6001results about "Chucks" patented technology

A tool attachment for mounting on a hand-held machine tool provided with a tool holder, the tool attachment having an output shaft and a base body at whose outer circumference a locking sleeve is disposed in a manner allowing it to rotate to release at least one assigned locking element; at the outer circumference of the base body, an anti-rotation unit is formed for the twist-proof mounting of the base body on a fastening unit assigned to the hand-held machine tool; on the anti-rotation unit and at an inner circumference of the fastening unit, complementary geometrical forms are provided which are configured to mesh with each other for the releasable, twist-proof mounting of the base body on the fastening unit.

Electronic device fabrication processes, apparatuses and systems for flowable gap fill or flowable deposition techniques are described. In some implementations, a semiconductor fabrication chamber is described which is configured to maintain a semiconductor wafer at a temperature near 0° C. while maintaining most other components within the fabrication chamber at temperatures on the order of 5-10° C. or higher than the wafer temperature.

A surgical device comprising an adapter assembly is disclosed. The adapter assembly selectively interconnects a loading unit and a device housing, and includes at least one drive converter assembly for interconnecting a rotatable drive shaft and an axially translatable drive member of the loading unit. The at least one drive converter assembly converts and transmits a rotation of the rotatable drive shaft to an axial translation of the axially translatable drive member of the loading unit. The at least one drive converter assembly includes a drive element, a drive nut, and a distal drive member. The drive element defines a longitudinal axis. The drive nut is disposed about the longitudinal axis, and the distal drive member is disposed along the longitudinal axis.

A wafer pedestal of a semiconductor apparatus is provided. The wafer pedestal is capable of supporting a substrate. The wafer pedestal includes a pedestal having at least one purge opening configured to flow a purge gas and at least one chucking opening configured to chuck the substrate over the pedestal. The pedestal includes a sealing band disposed between the at least one purge opening and the at least one chucking opening. The sealing band is configured to support the substrate.

A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.

A plurality of protruded portions is formed through embossing and is distributed and arranged regularly or irregularly on an electrostatic chuck surface, and has a circular or almost circular top surface shape and a roundness (R) of 0.01 mm or more is applied to an edge part defined by an intersection of the top surface and a side surface and a portion to which the roundness is applied occupies a quarter of a height h of the protruded portion or more.

A holder for a bit is disclosed. The bit may include a first locking element. The holder may include a housing; a base assembly including a first hole; a second locking element partially disposed within the first hole and configured to move between a locking position in which the second locking element engages the first locking element to prevent removal of the bit, and an unlocking position in which the second locking element is spaced from the first locking element allowing the bit to be removed; and a follower assembly contained within the housing and configured to move relative to the housing and base assembly between a first position in which the follower assembly supports the second locking element in the locking position, and a second position in which the follower assembly allows the second locking element to move from the locking position to the unlocking position.

A modular lift-pin assembly includes a lift-pin having a distal end, a connector, and an actuator pin. The connector includes an actuator end having a plurality of catch fingers disposed around the actuator end. Each of the plurality of catch fingers includes a lip extending radially inwards. A lift-pin end is coupled to the distal end of the lift-pin, and the actuator pin is coupled to the actuator end of the connector.

A substrate supporting structure (50) for semiconductor processing, comprising a mounting table (51) for placing a processed substrate (W) disposed in a processing chamber (20), wherein temperature control spaces (507) for storing the fluid used as a heat exchange medium are formed in the mounting table (51), a conductive transmission path (502) is disposed to lead a high frequency power to the mounting table (51), and flow channels (505, 506) feeding or discharging the heat exchange medium fluid to or from the temperature control spaces (507) are formed in the transmission path (502).

A vacuum chuck having a body portion made of moldable glass or another suitable dielectric material including a top surface and bottom surface, a series of flat lands on the top surface of the body portion for supporting a wafer, and a series of orifices and vacuum lines for drawing a vacuum to secure the wafer in place on the lands of the body portion. A method of manufacturing such a vacuum chuck. A method of aligning a wafer on such a vacuum chuck.

A pedestal assembly and method for controlling temperature of a substrate during processing is provided. In one embodiment, the pedestal assembly includes a support member that is coupled to a base by a material layer. The material layer has at least two regions having different coefficients of thermal conductivity. In another embodiment, the support member is an electrostatic chuck. In further embodiments, a pedestal assembly has channels formed between the base and support member for providing cooling gas in proximity to the material layer to further control heat transfer between the support member and the base, thereby controlling the temperature profile of a substrate disposed on the support member.

A medical instrument has an instrument insert and an instrument handle, which are detachably connected to one another. An actuation rod of the instrument insert is releasably connectable to a movable grip of the instrument handle via a locking connection. A blocking element is provided which blocks the movable grip when the actuation rod has been released.

Embodiments of the present invention provide electrostatic chucks for operating at elevated temperatures. One embodiment of the present invention provides a dielectric chuck body for an electrostatic chuck. The dielectric chuck body includes a substrate supporting plate having a top surface for receiving a substrate and a back surface opposing the top surface, an electrode embedded in the substrate supporting plate, and a shaft having a first end attached to the back surface of the substrate supporting plate and a second end opposing the first end. The second end is configured to contact a cooling base and provide temperature control to the substrate supporting plate. The shaft is hollow having a sidewall enclosing a central opening, and two or more channels formed through the sidewall and extending from the first end to the second end.

A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.

A pedestal assembly and method for controlling temperature of a substrate during processing is provided. In one embodiment, the pedestal assembly includes an electrostatic chuck coupled to a metallic base. The electrostatic chuck includes at least one chucking electrode and metallic base includes at least two fluidly isolated conduit loops disposed therein. In another embodiment, the pedestal assembly includes a support member that is coupled to a base by a material layer. The material layer has at least two regions having different coefficients of thermal conductivity. In another embodiment, the support member is an electrostatic chuck. In further embodiments, a pedestal assembly has channels formed between the base and support member for providing cooling gas in proximity to the material layer to further control heat transfer between the support member and the base, thereby controlling the temperature profile of a substrate disposed on the support member.

The present invention is directed at a handheld power tool comprising means for receiving a tool accessory; means for rotating said tool accessory; and at least one quick connect means for use with power tool attachments.

A tool for gripping and removing mechanical fasteners such as pedicle screws. With reference to FIG. 7, the device generally resembles a screwdriver, having a handle on one end, a long shaft in the middle, and fastener engaging means on the other end. The fastener engaging means comprises a set of two or more jaws having inward facing gripping surfaces positioned to grasp the external surfaces of a screw head. The jaws are formed as part of a collet slidably mounted within an outer thread sleeve. The thread sleeve is attached to the shaft. A tapered journal on the collet interacts with a tapered bore in the thread sleeve so that when the collet is pulled into the thread sleeve, the set of two or more jaws are squeezed together. The threaded engagements between the collet and the thread sleeve should be the reverse of the thread on the screw to be removed; i.e., if a right-hand screw is to be removed then the threaded engagement between the collet and the thread sleeve should be made with a left-hand thread. In operation, the jaws are placed over the screw head and the device is rotated in a counterclockwise direction (for removal of a screw with a right-hand thread). The inward facing surfaces on the jaws bear against the bolt head, thereby impeding the rotation of the collet relative to the thread sleeve. The left-hand threaded engagement between the collet and the thread sleeve therefore pulls the collet further into the thread sleeve, whereupon the tapered bore squeezes the jaws more tightly together. Thus, the reader will appreciate, applying torque to the device when it is in position on a screw head simultaneously torques the screw head and squeezes the jaws more tightly together. The inward facing surfaces are also provided with an undercut in order to accommodate axial misalignment between the jaws and the screw head.

A power tool having a receptacle for securing a tool to a drive shaft thereof is disclosed. The receptacle comprises a receiving opening, preferably being arranged on the tool. The receiving opening engages a securing section preferably being provided in a raised fashion on the drive shaft of the power tool, thereby effecting a positive fit. The securing section comprises a plurality of rounded tips arranged at even radial distances from said longitudinal axis, at angular intervals between each other, each rounded tip having a pair of lateral flanks extending from a common apex toward an intermediate section connecting lateral flanks of a pair of adjacent rounded tips. Preferably the receiving opening comprises a number of rounded tips which is twice the number of rounded tips provided on the raised section.

A surgical tool system with a handpiece and a cutting accessory that has inner and outer hubs. The handpiece has a spring biased lock ring that abuts a complementary stop member integral with the accessory outer hub to hold the accessory to the handpiece. An RFID chip is disposed against an inner wall of the accessory outer hub. An elastomeric seal pressed against the inner wall of the accessory outer hub provides environmental protection for the RFID chip. The seal has a rib that extends around the outer perimeter of the proximal end of the outer hub so as to form a seal between the accessory and an adjacent inner wall of the handpiece. Stop tabs extend inwardly from the seal to prevent the drive hub disposed inside the outer hub from falling out.

A surgical instrument for the dissection of bone and other tissue includes a spindle, a dissection tool and a male member carried by the spindle. The spindle includes a cavity. The dissection tool is releasably received in the cavity. The dissection tool extends along an axis and includes a first end and a second end with the first end having a cutting element and a second end having a generally cylindrical cross-section and a centrally located aperture partially extending along the axis. The male member is carried by the spindle and extends into the aperture of the dissection tool. The cavity may define a drive portion and a tool receiving aperture. One or more alignment projections may extend from the drive portion into the tool receiving aperture.

A locking instrument assembly for use in conjunction with an intramedullary device is disclosed. The locking instrument assembly includes an inner collet, an outer body, and a knob. The inner collet has a collar and a fastener member. The knob engages the fastener member to press the outer body against the collar. As the knob mates with the fastener member, the collar applies a clamping force to the intramedullary device.

A surgical handpiece with a rotating spindle for receiving the coupling head of a surgical attachment or a cutting accessory. A gear train has plural drive heads that simultaneously rotate at different speeds. A clutch assembly has pins that move along the length of the spindle. The clutch assembly sets the position of the pins so they will engage one of the drive heads. The spindle rotates with the drive head with which the clutch pins are engaged.

An adapter is disclosed for mounting a tool on an oscillating drive having a drive shaft that can be driven to oscillate about its longitudinal axis, wherein the adapter is passed by a central opening, and has at its drive end at least one positive-locking element for positive connection with the tool, the positive-locking element having the shape of a regular polygon, or a plurality of positive-locking elements arranged on a circle concentric to the center axis, or a plurality of outwardly extending convex projections having rounded tips and being connected with neighboring projections via rounded concave lateral flanks, wherein the positive-locking elements on the drive end are configured for positive-locking connection with a matching positive-locking counter-element on the drive shaft, and wherein the adapter has a second receptacle on its tool end for effecting connection with a tool having a shape different from the first receptacle and being configured as a circle, or as a plurality of positive-locking elements arranged along a circle concentric to the center axis, or as plurality of outwardly extending convex projections with rounded tips and being connected with neighboring projections via rounded concave lateral flanks.

A “snap-in” bit chuck assembly for a rotary hand or powered tool, includes a body having a hex shank at its rearward end and a retraction collar slidably disposed on the body. The body has a coaxial hex socket formed therein to allow a tool bit to be inserted thereinto. A coil spring biases the retraction collar forwardly and biases a retaining clip toward the bottom of an angular slot formed in the body. The bit is removed by sliding the retraction collar rearwardly, to compress the coil spring and allow the retaining clip to retract back up the slot. The bit is biased out of a locked position by a plunger that ensures that the bit remains disengaged when the retraction collar is released.

An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.