The invention discloses a packaging substrate with a temperature detection function, a power
semiconductor module and a manufacturing method thereof, and the packaging substrate with the temperature detection function comprises an integrated
ceramic insulating layer which is provided with a first surface and a second surface which are opposite to each other; the temperature sensor comprises a
ceramic insulating layer, a sensor mounting groove, an independent temperature sensor
chip, an insulating filling body and a three-dimensional
interconnection structure, and is configured to lead an
electric signal of the temperature sensor
chip to an external bonding pad on the second surface or the side surface of the
ceramic insulating layer, the packaging substrate has the advantages that high-precision and quick response measurement of
junction temperature of a power
chip can be achieved, temperature rise decoupling deviation is eliminated, excellent high-
voltage electrical isolation reliability is ensured while direct
thermal coupling is achieved, the
dielectric breakdown risk is avoided, the manufacturing method is flexible, the reliability of a power
semiconductor module is improved, and the manufacturing cost is reduced. The comprehensive cost is reduced, and the long-term stability of
temperature monitoring can be ensured while the rapid and accurate electrothermal response characteristic of the sensing unit is ensured.