2197 results about "Electronic assemblies" patented technology

High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and / or the use of a crosstalk mitigation structure.

A magnetic latch mechanism for latching a first electronic assembly to a second electronic assembly. The magnetic latch mechanism includes a Halbach array captured by the first electronic assembly. The Halbach array is configured to provide a first magnetic flux in a first direction. The magnetic latch mechanism further includes an attraction plate captured by the second electronic assembly. The attraction plate is configured to be coupled with the first magnetic flux when the first electronic assembly is in a closed position with respect to the second electronic assembly such that there is mutual attraction between the attraction plate and the Halbach array in the closed position.

Apparatuses and methods for forming displays are claimed. One embodiment of the invention includes a contact smart card wherein fluidic self assembly is used to build the microelectronic structures on the display such that a contact smart data is transmitted unidirectionally. A contact smart card is inserted directly into a device that transfers data to a display coupled to the smart card. Another embodiment of the invention relates to a contactless smart card in which fluidic self assembly is also used here to build the display. Data is transmitted to an antenna that is embedded in the contactless card in which a plurality of blocks were deposited thereon.

A modular electronic assembly for integration with a pneumatic tire includes a mounting patch, a power source, and at least one electronic device supported by a substrate. The mounting patch is preferably adapted for positioning on the inner liner of a pneumatic tire, and the power source is at least partially embedded in the mounting patch. Such embedded positioning of the battery results in an overall structure with a lower center of gravity than previous tire electronics assemblies, thus having increased mechanical stability and survivability in a tire environment. Electronic device(s) supported on the substrate may receive power from the power source, which in some embodiments corresponds to one or more batteries. The substrate supporting the at least one electronic device may be attached to the mounting patch by a variety of fashions. Exemplary attachment configurations may correspond to an adhesive layer, a hook and loop tape combination, or physical interconnection via terminals extending from the power source through the support substrate. Exemplary electronic devices may include such components as condition-responsive devices including transducers, acoustic devices, sensors, etc. for sensing certain environmental conditions such as temperature and / or pressure, tire revolution counters, vehicle speed sensors, sidewall deflection sensors, tire displacement sensors, microprocessors, memory modules, RFID transponders, light assemblies, data transmitters and / or receivers, and power, supply components. Selected of the electronic devices (including one or more antennas associated with any RF devices) may be encapsulated by a non-conductive rubber or elastic material to facilitate effective transmission characteristics. Conductive springs, flexible conductive elastomer or fatigue-resistance metal may be used to interconnect various electronic components (such as an RF device to an antenna).

In one embodiment, this invention discloses a device that is a lamp on the one hand, and also a speaker on the other, comprising a light-emitting element, a surface that acts as a sound-emitting element, and a base socket that can fit to an ordinary household lamp socket. The surface can be translucent and act as a lamp cover at the same time. There is also an electronic assembly in the lamp that controls both the light-emitting and sound-emitting elements, as well as communicates with an external host or other devices. In another embodiment, the lamp cover can also couple with an acoustic-wave transducer unit so that the audio lamp device becomes a light and a microphone. Various sensors can also be equipped within the audio lamp, and the results can be sent to the external host through the electronic assembly.

An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.

A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.

A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

An electronic assembly may be contained in a label that performs time-temperature integration (TTI) and indicates that time and / or temperature levels have been reached that may compromise the quality, shelf life, or safety of the item to which the label is affixed. The label may be used on a wide variety of objects that require careful handling in terms of temperature and / or time elapsed before use. The labeling system includes circuitry that measures and calculates, and indictor(s) that signal that the time has come for discounted sale, and, later, that the time has come for disposal rather than sale. Optionally, the circuitry may act as an “over-temperature alarm” system, to measure, calculate, and indicate when a one-time temperature violation has occurred that is of such a magnitude that the item is immediately considered compromised or spoiled. The label may take the form of a flexible, disposable label that is typically powered by a small battery. Methods may include providing a temperature-variable oscillator or time-base, counting cycles of said oscillator within a logic circuit to determine when one or more preset total cycle counts is / are reached, and signaling when said total cycle count(s) is / are reached.

An assembly for high performance cooling of electronics is described that includes a container for heat transfer liquid in which complex electronic assemblies are immersed. The electronics are sealed inside the liquid container such that an electrical connector protrudes to the exterior of the container. A thermally conductive plate is made part of the liquid filled container assembly such that a portion of the plate is in contact with the liquid and a portion of the plate protrudes from or forms part of the exterior of the container.

An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having a second plurality of conductive traces formed thereon and a second surface having a third plurality of conductive traces formed thereon. A first electronic component is electrically coupled to one or more of the plurality of conductive traces on the first surface of the second substrate. At least one of a plurality of conductive interconnects is incorporated within each solder joint that electrically couples one or more of the conductive traces formed on the second surface of the second substrate to one or more of the conductive traces formed on the first substrate.

An electromechanical surgical assembly includes a surgical device, an adapter, and a filter. The surgical device includes a connecting portion having a distal facing recess including an electrical plug. The adapter includes a proximal facing cap configured to mate with the recess of the surgical device, the proximal facing cap including an electronic assembly including a plurality of electrical contact pins configured for electrical connection with the electrical plug. The filter is removably positioned within the recess of the surgical device. The plurality of electrical contact pins extend through the filter when the adapter is connected to the surgical device.

An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.

A cable connector assembly for outdoor connection to transceivers. Electrical connection between a component of the cable connector assembly and a connector inside an electronic assembly to which the cable connector assembly is attached is made through a force generated by a biasing member within the cable connector assembly. The biasing member may generate the force as the cable connector assembly is attached to an adapter. Once the cable connector assembly is disengaged from the adapter, the force is released, allowing easy removal of the cable connector assembly, without the need to release a latch. In an environmentally sealed connector in which access to a release mechanism may be restricted, such a structure provides ease of use for either electrical or optical connectors. For optical cable connector assemblies, the optical cable connector may be coupled to a transceiver such that biasing force generated within the cable connector assembly holds the transceiver in a mating relationship with a connector within an electronic assembly but can be easily removed.