87results about How to "Avoid contact failure" patented technology

The light emitting diode lighting apparatus includes: a tubular cover; a cap portion which is coupled to an end of a longitudinal direction of the cover; and a light emitting diode module which is coupled to the cap portion and is disposed within the cover. The cap portion includes: a cap which is coupled with the cover and is provided with a coupling portion therein; and a contact terminal which is coupled to the coupling portion to directly contact the light emitting diode module and elastically supports the light emitting diode module.

An electronic cigarette includes a mouthpiece, an atomizer assembly, a first connecting assembly, a second connecting assembly, and a power assembly. The atomizer assembly is received in the first housing of the mouthpiece, which includes a liquid reservoir and a heating element. The first connecting assembly includes a first conductive tube, a second conductive tube, and a first sleeve. The first sleeve includes an insulation tube, a convex ring, and a connecting portion. The insulation tube is disposed between the first conductive tube and the second conductive tube; the convex ring is sleeved on the second conductive tube and fixed to the first housing; the connecting portion extends through the second conductive tube and interconnects the insulation tube and the convex ring. The second connecting assembly includes a second sleeve and a flexible conductive ring. The power assembly includes a second housing fixed to the first housing and a battery.

A MIS transistor includes a gate electrode portion, insulating sidewalls formed on side surfaces of the gate electrode portion, source / drain regions and a stress film formed so as to cover the gate electrode portion and the source / drain regions. A height of an upper surface of the gate electrode portion is smaller than a height of an upper edge of each of the insulating sidewalls. A thickness of first part of the stress film located on the gate electrode portion is larger than a thickness of second part of the stress film located on the source / drain regions.

A flat panel display includes a substrate having a pixel region and a non-pixel region, the substrate having a transistor in the pixel region and a pad in the non-pixel region, a first planarizing layer in the pixel region covering the transistor and including a via hole exposing a portion of the transistor, and a second planarizing layer in the non-pixel region and having a pad contact hole opening the pad, the second planarizing layer being thinner than the first planarizing layer.

A wafer holder hardly deformable under high load and capable of effectively preventing a contact failure with a wafer and further capable of preventing temperature increase of a driving system of a wafer prober is provided. In a wafer holder having a chuck top and a supporter, variation in thickness of the chuck top from a wafer-mounting surface to a contact surface with the supporter, and variation in thickness of the supporter from a bottom surface to a contact surface with the chuck top are both set to at most 50 μm. When the supporter is of a structure having a circular tube portion and a base portion separate from each other, variation in thickness of the circular tube portion from a contact surface with the chuck top to a contact surface with the base portion, and variation in thickness of the base portion from a bottom surface to a contact surface with the circular tube portion are preferably both set to at most 25 μm.

After an insulation layer is formed on a substrate, a contact hole is formed through the insulation layer. A recessed plug is formed to partially fill up the contact hole. The recessed plug has a height substantially smaller than a depth of the contact hole. A metal wiring structure is formed on the recessed plug and on the insulation layer. A lower portion of the metal wiring structure, formed within the contact hole, prevents damage to the recessed plug during an etching process for forming the metal wiring structure. Therefore, the recessed plug may be formed without damage thereof even if an alignment error occurs between an etching mask and the recessed plug during metal wiring structure formation.

There is disclosed a wiringboard comprising a core substrate 110, a build-up layer 130a formed on at least one side of main surfaces the core substrate, wherein a cavity 120 for accommodating a chip-type decoupling capacitor 121 is formed in the build-up layer 130a. The capacitor 121 includes electrode terminals on an upper surface thereof that are directly connected to a semiconductor component, and electrode terminals on a back surface of the capacitor 121 is connected to a wiring conductor layer 132a on a bottom surface of the cavity 120. This structure enables decoupling capacitor and the semiconductor component 260 to be connected with low resistance and low inductance.

Disclosed are a display device and a method of manufacturing the same. In the disclosed display device, a pad cover electrode disposed on a pad area comes into contact with an upper surface and a side surface of a pad electrode since a planarization layer is disposed on an active area excluding the pad area, which may prevent contact failure between the pad cover electrode and a conductive ball. In addition, in the display device, a first electrode, which is connected to a thin film transistor via a pixel connection electrode, is formed via the same mask process as the planarization layer so that it has a line width similar to that of the planarization layer and overlaps the planarization layer, which may simplify a structure and a manufacturing process.

A fuse holder component includes a bottom plate fixed to a printed board, and first and second side plates whose main body portions individually extend from side edges of the bottom plate. The second side plate includes a suction portion extending through an extension portion from the main body portion and provided with a suction surface to which a suction nozzle of a mounter is accessible. A pair of fuse holder components, surface-mounted on the printed board by using the mounter, constitute a fuse holder that stably holds a glass-tube fuse.

According to the present invention, there is provided a card adapter which is capable of preventing contact failure between a cover member and a ground terminal caused by the floating of the cover member when a card is inserted into a card inserting portion. A contacting surface 40 facing a back-end surface 1b of the card inserting portion 1a is provided on the ground terminal 12. A ground contacting portion 41 comprising a contacting portion 41a brought into contact with the contacting surface 40, a plate spring portion 41b extending in a widthwise direction of the card inserting portion 1a and bent in a lengthwise direction of the card inserting portion 1a, and a cantilever supporting portion 41c for supporting the plate spring portion 41b in a cantilever manner is formed in a bent portion 4a provided in a front-end portion of the cover member 4. In addition, in a lengthwise direction of the card inserting portion 1a, the contacting portion 41a of the ground contacting portion 41 is pressed against the contacting surface 40 of the ground terminal 12 to be brought into contact with each other through the elastic force of the plate spring portion 41b.

A touch screen panel is provided. The touch screen panel includes an Indium Tin Oxide (ITO) sensor glass layer, a window glass layer mounted above the ITO sensor glass layer by means of an Optical Clear Adhesive (OCA), a conductive layer disposed between a surface of the window glass layer and a surface of the ITO sensor glass layer that includes an electrode pattern, and a touch screen control unit mounted on one of the window glass layer surface and the ITO sensor glass layer surface on which the conductive layer is mounted.

A semiconductor device and a manufacturing method thereof are provided. A semiconductor device includes a stack structure including conductive layers stacked in a step shape, a first interlayer insulating layer formed over the stack structure, the first interlayer insulating layer including contact holes with a uniform depth, which expose the conductive layers, lower contact plugs formed in the contact holes, the lower contact plugs being respectively contacted with the conductive layers, and lower contact pads respectively connected to the contact plugs.

In a semiconductor device and a method of fabricating the same, the semiconductor device includes a contact pad in a first interlayer insulating layer on a semiconductor substrate, a contact hole in a second interlayer insulating layer on the first interlayer insulating layer, selectively exposing the contact pad, a contact spacer on internal walls of the contact hole, a first contact plug connected to the contact pad exposed by the contact hole having the contact spacer on the internal walls thereof, the first contact plug partially filling the contact hole, a metal silicide layer on a surface of the first contact plug, and a second contact plug on the metal silicide layer and partially filling the remaining portion of the contact hole.

A MIS transistor includes a gate electrode portion, insulating sidewalls formed on side surfaces of the gate electrode portion, source / drain regions and a stress film formed so as to cover the gate electrode portion and the source / drain regions. A height of an upper surface of the gate electrode portion is smaller than a height of an upper edge of each of the insulating sidewalls. A thickness of first part of the stress film located on the gate electrode portion is larger than a thickness of second part of the stress film located on the source / drain regions.

A fuel cell collector structure of the present invention includes a single cell which is formed by sandwiching a plate-shaped solid electrolyte between a fuel electrode and an air electrode, a collector which is provided at a position adjacent to the single cell, and a separator which is provided at the position adjacent to the collector. In the fuel cell collector structure, the collector is made of a porous electric conductor having a plurality of apertures on a surface, the single cell and / or the separator has a plurality of electrically conductive projections on the surface, and the projections intrude into the apertures to come into contact with the collector.

In a semiconductor device and a method of fabricating the same, the semiconductor device includes a contact pad in a first interlayer insulating layer on a semiconductor substrate, a contact hole in a second interlayer insulating layer on the first interlayer insulating layer, selectively exposing the contact pad, a contact spacer on internal walls of the contact hole, a first contact plug connected to the contact pad exposed by the contact hole having the contact spacer on the internal walls thereof, the first contact plug partially filling the contact hole, a metal silicide layer on a surface of the first contact plug, and a second contact plug on the metal silicide layer and partially filling the remaining portion of the contact hole.

A control unit is stored in an airtight housing constituted by a base, an annular peripheral wall member, a cover, and first and second interior packings, second wiring conductors connected to input / output equipment and first wiring conductors connected to a host controller through a control signal connector are brought into press-contact with input / output control terminals of the control unit by first and second pressing elastic mats, the relative positions of associated components are regulated by positioning pins passing through from the cover to the base, and the cover is opened by loosening blockade screws without causing an assembly dimension error or sliding wear of conductive contact portions due to thermal deformation, whereby the control unit is detached.

The present invention discloses an online monitoring device for an electrical switch cabinet state based on multidimensional feature parameters for realizing real-time monitoring for key point temperature, a partial discharge state and an operating mechanism state of a high voltage switch cabinet. The online monitoring device for an electrical switch cabinet state based on multidimensional featureparameters comprises a switch cabinet, a temperature sensor, an intelligent data collector, an intelligent communication terminal, an intelligent master station, a big data server, a computer, a mobile terminal, a DC 12V power adapter, an AC transformer, a Hall current sensor, a vibration sensor, a TEV ground wave sensor, an AE ultrasonic sensor, a panel antenna, a feedback line and a remote system master station. The online monitoring device for an electrical switch cabinet state based on multidimensional feature parameters can be adopted to effectively avoid cable joint fault, bus fault, contact fault, operating mechanism fault, etc., can effectively ensure reliable operation of switch cabinet equipment, and can ensure safe and stable operation of a power grid.

An electrical connector comprises a generally rectangular dielectric housing with a mating face and a mounting face. A plurality of terminal support posts extend in a direction from the mounting face towards the mating face and each support post has oppositely facing first and second sidewalls and a connecting surface. A plurality of terminal receiving cavities are spaced along a longitudinal axis of the housing for receiving terminals therein. A plurality of terminals are provided with each including a solder tail portion and a generally U-shaped contact portion. The solder tail portion is positioned along the mounting face and the contact portion includes a first, distal contact leg, a second, proximal contact leg spaced from and generally parallel to the first contact leg and a connecting portion extending between the first and second contact legs. The first contact leg extends along the first sidewall, the second contact leg extending along the second sidewall, and the connecting portion extending along the connecting surface.

A semiconductor device includes a semiconductor substrate having a resistor region, an isolation layer disposed in the resistor region, the isolation layer defining active regions, first conductive layer patterns disposed on the active regions, a second conductive layer pattern covering the first conductive layer patterns and disposed on the isolation layer, the second conductive layer pattern and the first conductive layer patterns constituting a load resistor pattern, an upper insulating layer disposed over the load resistor pattern, and resistor contact plugs disposed over the active regions, the resistor contact plugs penetrating the upper insulating layer to contact the load resistor pattern.

There is disclosed a coordinate transformation device for electrical signal connection used for a probe card applicable to narrow pitch pads, which particularly simplifies wiring from the terminal onto the inspection apparatus board and prevents electrical contact failure. In the coordinate transformation device for electrical signal connection, an input terminal of a first wiring group corresponding to one of probe output terminals is provided with at least two terminals independently movable in a yz plane. When the probe output terminal and the input terminal of the first wiring group are contacted and conducted with each other, a wall surface of a first terminal of the input terminal of the first wiring group comes into contact with a side wall of the probe output terminal, and a wall surface of a second terminal thereof comes into contact with a side surface on the opposite side of the probe output terminal.

A wafer holder less susceptible to deformation even under high load and having high heat-insulating effect and hence capable of improving positional accuracy, improving thermal uniformity and rapid heating and cooling of chips, as well as a heater unit including the wafer holder and a wafer prober including the heater unit are provided. The wafer holder includes a chuck top having a chuck top conductive layer on its surface and a supporter supporting the chuck top, and has a support member in a space between the chuck top and the supporter. Preferably, the support member is arranged concentric with the supporter or approximately at the center of the supporter, and more preferably, support members arranged concentrically and arranged at the center are both provided.

A switch device that prevents a contact failure from occurring between electrode contact points by having a self-cleaning function is provided. When a key top 4 is pushed downward, a portion between a winding start end 7b and a winding terminal end 7c of a spiral contactor 7 is extended by an operation part 3B provided in an actuator 3. At this time, the winding start end 7c slides along the surface of a stationary electrode 5. As a result, dusts or stains attached to the winding terminal end 7c and / or the stationary electrode 5, oxide films formed on the surfaces of the electrodes, etc., is self-cleaned. Therefore, it is possible to solve a contact failure problem between the movable electrode 6 and the stationary electrode 5.

A connector C to be mounted on a case of a device includes a coated wire 10 formed such that a core 11 is coated with an insulation coating 12, a terminal fitting 20 to be fit and connected to a mating terminal, a flexible conductor 15 interposed between the terminal fitting 20 and an end of the coated wire 10, and a housing 30 made of synthetic resin and accommodating the terminal fitting 20 together with the flexible conductor 15. The core 11 of the coated wire 10 is provided with a core fixing portion 25 integrated with the core 11 and the core fixing portion 25 is embedded in the housing 30 by molding.