4465 results about "Board structure" patented technology

A LED-based replacement light for a fluorescent socket is constructed such that a tubular housing has a D-shaped cross section with a flat base with opposing longitudinal edges, opposing sides extending generally perpendicular to the flat base from the opposing longitudinal edges, and a curved surface spanning the opposing sides opposite the flat base. A circuit board structure defines a LED-mounting side with multiple LEDs mounted on the LED-mounting side at predetermined intervals along a length of the circuit board, with at least areas of a primary heat transferring side directly underlying the respective LEDs in thermally conductive relation with the tubular housing for highly electrically insulated thermal transmission of heat generated by the multiple LEDs from the circuit board to an ambient environment surrounding an exterior of the tubular housing. At least one electrical connector is at a longitudinal end of the housing in electrical communication with the circuit board.

A printed circuit board structure for a scope unit of an electronic endoscope system, which is provided with a first printed circuit board formed with a first circuit section, and a second printed circuit board formed with a second circuit section. The first printed circuit board is piled on the second printed circuit board. The second printed circuit board having an area covered with the first printed circuit board and at least one area which is not covered with the first circuit board. The at least one area is used for electrically connecting the second circuit section with an electrical unit other than the second circuit section.

A printed circuit board structure for a scope unit of an electronic endoscope system, which is provided with a first printed circuit board formed with a first circuit section, and a second printed circuit board formed with a second circuit section. The first printed circuit board is piled on the second printed circuit board. The second printed circuit board having an area covered with the first printed circuit board and at least one area which is not covered with the first circuit board. The at least one area is used for electrically connecting the second circuit section with an electrical unit other than the second circuit section.

The present invention discloses one kind of combined beam of laminated steel-concrete plate for highway bridge and building as support member of bridge and building. Shear resistant connecting parts are welded to steel beam, prefabricated solid or hollow reinforced concrete boards are set on the steel beam, the steel bar tails are crossed and welded together, and the post-deposited concrete is deposited to form the combined beam. The combined beam has the advantages similar to those of in-situ deposited combined beam as well as saving in formwork and formwork supported step, simple prefabricated board structure, fast construction speed, etc. The present invention has wide application foreground in bridge structure and building structure fields.

A seal plate assembly is provided in a rotor disc for a turbine engine. The seal plate assembly includes a radially extending flange on the disc and an annular groove defined between a radial surface on the flange and a face of the disc. An annular outer surface extends axially in facing relationship to an annular inner surface of the groove. A plate structure is supported between the inner and outer surfaces, and a lock structure is provided for holding the plate structure in place. The lock structure includes an axial leg that is adapted to be located between an inner edge of the plate structure and the inner surface of the groove, and the lock structure further includes a radial leg that is adapted to be located between the radial surface on the flange and an outwardly facing surface of the plate structure.

A hinge mechanism 29 that rotatably provides a luggage board 27 and an auxiliary board 28 continuously with each other while interposing an integral hinge 13 therebetween, in which a space portion S is provided between mutually opposite end surfaces 20 and 21 of the luggage board 27 and the auxiliary board 28, wherein a restoring force generation portion 30a of a spring member 30 is housed in the space portion S, and in addition, both end portions 31 and 32 of the spring member 30 are fixed to the luggage board 27 and the auxiliary board 28, respectively.

Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and / or power planes.

Provided is a printed wiring board formed with a through-hole into which a press-fit pin is press-fitted. The printed wiring board includes at least one signal transmission layer, a signal transmission wiring pattern formed in the signal transmission layer, and an electrode portion of the signal transmission wiring pattern exposed at an inner circumferential surface of the through-hole. The electrode portion is not formed covering the entire inner circumferential surface of the through-hole but at a part of the inner circumferential surface of the through-hole.

A circuit board structure and a method for fabricating the same are proposed. A substrate with a first circuit layer formed on at least one surface thereof is provided. A dielectric layer is formed on the surface of the substrate, and a plurality of first and second openings are formed in the dielectric layer, wherein the second openings expose electrical connection pads of the first circuit layer. A metal layer is formed on the surface of the dielectric layer and in the first and second openings. By removing the metal layer on the surface of the dielectric layer, a second circuit layer is formed in the second openings, and a conductive structure is formed in the second openings for electrical connection with the first circuit layer. The present invention improves the bonding strength between the circuit layer and the dielectric layer, and the ability of fabricating fine circuits.

Significant advances in semiconductor microelectronics technologies have resulted in greatly enhanced chip performance. Systems studies have continuously shown that on-board interconnects between chips are the bottleneck in achieving board level performance that is comparable with this chip performance. This invention provides a multiple-layer photonic-electronic circuit board family that solves this interconnect performance problem. Multiple layers of patterned optical channel waveguides and patterned electrical conductors co-exist in a single circuit board structure, with optical vias to transport light between different photonics layers and electrical vias to transport electrical signals and power between different electronics layers. An all-lithographic fabrication technology is used to build the entire board structure with mutually compatible planar processing steps. Novel techniques are used to produce channel optical waveguides connected to in-plane 45 degree turning mirrors and channel optical waveguides connected to optical vias with out-of-plane 45 degree turning mirrors. The mirrors can have either total internal reflection or metallized facets.

The invention provides a method and a device for folding and flexibly positioning a body wallboard. Due to the method and the tool for folding and flexibly positioning the body wallboard, lots of special clamping boards are not needed and good flexibility is achieved; a positioner clamping mechanism can be adsorbed on a positioning support surface of the wallboard, so that six-freedom-degree and multi-pose regulation of the body wallboard can be achieved; laser trackers distributed on a first layer of working table, a second layer of working table and a third layer of working table can feed back assembling information at real time, thus drastically improving assembly accuracy; the body wallboard is fixed by the adsorption positioning mechanism, thus being simple in assembly and disassembly, reducing manual operation and improving assembly efficiency; and in addition, the method and the device have good generality, so that the method and the device can be suitable for folding process of body wallboard structures with different sizes and satisfy folding requirement of various body wallboards.

The invention discloses a visual measuring and control device for vibration of a piezoelectric flexible board structure. In order to detect the bending and twisting vibration of a flexible board, a charge coupled device (CCD) camera is arranged in front of the free end of the flexible board, an optical axis of the camera is ensured to be vertical to the free end surface in the static state, and in addition, a region of interest (ROI) of the free end edge is always in the camera view field range during the vibration. The CCD camera measures each frame of image of the edge vibration, a computer processes the detected image sequence, the free end surface edge is extracted, and the suggested algorithm is adopted for obtaining parameters for reflecting low-frequency bending and twisting vibration of the flexible board structure. Piezoelectric chips are symmetrically arranged at both sides of the flexible board to be used as drivers capable of obtaining the bending and twisting vibration of the flexible board in a mode of reasonably combining the piezoelectric sheets and exerting the voltage. The bending and twisting vibration signals measured in a visual are respectively fed back for controlling the vibration of the flexible board after being processed.

A method is disclosed utilizing off the shelf constant cross section thickness sandwich panels comprised of Fiber Reinforced Thermoplastic (FRTP) resin skins and low density thermoplastic (TP) core material wherein the steps of selectively and controllably exposing the panels to heat and incrementally thermoforming the skin-core into a consolidated composite edge or intra-panel area in consideration of subsequent mating and attachment of the FRTP sandwich panel to other structures is achieved. The exact configuration of articles so thermoformed is design optimized to overcome manufacturing, assembly, weight, in-service and structural performance shortcomings of prior art and FRP sandwich panel structures. Further disclosed is an improved, load-bearing, modular design container structure assembled from such thermoformed FRTP sandwich panels in which is utilized the unique core-skin edge configuration of the present invention in consideration of improved: load bearing performance, useful load volume, reduced manufacturing costs, structural weight savings, impact and damage tolerance and repair and replace issues.

Through enlarging contact area between transparent pixel electrode and drain electrode of thin film transistor (TFT), structure of array base plate (ABP) of TFT LCD form favorable connection. The method for preparing ABP of TFT LCD includes three steps of photoetching technology with masks: first, using first ordinary mask defines pattern of first layer of metal thin film so as to form grid scan lines, and grid electrode; then, using second mask i.e. graytone, semitransparent mask defines patterns of second layer of metal thin film and active layer to form channels of data scan lines, silicon island, source / drain electrodes and TFT; finally, using third ordinary mask defines second layer of insulation film i.e. pattern of passive film, and using lift off stripping technique forms patterns of transparent conductive film, i.e. transparent pixel electrodes. The invention reduces number of mask, and number of photoetching process, and simplifies procedure for preparing ABP of TFT LCD.

The invention presents a new design of C7 or C9 type LED bulb and its embedded PCB electronic circuit board structure, comprising a lamp cover, LEDs, a PCB circuit board and a base. The bulb houses one or multiple number of LEDs. The LEDs are soldered on the PCB board that is embedded inside of the base. The PCB board power input ports connect to the brass base or are directly wired to outside the base. The base and the lamp cover may be attached together by means of bonding (thermal, sonic or solvent), friction interference fit, adhesive or simply by screwing the lamp cover into the threaded base. The PCB board, utilizing a bridge design, allows the LED bulb to be directly powered by 110-120V AC voltage power sources. The simple bulb design significantly reduces the weight of the entire product and power consumption.

This invention discloses one TFT LCD array base board structure, which comprises glass base board to form film transistor array on glass baseboard; one coating layer forming between glass base board and film transistor array with film layer as polyimide film. This invention also discloses one process method, which comprises the following steps: firstly providing one glass baseboard; then sticking polyimide film on glass baseboard; finally processing film transducer array on the polyimide film surface.

Methods, systems, and apparatuses for electrical connections through circuit boards are described. A via-in-via structure in a circuit board provides two electrical signal paths. The circuit board includes a dielectric layer having opposing first and second planar surfaces. A first opening extends through the dielectric layer. An electrically conductive coating coats a surface of the dielectric layer in the first opening. An electrically insulating material substantially fills the first opening. The circuit board includes a first additional dielectric layer attached to the first planar surface, and a second additional dielectric layer attached to the second planar surface. A second opening extends through the first additional dielectric layer, the electrically insulating material filling the first opening, and the second additional dielectric layer. An electrically conductive material coats a surface of the first additional dielectric layer, the electrically insulating material, and the second additional dielectric layer in the second opening.

Superconducting connections are provided to internal layers of a multi-layer circuit board structure, for example by superconducting vias.

The invention provides a flat double-face phase-change restraining heat conducting board structure and a manufacturing method thereof. The flat double-face phase-change restraining heat conducting board structure is a composite board type structure. The surface of the flat double-face phase-change restraining heat conducting board structure is a plane. Heat superconducting pipelines which are in a specific shape and are communicated with one another are arranged in the flat double-face phase-change restraining heat conducting board structure. The heat superconducting pipelines are closed pipelines and are filled with a heat conducting working medium. Groove channels communicated with one another are formed in the heat conducting board structure with the double faces being planes and the groove channels are filled with the heat conducting working medium and closed, so that the characteristics that the heat conducting speed is high and the temperature uniformity is good for phase-change restraining heat conduction are achieved. The double faces of the phase-change restraining heat conducting board structure are designed to be the planes so that the structure can be well combined with a high-power device and a cooling fin set, and application occasions and the range of a phase-change restraining heat conducting board can be expanded greatly. A blowing and expanding process is adopted to obtain the flat double-face board structure with the internal groove channels, and the structure has the characteristics of being low in cost, easy to machine and high in reliability.

A structure comprising a softwood-ceiling / hardwood-floor formed of a single set of adjacent boards. Each of the boards including a hardwood layer bonded to a softwood layer, the board having a first edge and a second edge, the first edge having a tongue, the second edge having a groove, the first edge having a first chamfer on the softwood layer, the second edge having a second chamfer on the softwood layer. All boards securely attached to carrying beams that span the walls between two levels within a building.

A circuit board structure with an embedded semiconductor chip and a fabrication method thereof are provided, including the steps of providing a semiconductor wafer having an active surface with a plurality of electrode pads, a connection metal layer formed on the electrode pads: forming a protective layer on the connection metal layer and the semiconductor wafer, performing a cutting process to form a plurality of semiconductor dies, providing a carrier board having at least on e cavity for receiving the semiconductor chip; and forming sequentially on the protective layer covering the semiconductor chip and the carrier board a dielectric layer and a circuit layer electrically connected to the connection metal layer of the semiconductor chip. The present invention is a simple, in process and low in process cost, due to the connection metal layer covered by the protective layer formed on the semiconductor chip protected from oxidation and contamination.

Ram seal units for attachment to the rams of blowout preventers incorporate an integral ram seal block having a central web, with a parallel rectangular elastomer support plates extending from opposite sides of the integral ram seal block. The central web is perforate to permit its interlocked relation with elastomer sealing material that is molded to ram seal block. The generally rectangular elastomer support plates define outer face surfaces that remain exposed after the molding operation has been completed. These outer face surfaces of the elastomer support plates are adapted to be disposed in intimate face-to-face relation with internal wall surfaces of ram seal receptacles that are provided within BOP ram elements. Each of the rectangular elastomer support plates defines a pair of spaced retainer receptacles which receive a respective retainer element of a BOP ram to secure the ram seal units in retained relation within one of the ram seal receptacles of a BOP ram element. When so supported, the elastomer sealing material located between the generally rectangular elastomer support plates and encapsulating the central web structure of each integral ram seal block, will be presented for sealing contact with its opposed counterpart of the opposed BOP ram element and with the wireline that is present within the body of the BOP unit.

A circuit board structure integrated with semiconductor chip and a method of fabricating the same are proposed. A supporting plate formed with at least one cavity is provided and a semiconductor chip having a plurality of conductive contacts is embedded in the cavity. An anisotropic conductive film (ACF) layer and a circuit board formed with a plurality of conductive contacts on a surface thereof are provided. The circuit board is pressed to the supporting plate by the ACF layer, wherein the conductive contacts of the circuit board are electrically connected to the conductive contacts of the chip via the ACF layer, so as to form the circuit board structure integrated with semiconductor chip.

A method for forming a circuit board structure of composite material is disclosed. First, a composite material structure including a substrate and a composite material dielectric layer is provided. The composite material dielectric layer includes a catalyst dielectric layer contacting the substrate and at least one sacrificial layer contacting the catalyst dielectric layer. The sacrificial layer is insoluble in water. Later, the composite material dielectric layer is patterned and simultaneously catalyst particles are activated. Then, a conductive layer is formed on the activated catalyst particles. Afterwards, at least one sacrificial layer is removed.