2987 results about "Edge region" patented technology

The embodiment of the invention relates to the photovoltaic field, and provides a back contact battery and a preparation method thereof, and a photovoltaic module, and the back contact battery comprises a battery body of which the back surface comprises a first edge region, a central region and a second edge region which are sequentially arranged along a first direction; the first fine grid and the second fine grid are positioned in the central region and are alternately arranged along a second direction; the edge bus bar extends along the second direction, is positioned in the first edge region or the second edge region, and is connected with the plurality of first or second fine grids; the edge bonding pad is located on the portion, close to the first edge area or the second edge area, of at least one fine grid and electrically connected with the edge bus bar, and the fine grid is one of the first fine grid and the second fine grid; one end of the connecting section is connected with one side, close to the edge bus bar, of the edge bonding pad or connected with one of the two opposite sides of the edge bonding pad in the second direction, the other end of the connecting section is connected with the edge bonding pad or one fine grid, and at least the photoelectric conversion efficiency of the back contact battery can be improved.

The invention discloses a solar cell and a manufacturing method thereof, and a photovoltaic module, and relates to the field of photovoltaic technology. The solar cell includes: a semiconductor substrate having a first surface including a first region and a second region; the second area comprises an edge area and a middle area, each of the edge area and the middle area comprises a step structure recessed towards the second surface, and the step depth of the step structure of the edge area of the second area is larger than that of the step structure of the middle area of the second area; and the first doping layer is arranged on the first region, and the height of the bottom wall of the step structure in the middle region of the second region is lower than that of the first doping layer. The first passivation layer is arranged on the side, away from the semiconductor substrate, of the first doping layer and arranged on the second area. According to the embodiment of the invention, the thickness along the splitting direction is reduced, so that the splitting difficulty is reduced, meanwhile, the recombination of current carriers is reduced, and the passivation effect is improved.

Provided herein are various apparatuses and systems for providing edge heating of semiconductor wafers using optical means. Such systems may direct radiant energy towards the edge region of a semiconductor wafer.

The invention discloses a circuit board surface coating quality detection method and device, and the method comprises the steps: obtaining an image of a coating surface, and removing noise interference; brightness gradient information is extracted, and when the brightness gradient information exceeds a preset brightness threshold value, it is judged that defects exist, and a potential defect area is obtained; a potential defect area is separated from the background, image brightness distribution is mapped into plating depth data, and surface topography parameters are calculated; the defect areas are classified, edge optical characteristics are extracted from coating edge areas in the image, the coating thickness difference is calculated, the thickness difference and the edge optical characteristics are fused to obtain fusion characteristics, and an image is generated through an algorithm; and calculating the brightness dispersion degree of the plating layer edge and the local thickness difference of each edge region, carrying out weighted average on the corresponding pixel gray value to obtain a fused comprehensive defect region image, and calculating to obtain the comprehensive quality score of the plating layer. The method can accurately detect the quality of the circuit board.

Provided are a solar cell, a method for preparing a solar cell, and a photovoltaic module, relating to the field of photovoltaics. The solar cell includes a substrate, a dielectric layer and a doped semiconductor layer which are stacked, a passivation layer, and electrodes. The substrate has a first surface. The first surface includes an edge region and a center region. The edge region surrounds the center region. The edge region is substantially flush with or closer to the second surface than the center region. The dielectric layer is formed over the center region. The passivation layer covers the edge region and a surface of the doped semiconductor layer facing away the dielectric layer. The electrodes are located in the center region, and penetrate the passivation layer in a thickness direction to be in electrical contact with the doped semiconductor layer.

A back-contact cell and a manufacturing method therefor, and a photovoltaic module, which belong to the technical field of photovoltaics. The back-contact cell comprises: a semiconductor substrate, which has a first surface and a second surface, which are arranged opposite each other, wherein the first surface is of a textured structure; and a tunneling passivation layer and an N-type doped polycrystalline silicon layer, which are sequentially stacked in a local region of the second surface in the thickness direction of the semiconductor substrate, wherein the ratio of the thickness of the part of the N-type doped polycrystalline silicon layer that is located in an edge region of the second surface to the thickness of the part of the N-type doped polycrystalline silicon layer that is located in the central region of the second surface is greater than or equal to 1 and is less than or equal to 1.2.

An acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support, an IDT electrode on the piezoelectric layer and including a pair of busbars and electrode fingers, and mass addition films on the electrode fingers. An acoustic reflection portion overlaps at least a portion of the IDT electrode. d / p is about 0.5 or smaller. A region in which adjacent electrode fingers overlap each other is a cross region including a central region, and first and second edge regions. At least a portion of the mass addition films overlap the central region. A width of at least one of the mass addition films is different from a width of other mass addition films.

A heavy-duty truck includes a cabin, a window having an upper edge region and a lower edge region, a hinge that rotatably couples the upper edge region of the window to the cabin, and a motor-driven actuator coupled to the lower edge region of the window such that actuation of the motor-driven actuator in a first direction moves the lower edge region of the window away from the cabin, thereby opening the window to an open position, and actuation of the motor-driven actuator in a second direction opposite to the first direction moves the lower edge region of the window toward the cabin, thereby closing the window to a closed position.

The invention relates to an angular, in particular rectangular, bursting disc (1) made of a sheet metal, with an edge region (11) with which the bursting disc (1) can be attached to an opening of a container or a pipe, and with a central region (12) with which the opening can be sealed up to a bursting pressure, and with predetermined breaking lines along which the bursting disc (1) tears open when the bursting pressure is reached, so that the central region (12) opens completely or partially, wherein the bursting disc (1) has a fold in the edge region (11) which has a first, folded part of the sheet metal and a second part of the sheet metal to which the folded part is parallel or predominantly parallel.

The embodiment of the invention provides a preparation method of a solar cell and the solar cell, and the method comprises the steps: firstly obtaining a substrate cell piece, forming a passive film layer on the substrate cell piece, then forming a grid line on the passive film layer, and then carrying out the sintering. When the grid line is subjected to laser scanning, reverse bias voltage is applied to the grid line, meanwhile, laser scanning is carried out from the middle area of the passive film layer to the edge area, and the laser power when laser scanning is carried out on the middle area is larger than the laser power when laser scanning is carried out on the edge area. When a passive film is formed, due to the influence of a winding plating phenomenon, the passive film has the characteristics that the middle is thin and the edge is thick. The laser power of the edge area is lower, so that the process strength of the edge area can be reduced, and the temperature generated by the edge area can be reduced. Compared with the prior art, the method has the advantages that the high-temperature phenomenon of the edge area can be relieved, the abnormal black edge phenomenon caused by high process strength at the edge is effectively reduced, and the product yield and quality are improved.

The invention discloses a method, a device and equipment for testing the uniformity of a light guide film, and the method comprises the steps: carrying out the dynamic temperature adjustment of the light guide film, and obtaining the multi-wavelength dynamic spectrum data of an edge region; nonlinear optical response characteristics are extracted; generating a dynamic optical characteristic diagram and performing three-dimensional structure analysis; calculating a thermo-optical coupling complexity index; generating dynamic change data of the optical performance of the edge region; and executing multi-dimensional evaluation index processing and time sequence analysis to obtain a dynamic accurate evaluation result. According to the technical scheme, the optical performance of the edge area of the light guide film can be accurately evaluated under the dynamic temperature condition, the influence of temperature change on the uniformity of the light guide film is effectively captured, the accuracy and practicability of a test result are improved, and a more reliable basis is provided for design optimization and quality control of the light guide film.

The invention provides a progressive addition lens design method based on free-form surface expression, is mainly used for vision correction of presbyopia groups, and belongs to the field of eye vision optical design. According to the design method, focal power matching and astigmatism minimization of the progressive multi-focus lens are achieved by optimizing the free-form surface, the design method constructs a nonlinear functional minimization problem by means of free-form surface expression, and meanwhile an optimized initial solution is obtained by solving a linear fourth-order partial differential equation related to a spherical base disturbance term; according to the method, astigmatism in an effective area of the lens can be minimized on the premise of realizing focal power matching as far as possible, high astigmatism areas on two sides of the progressive channel are transferred to an edge area of the lens, and various customization requirements including specific light adding degree, channel length, effective visual area range and the like can be met for a wearer.

The invention is suitable for the technical field of solar cells, and provides a back contact cell, a cell assembly and a photovoltaic system. The back contact battery comprises a silicon substrate and a plurality of fine grids arranged on the silicon substrate, the plurality of fine grids extend along a first direction and are arranged at intervals along a second direction, and the silicon substrate is provided with a first edge in the second direction; the silicon substrate comprises a first edge region, and the first edge region is an edge region close to the first edge; at least one fine grid located in the first edge area comprises a bent part, the maximum distance between the bent part and the first edge is larger than the distance between the fine grid and the first edge, and the bent part is located in the area, electrically connected with the welding strip, of the fine grid. According to the back contact battery, the battery assembly and the photovoltaic system provided by the invention, the welding tension of the fine grids in the first edge region can be improved, the current collection effect can also be improved, and the power generation efficiency of the battery is further improved.

An acoustic wave device includes a support, a piezoelectric layer on the support, an IDT electrode on the piezoelectric layer and including busbars and electrode fingers, and mass-added films on the electrode fingers. An acoustic reflection portion is provided in the support and overlaps at least a portion of the IDT electrode. d / p is about 0.5 or less. When viewed in an electrode finger orthogonal direction, a region in which the electrode fingers adjacent to each other overlap each other is an intersecting region including a central region, and first and second edge regions. At least a portion of the mass-added films overlaps the central region in plan view.

The invention discloses a manufacturing process of a circuit board structure of aviation equipment, which comprises the following steps of: providing a carbon fiber reinforced ceramic substrate, after desizing process treatment, coating high-temperature ceramic slurry on the carbon fiber reinforced ceramic substrate, forming a high-temperature-resistant base material layer through vacuum drying, coating an electromagnetic shielding material on the surface of the base material layer, and forming the circuit board structure of the aviation equipment. Designing a circuit pattern, and transferring the circuit pattern to the electromagnetic shielding layer through a laser cutting or etching process to form a circuit layout; wiring the copper alloy film according to the circuit pattern, and combining the copper alloy film with the polymer composite material middle layer through a lamination process to form an electrical connection layer; coating the surface of the circuit board with a resin material, performing curing treatment, mounting a metal connecting piece in the edge area of the circuit board, performing connection in a crimping manner, then performing a 3D printing process, and printing connecting points on the surface of the circuit board; the circuit board provided by the invention has the advantages of high temperature resistance, electromagnetic interference resistance, support and excellent protection performance.

A flexible display device includes a supporting layer and a flexible display panel. The supporting layer has two non-folding regions and a folding region between the two non-folding regions. The folding region has a central region and two edge regions. Each of the edge regions is located between one of the two non-folding regions and the central region, and open porosities of the two edge regions are different from an open porosity of the central region. The flexible display panel is located on the supporting layer.

The invention relates to a cuboid membrane stack (9) for an air humidifier (1), which has a stacking direction (S) and four stacking sides (10) transverse to the stacking direction (S), wherein the membrane stack (9) has a vertical direction (Z) parallel to the stacking direction (S), a longitudinal direction (X) perpendicular to the vertical direction (Z), and a transverse direction (Y) perpendicular to both the vertical direction (Z) and the longitudinal direction (X), wherein the four stacking sides (10) form an air supply inlet (ZE) and an air supply outlet (ZA) facing away from each other in the longitudinal direction (X), and an exhaust air inlet (AE) and an exhaust air outlet (AA) facing away from each other in the transverse direction (Y), wherein the membrane stack (9) has several membranes (11) which, within the membrane stack (9), each form an air supply path (ZP) connecting the air supply inlet (ZE) to the air supply outlet (ZA), and an exhaust air path (AP). separate,which connects the exhaust air inlet (AE) with the exhaust air outlet (AA). Improved dimensional stability can be achieved by forming a membrane pair (18) with two membranes (11) that are adjacent in the stacking direction (S) and that define one of the supply air paths (ZP) in the stacking direction (S), by connecting the two membranes (11) of the respective membrane pair (18) airtightly to each other by an adhesive bond (21) in a first edge region (19) adjacent to the exhaust air inlet (AE) and in a second edge region (20) adjacent to the exhaust air outlet (AA), and by having the membrane stack (9) have several spacers (12) that are arranged in the stacking direction (S) between two immediately successive membrane pairs (18) and each of which rests against one of the membranes (11) of the two membrane pairs (18) and separates them from each other in the stacking direction (S), such thatthat the membranes (11) adjacent to and spaced apart from each other on the spacer (12) limit one of the exhaust air paths (AP) in the stacking direction (S).

The embodiment of the invention provides a wafer back alignment mark, a manufacturing method of the wafer back alignment mark, a wafer back cutting method, a wafer back photoetching method and a preparation method of a semiconductor device. The manufacturing method comprises the following steps: providing a wafer of which the front surface is provided with a tube core and a scribing channel; a blind hole array corresponding to the scribing channels is manufactured in the edge area of the front face of the wafer, and the hole depth of blind holes is larger than the first thickness; thinning the middle region of the back surface of the wafer, and manufacturing a metal layer in the thinned middle region of the back surface of the wafer; and grinding the edge area of the back surface of the wafer to enable the blind hole array in the edge area to be completely exposed, and forming a wafer back surface alignment mark which is displayed on the back surface of the wafer and can be used for scribing or photoetching the back surface of the wafer. By means of the manufactured wafer back face alignment mark, processes including wafer back face cutting or wafer back face photoetching and the like can be executed on the back face of the wafer, and the problem that effective wafer back face alignment marks are lacked when related manufacturing processes are carried out on the back face of the wafer in the related technology is solved.

The invention discloses an image processing method. The method comprises the following steps: acquiring a to-be-processed image and a target specification parameter; edge region expansion is carried out on the to-be-processed image, a first image conforming to the target specification parameter is obtained, and the first image comprises the to-be-processed image and an expanded edge region; the first image and image generation prompt information are input into an image expansion model, the image expansion model generates image content for the edge area based on the to-be-processed image, the image generation prompt information comprises positive prompt information and negative prompt information, and the process of generating the image content for the edge area by the image expansion model comprises N rounds of iterative computation, in the latter N-p rounds of iterative computation of the N rounds of iterative computation, the image expansion model predicts an image generation result based on the forward prompt information; and obtaining a target image matched with the target specification parameter according to the to-be-processed image and target image content generated by the image expansion model. By using the scheme, the efficiency of converting the to-be-processed image into the target image can be improved.

The invention relates to an image processing method suitable for a variable-size TFT display screen, and the method comprises the following steps: obtaining the size and range of a display region of the TFT display screen in real time, and obtaining the position coordinate range of an edge region of an optical alignment film; detecting the pixel brightness in the coordinate range of the corresponding position of the edge area of the optical alignment film by adopting an image processing method; calculating to obtain compensation curve correction parameters by combining factors influencing the brightness distribution of the edge area; correcting the pixel brightness of the edge area of the optical alignment film by adopting the compensated brightness distribution curve; after the pixel brightness compensation of the edge area is completed, obtaining a change value of the display contrast before and after the compensation; and the compensation curve parameters of the edge region are adjusted in real time by analyzing the relationship between the change value of the display contrast and the pixel brightness compensation intensity. The brightness uniformity of the edge area of the TFT display screen can be effectively improved, the overall display quality is improved, the requirements of display screens of different sizes can be met, and high practicability and adaptability are achieved.

The invention relates to the technical field of semiconductor detection, and discloses a digital detection system and method for a wafer ultrasonic field, and the method comprises the steps: configuring an acoustic topological insulator coupling system, and constructing a non-scattering sound wave transmission channel; a heterogeneous metasurface sound field regulation and control system is constructed, and depth dimension information is obtained; applying an acoustic holographic compensation algorithm to eliminate imaging distortion of the bending area, and outputting compensated sound field distribution; executing a phase recovery and annular reconstruction algorithm to realize high-quality three-dimensional imaging of the marginal region; a self-adaptive coupling adjustment system is realized, and the characteristics of a coupling material are automatically adjusted according to the edge reflection signal quality monitored in real time; the non-scattering sound wave transmission channel is constructed through the acoustic topological insulator coupling system, the problem of serious sound wave scattering in the edge area is effectively solved, the detection sensitivity of the wafer edge area is improved, the defect omission ratio is reduced compared with a traditional method, and the wafer detection integrity is improved.

The invention relates to the technical field of resolution improvement, in particular to a video definition improvement method and system.According to the video definition improvement method and system, through window accumulation of adjacent frame gray difference and coordinate difference, minimum displacement is selected, mapping is updated, boundary neighborhood weighted correction is carried out, cross-frame dislocation is reduced, and motion area connection is guaranteed; capturing a three-frame gray scale sequence to calculate a difference value, writing a replacement value according to a monotone and amplitude condition, inputting the replacement value and an alignment frame difference into Fourier transform, decomposing amplitude and phase distribution in a residual field in a frequency domain, and performing amplitude and phase consistency elimination on an abnormal block during frame-by-frame superposition to obtain an abnormal block; row difference and column difference absolute values of neighborhood blocks in the residual iteration texture matrix are accumulated into energy, the energy and a center difference are combined with a threshold value to output a mark, and a texture region and an edge region are distinguished; the brightness of the low-frequency position is updated according to the weight mean value, the maximum difference and the direction difference are combined for the high-frequency position, the edge gradient is extracted through the convolutional neural network, a correction value is generated, edge steps and fuzziness are suppressed, and high-frequency details are continuously kept.

The invention discloses a peripheral visual area out-of-focus imaging system with variable out-of-focus amount. The peripheral visual area out-of-focus imaging system is composed of a zoom reflector and a spectroscope. The zoom reflector is located right above an observed object, and the side, provided with the microstructure array, of the zoom reflector faces the observed object; the spectroscope is positioned between the zoom reflector and an observed object, and is inclined at a certain angle relative to the vertical direction; the surface, provided with the microstructure array, of the zoom reflector comprises two regions, namely a central region S1 and a peripheral edge region S2, the S1 region is composed of a concentric ring microstructure array with the equivalent focal length F1, the S2 region is composed of concentric ring microstructures with the equivalent focal lengths F1 and Fv which are alternately arranged, the centers of concentric rings of the S1 region and the S2 region coincide, and the center of the concentric ring microstructures of the S1 region and the center of the concentric ring microstructures of the Fv region coincide with the center of the concentric ring microstructures of the S2 region. And the microstructure is an edge tooth structure in circular ring distribution. The micro-structure array is adopted, the defocusing amount can be freely controlled through the structure parameters of the micro-structure array capable of being flexibly regulated and controlled, a defocusing image with the variable defocusing amount and uniform brightness is achieved, and therefore the good myopia prevention and control effect is achieved.

An acoustic wave device, a radio frequency filter and an electronics module are provided. The acoustic wave device, comprises a layer of piezoelectric material, a pair of interdigital transducer electrodes disposed on an upper surface of the layer of piezoelectric material, each interdigital transducer electrode including a bus bar and a plurality of electrode fingers extending from the bus bar through a central region of the interdigital transducer electrode towards an edge region of the interdigital transducer electrode, each of the plurality of electrode fingers having a width in a direction perpendicular to the extension of the electrode fingers that is smaller in the edge regions than in the central regions, and trench portions located in the upper surface of the layer of piezoelectric material, the trench portions overlapping with the edge regions of the interdigital transducer electrodes. The acoustic wave device provides effective suppression of transverse modes.

The invention discloses a processing method related to abutted seam Mura patterns. The method comprises the steps that a to-be-printed pattern is divided into at least two printing partitions; wherein one printing subarea is a corresponding area, printed on the substrate at a time, of the nozzle module, and the at least two printing subareas comprise the first printing subarea and the second printing subarea; printing operation is executed on the edge area according to a preset first proportion and a preset second proportion; wherein the edge area is an adjacent area of the first printing subarea and the second printing subarea, the edge area comprises a first edge area and a second edge area, and the preset first proportion is the proportion of ink droplets printed by the spray head module for the first time to ink droplets to be printed in the first edge area, and the preset second proportion is the proportion of ink droplets printed by the spray head module for the second time to ink droplets to be printed in the second edge area. The preset second proportion is the proportion of ink droplets printed by the nozzle module for the second time to ink droplets to be printed in the second edge area. According to the method and the device, abutted seam Mura patterns between two adjacent pass can be reduced.

The invention provides a deviation defect detection method and device, electronic equipment and a storage medium, and the method comprises the steps: obtaining a pre-labeled defect image, obtaining a training set, processing the defect image, obtaining processing data, optimizing an initial loss function of a pre-constructed initial segmentation model through the processing data, and obtaining a deviation defect detection result. Obtaining a target loss function, and training the initial segmentation model to obtain a target segmentation model; inputting a to-be-detected image into the target segmentation model to obtain edge positions of a part area of the to-be-detected part and a reference area of the to-be-detected part; and determining whether the to-be-detected part has the deviation defect or not based on the part area of the to-be-detected part and the edge position of the reference area of the to-be-detected part. According to the method, the loss function of the existing segmentation model is updated to obtain the target segmentation model, so that the target segmentation model can be used for accurately extracting and segmenting the edge region of the product, and the accuracy of detecting the deviation defect is improved.

A grommet apparatus for cable passage is provided at a component opening. It includes a radially circumferential connecting portion for connecting the grommet apparatus to an edge region of a component opening in an assembly direction and a cable passage portion.

The invention relates to a SiC crystal ingot facet detection method based on Raman combined with resistivity detection, which comprises the following steps: S1, providing a silicon carbide workpiece, acquiring resistivity rho k of different detection areas on the surface layer of the workpiece based on a preset resistivity detection scanning path, and further preliminarily screening out resistivity abnormal areas; s2, on the basis of a preset Raman detection scanning path, obtaining the edge area on the surface layer of the workpiece, the Raman characteristic peak frequency omega ij of different detection points of the resistivity abnormal area obtained in the S1, a detection image, and an XY coordinate position on an XY plane perpendicular to the height direction of the workpiece; and S3, based on a preset n-rho inverse proportion function model of the doping concentration n and the resistivity rho, and a delta omega-n linear model of the Raman frequency shift delta omega and the doping concentration n, determining and associating the XY coordinate positions of the S2 and the corresponding resistivity rho ij, and constructing a resistivity distribution diagram of the surface layer of the workpiece. The method has the advantages of small detection error and short detection time.

Disclosed herein in is an absorbent pet pad having erectable edges that define a central region where pet waste in confined. An exemplary embodiment comprises a non-rigid absorbent central region surrounded by edge region. The edge region can be erected to an erected angle, forming a substantially vertical border surrounding the pad. The border serves to retain pet waste, and to urge a pet, instinctively, to locate itself entirely on the pad when expelling waste. The erected angle forming the border may be established and maintained with edge attachment features. The erected edge region may be especially rigid owing to a folded A-shaped cross section.

A method for producing spectacles lenses (10), in which method, starting with a blank which has predetermined surface geometries on a front face (12) and a rear face (14) remote therefrom and having a contoured edge (16) therebetween, a finished part is formed by material removal and / or deposition. In a step of generating an optically active shape of the spectacles lens, the semifinished product is shaped, which has an edge region (18) in which an orientation structure (20) is also made. For at least one subsequent step of further machining, the location and position of the semifinished product in space are clearly identified and established with the aid of a positioning receptacle (22) arranged in a defined manner in space.