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2402results about How to "Reduce components" patented technology

Pulse oximetry method and system with improved motion correction

InactiveUS6839582B2Reduces complexity and component requirementReduce complexityDiagnostic recording/measuringSensorsPerfusionPower flow
A pulse oximetry method and system for improved motion correction is disclosed. The method/system provides for the use of a detector output signal to obtain a different plurality of differential absorption data sets in corresponding relation to each of a succession of measurement, wherein each of the data sets includes differential absorption values for light of a first wavelength and light of a second wavelength. The data sets are processed to obtain a relative motion estimate value for each measurement. When the relative motion estimate value for a given measurement falls within a predetermined range (i.e., corresponding with clinical motion), a corresponding blood analyte indicator value is adjusted in a predetermined manner, wherein the corresponding adjusted blood analyte indicator is employable to obtain at least one blood analyte concentration value. In one embodiment, blood analyte indicator values may be readily multiplied by a predetermined adjustment factor (i.e., when clinical motion is identified). The relative motion estimate value for a given measurement may be obtained by conducting a principal component analysis of the corresponding plurality of data sets relative to a corresponding best fit function therefor to obtain corresponding variance values V1, V2. The variance value V1, and/or V2 for a given current measurement may be employed to obtain a current motion estimate value. The current motion estimate value and the relative motion estimate value obtained for a prior low motion measurement (i.e., for which no adjustment was necessary) may be used to compute the relative motion estimate value for the current measurement. The variance values V1 and/or V2 are also employable to compute an ongoing, updated motion probability factor, wherein such factor may be used to adjust relative motion estimates values in instances of rapid tissue perfusion changes.
Owner:DATEX OHMEDA

Plasma processing apparatus and mounting unit thereof

A parallel plate type plasma processing apparatus including a RF feed rod for applying a high frequency power to a susceptor and a temperature detection unit for detecting the temperature of a substrate on the susceptor is configured to reduce an effect that high frequency current flowing in the RF feed rod has on temperature detection of the temperature detection unit. A surface portion of the susceptor serves as a mounting unit including an electrostatic chuck and a heater. A shaft, which is a protection pipe extracted downward from the processing chamber, is provided under the mounting unit. A chuck electrode of the electrostatic chuck serves as an electrode for applying a high frequency voltage. Provided in the shaft are two RF feed rod for supplying a power to the electrode and an optical fiber, i.e., a temperature detection unit, having a dielectric fluorescent material is disposed in a leading end thereof. Then, the two RF feed rods and bar type conductive leads for the heater are alternately arranged at equal intervals in a circumferential direction on a circle having the optical fiber at the center thereof such that the region having therein the optical fiber is an electromagnetic wave-free region since the electric force lines respectively traveling from the RF feed rods to bar type conductive leads are offset with each other.
Owner:TOKYO ELECTRON LTD

Package for semiconductor power device and method for assembling the same

A package for a semiconductor power device which comprises: a conductive bottom plate as a heat sink; an insulating substrate mounted on the bottom plate; a copper film formed on the insulating substrate to expose a peripheral region of the insulating substrate; semiconductor chips disposed on the copper film; a container arranged on the bottom plate, surrounding the insulating substrate; an external terminal supported through the container and connected electrically with the semiconductor chips; and a silicone gel filled within the container, wherein a solidified insulating material is disposed on an outer edge region of the copper film and the peripheral region of the insulating substrate. Thus, reducing an electric field across the interface and making it difficult to cause a creeping discharge. A notch is formed in the bottom plate, and the notch is filled with a high heat conductive resin. The notch is located outwardly apart from a region where the semiconductor chips are mounted. Thus, a creeping breakdown is prevented without sacrificing a heat radiation effect of the bottom plate. Using a waterproof and flexible film to seal an inlet for filling the silicone gel into the case, a heat stress caused by an expansion and a shrinkage of the silicone gel in response to a variation of temperatures is reduced, and it prevents the silicone gel from being wet. A thermoplastic insulating resin is employed instead of the silicone gel.
Owner:KK TOSHIBA
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