682 results about "Electronic assemblies" patented technology

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a frontal shell having a rear edge, a rear shell having a frontal edge, and an electronics assembly. The electronics assembly includes various components and devices used in the operation of the humanoid robot.

A head and neck assembly for a humanoid robot, including a head portion having an exterior surface defining an overall shape resembling a human head; a neck portion extending from the head portion; a head housing assembly enclosing the head portion and neck portion; an electronics assembly contained within the head housing assembly; and a head actuator assembly configured to move the head portion relative to a torso of the humanoid robot.

A humanoid robot includes an upper region includes a head and neck assembly having a neck portion and a head portion coupled to the neck portion. Said head portion includes: a frontal shell having a rear edge, a rear shell having a frontal edge, and an electronics assembly. The electronics assembly includes various components and devices used in the operation of the humanoid robot.

An electronic candle, including an inner housing, a light element disposed on the inner housing, a candle tube sleeved outside the inner housing and an electronic assembly, the candle tube is light-transmissive and non-transparent, the lighting element emits light that passes through the candle tube; and the electronic assembly includes a printed circuit board assembly (PCBA) and a lamp head, at least a portion of the PCBA is arranged within the inner housing, the PCBA is electrically connected to both the light element and the lamp head, and the lamp head extends through the candle tube.

The invention relates to a cooling device for cooling an electrical and / or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component having a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40) a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5) along the longitudinal direction (11), the cooling device (1) also comprising at least one turbulator (6) that is arranged inside a turbulator section (56) of the cooling channel (5). According to the invention, a turbulence portion (61) for generating local turbulence in the flow of the cooling fluid and a blocking region (62) for locally blocking the flow of the cooling fluid are formed on the turbulator (6).

A trans-inductor voltage regulator (TLVR) inductor module includes: a magnetic core; a first winding embedded in the magnetic core; a second winding embedded in the magnetic core and inductively coupled to the first winding; a third winding embedded in the magnetic core; a fourth winding embedded in the magnetic core and inductively coupled to the third winding; and a first integrated metallic connector that connects the second winding and the fourth winding in a series loop. A power electronics assembly that includes the TLVR inductor module is also described.

Disclosed herein are embodiments of a wound treatment apparatus with electronic components integrated within a wound dressing. In some embodiments, a wound dressing apparatus can comprise a wound dressing. The wound dressing can comprise an absorbent material, an electronics unit comprising a negative pressure source, the electronics unit integrated within the wound dressing and at least partially encapsulated by a flexible film. The flexible film can comprise a window or aperture configured to permit fluid communication between the absorbent material and the negative pressure source. In some embodiments, a wound dressing apparatus can comprise a wound contact layer, an absorbent layer over the wound contact layer, the absorbent layer comprising one or more apertures, a cover layer configured to cover and form a seal over the wound contact layer and the absorbent layer, and an electronics assembly comprising a negative pressure source. A portion of the cover layer overlying the one or more apertures in the absorbent layer can be configured to be compressed within the aperture in the absorbent layer when negative pressure is applied to the wound dressing apparatus. The compressed cover layer can indicate a level of negative pressure below the cover layer. In some embodiments, the wound dressing apparatus can comprise an indicator material layer and a cover layer configured to cover and form a seal over the wound contact layer and the indicator material layer. The indicator material layer can be configured to protrude relative to a surrounding surface of an upper surface of the wound dressing apparatus when negative pressure is applied to the wound dressing apparatus and the protruding indicator material layer indicates a level of negative pressure below the cover layer.

Liquid metal thermal interface materials and their uses in electronics assembly are described. In one implementation, a semiconductor assembly includes: a semiconductor die; a heat exchanger; and a thermal interface material (TIM) alloy bonding the semiconductor die to the heat exchanger without using a separate metallization layer on a surface of the semiconductor die or a surface of the heat exchanger. The TIM alloy may be formed by placing a TIM material between the semiconductor die and the heat exchanger, the TIM material comprising a first liquid metal foam in touching relation with the surface of the semiconductor die, a second liquid metal foam in touching relation with the surface of the heat exchanger.

A luminous frame assembly includes a support frame and a pod light device detachably mounted on the support frame. The pod light device includes a housing, light guide bars, and an electronic assembly. The light guide bars are connected to the housing at intervals along a radial direction, with one end of each of the light guide bars, away from the housing, protruding upward and / or downward from the housing. The electronic assembly includes a main board and light-emitting components, with the light-emitting components connected to the light guide bars. When the light-emitting components emit light, a unique visual effect is produced, and top and / or bottom of the support frame are illuminated for providing a clear target to facilitate nighttime play or sports, thereby improving user experience and practicality.

The invention relates to a cooling device for cooling an electrical and / or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component comprising a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40), a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5), the cooling device (1) further comprising at least one turbulator (6) arranged inside the depression (40) of the cooling channel (5), the turbulator (6) adjoining a bottom surface (44) in the depression (40) of the bottom plate (4) and the bottom surface (44) facing the top plate (3). According to the invention, the bottom plate (4) comprises an embossment (7) in a bending region (43) on the edge of the bottom surface (44).

A shielded electric plug. The electric plug includes a plug housing and a data line arranged within the plug housing for transmitting data in the Gbit / s range. A plug side of the data line electrically contacts the plug with a complementary mating plug and a connection side of the data line for electrically contacting with a circuit carrier. The data line is enclosed by a metal shielding housing. The plug housing includes a connection element with a press-in pin for mechanically contacting the plug with the circuit carrier using a press-in connection. The connection element includes a spring contact element to resiliently abut the circuit carrier so as to contact same when the electric plug is pressed in. The press-in pin is in the form of a first ground connection, and the spring contact element is designed is in the form of a second ground connection.

The invention provides a target object 6D pose estimation method and system oriented to electronic equipment AR assembly guidance. The method comprises the steps of electronic part coarse positioning based on improved YOLOv5s-CBAM, multi-mode (RGB-point cloud) feature fusion fine registration and LSTM dynamic motion prediction compensation. The system is developed based on an ROS framework and a PyTorch platform, and depends on an Open3D point cloud library and a TensorRT acceleration engine. According to the method, the problems of small target detection, metal reflection and shielding in an electronic assembly scene are solved through a cascaded visual positioning technology, the problem of insufficient precision caused by dependence on mark points or general SLAM in a traditional AR guide system is avoided, and the pose estimation robustness in a complex working condition is improved. Compared with an existing assembling method depending on manual calibration or two-dimensional drawings, the assembling efficiency and the first-pass yield are remarkably improved.

The present invention relates to an electronic assembly, an electronic component comprising the electronic assembly, and a method for embedding and protecting electronic components, particularly for protection against temperature effects. A more uniform heat distribution within the injection mold can be ensured through an interaction between the geometric design of the injection mold in combination with its chemical composition.

This application provides an electronic assembly and an electronic device. At least two antennas are formed on a metal frame of the electronic assembly, a circuit board and an electronic component are located on one side of the metal frame, and there is a gap between the metal frame and each of the circuit board and the electronic component. An orthographic projection of the electronic component on the metal frame covers a first antenna, a slit between the first antenna and a second antenna, and a part of the second antenna. One end of a first extension member is connected to one end of the first antenna which is close to the second antenna, the other end of the first extension member is electrically connected to a first feed point on the circuit board. The second antenna is electrically connected to a second feed point on the circuit board.

The utility model relates to an end effector capable of moving stably and accurately, which comprises a mounting seat, and is characterized by further comprising a first driving source, a second driving source, a third driving source, a fourth driving source, a fourth driving source and a fourth driving source, and the first driving source is fixedly arranged at the top of the mounting seat and used for providing locking driving force; the angle free adjusting mechanism is movably inserted into the mounting seat; the first driving source can lock, clamp and fix the angle free adjusting mechanism; and the suction cup assembly and the output end of the free angle adjusting mechanism are coaxially arranged, and the free angle adjusting mechanism can enable negative pressure adsorption to be formed between the suction cup assembly and a contact part. The manipulator can accurately grab and carry parts, can be widely applied to the industries such as mechanical manufacturing, electronic assembly and logistics, and improves the automation degree and the working efficiency in the production process.

A shoe cleaning mat including a housing assembly, a cleaning assembly and an electronic assembly. The housing assembly includes a housing having an opening in a top wall thereof. The cleaning assembly includes brushes equidistantly disposed within the housing. The brushes are connected therebetween through a shaft. The electronic assembly includes a motor, a battery and a sensor. The battery provides power to the motor and the sensor. The sensor is attached to a periphery of the opening of the housing. The motor is actuated when the sensor detects motion. The motor is actuated to move the movable base moving the brushes to clean a shoe introduced through the opening of the housing.

Provided in the embodiments of the present application are a heat dissipation device, an electronic assembly, and an electronic apparatus. The heat dissipation device is configured to dissipate heat from a heating element. The heat dissipation device comprises a jet structure, a heat dissipation structure and a supporting structure. The jet structure is spaced apart from the heat dissipation structure in a first direction, and the supporting structure provides support between the jet structure and the heat dissipation structure; and the surface of the heat dissipation structure away from the jet structure is configured to be in heat conduction connection with the heating element. The jet structure is provided with a liquid inlet, a jet opening, and a jet cavity, which brings the liquid inlet into communication with the jet opening. The jet opening faces the heat dissipation structure, and the jet opening is configured such that a refrigerant is ejected therethrough to the heat dissipation structure. Heat generated by the heating element can be conducted to the refrigerant via the heat dissipation structure, thereby causing the refrigerant to boil. After boiling, the refrigerant changes from liquid to gas, and detaches from the surface of the heat dissipation structure, thereby realizing heat dissipation for the heating element.

A coolant guiding structure can guide a coolant to a plurality of electronic components spaced from each other. The coolant guiding structure includes a housing, a plurality of first baffles, a plurality of second baffles, and a plurality of spoiler assemblies. The housing includes a liquid inlet and a liquid outlet. The liquid inlet can introduce the coolant into the housing, and the liquid outlet can discharge the coolant out of the housing. A first opening is formed between two adjacent first baffles, a second opening is formed between two adjacent second baffles, and a guide channel is formed between the first opening and the second opening. Each first baffle and a corresponding second baffle can accommodate one electronic component therebetween. At least two spoiler assemblies are disposed in the guide channel. The present disclosure further provides an electronic assembly.

A battery pack with electromagnetic compatibility (EMC) for an electric vehicle is presented that includes a battery pack housing, at least one battery module enclosed within the battery pack housing, and an electronics assembly enclosed within the battery pack housing, in which the electronics assembly comprises a DC-DC converter and an electronics assembly casing, wherein at least one of the electronics assembly and battery pack housing includes an electromagnetic interference (EMI) shield to enable EMC. The electronics assembly includes a battery management system (BMS) circuit board and a DC-DC converter control circuit board and a DC-DC converter power electronics board. The electronics assembly is of substantially a same dimension of a battery module, in which the EMI shield comprises at least one of a metallic screen, metallic wires, a metallic tape, a metallic sheet, a metallic coating, paramagnetic materials, carbon based materials and metallic and / or carbon particle-infused composites.

The present invention relates to a cooling fin arrangement (1) of a cooler, through which fluid can flow, for cooling power electronics (200). The cooling fin arrangement (1) comprises at least one cooling fin (10), which is formed from a wave profile that periodically repeats in a direction of repetition (501), the direction of repetition (501) being perpendicular to a flow direction (500). The invention also relates to a cooler, through which fluid can flow, for cooling power electronics (200), the cooler comprising a cooling fin arrangement (1) of this type, and to a power electronic assembly (1000), comprising power electronics (200) and a cooler (100) of this type, through which fluid can flow.

The invention relates to an electronic assembly (1), having - a main printed circuit board (2) and - a semiconductor component (28) arranged on the main printed circuit board (2), characterized by - a measuring printed circuit board (26) arranged in thermally conducting contact with the semiconductor component (28), and - a temperature sensor (16) arranged on the measuring printed circuit board (26) and configured to measure a temperature, on the basis of which a junction temperature (θ_J) of the semiconductor component (28) can be determined.

An electronic apparatus includes a casing assembly and an electronic assembly. The casing assembly includes a casing and a heat dissipation unit. The heat dissipation unit is disposed in the casing and includes a heat dissipation main body. The heat dissipation main body is provided with a first inclined surface. The electronic assembly is slidably mounted in the casing and includes an electronic unit and a thermal interface material. The electronic unit includes an electronic main body, the electronic main body is provided with a second inclined surface. The thermal interface material is disposed on the second inclined surface of the electronic unit, and the thermal interface material is in contact with the first inclined surface of the heat dissipation unit so as to thermally couple the electronic assembly with the heat dissipation unit.

The invention discloses an intelligent production scheduling method and system based on a fixed sequence genetic algorithm. The method comprises the following steps: dividing independent production areas of a workshop; key operation is determined, and modeling is carried out on time of the key operation; generating a process set containing a fixed sequence key job based on a process path, performing crossover variation by using an improved genetic algorithm, and keeping the sequence of internal processes of a task unchanged to avoid an invalid solution; and calculating the shortest processing duration through population iteration, and generating a production scheduling Gantt chart. The system comprises a workshop function area module, a key operation type module, a key operation modeling module and a production scheduling result output module, so as to realize the output of an intelligent production scheduling result. The method improves the production scheduling efficiency and the applicability of the production scheduling result, and is suitable for complex production scenes such as electronic assembly and cabinet debugging.

In one embodiment, the method is for testing electronic assemblies (1) each having a plurality of electronic components (3) applied on a circuit board (2), the method comprising the following steps: A) feeding the electronic assemblies (1) in an inspection system (10) comprising a first imaging stage (41) and an evaluation unit (51), B) imaging, by the first imaging stage (41), the electronic assemblies (1) so that first component images (61) of the electronic assemblies (1) are taken, C) identifying, by the evaluation unit (51), at least some of the electronic components (3) of the respective electronic assembly (1) in the respective first component image (61), and E) evaluating, by the evaluation unit (51), a fastening of the identified electronic components (3) on the circuit board (2) of the respective electronic assembly (1).

The present disclosure relates to the technical field of lighting fixtures, specifically a solar-powered waterproof decorative lamp, comprising: a lower shell; an upper shell, joined with the lower shell; a sealing ring, arranged between the lower shell and the upper shell for sealing the lower shell and the upper shell; an electronic assembly, arranged between the lower shell and the upper shell for providing a light source and power supply for the decorative lamp; and a photovoltaic power generation assembly, installed on top of the upper shell for providing solar charging to the electronic assembly.

An assembly of electronic components for reception of data using an optical fibre wherein said assembly comprises: a photodiode; a first amplifier coupled to said photodiode; a second amplifier, whose electrical behaviour is substantially identical to an electrical behaviour of said first amplifier; an impedance network comprising at least two electronic components coupled between an input of said second amplifier and a reference terminal, wherein those at least two electronic components comprise at least two impedance elements, one impedance element being capacitive and another being resistive or inductive, and wherein said at least two electronic components are adjustable under electronic control to adjust the impedance presented by said impedance network; and circuitry for creating a signal formed from a subtraction of outputs of the first and second amplifiers.

The present invention relates to a fluid-permeable cooler (100) for cooling a power module (208) that comprises a power substrate. The fluid-permeable cooler (101) comprises a first metal part (101), a second metal part (102) and a cooling structure (1). The first metal part (101) and the second metal part (102) are interconnected by means of a soldering process and define a cooling channel (111) which is permeable by a fluid and in which the cooling structure (1) is located.The first metal part (101) comprises a receiving region (109) to which the power module (208) can be attached. The first metal part (101) is made from a metal material which has an expansion coefficient that is greater than the expansion coefficient of the power substrate (208). The invention also relates to a power electronics assembly (1000) having a cooler (100) of this kind and a power module (200).

The utility model provides an assembly with an electronic component. The assembly comprises a coiled material belt, a plurality of reinforcing plates arranged at intervals are arranged on the material belt in the belt-shaped extension direction of the assembly, a circuit structure is fixed to each reinforcing plate, and electronic components are welded to the circuit structures. The assembly is in a strip shape with a plurality of circuit structures and can be conveniently and directly input into an injection molding machine for injection molding, bases can be respectively formed below the circuit structures and the reinforcing plates only through one-time injection molding, the injection molding frequency is low, and the production efficiency can be effectively improved. And then the injection-molded component is divided to form independent electronic components, and the reinforcing plate is arranged in the plastic base of each electronic component, so that the structural strength is high. The base in the electronic component can be used as the base of the voice coil motor, and the electronic component can be a Hall element and the like and is used for realizing the closed loop function of the voice coil motor in the camera module.

A solar fountain nozzle includes: a housing, where a water inlet cavity and an accommodating cavity that are independent of each other are disposed in the housing, a first end of the water inlet cavity is provided with a water inlet, a second end of the water inlet cavity is closed, a first end of the accommodating cavity is closed, a second end of the accommodating cavity is an open end, a side surface of the housing is provided with a jet, and the jet communicates with the water inlet cavity; an electronic assembly; a mounting base, where the electronic assembly is disposed on the mounting base, and is placed in the accommodating cavity along with the mounting base from the second end of the accommodating cavity; and a solar panel disposed at an upper end of the housing, where the solar panel is electrically connected to the electronic assembly.

The invention relates to a cross-inductor voltage regulator (TLVR) inductor module and a power electronic assembly including the TLVR inductor module. A cross-inductor voltage regulator (TLVR) inductor module includes: a magnetic core; a first winding embedded in the magnetic core; a second winding embedded in the magnetic core and inductively coupled to the first winding; a third winding embedded in the magnetic core; a fourth winding embedded in the magnetic core and inductively coupled to the third winding; and a first integrated metal connector connecting the second winding and the fourth winding in the series loop. A power electronic assembly including the TLVR inductor module is also described.