7392results about "Working accessories" patented technology

The invention provides a laser positioning method for improving gemstone cutting precision, and belongs to the technical field of gemstone cutting laser positioning. A gemstone crystal refractive index tensor model and a ray tracing algorithm are established to simulate a propagation path of light in a gemstone; a thermo-optic effect prediction model is adopted to predict a focus drift distance according to temperature distribution and laser power data and calculate wavefront predistortion phase distribution for compensation, and a zero-vibration input shaping filter is designed for a galvanometer scanning system to suppress residual vibration. A composite control strategy that feedforward control compensates inertia lag and feedback control corrects position errors is adopted to drive a galvanometer, the inherent frequency of a system is recognized through spectral analysis, and the scanning frequency is adjusted to avoid resonance. The technical problem that in the long-time machining process, due to the thermo-optic effect and vibration of a galvanometer scanning system, the laser focus point position generates accumulated drifting, and the cutting precision is reduced is solved.

The invention relates to a wall surface scabbling device for a narrow vertical tubular space and a construction method, and belongs to the technical field of scabbling construction. The wall surface scabbling device comprises a top supporting frame, an inner supporting frame, a rotating frame and scabbling operation equipment, the top supporting frame is used for transversely supporting the top of a to-be-scabbled component with a vertical tubular space; the inner supporting frame is used for being supported in the vertical tubular space, and the inner supporting frame is connected to the top supporting frame through a lifting assembly so as to ascend and descend relative to the top supporting frame in the vertical tubular space; the rotating frame is rotationally connected to the inner supporting frame through the rotating assembly and rotates relative to the inner supporting frame with the axis of the inner supporting frame as the axis. The scabbling operation equipment is installed on the rotating frame and faces the wall face of the vertical tubular space, and the scabbling operation equipment rotates along with the rotating frame so as to change the operation position in the circumferential direction. The scabbling device can replace manpower to carry out wall scabbling construction in a narrow vertical tubular space, the construction efficiency is high, and the risk is low.

The invention relates to the technical field of constructional engineering, and discloses bar planting integrated equipment and an operation method thereof.The bar planting integrated equipment comprises a bearing mechanism which comprises a machine shell, a storage groove formed in the outer side of the machine shell, telescopic supporting legs rotationally installed in an inner cavity of the storage groove and universal wheels fixedly installed at the bottom of the machine shell; the driving mechanism comprises a three-section type hydraulic telescopic column located in the center of an inner cavity of the machine shell, a ball bearing seat fixedly installed at the end of the three-section type hydraulic telescopic column and a jacking buffering assembly fixedly installed at the top of the ball bearing seat. And the integrated mechanism is used for integrated punching operation and comprises an operation support fixedly installed on the outer surface of the innermost section of the three-section type hydraulic telescopic column. An integrated platform is provided for the punching assembly, the hole cleaning assembly, the glue injection assembly and the steel bar planting assembly through the integrated mechanism, the assemblies can be reasonably distributed around operation points, operation of all steps is rapidly achieved, and therefore the operation efficiency is effectively improved.

The embodiment of the invention provides a dicing saw cutting pressure control method and device based on dynamic pressure prediction and a dicing saw. The method comprises the steps that S1, real-time material characteristic parameters on a cutting path are obtained through a multi-source sensor; s2, based on the material characteristic parameters, a dynamic mapping model of material characteristics and cutting pressure is established, and output parameters are predicted pressure compensation values; s3, before a cutting tool reaches a pressure sudden change area, cutting pressure is adjusted in advance according to a predicted pressure compensation value output by the dynamic mapping model, meanwhile, an actual pressure value is detected in real time through a force sensor, and pressure deviation is corrected in combination with a control algorithm; and S4, carrying out staged pressure loading on the non-uniform doping region in the heterogeneous material. According to the method, the pressure sudden change point is predicted through the dynamic mapping model, the pressure is adjusted in advance in combination with a control algorithm, and the characteristics of the adaptive heterogeneous material are loaded in stages, so that the shear mark uniformity is remarkably improved, and the material damage risk is reduced.

The application relates to the technical field of stone cutting equipment, in particular to high-efficiency stone wire saw cutting equipment, which is characterized by comprising a mounting frame, a lifting frame, a lifting driving mechanism, a stone clamping and placing mechanism and a wire saw cutting mechanism, the lifting frame is arranged in the mounting frame and is slidably connected to the mounting frame through a first sliding assembly, the lifting driving mechanism is arranged on the mounting frame and is used for driving the lifting frame to lift, the stone clamping and placing mechanism is arranged below the lifting frame and is used for clamping and placing a stone body, and the wire saw cutting mechanism is arranged on the lifting frame. The application can effectively reduce the wire breaking probability of the cutting wire, the threading overhauling after wire breaking is relatively convenient, and the consistency of the tension among the multiple cutting wires can be effectively ensured.

The wire cutting assembly comprises a bottom frame, a cutting frame, rollers, a take-up and pay-off assembly, a tensioning assembly and a lifting frame, the cutting frame is arranged at the upper end of the bottom frame, the lifting frame is arranged under the cutting frame through a lifting device, the rollers are symmetrically arranged on the cutting frame, and the tensioning assembly is arranged on the lifting frame. The take-up and pay-off assembly comprises a pay-off device and a take-up device, at least two cutting lines are wound on the roller at intervals corresponding to the take-up and pay-off assembly, the pay-off device and the take-up device are arranged on the cutting frame corresponding to the two ends of the cutting lines, and one take-up and pay-off assembly correspondingly controls take-up and pay-off of one cutting line. The tensioning assembly is arranged on the cutting frame corresponding to the pay-off device and the take-up device. Through the arrangement of the multiple pay-off devices and the multiple take-up devices, simultaneous work of multiple cutting lines is achieved, the speed and tension of each cutting line can be independently controlled, and the problem that tension is possibly uneven when multiple cutting lines are driven by a traditional single motor is solved.

The invention relates to the technical field of graphene, and more particularly discloses an automatic processing system and method for a graphene cooling fin, and the method comprises the steps: obtaining the specification and shape parameters of the cooling fin, a monitoring video, a slicing pressure value and other information, extracting a slicing process change feature vector, a cooling fin parameter correlation feature vector and a pressure feature vector, and obtaining a graphene cooling fin; the feature vectors are classified through a classifier, and whether the pressure value at the current time point needs to be increased or decreased is judged. In this way, automatic machining of the graphene cooling fins is achieved, and the machining applicability and quality are improved.

Provided is an environment-friendly mobile collecting box for decoration cutting dust. The mobile collecting box comprises a box body, wherein a water tank is fixedly mounted on one side of the bottomsurface of the inner wall of the box body, the bottom surface and the outer side of the water tank are fixedly connected to the inner wall of the box body separately, the inner side of the water tankis fixedly connected to one side of the box body, and openings are formed in the top surface and the other side of the box body; a first through hole is formed in the bottom of the inner side of theinner wall of the water tank, a switching valve is disposed in the first through hole, and a second through hole is formed in one side of the box body; the interior of the first through hole communicates with the interior of the second through hole, and the second through hole communicates with the interior of the box body; the top surface of the water tank is fixedly connected to one end of a hose, and the other end of the hose is arranged in the box body, and a floating plate is fixedly mounted on the periphery of the other end of the hose. Sediment in the box body can be pushed directly into the garbage bag through cooperative use of a mud box and a garbage bag, and the mud box can be taken and placed freely; after the mud box is taken out, a sealing cap of the garbage bag containing the sediment is removed, and after the garbage bag is replaced by a new garbage bag, the mud box is put back, and the sediment is not in contact with the mud box, and cleaning of the mud box by a user is not needed, so that time and labor are saved.

The invention discloses a microcrystalline texture glass cover plate and a preparation method thereof. The microcrystalline texture glass cover plate comprises a glass body; a series of surface microstructures are arranged on the surface of the glass body, the section of each surface microstructure is in a wave shape, compared with a common glass cover plate, the glass cover plate is endowed with more excellent optical and mechanical performance due to the special structure of the microcrystalline glass, and the requirements of high-end markets are better met when the glass cover plate is applied to consumer electronics cover plates. The diversification of the MASK design provides diversification of the texture effect of the microcrystalline glass, and specific requirements are met. And the surface of the microcrystalline glass is processed more accurately by the yellow light development technology and reaches the micron level. Pyramid morphology of particles on the surface of the microcrystalline glass is regulated and controlled through a wet etching process, uniform etching is carried out, the texture effect is brighter, and the hand feeling is finer and smoother.

The invention provides a cutting height adjusting method and device of a cutting knife, wafer processing equipment and a medium, and relates to the technical field of wafer processing equipment.The method comprises the steps that the surface height difference between a sample silicon wafer on an auxiliary workbench and a to-be-processed wafer on a main working disc is measured; after the cutting knife cuts the sample silicon wafer to form a cutting mark, calculating a cutting depth value corresponding to the cutting mark; calculating the surface height information of the sample silicon wafer according to the cutting depth value of the cutting mark and the height information corresponding to the lowest point of the cutting knife when the cutting knife cuts the sample silicon wafer on the auxiliary workbench; and according to a preset cutting depth value, the surface height information of the sample silicon wafer and the surface height difference between the sample silicon wafer on the auxiliary workbench and the to-be-processed wafer, target cutting height information of the cutting knife when the cutting knife cuts the to-be-processed wafer is determined. After the height of the cutting knife is adjusted according to the target cutting height information, the cutting mark cut by the cutting knife has high-precision cutting depth.

The invention relates to the technical field of wafers, in particular to a wafer fixing device for a cutting machine, which comprises a rotary table and a wafer carrier, a first airway is arranged in the center of the turntable; a pore plate is arranged at the top of the rotary table; an air chamber communicated with the first air passage is formed between the pore plate and the rotary table; a plurality of second air channels are formed in the rotary table in the circumferential direction; a control valve for communicating the first air passage with each second air passage is arranged between the first air passage and the plurality of second air passages; the turntable is provided with a supporting table; the wafer carrier comprises a tightening ring arranged on the supporting table and a UV adhesive tape film arranged on the tightening ring; the UV adhesive tape film is provided with a plurality of air cavities communicating with the second air channels in a one-to-one correspondence mode in the circumferential direction. In this way, the centrifugal cleaning force is enhanced, cleaning dead corners are reduced, cutting chippings are easier to clean, the cleaning effect is better, and the cleaning efficiency and the product yield are improved.

The stone machining device comprises a step frame, a three-axis carving machine is installed on the upper step face of the top end of the step frame, and two symmetrical L-shaped shaft frames are installed on the portion, on one side of the three-axis carving machine, of the lower step face of the step frame. Rotary plate containing bases are rotationally installed on the outer walls of the opposite sides of the two L-shaped shaft brackets correspondingly, and at least four annular rectangular notch grooves at equal intervals are formed in the outer walls of the rotary plate containing bases. The double-end split clamping plate assembly firmly fixes a stone plate, the chain wheel driving unit drives the rotary plate containing base to rotate, the carved stone plate is turned over to the belt plate conveying machine till the stone plate is conveyed out of a storage station, so that the purpose of continuous discharging is achieved, and workers only need to manually support the stone plate to turn over in the discharging process.

The utility model provides a light wallboard gantry cutting device, and relates to the technical field of building material field processing, the light wallboard gantry cutting device comprises a rack, a three-axis module mechanism, a cutting assembly and a material moving mechanism, one side of the rack in the horizontal direction is provided with an opening, the rack is provided with a cutting station and a feeding and discharging station, the cutting station is located in the rack, and the feeding and discharging station is located in the rack. The feeding and discharging station is located on the opening side of the machine frame. The three-axis module mechanism is arranged on the machine frame and comprises a movable end. According to the gantry cutting device for the light wallboards, the cutting device is placed near a construction building, the light wallboards are driven by the material moving mechanism to turn over and enter the cutting station, and after feeding, the light wallboards are transversely cut through the three-axis module mechanism and the cutting assembly, so that field width cutting operation is achieved, and the cutting efficiency is improved for scenes needing batch cutting. And a plurality of arranged light wallboards can be directly placed and cut in sequence, so that the labor cost is greatly reduced, and the building construction efficiency is improved.

The present invention provides a positioning mechanism for a crystal bar fixed-angle bonding machine, belonging to the technical field of semiconductor equipment. It solves the problem of low bonding accuracy of existing crystal bar fixed-angle bonding machines. The positioning mechanism of this crystal bar fixed-angle bonding machine includes a fixture for horizontally positioning a material plate and a correction reference vertical plate vertically arranged above the fixture and capable of rotating relative to the fixture. A positioning frame is connected to the correction reference vertical plate and can slide in a direction perpendicular to the plate surface of the correction reference vertical plate. A flexible suction cup capable of adsorbing the crystal bar is connected to the positioning frame. When the flexible suction cup adsorbs the crystal bar, the positioning frame can retract and make the crystal bar press against the correction reference vertical plate. A pressing block is also provided on the correction reference vertical plate. When the flexible suction cup adsorbs the crystal bar and the crystal bar presses against the correction reference vertical plate, the pressing block can descend and press the crystal bar tightly on the material plate. The bonding accuracy of this crystal bar fixed-angle bonding machine is higher.

The utility model discloses a municipal construction grooving machine with a protective structure, which comprises a base, an air cylinder is fixedly mounted at the top of the base, the output end of the air cylinder is fixedly connected with a support, the bottom end of the support movably penetrates through the base and extends to the outside, and a grooving cutter is rotatably connected onto the support. Through the arrangement of the base, the support, the grooving cutter, the protection frame, the hose and other structures, the road grooving position can be shielded and protected in the road grooving process, stone generated during grooving is prevented from splashing everywhere to accidentally injure surrounding personnel, meanwhile, gas in the protection frame can rapidly circulate in a blowing and sucking mode, and the safety of the road grooving position is improved. According to the grooving device, the grooving cutter can be cooled, meanwhile, dust generated during grooving can be sucked and collected, the situation that the dust is influenced by the external environment and diffused everywhere to pollute the working environment is avoided, the situation that the diffused dust is inhaled by people around the device to affect the body health of the people is avoided, and then the safety of the device during use is improved.

The apparatus for reverse cutting of a structure, according to the present invention, comprises a pair of reverse pulley devices, the pair of pulley devices comprising: main tubes inserted and mounted so as to penetrate two holes; a pair of first support pulleys mounted on the inner sides of the front ends of the main tubes to rotatably support a wire; a pair of second support pulleys mounted on the inner sides of the rear ends of the main tubes to rotatably support the wire; openings which are cut in portions where the two main tubes face one another and allow the wire to move; and cap covers which are coupled to the front ends of the main tubes to seal same.

The utility model relates to the field of cutting equipment, and discloses a slide rail assembly for a cutting machine, which comprises a rail piece and a slide block piece, rail parts are arranged on two sides of an inner groove of the rail piece, the slide block piece is in sliding fit with the rail parts, the slide block piece comprises a base and a movable block, and matching surfaces clamped with the rail parts are arranged on the outer sides of the base and the movable block. The rail piece and the sliding block piece are in sliding fit through the matching faces, a sliding layer used for contact fit is arranged on the matching faces, an adjusting block is arranged between the base and the movable block and used for adjusting the distance between the matching faces on the two sides of the base and the matching faces on the two sides of the movable block, and the rail piece and the sliding block piece are in sliding fit through the matching faces to obtain a large sliding contact face, so that sliding fit is more stable; on the basis, sliding fit is smoother through the self-lubricating sliding layers on the fit surfaces, meanwhile, the distance between the fit surfaces is allowed to be adjusted through an adjusting block through the design of the sliding block piece, it is ensured that the sliding block piece can be accurately installed in the rail piece, and the fit clearance can be adjusted during follow-up maintenance.

The invention discloses a cement wall prefabricating drilling device for building construction, and relates to the technical field of building construction equipment, the cement wall prefabricating drilling device for building construction comprises a supporting bottom plate and further comprises a first drilling mechanism, and the first drilling mechanism is located above the supporting bottom plate. Therefore, the first drilling operation table is driven to be adjusted in the overall direction, the drilling requirements of different directions are met, the equipment use flexibility of overall drilling operation is improved, and the device is suitable for various scenes. According to the drilling equipment, the driving adjusting mechanism is arranged, large particles cannot enter a fixing box, recycling treatment is conducted through a recycling box at the bottom, classified storage is conducted on equipment needed on site through a classified storage box, drilling modes of different states are switched according to drilling scene needs, and the drilling efficiency is improved. And meanwhile, the functions of storage of equipment required during drilling, field environment purification during drilling, field equipment movement and the like are integrated.

The invention relates to the technical field of diamond saw blades, in particular to a laser welding diamond saw blade for ultra-narrow slit cutting and a preparation method of the laser welding diamond saw blade. The copper-cobalt-tin alloy material comprises the following raw materials: copper-cobalt-tin alloy powder, tungsten carbide powder, titanium-aluminum nitride, spherical cobalt powder, rare earth yttrium powder, ferrophosphorus powder and diamond abrasive particles. According to the preparation method, the core of the preparation method lies in the combination of powder metallurgy prefabrication of the tool bit and the precise laser welding process, especially the innovative laser welding process, and the prepared diamond saw blade is high in welding seam strength, narrow in heat affected zone and extremely small in matrix deformation; the problems of base body deformation, insufficient welding seam strength, short service life and the like of a traditional saw blade in the ultra-narrow seam cutting process are solved, and the saw blade is perfectly suitable for ultra-narrow seam cutting scenes with extremely high requirements for precision and stability.

The embodiment of the invention provides automatic pearl clamping and punching equipment and an operation method, and relates to the technical field of pearl processing equipment. Comprising a base, a first motor, an adjusting mechanism and a clamping mechanism, the first motor is connected with the base, a drill bit is installed at the output end of the first motor, the adjusting mechanism is arranged on the base, the clamping mechanism is connected with the adjusting mechanism, and the three clamping parts are firstly driven to be away from one another so that pearls can be placed; according to the working process that the clamping parts are driven to be close to each other to stably clamp the pearls, then the pearls are transferred to the drill bit through the adjusting mechanism to be punched, and finally the clamping parts are reset to loosen and take out the pearls, cracks, damage or fragmentation of the pearls caused by too tight clamping can be avoided; the problems that in traditional pearl clamping and punching, due to improper clamping force, the quality of pearls is damaged, and the punching precision is insufficient are effectively solved, and then the utilization rate of the pearls and the precision and quality of follow-up jewelry processing are improved.

The utility model discloses a PC imitation stone brick cutting device capable of quickly replacing a blade, and relates to the technical field of stone brick cutting, the PC imitation stone brick cutting device comprises a support frame, one side of the support frame is fixedly connected with a fixing frame, one side of the fixing frame is fixedly connected with a shell, the middle position of the other side of the shell is rotatably connected with a shaft rod, and the other side of the shaft rod is fixedly connected with a blade. A driving mechanism is arranged at one end of the shaft rod, a fixing sleeve is fixedly connected to the other end of the shaft rod, the outer side of the fixing sleeve is sleeved with a cutting blade and a first positioning disc from outside to inside, and the tail end of the fixing sleeve is connected with a second positioning disc. The positioning shaft is taken out from the interior of the second inserting hole, then the first positioning disc is conveniently slid, the positioning disc is taken down from the outer side of the fixing sleeve, meanwhile, the inserting rod is taken down from the interiors of the third inserting hole and the first inserting hole, and then the cutting blade is conveniently taken down from the outer side of the fixing sleeve to be replaced.

The utility model discloses a ceramic rolling forming device, comprising: a workbench; a rotating arm, which is rotatably placed above the workbench, and a rolling head is rotatably arranged at the end of the rotating arm; a rotating disk, which is rotatably placed on the top of the workbench, and a plurality of forming cylinders are arranged on the top of the rotating disk; a cutting component, which is placed on the top of the workbench, and the cutting component includes a mud conveying pipe for mud extrusion. The beneficial effects of the utility model are: the rotation from mud cutting to feeding and then to the forming position is all performed automatically, which significantly reduces the need for manual operation, reduces labor intensity and labor costs, and through the cooperation of infrared sensors and steel wires, the automatic cutting component can control the size of the mud very accurately, reducing material waste caused by inaccurate manual cutting, and through the rotation cooperation of the rotating disk and the forming cylinder, the processing speed is fast and continuous, thereby improving production efficiency.

The invention provides an artificial quartz stone plate chamfering device which comprises a base, a chamfering device and a chamfering device. A working groove used for storing water is formed in the top of the base. The chamfering assembly is arranged at the top of the base in a sliding mode and used for cutting the artificial quartz stone plate; and the positioning assembly is arranged in the base and used for fixing the artificial quartz stone plate. The invention belongs to the technical field of quartz stone plate processing. According to the chamfering device, the probability of chamfering edge breakage of the artificial quartz stone plate can be reduced, the chamfering efficiency of the artificial quartz stone plate is improved, and therefore the machining cost of the artificial quartz stone plate is greatly reduced.

The invention discloses a machining method for a monocrystalline silicon complex curved surface optical element. The machining method comprises the steps that S1, ultra-precision turning is conducted on the monocrystalline silicon complex curved surface optical element; s2, magneto-rheological polishing and shaping are carried out on the monocrystalline silicon complex curved surface optical element; s3, fairing the monocrystalline silicon complex curved surface optical element; and S4, the surface shape precision and the surface roughness of the monocrystalline silicon complex curved surface optical element are detected, if the detection result meets the requirement, machining is completed, and if the detection result does not meet the requirement, the step S2 is executed again. The method is simple in technological process and high in operability, after ultra-precision turning, the surface shape precision is good, subsurface damage is small, the grinding process can be omitted, the task load of the follow-up process is reduced, and the machining period of the monocrystalline silicon complex curved surface optical element is effectively shortened; by adopting a processing mode of combining ultra-precision turning and magneto-rheological polishing modification, processing and manufacturing of high-precision and high-surface-quality monocrystalline silicon complex curved surface elements can be realized.

The utility model discloses a radius-drawing adjustable automatic water drilling machine, and belongs to the technical field of wall water drilling machines. The device mainly comprises a fixed seat and a base which are arranged up and down, a transmission mechanism and at least two groups of guide assemblies are arranged between the fixed seat and the base, the transmission mechanism and the guide assemblies are jointly connected with a pull-out gear box in a sliding mode, a drill barrel body used for drilling is arranged at the output end of the pull-out gear box, and the pull-out gear box comprises a lower fixed seat. A gearbox body is connected into the lower fixing base in a sliding mode, a second guide hole matched with the guide assembly and a second transmission hole matched with the transmission mechanism are formed in the lower fixing base, and a second long-strip-shaped hole matched with the transmission mechanism is formed in the gearbox body. According to the water drilling machine, the drawing type gear box is additionally arranged, the drilling barrel body with the corresponding hole diameter is replaced according to the size of a hole to be drilled, adjustment and use are convenient, and the universality of the water drilling machine is improved.

The invention relates to the technical field of stone machining, in particular to a method and system for machining three-dimensional special-shaped stone through a robot, and the method comprises the following steps: obtaining path segments and extracting particle images, dividing density category identification sections, classifying the path segments, matching load conditions, screening out indexes, and mapping node coordinates to generate an interlaced section table. The method comprises the following steps: extracting a particle image, dividing density categories, identifying particle distribution differences, identifying staggered node areas in combination with spatial distribution grids, defining structural paragraphs, extracting direction vectors and sequence information to identify continuous paragraphs, adjusting attitude angle access tracks, and generating a processing path set. According to the three-dimensional special-shaped stone engraving method, combined inspection of path section direction consistency and sequence coherence is conducted, path interruption and jumping are controlled, difference analysis of the tail end posture and the engraving face direction is matched with angle adjustment, cutting offset and contour misalignment caused by posture mismatching in the machining process are reduced, and path stability and engraving coherence in the three-dimensional special-shaped stone engraving process are enhanced.

The invention relates to the technical field of wafer cutting, in particular to a high-stability wafer bearing platform for a wafer cutting machine, which comprises a first base, a lifting power part and a bearing table, the first base is provided with an accommodating groove; the lifting power piece is arranged in the accommodating groove; the bearing table comprises a driving ring and an objective table; the driving ring is rotationally arranged at the top of the first base; a plurality of driving tables are arranged at the edge position of the driving ring in the circumferential direction; a central shaft is arranged on the bottom surface of the objective table; the central shaft downwards penetrates through the driving ring, then extends into the accommodating groove and is connected with the output end of the lifting power piece; the central shaft is matched with the molded surface of the driving ring; a plurality of clamping assemblies in one-to-one correspondence with the driving tables are arranged at the edge position of the objective table in the circumferential direction; the clamping assembly can press a wafer placed on the top face of the objective table downwards and limit the wafer in the radial direction under the action of the driving table. According to the invention, the stability and reliability during wafer cutting or movement are improved.

The invention belongs to the technical field of monocrystalline silicon wafer processing, and provides a cutting processing and processing method for reducing the surface roughness of a monocrystalline silicon wafer, which comprises the following steps of: bonding and curing; preparing a cutting cooling liquid; arranging a wire net; setting cutting parameters; carrying out post-treatment; and laser repairing. Compared with a silicon wafer processed by a traditional electroplating diamond wire technology, the number of line marks of the monocrystalline silicon wafer obtained through processing is obviously reduced by adjusting cutting parameters and prolonging a bidirectional reciprocating cutting reversing period, and the number of the line marks on the surface of the monocrystalline silicon wafer can be controlled within three; according to the cutting processing method, by reducing the machine speed, the line mark depth of the monocrystalline silicon wafer can be reduced to be within 5 microns; according to the method, the processed silicon wafer is subjected to laser repairing, industrialization and automation of efficient laser repairing of the silicon wafer are expected to be achieved through the reconstruction mechanism of a monocrystalline silicon lattice structure in the laser irradiation process, line marks on the surface of the repaired silicon wafer can reach within 3 micrometers, and the surface roughness of the silicon wafer is reduced.

The invention discloses a rock core drilling sampling device for coal mining, and relates to the field of coal mining, the rock core drilling sampling device comprises a base and a support frame, the support frame is fixed above the base, the middle part of the base is designed to be of an open structure, an outer cover body is arranged above the base, and a connecting frame is fixed above the outer cover body; a connecting frame is arranged above the outer cover body, a mounting seat is connected above the connecting frame, a vertical control mechanism is arranged above the mounting seat, the vertical control mechanism is connected with the supporting frame to control the vertical movement of the outer cover body, a sampling barrel is arranged in the outer cover body, and the upper part of the sampling barrel is designed to be of an opening-shaped structure. And the sampling barrel is rotationally connected with the outer cover body. According to the rock core drilling and sampling device for coal mining, through the arrangement of the hollow sampling barrel, the sampling barrel can permeate into a soil body to move, so that drilling and sampling can be synchronously carried out, a sampling hole does not need to be formed firstly, and the rock core drilling and sampling device is more convenient to use.

The invention relates to the technical field of photovoltaic cutting, in particular to diamond wire surface modification liquid, a preparation method of the diamond wire surface modification liquid, a modified diamond wire and a preparation method and application of the modified diamond wire. The diamond wire surface modification liquid provided by the invention comprises a component A and a component B, and the mass ratio of the component A to the component B is (40-80): (20-60); the component A is prepared from the following components in percentage by mass: 5 to 40 percent of titanium alkoxide, 2 to 30 percent of organic solvent and the balance of water; the component B is prepared from the following components in percentage by mass: 1 to 10 percent of polyphenol compounds and the balance of water. Hydrophilic modification is carried out on the diamond wire by adopting the diamond wire surface modification liquid, the liquid carrying capacity of the diamond wire is improved, it is guaranteed that components of the cutting liquid are effectively carried into cutting slits in the photovoltaic cutting process, and wire marks of silicon wafers in the production process are reduced; and the use amount of wetting components in the cutting fluid is reduced.