Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

164results about How to "High weight ratio" patented technology

Thermal management for a ruggedized electronics enclosure

The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate rigidly coupled to a structural foam layer for providing mechanical support and thermal dissipation for the electronic components. A fluid channel, rigidly coupled to the structural foam, is provided for directing a cooling fluid in the plane of the heat spreader and a bottom plate rigidly coupled to the structural foam to protect the electronic components against one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention relates to a ruggedized electronics enclosure for housing electronic components containing a top compartment configured to house the electronic components. The top compartment contains a first electronics layer and a second electronics layer adjacent to said first electronics layer and a cooling assembly, rigidly coupled to the top compartment. A thermal shunt is configured to channel heat from the first and second electronics layers to the cooling assembly and to provide additional mechanical support to protect against potentially destructive shock events.
Owner:THEMIS COMP

Adhesive with insulating and heat-conducting properties used at ultralow temperature

The invention relates to an adhesive with insulating and heat-conducting properties used at an ultralow temperature, the adhesive being a two-component adhesive obtained by mixing a mixture component A and a curing agent and conducting a curing reaction. Curing conditions of the curing reaction are heating the mixture at a temperature of 25 DEG C for 24 hours and then raising the temperature to 150 DEG C to heat for 6 hours. The mixture component A is a mixture obtained by uniformly mixing 100 parts by weight of epoxy resin, 6 parts by weight of silane coupling agent, and 100-1000 parts by weight of heat-conducting powder filler in a mechanical manner, wherein the heat-conducting powder filler is composed of 0-60 wt% of metallic heat-conducting powder and 40-100 wt% of nonmetallic heat-conducting powder. The adhesive of the invention has excellent insulating and heat-conducting properties at ultralow temperature, can overcome the disadvantages that existing heat-conducting adhesives can not be used at ultralow temperature and has bad heat conductivity at ultralow temperature, contains no diluents added during preparation and causes no pollution induced by micro-molecule volatilization in the cuing reaction.
Owner:TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products