The invention discloses a high-performance Cu-Co-Si
alloy plate and a preparation method thereof, and belongs to the technical field of
copper alloy materials. The
alloy plate comprises the following components in percentage by weight: 1.0-2.5% of Co, 0.2-1.0% of Si, 0.09-0.2% of Cr, 0.01-0.1% of Ni, less than or equal to 0.2% of Ti, less than or equal to 0.5% of Fe, less than or equal to 0.5% of Sn, less than or equal to 0.5% of Zn, less than or equal to 0.5% of P and the balance of Cu and inevitable trace impurities. The preparation method comprises the steps of
smelting, semi-
continuous casting, hot rolling, cold rolling, cleaning,
stress relief annealing,
solid solution, final cold rolling, aging and the like. According to the invention, alloy elements are reasonably matched and a preparation process is optimized, so that the alloy plate forms a nanoscale dispersed precipitated phase,
dislocation motion is effectively hindered, grains are refined, and synergistic improvement of strength,
conductivity and processability is realized. The thickness of the finished board is (0.02-0.15) + / -0.003 mm, the
hardness is 180-220 HV, the electric
conductivity is 62-66% IACS, the tensile strength is 620-680 MPa, 90-degree bending R / t is 0.5, and the finished board is free of surface defects and can be widely applied to the electronic and electrical field with high reliability and high performance.