60results about How to "Good thermal coupling" patented technology

A resetable over-current self-protecting semiconductor power device comprises a vertical power semiconductor chip and an over-current protection layer composed of current limiting material such as a PTC material. The over-current protection layer may be sandwiched between the vertical power semiconductor chip and a conductive plate, which could be a leadframe, a metal plate, a PCB plate or a PCB that the device is mounted on.

A system for cooling processor assembly is disclosed which comprises printed circuit boards (PCB) with a plurality of heat emitting electronic components, and a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components. The housing comprises a base portion to which are transferred heat emitted by the electronic components. Furthermore, the system for cooling processor comprises a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate. The housings for each PCB system include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific therefor dedicated place defined by the guiding holes. Advantageously, the PCB together with its housing is pressed against the cooling plate alongside the base portion when fixed onto the cooling plate allowing thermal coupling between the housing and the cooling plate and a hot plugging of the PCB onto the cooling plate without requiring interrupting the cooling process applied to the cooling plate.

The present technique, in accordance with one exemplary embodiment, relates to a motorized pulley. The exemplary motorized pulley includes a rim or housing inside of which are disposed an electric motor and a gear assembly, which is configured to transfer torque of the electric motor to the housing. Thus, during operation of the motor, the exemplary pulley rotates the housing in relation to a support structure to which the motorized pulley is mounted. To improve the dissipation of heat generated during operation of the motor, the motor is thermally coupled to the frame. Additionally, the rotor shaft of the exemplary motorized pulley extends into the external environment surrounding the pulley, thereby facilitating the operation of a machine element located externally with respect to the pulley via the electric motor disposed within the pulley.

An electronic device is described, which comprises an envelope comprising a closed chamber and a printed-circuit board. The printed-circuit board is positioned in the chamber and defines a dissipation chamber. The printed-circuit board comprises at least one electronic device positioned in the dissipation chamber. The dissipation chamber comprises a filler simultaneously in contact with the electronic component, the printed-circuit board and a dissipation film.

A temperature-dependent switch 10 has a temperature-dependent switching mechanism 11; a housing 12, receiving the switching mechanism 11 and having a lower part 14 and an upper part 15; and two stationary contacts 31, 32, provided on the upper part 15 on its inner side 37, each contact being connected to an associated external termina 35, 36. A current transfer member is arranged on the switching mechanism 11 and moved by it, which transfer member is in contact with the two stationary contacts 31, 32 in temperature-dependent fashion. There is arranged physically in the region of the current transfer member and upper part 15 at least one resistor 38 which is electrically connected between the stationary contacts 31, 32 at least when the current transfer member is in contact with them.

A temperature-setting device for providing a predetermined temperature to a quantity of fluid circulating therethrough, a thermal treatment apparatus including such device for selectively treating a targeted tissue adjacent a subject's body cavity, and techniques using such thermal treatment apparatus are provided. The temperature-setting device comprises: an electrically conducting tubular element, a housing element for receiving the tubular element; and a transformer electrically connectable to the housing element. The tubular element functions as a resistor and heats the fluid circulating therethrough. Alternatively, the housing element comprises a thermal conducting member disposed within a bath of a cooling substance, the thermal conducting member having a recess for receiving the tubular element. The tubular element may alternately be placed in a housing element functioning as a heater and a housing element functioning as a cooler, thereby alternately heating or cooling the fluid circulating therethrough. The thermal treatment apparatus comprises: a temperature-setting device according to the present invention; a catheter insertable into a subject's body cavity, the catheter including a thermal treating section for thermally treating a targeted tissue; a pump; thermal sensor assemblies; and an air trapping element.

A multi-function interface adaptor comprises a base layer and flexible fingers extending from it. The interface adaptor is interposed between two objects to provide a mechanical and / or thermal interface with stress relief or shock absorption. Using bent fingers operating like springs, shocks and distributed stresses can be relieved in the plane of the adaptor, as well as normal to the plane. A preferred embodiment is an Interface Adaptor that replaces thermal grease between a semiconductor chip and its associated heat sink.

The invention provides a high temperature superconducting magnetic system protected by high heat capacity materials, wherein, a high temperature superconducting magnet (12) is arranged in a low temperature container (6); the periphery of the high temperature superconducting magnet (12) is coated with high heat capacity cold accumulation materials (17); a refrigerator (1) is installed in a vacuum container (2), and a primary cold head of the refrigerator (1) is connected with a cold shield (5) of the vacuum container (2) through a first heat pipe (3); a secondary cold head of the refrigerator (1) is connected with a low temperature container (6) through a second heat pipe (8); a first and a second cold conduction copper rods (23, 24) which are at the lower end of the second heat pipe (8) are connected with the high temperature superconducting magnet (12) through a cold conduction plate (15); a Y-Ba-Cu-O high temperature superconducting block (13) which is installed in external symmetry on the low temperature container (6) interacts with a permanent magnetic block (14) which is on the inner wall of the vacuum container (2), thus suspending the low temperature container (6); and the temperature signal of the high temperature superconducting magnet (12) detected by a temperature probe (18) is used for controlling the startup and shutdown of the refrigerator (1).

A system for cooling processor assembly is disclosed which comprises printed circuit boards (PCB) with a plurality of heat emitting electronic components, and a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components. The housing comprises a base portion to which are transferred heat emitted by the electronic components. Furthermore, the system for cooling processor comprises a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate. The housings for each PCB system include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific therefor dedicated place defined by the guiding holes. Advantageously, the PCB together with its housing is pressed against the cooling plate alongside the base portion when fixed onto the cooling plate allowing thermal coupling between the housing and the cooling plate and a hot plugging of the PCB onto the cooling plate without requiring interrupting the cooling process applied to the cooling plate.

An end-pumped solid state laser utilizing a laser diode stack of laser diode subassemblies as the pump source is provided. The laser gain medium of the solid state laser is contained within a laser cavity defined by a pair of reflective elements. Each laser diode subassembly includes a submount to which one or more laser diodes are attached. The fast axis corresponding to each output beam of each laser diode is substantially perpendicular to the mounting surfaces of the submount. The laser diodes can be of one wavelength or multiple wavelengths. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. On top of the submount, adjacent to the laser diode, is a spacer. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. Preferably the laser diode stack is thermally coupled to a cooling block.

The electric heating arrangement (1) has a tubular housing (2) in which is provided at least one PTC heating element (20) and at least one pair of metallic heat dissipators (9) between which the at least one heating element (20) is clamped and which for this purpose each comprise a base portion (10) facing the at least one heating element and one or two curved legs (15) projecting from said base portion, which adapt themselves resiliently to the inner surface of the surrounding wall of the housing (2). The invention provides that the legs (15) taper toward their free ends and / or that the base portion (10) is thicker than the legs (15) projecting it.

A side-pumped solid state laser utilizing a laser diode stack of laser diode submount assemblies is provided. The laser gain medium of the solid state laser is contained within a laser cavity defined by a pair of reflective elements. Each laser diode submount assembly includes a submount to which one or more laser diodes are attached. The radiation-emitting active layer of each laser diode is positioned substantially parallel to the mounting surfaces of the submount, causing the fast axis of each laser diode's output beam to be substantially orthogonal to the submount mounting surfaces. The laser diodes can be of one wavelength or multiple wavelengths. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. On top of the submount, adjacent to the laser diode, is a spacer. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. Preferably the laser diode stack is thermally coupled to a cooling block.

A laser diode package is provided. The laser diode package includes a plurality of laser diode submount assemblies, each assembly including a submount to which one or more laser diodes are attached. An electrically isolating pad is attached to the same surface of the submount as the laser diode. A metallization layer is deposited onto the outermost surface of the electrically isolating pad, to which an electrical contact pad is bonded. Electrical interconnects, such as wire or ribbon interconnects, connect the laser diode or diodes to the metallization layer. Preferably the laser diode stack is formed by electrically and mechanically bonding together the bottom surface of each submount to the electrical contact pad of an adjacent submount assembly. The laser diode stack is thermally coupled to a cooling block. Preferably thermally conductive and electrically isolating members are interposed between the laser diode stack and the cooling block.

An electronic device is described, which comprises an envelope comprising a closed chamber and a printed-circuit board. The printed-circuit board is positioned in the chamber and defines a dissipation chamber. The printed-circuit board comprises at least one electronic device positioned in the dissipation chamber. The dissipation chamber comprises a filler simultaneously in contact with the electronic component, the printed-circuit board and a dissipation film.

A laser diode package is provided, the package including a plurality of laser diode submount assemblies. Each submount assembly includes a submount. At least one laser diode is attached to a front portion of each submount while a spacer, preferably comprised of an electrically isolating pad and an electrical contact pad, is attached to a rear portion of each submount. Electrical interconnects, such as wire or ribbon interconnects, connect the laser diode or diodes to the electrical contact pad, either directly or indirectly. Preferably the laser diode stack is formed by electrically and mechanically bonding together the bottom surface of each submount to the electrical contact pad of an adjacent submount assembly. The laser diode stack is thermally coupled to a cooling block. Preferably thermally conductive and electrically isolating members are interposed between the laser diode stack and the cooling block.

An energy storage module having a plurality of stacked flat cells. The energy storage module has an interconnection formed in such a way that the energy storage module can be connected mechanically, electrically and / or for exchanging coolant with at least one other energy storage module of the same kind.

A reactor device (100) for reaction fluid comprising a reaction vessel (102) comprising: an end cap (104) comprising at least one passage (112) for the reaction fluid; and at least one tube (116) which extends through the reaction vessel (102). The reaction vessel is operable to receive a control fluid outside the at least one tube (116) for controlling the temperature inside the at least one tube (116). A manifold (200) is connectable to the end cap (104) and comprises at least one channel (206) for reaction fluid. An outlet (208) from the manifold (200) is in fluid communication with the tube (116). The end cap (104) has a thermal conductivity of greater than 1 watt per square meter kelvin to provide a thermal coupling between the control fluid and the manifold (200).

The present technique, in accordance with one exemplary embodiment, relates to a motorized pulley. The exemplary motorized pulley includes a rim or housing inside of which are disposed an electric motor and a gear assembly, which is configured to transfer torque of the electric motor to the housing. Thus, during operation of the motor, the exemplary pulley rotates the housing in relation to a support structure to which the motorized pulley is mounted. To improve the dissipation of heat generated during operation of the motor, the motor is thermally coupled to the frame. Additionally, the rotor shaft of the exemplary motorized pulley extends into the external environment surrounding the pulley, thereby facilitating the operation of a machine element located externally with respect to the pulley via the electric motor disposed within the pulley.

Apparatuses and methods for thermally processing a substrate are provided. A chamber containing a levitating support assembly configured to position the substrate at different distances from a plate during the heating and cooling of a substrate. In one embodiment a plurality of openings on the surface of the plate are configured to evenly distribute gas across a radial surface of the substrate. The distribution of gas may couple radiant energy not reflected back to the substrate during thermal processing with an absorptive region of the plate to begin the cooling of the substrate. The method and apparatus provided within allows for a controllable and effective means for thermally processing a substrate rapidly.

A holding device including a holding element, on which a substrate is electrostatically fixed, positioned on a substrate electrode. In one configuration, a load body on the substrate electrode presses the holding element onto it, and is connected via a clamping device, which presses the former onto the substrate electrode, with a base, which supports the substrate electrode, the load body and the base being electrically insulated from the substrate electrode. In another configuration, the side of the holding element faces the substrate as an electrically insulating ferroelectric or piezoelectric material. Another configuration includes a device via which a liquid convection medium is feedable into a space formed by the holding element and substrate or is removable from there again. A method for supplying heat or dissipating heat from the back of a substrate to which heat is applied from the front, and which is held by the holding device.

A holding device including a holding element, on which a substrate is electrostatically fixed, positioned on a substrate electrode. In one configuration, a load body on the substrate electrode presses the holding element onto it, and is connected via a clamping device, which presses the former onto the substrate electrode, with a base, which supports the substrate electrode, the load body and the base being electrically insulated from the substrate electrode. In another configuration, the side of the holding element faces the substrate as an electrically insulating ferroelectric or piezoelectric material. Another configuration includes a device via which a liquid convection medium is feedable into a space formed by the holding element and substrate or is removable from there again. A method for supplying heat or dissipating heat from the back of a substrate to which heat is applied from the front, and which is held by the holding device.

A device (1) for determining the qualify of a medium, particularly of a lubricant and / or cutting oil, includes a number of sensors (3, 4, 5, 6, 7) that emit electric output signals according to the respective sensor-specific input variables. One sensor is a temperature sensor (7) that emits an output signal, which is essentially only dependent on the temperature (T) of the medium and is essentially independent of, in particular, the quality of the medium. At least one other sensor (3, 4, 5, 6) emits an output signal that is dependent on both the quality of the medium as well as the temperature (T) of the medium. The sensors (3, 4, 5, 6, 7) are placed on a shared substrate (2) that can be immersed in the medium. An associated process also determines the quality of a medium.

Known rechargeable batteries contain a cell that is received in a cell cup. For monitoring the temperature of the rechargeable batteries, PTC elements are used, but they increase the amount of space needed and can be accommodated in a battery pack only with difficulty. For the sake of simple accommodation, a rechargeable battery has a cell, which is received in a cell cup. According to the invention, for monitoring the temperature of the cell, a temperature-dependent element, in particular a PTC element, is provided that at least partially surrounds the cell cup. The invention is intended in particular for battery packs in which temperature monitoring is required.

A combustion chamber pressure sensor for an internal combustion engine, having a sensor body able to be inserted into a receiving bore of the internal combustion engine, which sensor body has on the side of the combustion chamber a sealing device for sealing the sensor body in the receiving bore, and which sensor body is provided with affixation means for fixing the combustion chamber pressure sensor in place inside the receiving bore. The sealing device includes at least one separately produced heat-resistant elastic sealing element, which is disposed around an outer jacket of the sensor body.

The invention discloses a self-heating heat responsive element and a liquid level detector assembled thereby. The self-heating heat responsive element comprises a heating resistor, a heat-conducting medium and a heat responsive element, wherein the heat-conducting medium is respectively and tightly contacted with the heating resistor and the heat responsive element. The heat responsive element can be a heat responsive resistor, a diode and a triode. The liquid level detector comprises the self-heating heat responsive element and a voltage comparator, wherein the self-heating heat responsive element is a special element for detecting liquid level and can reliably work in a wider temperature range. A liquid level detection circuit is simple, flexible and strong in disturbance resisting capability and can exactly detect the liquid level.

An assembly is provided for attaching a temperature sensor to a battery cell. The assembly may comprise a sleeve having a hollow interior, the hollow interior being shaped to slide at least partially over the battery cell to a position on the battery cell. The assembly may further comprise a housing mounted on an exterior surface of the sleeve, the housing having an opening sized to accept the temperature sensor. The sleeve and the housing may provide thermal conductivity between the hollow interior of the sleeve and an interior of the opening of the housing, to facilitate thermal coupling between the battery cell and the temperature sensor.

A sensor system includes a thin-film sensor provided with at least one contact area on the surface thereof, and a printed circuit board provided with at least one contact pad on the surface thereof. The thin-film sensor is arranged in relation to the surface of the printed circuit board such that the surface of the thin-film sensor opposes the surface of the printed circuit board. In order to transmit sensor currents from the thin-film sensor to the printed circuit board, a conductive glue adheres to both the contact area of the thin-film sensor and to the contact pad on the surface of the printed circuit board.

A thermal conductivity detector includes at least four detector components that are arranged in receptacles of a thermal conduction block in a circle around a center axis of the thermal conduction block. The thermal conduction block comprises a central portion along the axis, the cross-axial dimensions of the central portion being less than the diameter of the circle. There are at least four equal peripheral portions that are connected solely to the central portion and are separated from each other, each of the peripheral portions carrying one of the detector components.