembly can be used with any type of electronic assembly for producing an image. Some embodiments use cross-flow heat exchangers comprised of corrugated plastic.

A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.

A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having an input port receiving air from the first vertical airflow path of the cabinet, an output port transmitting air to the second vertical air flow path, a heat exchanger positioned in an air flow path extending between the input and the output ports, and a fan assembly for driving air through the heat exchanger and towards the input port. The system further includes at least one air flow distribution device establishing a predetermined flow rate distribution through electronic assemblies supports by the brackets.

An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.

A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.

A magnetic latch mechanism for latching a first electronic assembly to a second electronic assembly. The magnetic latch mechanism includes a Halbach array captured by the first electronic assembly. The Halbach array is configured to provide a first magnetic flux in a first direction. The magnetic latch mechanism further includes an attraction plate captured by the second electronic assembly. The attraction plate is configured to be coupled with the first magnetic flux when the first electronic assembly is in a closed position with respect to the second electronic assembly such that there is mutual attraction between the attraction plate and the Halbach array in the closed position.

A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.

A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

An electronic assembly may be contained in a label that performs time-temperature integration (TTI) and indicates that time and / or temperature levels have been reached that may compromise the quality, shelf life, or safety of the item to which the label is affixed. The label may be used on a wide variety of objects that require careful handling in terms of temperature and / or time elapsed before use. The labeling system includes circuitry that measures and calculates, and indictor(s) that signal that the time has come for discounted sale, and, later, that the time has come for disposal rather than sale. Optionally, the circuitry may act as an “over-temperature alarm” system, to measure, calculate, and indicate when a one-time temperature violation has occurred that is of such a magnitude that the item is immediately considered compromised or spoiled. The label may take the form of a flexible, disposable label that is typically powered by a small battery. Methods may include providing a temperature-variable oscillator or time-base, counting cycles of said oscillator within a logic circuit to determine when one or more preset total cycle counts is / are reached, and signaling when said total cycle count(s) is / are reached.

A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to be cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.

The invention relates to a shoe with a sole unit, where the sole unit includes a recess for removably receiving a housing of an electronic assembly, for example, an electronic pedometer, an accelerometer, or a speed sensor. Further, the invention relates to a housing for receiving an electronic assembly, for example, a pedometer, an accelerometer, or a speed sensor, where the housing has an outer shape corresponding to the shape of a recess formed in a shoe sole.

A cassette-based power measuring apparatus includes a power sensing arrangement mounted within a cavity defined by a hollow bicycle cassette. The power sensing arrangement includes a torque sensing assembly including torque sensing elements configured to measure a user applied torque. The torque sensing elements are in communication with an electronics assembly configured to process the measured data and transmit it to a receiver. The torque sensing assembly may comprise a torque tube or a series of bending beams secured between a rear plate of the cassette and a freehub. The torque tube or bending beams may include strain gauges bonded thereto for measuring strain induced by application of forces in response to user-applied power.

An assembly for high performance cooling of electronics is described that includes a container for heat transfer liquid in which complex electronic assemblies are immersed. The electronics are sealed inside the liquid container such that an electrical connector protrudes to the exterior of the container. A thermally conductive plate is made part of the liquid filled container assembly such that a portion of the plate is in contact with the liquid and a portion of the plate protrudes from or forms part of the exterior of the container.

An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also includes a heat pipe device in thermal communication with an exposed surface of the electronics package. The heat pipe device includes a thermal conductive pipe having an internal volume and an open end. The heat pipe device also includes a thermal conductive end cap positioned to close the open end of the pipe. The end cap has an outer surface for receiving in thermal communication an electronics package. The heat pipe device further includes a cooling fluid disposed in the internal volume of the pipe for transferring thermal energy from the end cap to the outside environment.

On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked architecture for efficiently accessing individual memory devices in a chip-scale package stack. The use of a ball grid array chip-scale package architecture in combination with thermally compatible materials decreases the risk of thermal cracking while improving heat dissipation. Moreover, this architecture permits mounting support components, such as capacitors and resistors, on the chip-scale package.

An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having a second plurality of conductive traces formed thereon and a second surface having a third plurality of conductive traces formed thereon. A first electronic component is electrically coupled to one or more of the plurality of conductive traces on the first surface of the second substrate. At least one of a plurality of conductive interconnects is incorporated within each solder joint that electrically couples one or more of the conductive traces formed on the second surface of the second substrate to one or more of the conductive traces formed on the first substrate.

An electromechanical surgical assembly includes a surgical device, an adapter, and a filter. The surgical device includes a connecting portion having a distal facing recess including an electrical plug. The adapter includes a proximal facing cap configured to mate with the recess of the surgical device, the proximal facing cap including an electronic assembly including a plurality of electrical contact pins configured for electrical connection with the electrical plug. The filter is removably positioned within the recess of the surgical device. The plurality of electrical contact pins extend through the filter when the adapter is connected to the surgical device.

Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.

A cable connector assembly for outdoor connection to transceivers. Electrical connection between a component of the cable connector assembly and a connector inside an electronic assembly to which the cable connector assembly is attached is made through a force generated by a biasing member within the cable connector assembly. The biasing member may generate the force as the cable connector assembly is attached to an adapter. Once the cable connector assembly is disengaged from the adapter, the force is released, allowing easy removal of the cable connector assembly, without the need to release a latch. In an environmentally sealed connector in which access to a release mechanism may be restricted, such a structure provides ease of use for either electrical or optical connectors. For optical cable connector assemblies, the optical cable connector may be coupled to a transceiver such that biasing force generated within the cable connector assembly holds the transceiver in a mating relationship with a connector within an electronic assembly but can be easily removed.

The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an electrical component. The system for conducting heat energy in an electronic assembly includes an electrical component, an elastically deformable member, and a housing. The elastically deformable member is placed in a compressed position between the electrical component and the housing such that the elastically deformable member is fixed into an assembled location. The elastically deformable member conducts heat energy away from the electrical component into the housing where it is dissipated into the environment. Since the compressed position fixes the location of the elastically deformable member, the system does not require a mechanical fastening to the electrical component thereby reducing thermo-mechanical fatigue. The elastically deformable member is made of a metal material allowing it to easily conduct the heat energy.