A pedestal
assembly and method for controlling temperature of a substrate during
processing is provided. In one embodiment, the pedestal
assembly includes an electrostatic chuck coupled to a metallic base. The electrostatic chuck includes at least one chucking
electrode and metallic base includes at least two fluidly isolated conduit loops disposed therein. In another embodiment, the pedestal
assembly includes a support member that is coupled to a base by a material layer. The material layer has at least two regions having different coefficients of
thermal conductivity. In another embodiment, the support member is an electrostatic chuck. In further embodiments, a pedestal assembly has channels formed between the base and support member for providing cooling gas in proximity to the material layer to further control
heat transfer between the support member and the base, thereby controlling the temperature profile of a substrate disposed on the support member.