10351results about "Working accessories" patented technology

An object cutting method which can reliably remove particles remaining on cut sections of chips is provided. An expandable tape 23 is electrically charged in a state where a plurality of semiconductor chips 25 obtained by cutting a planar object to be processed along a line to cut are separated from each other on the expandable tape 23. This electric action causes particles remaining on cut sections of the semiconductor chips 25 to eject therefrom even when a molten processed region is formed in the cut sections Therefore, particles remaining on the cut sections of the chips 25 can reliably be removed.

A cutting and dust collecting assembly comprises a rotatable, circular saw blade (4) having a first side (20), a second side (21), and a cover device (6) with a terminal member (52). The bottom surface (36) of the cover device extends in a plane. A longitudinal passage (45, 46) for the saw blade extends through the cover device from its top surface to its bottom surface. The terminal member comprises a terminal chamber (60) having an inlet (45a), the mouth of which coincides with the plane of said bottom surface. An outlet (58) can be connected to a vacuum source. The direction of rotation of the operating blade is such that the rear part (4a) of the saw blade which has passed beyond the bottom surface of the cover device will move in a direction upwards-rearwards towards the bottom surface. The invention also concerns the cover device, a sealing body belonging to the cover device and a working machine which is provided with the cutting and dust collecting assembly.

A wire saw (10) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots (14) into wafers. The wire saw includes a cutting head (16), an ingot support (12), and multiple generally parallel lengths of cutting wire (18) defining a cutting web (30). A slurry delivery system includes nozzles (34, 36, and 38) positioned for dispensing slurry along the wire web generally at lateral sides of each ingot. A process for simultaneously slicing at least two generally cylindrical semiconductor ingots into wafers includes mounting at least two ingots to a common ingot support, moving the ingot support relative to the cutting web so that the two ingots simultaneously press against the cutting web at cutting regions, and dispensing a liquid slurry to at least three locations on the wire web including two outermost sides of the cutting regions and a location between each pair of ingots.

A chop saw, grinding wheel, or like apparatus is disclosed herein also incorporated to an easily portable dust collection system. In a preferred embodiment, a worktable is provided with a center slot for receiving a circular saw blade. A negative pressure and resulting air flow is provided at the center slot to capture particulate matter as a byproduct of cutting the workpiece. Side slots are also disclosed to assist in particulate collection. A unique filter chamber having a cylindrical filter is additionally provided to remove dust from air and discharge the filtered air at a lateral side of the apparatus. A filter cleaning knob is additionally disclosed to assist in cleaning the filter. Of the beneficial aspects of the chop saw with dust collection system is its portability being one integral unit and the dust filter being easily cleaned and maintained.

The invention discloses an all-silicon-rod squaring machine and squaring method. The all-silicon-rod squaring machine comprises a machine base, at least one bearing frame set, a cutting device and at least one lifting position adjusting device; each bearing frame set comprises a plurality of bearing frames arranged on the machine base in a front-and-back manner, and the bearing frames are used for transversely bearing an all-silicon rod; the cutting device comprises a slippage support which slips along the machine base and at least one linear cutting unit; each linear cutting unit is arranged on the slippage support and corresponds to the corresponding bearing frame set, and each linear cutting unit internally comprises two opposite cutting lines; each lifting position adjusting device is arranged on the machine base, corresponds to the corresponding bearing frame set and is used for jacking the all-silicon rod and driving the all-silicon rod to rotate by a cutting angle to adjust the cutting position; and according to the all-silicon-rod squaring machine, the number of the bearing frame sets, the number of the linear cutting units and the number of the lifting position adjusting devices each can be multiple, and the aim of squaring the multiple all-silicon rods at the same time can be achieved.

A saw apparatus for cutting a work piece includes a circular saw blade, a saw blade drive mechanism including a motor drivably connected to the saw blade and having a motor pulley, and including a blade mounting structure, a saw table including a housing with a housing side wall, and a housing top wall having a blade passing opening and being hingedly secured to and resting on the housing side wall, a housing partition defining a drive mechanism chamber and a blade mounting chamber within the housing having a drive mechanism chamber bottom wall sealingly joined to the housing side wall, and a cooling liquid contained within the blade mounting chamber, so that the blade mounting mechanism includes a blade axle extending through the housing partition between the blade mounting chamber and the drive mechanism chamber, and the blade protrudes up through the blade passing opening and down into the cooling liquid, and a blade axle pulley is secured to the blade axle, passes through the housing partition, and a belt extends from the blade axle pulley to the motor pulley.

At a milling machine to work ground surfaces, with a machine frame, a milling drum supported at the machine frame, at least one transport device arranged at the machine frame which accepts the milled material from the milling drum, as well as with a suction device for the air polluted with dusts and vapors, whereby the milled material on the at least one transport device is enclosed by a channel, the suction device is connected to a rear channel section of the channel in the direction of the material transport and sucks off the air polluted during milling at the milling drum and in the rear channel section essentially in the direction of the material transport, it is provided that the suction device consists of a suction ventilator, a separator device for solids and a suction channel which is connected to the rear channel section, that the suction ventilator is arranged downstream of the separator device, and that the suction device disposes of the separated solids onto the transport device in a forward channel section in the direction of the material transport or into a collecting device, and the suction ventilator blows off the cleaned air into the environment.

This invention relates to a method for determining a wear state of a chisel, a chisel holder, and/or a chisel holder replacement system equipped with a chisel and chisel holder. For this method to give the user qualitative and quantitative information about the wear, according to one embodiment of this invention, a position of at least one point of the chisel and/or the chisel holder is determined by a contactless measurement method and a corresponding measurement result is compared in a switching unit to a reference value stored in a memory device.

The invention relates to cooling liquid for diamond wire cutting technology, which mainly comprises a lubricant, an emulsifier, an antirust agent, a dispersant, a preservative, and deionized water, wherein the mass percents of the components are 5-50% of the lubricant, 0.05-10% of the emulsifier, 0.1-5% of the antirust agent, 0-10% of the dispersant, 0-5% of the preservative, and the balance being deionized water. The cooling liquid has excellent lubricity and dispersibility, is easy to clean, suitable for cutting of hard and brittle materials such as crystal silicon, sapphire, and the like, can not only meet requirements for diamond wire high-speed cutting, but also realize good surface finish of cut pieces, and can significantly increase product qualified rates.

The invention discloses a glass clamping device with adjustable spacing, comprising a base, a first clamping mechanism, a lead screw, a second clamping mechanism, a left sliding block and a right sliding block. The left sliding block is threaded and sleeved on the wire. The left outer ring of the rod, the right sliding block is sleeved on the right outer ring of the lead screw through a threaded connection, the bottom end of the left sliding block is fixedly welded with a second support rod, and the bottom end of the second support rod is fixedly installed with a second support rod. No. 1 connecting sleeve, the second clamping mechanism is arranged on the No. 2 connecting sleeve, the bottom end of the right slider is fixedly welded with a No. 1 support rod, and the bottom end of the No. 1 support rod is fixedly installed with a No. 1 connecting sleeve, the first The clamping mechanism is arranged on the No. 1 connecting sleeve. The invention is simple in structure, convenient in use, convenient in disassembly and maintenance, is suitable for glass workpieces of different sizes, has a wide application range, is convenient for multi-angle processing operations on glass workpieces, and is suitable for popularization and use.

A process for controlling and a core drilling machine (1) having an electrical motor (2) for rotational drive of a core drill bit (3) having cutting edges (5) oriented axial to a work piece (4), a feeding means (6) for generating the feed of the core drill bit (3) against the work piece (4) and having a controller (7) for controlling, relative to a first one-to-one control parameter, detected by a sensor (8, 8′) for electrical power consumption (P) or torque (M). A force sensor (9, 9′) is connected to the controller (7) for detecting the contact pressing force (F_N) of the core drill bit (3) as the second control parameter.