1411 results about "Thermal coupling" patented technology

A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreaders and electrically insulated from these heat spreaders by the dielectric material. At least one via passes through the dielectric material above each heat spreader, and at least one LED die is disposed above each via. The bendable electrical interconnection layer may be a lead frame comprising metal pathways that electrically interconnect some or all LED dice in series, in parallel, in anti-parallel, or in some combination of these configurations. Each via contains a thermally conductive material in thermal contact with the corresponding heat spreader below it and in thermal contact with the corresponding LED die above it. The LED dice may be thermally and electrically coupled to submounts disposed above corresponding heat spreaders in some embodiments.

A vertically stacked array antenna structure is described. The structure comprises a radiating layer, a passive layer disposed under said radiating layer, an active layer disposed under said passive layer, and an interface assembly. The radiating layer comprises an array of radiating elements. The passive layer has only passive components. At least a part of the passive components includes an array of RF duplexers corresponding to the array of radiating elements. The active layer comprises RF amplifiers. The interface assembly comprises at least one metallic frame which is in direct thermal coupling with the RF amplifiers. The interface assembly is configured for providing thermal communication of the active layer with a heat exchanger.

A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.

In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.

In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. A board supports lamp electronics for the lamp and is located in the enclosure. The LED array is mounted to the board and LEDs are mounted on a submount formed to have a three dimensional shape. The board is electrically coupled to the LED array and the submount may be thermally coupled to the gas for dissipating heat from the plurality of LEDs.

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.

A sulfonated aromatic perfluorocyclobutane block copolymer comprises a hydrophobic perfluorocyclobutane ether chain segment and a hydrophilic sulfonated perfluorocyclobutane ether chain segment. The sulfonated perfluorocyclobutane copolymer may be used to make proton conductive membranes and membrane electrode assemblies in fuel cells. Processes of making the block copolymer through thermal coupling reactions are also disclosed.

The invention provides a method and a system for calculating the transient junction temperature of an IGBT (Insulated Gate Bipolar Translator) module. The method comprises the steps of: acquiring circuit state information, loss parameter and internal thermistor voltage drop information; calculating power module loss according to the circuit state information and the loss parameter, and calculating substrate temperature according to the internal thermistor voltage drop information of the module; according to the temperature information provided by internal chips and the internal thermistor of the module as reference temperature, in consideration with thermal coupling between the internal chips of the power module at the same time, establishing a simpler IGBT module thermistor network model, and calculating a junction temperature rise according to the power module loss and the thermistor network model; and calculating the transient junction temperature according to the substrate temperature and the junction temperature rise, thus realizing on-line acquisition of the transient working junction temperature of the IGBT. By sufficiently utilizing the existing thermistor resource inside the power module, a junction temperature measurement system based on a power module electro-thermal coupling model is established, so that accurate power device junction temperature information is provided for security operation and health management of a converter system.

The invention provides a thermal protection voltage-sensitive resistor module used for surge protection, which consists essentially of a metal oxide voltage-sensitive resistor, a thermal response switch, a set of thruster with a compression spring and a wedge-shaped quencher and a case. Thermal coupling exists between the thermal response switch and the metal oxide voltage-sensitive resistor. When the metal oxide voltage-sensitive resistor is overstressed, the resistor emits heat, the thermal response switch can immediately sense the heat and soften the welding point of solder with low melting point, then the welding point is forced to be quickly disconnected and part of the wedge-shaped quencher is inserted into the clearance at the breakage place of the welding point under the joint effect of the thruster with the spring and the wedge-shaped quencher and the resilient conductive connection arm, thus the quenching effect is enhanced.

The invention discloses a water-gas two-phase adsorption-desorption-seepage experimental system and method for loaded coal containing methane. The water-gas two-phase adsorption-desorption-seepage experimental system for loaded coal containing methane comprises a pressure loading part, wherein the pressure loading part comprises a tank body for containing a constant-temperature water bath, a reference pot and a coal sample holder are arranged in the tank body, the gas inlet of the reference pot is connected with a high-pressure methane delivery pipeline, the gas outlet of the reference pot is connected with the gas inlet of the coal sample holder through a connecting pipeline, and the gas outlet of the coal sample holder is connected with a water-gas separation device. The water-gas two-phase seepage experimental method for loaded coal containing methane is carried out on the basis of the experimental system. By changing different loading conditions, loading paths and experimental temperatures, adsorption-desorption experiments and methane seepage experiments for the loaded coal containing methane under the conditions of different solid-gas thermal coupling can be realized, and water-gas two-phase seepage experiments and methane adsorption-desorption experiments under the condition of different moisture contents also can be realized.

A plasma reactor for processing a workpiece includes a reactor chamber, an electrostatic chuck within the chamber having a top surface for supporting a workpiece and having indentations in the top surface that form enclosed gas flow channels whenever covered by a workpiece resting on the top surface. The reactor further includes thermal control apparatus thermally coupled to the electrostatic chuck, an RF plasma bias power generator coupled to apply RF power to the electrostatic chuck, a pressurized gas supply of a thermally conductive gas, a controllable gas valve coupling the pressurized gas supply to the indentations to facilitate filling the channels with the thermally conductive gas for heat transfer between a backside of a workpiece and the electrostatic chuck at a heat transfer rate that is a function of the pressure against the backside of the workpiece of the thermally conductive gas. The reactor further includes an agile workpiece temperature control loop including (a) a temperature probe in the electrostatic chuck, and (b) a backside gas pressure controller coupled to an output of the temperature probe and responsive to a specified desired temperature, the controller governing the gas valve in response to a difference between the output of the temperature probe and the desired temperature.

A method for monitoring the operating temperature of a semiconductor device. The method comprising the steps of: placing a thermal coupling material between the bottom of the semiconductor device and the top of a printed circuit board for inserting the device thereinto; inserting a sensor so to be at least partially covered by the thermal coupling material; and measuring the temperature from the sensor within a predetermined time interval. In accordance with another aspect of the invention, an apparatus is described to carry out the above process.

The present invention provides an optical device comprising one or more heat pipes with a desired level of thermal coupling with the light-emitting elements which are positioned along a periphery of the evaporator surface portion of the heat pipe in such a way that they are thermally coupled to the heat pipe. In one embodiment, the heat pipe of the present invention can be readily integrated with optical elements such as reflectors or collimators.

A sensor method and system are disclosed. A fluid flow sensor can be provided, which measures the thermal conductivity of a fluid. The sensor itself can be configured to comprise one or more sensing element associated with a sensor substrate. A heater can be associated with said sensor wherein said heater provides heat to said fluid. A film component can also be provided that that isolates said fluid from said heater and said sensor, such that said film component conducts heat in a direction from said heater to said sensor, thereby forming a thermal coupling between said sensor, said heater and said fluid, which permits said sensor to determine a composition of said fluid by measuring thermal conductivity thereof without undesired losses of heat in other directions. The film component can be configured on or in the shape of a tubing or a flow channel.

PCT No. PCT/FR96/00150 Sec. 371 Date Aug. 21, 1997 Sec. 102(e) Date Aug. 21, 1997 PCT Filed Jan. 30, 1996 PCT Pub. No. WO96/26631 PCT Pub. Date Aug. 29, 1996Method for fabricating thermally cooled electronic cards. A card of any kind is covered with a rigid heat sink shaped to fit the card and is attached thereto. The heat sink is formed in such a way that it fits as closely as possible the shape of the printed circuit. The printed circuit has components on one or both faces so that it is possible to increase the surface thermal coupling between the sink and the board. An optical sensor using a laser beam may be used.

A thermal management system that utilizes a multi-mode valve assembly within the drive train control loop to provide efficient thermal control of the drive train components is provided. The multi-mode valve assembly allows the mode of thermal coupling between the thermal control loop and the various drive train components (e.g., vehicle propulsion motor, gearbox assembly, power electronics subsystem, etc.) to be varied in accordance with present conditions.

A commercially viable modular ceramic oxygen transport membrane reforming reactor for producing a synthesis gas that improves the thermal coupling of reactively-driven oxygen transport membrane tubes and catalyst reforming tubes required to efficiently and effectively produce synthesis gas.

A direct current (DC)-DC converter and radio frequency (RF) power amplifier (PA) circuitry are disclosed. The DC-DC converter provides an envelope power supply signal to the RF PA circuitry based on a first power supply output control signal. As a temperature of the RF PA circuitry changes, the envelope power supply signal may need to be adjusted to meet temperature compensation requirements of the RF PA circuitry. With adequate thermal coupling between the DC-DC converter and the RF PA circuitry, adjustments to the envelope power supply signal may be based on temperature measurements of the DC-DC converter. A desired correction of the first power supply output control signal is determined based on a measured temperature of the DC-DC converter and the temperature compensation requirements of the RF PA circuitry. The first power supply output control signal is adjusted based on the desired correction.

A temperature sensing system incorporates a contact temperature sensor probe for measuring the temperature of articles. The probe is able to operate effectively even in high radio frequency environments such as those present within radio frequency excited plasma processing chambers. The temperature sensing system includes a contact temperature sensor, such as a thermocouple, surrounded by a shielding sheath of a material such as aluminum which is clad with one or more layers of a cladding material. A tip insulator is provided surrounding the sheath for providing RF insulation and thermal coupling. An RF insulating and thermal insulating mounting member is connected to the tip insulator for mounting the probe on an article to be measured.