The invention provides a
wafer jacking device of a
semiconductor, and belongs to the technical field of
semiconductor processing equipment. The device comprises a process cavity, a supporting part and a
wafer, and further comprises a jacking
assembly, a uniform-flow gas-flowing
assembly and a gas-blocking and gas-exhausting
assembly, through the arrangement of the gas
storage tank and the annular baffle, it is ensured that the movable part is subjected to uniform and stable thrust in the rising process, the abrasion, inclination or jamming phenomena caused by uneven pressure are avoided, meanwhile, gas can be uniformly discharged only through one gas conveying pump, and an additional valve
control system is not needed; through a magnetic control mechanism, opening and closing control over the vent groove is achieved in the jacking process, air can be automatically exhausted after jacking is completed, additional pumping treatment is not needed, and
energy consumption is reduced; the corrugated sleeve and the sealing
gasket are dual-guaranteed, so that support can be provided under extreme conditions, and the spring and the corrugated sleeve cooperatively buffer and reduce vibration so as to protect the
wafer; the ejector pin is flexibly adjusted and is suitable for jacking
processing of wafers of multiple specifications, and the universality of the device is enhanced.