1322 results about "Electronic assemblies" patented technology

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a frontal shell having a rear edge, a rear shell having a frontal edge, and an electronics assembly. The electronics assembly includes various components and devices used in the operation of the humanoid robot.

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a rear shell, and a frontal shell coupled to the rear shell to define a head volume between the frontal shell and the rear shell, and an electronics assembly with a display located in the head volume between the frontal shell and the rear shell. The frontal shell of the head housing assembly includes: a first arc length at a first location below the display, a second arc length at a second location aligned with a portion of the display, and wherein said second arc length is greater than the first arc length, and a third arc length at a third location above the display, and wherein said third arc length is greater than both the first arc length and the second arc length.

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a frontal shell having a rear edge, a rear shell having a frontal edge, and an electronics assembly. The electronics assembly includes various components and devices used in the operation of the humanoid robot.

A head and neck assembly for a humanoid robot, including a head portion having an exterior surface defining an overall shape resembling a human head; a neck portion extending from the head portion; a head housing assembly enclosing the head portion and neck portion; an electronics assembly contained within the head housing assembly; and a head actuator assembly configured to move the head portion relative to a torso of the humanoid robot.

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a frontal shell having a rear edge, a rear shell having a frontal edge, and an electronics assembly. The electronics assembly includes various components and devices used in the operation of the humanoid robot.

The invention provides an intelligent electronic assembly quality control system based on AOI (automatic optical inspection) and SPI (solder paste printing inspection) integration, and belongs to the field of electronic information equipment flexible production lines. Comprising an AOI module, an SPI module, a data integration module, a feedback control module and a data storage and transmission module. All the modules carry out high-frequency data transmission through an industrial Ethernet; according to the system provided by the invention, the precision of quality detection is improved, and the accurate recognition of defects is realized through the data association of the AOI and the SPI module and the anomaly detection of the SVM and the CNN algorithm. Real-time process optimization is achieved, the feedback control module automatically adjusts printing and mounting process parameters according to the quality data model, and the product consistency is remarkably improved. The method improves the traceability and safety of the data, achieves the efficient storage and safety access of the detection data through distributed cloud storage and data encryption transmission, and supports the quality problem traceability.

A connector that enables electronic assemblies to be efficiently configured for any of multiple power requirements. The connector may have a mating interface, which may mate with a power supply, a mounting interface for attaching the connector to a PCB and a power tap off interface. The power tap off interface may enable distribution of a portion of the power received through the mating interface to remote locations on the PCB. The connector may be assembled with conductive element subassemblies, enabling efficient configuration of the connector with conductive elements with and without mating contact portion for power tap off. Each subassembly may include a member to which other members with mating contact portions and / or tails for a mounting interface are attached. A projection providing mechanical support for the power tap off interface may be angled relative to the mating interface such that the connector provides lower resistance to airflow, which may lower the cost and / or enable enhanced performance of an assembly using such a connector.

An electronic candle, including an inner housing, a light element disposed on the inner housing, a candle tube sleeved outside the inner housing and an electronic assembly, the candle tube is light-transmissive and non-transparent, the lighting element emits light that passes through the candle tube; and the electronic assembly includes a printed circuit board assembly (PCBA) and a lamp head, at least a portion of the PCBA is arranged within the inner housing, the PCBA is electrically connected to both the light element and the lamp head, and the lamp head extends through the candle tube.

The invention discloses an electronic assembly welding workbench. Comprising a gantry workbench structure, a smoke suction mechanism, a welding angle adjusting mechanism and a double-station clamping mechanism. A rotating cylinder is arranged on the surface of the smoke suction cylinder through matching of a driving worm and a worm gear ring so as to realize multidirectional angle adjustment of the welding gun; the circuit board is rapidly clamped through the action of the rack, the driving gear and the extrusion convex strip, and double-station cross feeding and discharging are achieved; the smoke suction mechanism concentrates and efficiently discharges smoke through a horn and a corrugated pipe; and automatic multi-angle welding can be implemented by combining a tin wire placing machine and a sensor, so that the welding efficiency and quality are remarkably improved.

An abrasive article includes a body and an electronic assembly coupled to the body, the electronic assembly including an electronic device, and a first portion between the body and the communication device, the first portion having a material of an average relative magnetic permeability of not greater than 15.

A thermal management system defines a thermal management system flowpath to provide a flow of a fluid to an electric machine and a power electronics assembly electrically connected to the electric machine. The thermal management system includes a first heat exchanger thermally connected to the thermal management system flowpath and to the electric machine, and a second heat exchanger thermally connected to the thermal management system flowpath downstream of the first heat exchanger. The second heat exchanger is thermally connected to the power electronics assembly.

The utility model discloses a zero interruption dual power supply fast switching device, comprising a dual power supply switch, a power electronic assembly, an output switch QF and a load which are connected in sequence, the power electronic assembly comprises an electronic bypass unit VT, a mechanical bypass contactor KM, an isolation transformer TM, a bidirectional converter CU and a super capacitor energy storage unit CAP, a contact S1 in the dual-power switch is connected with a main power supply, a contact S2 is connected with a standby power supply, a mechanical bypass contactor KM is connected with an electronic bypass unit VT in parallel, an isolation transformer TM is connected to the output end of the electronic bypass unit VT, and the two ends of a bidirectional converter CU are connected with the isolation transformer TM and a super capacitor energy storage unit CAP respectively. According to the device, the dual-power-supply change-over switch is matched with the power electronic component, so that rapid switching of the dual-power-supply switch is realized, the problem of power supply interruption in the switching process is solved, and the reliability of power supply is improved; and meanwhile, few energy storage elements are used, and the cost is low.

The invention relates to a cooling device for cooling an electrical and / or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component having a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40) a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5) along the longitudinal direction (11), the cooling device (1) also comprising at least one turbulator (6) that is arranged inside a turbulator section (56) of the cooling channel (5). According to the invention, a turbulence portion (61) for generating local turbulence in the flow of the cooling fluid and a blocking region (62) for locally blocking the flow of the cooling fluid are formed on the turbulator (6).

An electronic assembly includes a shaft assembly and housings arranged oppositely. The shaft assembly includes a first shaft case, first rotating members, and rotating units. The first rotating members are at least partially disposed at two opposite sides of the first shaft case. Each of the first rotating members has one end rotatably connected with the first shaft case and the other end connected with the housings. The rotating units are at least partially disposed at the two opposite sides of the first shaft case. Each of the rotating units includes a second rotating member and a movable plate. The second rotating member has one end rotatably connected with the first shaft case and the other end connected with the movable plate. The movable plate has one end connected to the housings.

The invention relates to an electronic assembly (100), comprising: - a switching device (102) for switching a main current path (103), wherein the switching device (102) comprises n series-connected semiconductor switching units (102.1, 102.2,..., 102.n), wherein n is a natural number excluding zero, - a voltage limiting device (114) connected in parallel with the switching device (102) and comprising at least one overvoltage protection component (107) and at least one diac (109) connected in series with the at least one overvoltage protection component (107), and - n surge arresters (110, 110.1, 110.2, ..., 110.n), wherein each one of the n surge arresters (110, 110.1, 110.2,..., 110.n) is connected in parallel with each one of the n semiconductor switching units (102.1, 102.2,..., 102.n) in a bijective relationship.

The present invention relates to an electronic assembly comprising a housing (100), a connector (107), an electronic circuit board (108), a sensor board (109), and a front cap (106). The housing (100) accommodates the connector (107), the electronic circuit board (108), the sensor board (109), and the front cap (106) successively from a rear to a front. A collar (102) is provided on the rear of the housing (100) against which an axial end face of the connector (107) is supported, preventing the connector (107) from being pulled out of the rear of the housing (100). The connector (107), the electronic circuit board (108), and the sensor board (109) form a single, integrated assembly. The front of the housing (100) secures the component within the housing (100) by means of crimping around the front cap (106) and presses the component against the collar (102). Furthermore, a method for manufacturing an electronic assembly is described.

An electronic assembly comprises a first housing portion and a second housing portion coupled to the first housing portion to form a cavity. A circuit board resides within the cavity. The second housing portion has a connector body with a hollow core, where the connector body extends outward from the second housing portion. The connector body has walls with a corresponding wall mating surface that faces a respective circuit-board mating surface of the circuit board. An adhesive sealant is configured to adhere to the wall mating surface and the circuit-board mating surface.

Damping arrangement for an axle of an active chassis of a motor vehicle. A damping system interacts with each wheel of the axle. Each of the damping systems includes the following assemblies: a damper including a double-acting hydraulic cylinder and a piston, a hydraulic pump and an electric motor for driving same, and a hydraulic unit which includes a hydraulic reservoir and valves. The hydraulic pump and the hydraulic unit of the respective damping system interact with hydraulic chambers of the hydraulic cylinder in such a manner that a movement of the piston in a first or in a second operating direction can be provided depending on the delivery direction of the hydraulic pump. The electric motors of both damping systems are connected to a common control device and can be actuated thereby, wherein the common control device has electronic assemblies which are distributed on different printed circuit boards.

A trans-inductor voltage regulator (TLVR) inductor module includes: a magnetic core; a first winding embedded in the magnetic core; a second winding embedded in the magnetic core and inductively coupled to the first winding; a third winding embedded in the magnetic core; a fourth winding embedded in the magnetic core and inductively coupled to the third winding; and a first integrated metallic connector that connects the second winding and the fourth winding in a series loop. A power electronics assembly that includes the TLVR inductor module is also described.

The invention provides an electronic assembly and electronic equipment, the electronic assembly comprises an electronic module and a structural member, a welding layer is arranged between the electronic module and the structural member, and the welding layer is used for connecting the electronic module and the structural member. Wherein the welding layer comprises a thinning area and a thickening area, and the thickness of the thickening area is larger than that of the thinning area, so that the stress of the welding layer is reduced, the connection reliability between the electronic module and the structural part is improved, and the temperature cycle fatigue life of the welding structure is prolonged. The thickening area is located in the edge area of the welding layer, the stress of the edge area of the welding layer is usually large, and the thickening area is arranged in the edge area of the welding layer, so that the stress of the welding layer is reduced. According to the scheme, the thickness of the thinning area in the middle of the welding layer is small, the distance between the electronic module and the structural part is small, and miniaturization of the electronic assembly can be achieved. And when the structural member is the radiator, the thermal resistance between the radiator and the electronic module is relatively small, so that the heat conduction efficiency between the radiator and the electronic module can be improved.

Disclosed herein are embodiments of a wound treatment apparatus with electronic components integrated within a wound dressing. In some embodiments, a wound dressing apparatus can comprise a wound dressing. The wound dressing can comprise an absorbent material, an electronics unit comprising a negative pressure source, the electronics unit integrated within the wound dressing and at least partially encapsulated by a flexible film. The flexible film can comprise a window or aperture configured to permit fluid communication between the absorbent material and the negative pressure source. In some embodiments, a wound dressing apparatus can comprise a wound contact layer, an absorbent layer over the wound contact layer, the absorbent layer comprising one or more apertures, a cover layer configured to cover and form a seal over the wound contact layer and the absorbent layer, and an electronics assembly comprising a negative pressure source. A portion of the cover layer overlying the one or more apertures in the absorbent layer can be configured to be compressed within the aperture in the absorbent layer when negative pressure is applied to the wound dressing apparatus. The compressed cover layer can indicate a level of negative pressure below the cover layer. In some embodiments, the wound dressing apparatus can comprise an indicator material layer and a cover layer configured to cover and form a seal over the wound contact layer and the indicator material layer. The indicator material layer can be configured to protrude relative to a surrounding surface of an upper surface of the wound dressing apparatus when negative pressure is applied to the wound dressing apparatus and the protruding indicator material layer indicates a level of negative pressure below the cover layer.

Cooling arrangement (7) for cooling an electrical unit (10), wherein the cooling arrangement comprises: a heat sink (5), a substrate (6), wherein the heat sink comprises: a cooling channel (35) through which coolant can flow in a predetermined direction, a cooling wall (50) on the side of the cooling channel facing the electrical unit (10) to be cooled, wherein the substrate is positively connected to the heat sink at the cooling wall, and is designed so that the electrical unit can be mechanically fixed to it on the side facing away from the heat sink, wherein the cooling arrangement is designed so that, in operation, the coolant is guided through the cooling channel at a predetermined operating pressure which is higher than the ambient pressure which is present on the substrate on the side of the electrical unit to be cooled, and wherein a distance (D) between the cooling channel (35) and the cooling wall (50) is selected to be so small,that the heat sink, without the positively connected substrate, cannot ensure sufficient dimensional stability and / or sealing at the specified operating pressure, and the substrate and its positively connected connection to the heat sink on the cooling wall are designed such that the cooling arrangement can ensure this sufficient dimensional stability and sealing, and wherein the heat sink is monolithic. Also disclosed are an electronic assembly with such a cooling arrangement, an electrical power converter with such an electronic assembly, and methods for assembling these devices.

Liquid metal thermal interface materials and their uses in electronics assembly are described. In one implementation, a semiconductor assembly includes: a semiconductor die; a heat exchanger; and a thermal interface material (TIM) alloy bonding the semiconductor die to the heat exchanger without using a separate metallization layer on a surface of the semiconductor die or a surface of the heat exchanger. The TIM alloy may be formed by placing a TIM material between the semiconductor die and the heat exchanger, the TIM material comprising a first liquid metal foam in touching relation with the surface of the semiconductor die, a second liquid metal foam in touching relation with the surface of the heat exchanger.

A luminous frame assembly includes a support frame and a pod light device detachably mounted on the support frame. The pod light device includes a housing, light guide bars, and an electronic assembly. The light guide bars are connected to the housing at intervals along a radial direction, with one end of each of the light guide bars, away from the housing, protruding upward and / or downward from the housing. The electronic assembly includes a main board and light-emitting components, with the light-emitting components connected to the light guide bars. When the light-emitting components emit light, a unique visual effect is produced, and top and / or bottom of the support frame are illuminated for providing a clear target to facilitate nighttime play or sports, thereby improving user experience and practicality.

Solid metal foam thermal interface materials and their uses in electronics assembly are described. In one implementation, a method includes: applying a thermal interface material (TIM) between a first device and a second device to form an assembly having a first surface of the TIM in in touching relation with a surface of the first device, and a second surface of the TIM opposite the first surface in touching relation with a surface of the second device, the TIM comprising a solid metal foam and a first liquid metal; and compressing the assembly to form an alloy from the TIM that bonds the first device to the second device.

An electronic assembly is provided. The electronic assembly includes a first circuit structure including a transistor, a through via and a conductive structure, a plurality of electronic elements disposed on the first circuit structure, a first pad disposed between the first circuit structure and one of the plurality of electronic elements, a second circuit structure disposed on the first circuit structure, and a second pad disposed between the second circuit structure and one of the plurality of electronic elements. At least a portion of the conductive structure is disposed in the through via. The conductive structure is electrically connected to the first pad and the transistor.

The disclosure discloses a battery mounting structure, an outdoor mobile power supply and an electronic assembly, and belongs to the technical field of electronic assemblies. The battery mounting structure comprises a telescopic member, a first battery assembly and at least one second battery assembly. The first battery assembly is sleeved on the telescopic member; one second battery assembly is sleeved on the telescopic member and electrically connected with the first battery assembly, and the remaining second battery assemblies are sleeved on the telescopic member in an axial direction of the telescopic member in sequence and electrically connected in sequence. According to the battery mounting structure provided by the disclosure, a user can increase or reduce a number of the second battery assemblies at will according to an actual electricity demand, so as to increase or reduce a battery capacity at will, thus improving use convenience and portability.

The invention relates to a cooling device for cooling an electrical and / or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component comprising a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40), a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5), the cooling device (1) further comprising at least one turbulator (6) arranged inside the depression (40) of the cooling channel (5), the turbulator (6) adjoining a bottom surface (44) in the depression (40) of the bottom plate (4) and the bottom surface (44) facing the top plate (3). According to the invention, the bottom plate (4) comprises an embossment (7) in a bending region (43) on the edge of the bottom surface (44).

Disclosed is an electronic assembly that includes a heat sink with a groove that is cut on a surface of the heat sink. A thermal interface material is disposed between the heat sink and an electronic device. A compressible filler disposed in the groove surrounds and confines the thermal interface material.

A device with exchangeable electronics assemblies of a motor vehicle. The device includes a housing to at least partially enclose the electronics assemblies exchangeable in an insertion direction, an insertion mechanism for receiving the exchangeable electronics assemblies, a front side which is at least partially detachably connected to the housing and via which access to the exchangeable electronics assemblies arranged inside the housing is possible. A rear housing cover and a circuit board which is aligned transversely to an insertion direction of the electronics assemblies and serves to contact the exchangeable electronics assemblies are provided. The electronics assemblies respectively include an electronics component to be cooled and at least one heat-conducting element which is in thermal contact with the electronics component, and for thermally connecting a cooler, the heat-conducting element has a contact surface oriented transversely to the insertion direction, and the cooler arranged in front of the circuit board, when viewed in the insertion direction, for cooling a plurality of electronics assemblies.