4629results about "Working accessories" patented technology

The invention provides a laser positioning method for improving gemstone cutting precision, and belongs to the technical field of gemstone cutting laser positioning. A gemstone crystal refractive index tensor model and a ray tracing algorithm are established to simulate a propagation path of light in a gemstone; a thermo-optic effect prediction model is adopted to predict a focus drift distance according to temperature distribution and laser power data and calculate wavefront predistortion phase distribution for compensation, and a zero-vibration input shaping filter is designed for a galvanometer scanning system to suppress residual vibration. A composite control strategy that feedforward control compensates inertia lag and feedback control corrects position errors is adopted to drive a galvanometer, the inherent frequency of a system is recognized through spectral analysis, and the scanning frequency is adjusted to avoid resonance. The technical problem that in the long-time machining process, due to the thermo-optic effect and vibration of a galvanometer scanning system, the laser focus point position generates accumulated drifting, and the cutting precision is reduced is solved.

The embodiment of the invention provides a dicing saw cutting pressure control method and device based on dynamic pressure prediction and a dicing saw. The method comprises the steps that S1, real-time material characteristic parameters on a cutting path are obtained through a multi-source sensor; s2, based on the material characteristic parameters, a dynamic mapping model of material characteristics and cutting pressure is established, and output parameters are predicted pressure compensation values; s3, before a cutting tool reaches a pressure sudden change area, cutting pressure is adjusted in advance according to a predicted pressure compensation value output by the dynamic mapping model, meanwhile, an actual pressure value is detected in real time through a force sensor, and pressure deviation is corrected in combination with a control algorithm; and S4, carrying out staged pressure loading on the non-uniform doping region in the heterogeneous material. According to the method, the pressure sudden change point is predicted through the dynamic mapping model, the pressure is adjusted in advance in combination with a control algorithm, and the characteristics of the adaptive heterogeneous material are loaded in stages, so that the shear mark uniformity is remarkably improved, and the material damage risk is reduced.

The application relates to the technical field of stone cutting equipment, in particular to high-efficiency stone wire saw cutting equipment, which is characterized by comprising a mounting frame, a lifting frame, a lifting driving mechanism, a stone clamping and placing mechanism and a wire saw cutting mechanism, the lifting frame is arranged in the mounting frame and is slidably connected to the mounting frame through a first sliding assembly, the lifting driving mechanism is arranged on the mounting frame and is used for driving the lifting frame to lift, the stone clamping and placing mechanism is arranged below the lifting frame and is used for clamping and placing a stone body, and the wire saw cutting mechanism is arranged on the lifting frame. The application can effectively reduce the wire breaking probability of the cutting wire, the threading overhauling after wire breaking is relatively convenient, and the consistency of the tension among the multiple cutting wires can be effectively ensured.

Provided is an environment-friendly mobile collecting box for decoration cutting dust. The mobile collecting box comprises a box body, wherein a water tank is fixedly mounted on one side of the bottomsurface of the inner wall of the box body, the bottom surface and the outer side of the water tank are fixedly connected to the inner wall of the box body separately, the inner side of the water tankis fixedly connected to one side of the box body, and openings are formed in the top surface and the other side of the box body; a first through hole is formed in the bottom of the inner side of theinner wall of the water tank, a switching valve is disposed in the first through hole, and a second through hole is formed in one side of the box body; the interior of the first through hole communicates with the interior of the second through hole, and the second through hole communicates with the interior of the box body; the top surface of the water tank is fixedly connected to one end of a hose, and the other end of the hose is arranged in the box body, and a floating plate is fixedly mounted on the periphery of the other end of the hose. Sediment in the box body can be pushed directly into the garbage bag through cooperative use of a mud box and a garbage bag, and the mud box can be taken and placed freely; after the mud box is taken out, a sealing cap of the garbage bag containing the sediment is removed, and after the garbage bag is replaced by a new garbage bag, the mud box is put back, and the sediment is not in contact with the mud box, and cleaning of the mud box by a user is not needed, so that time and labor are saved.

The invention provides a cutting height adjusting method and device of a cutting knife, wafer processing equipment and a medium, and relates to the technical field of wafer processing equipment.The method comprises the steps that the surface height difference between a sample silicon wafer on an auxiliary workbench and a to-be-processed wafer on a main working disc is measured; after the cutting knife cuts the sample silicon wafer to form a cutting mark, calculating a cutting depth value corresponding to the cutting mark; calculating the surface height information of the sample silicon wafer according to the cutting depth value of the cutting mark and the height information corresponding to the lowest point of the cutting knife when the cutting knife cuts the sample silicon wafer on the auxiliary workbench; and according to a preset cutting depth value, the surface height information of the sample silicon wafer and the surface height difference between the sample silicon wafer on the auxiliary workbench and the to-be-processed wafer, target cutting height information of the cutting knife when the cutting knife cuts the to-be-processed wafer is determined. After the height of the cutting knife is adjusted according to the target cutting height information, the cutting mark cut by the cutting knife has high-precision cutting depth.

The invention discloses a cement wall prefabricating drilling device for building construction, and relates to the technical field of building construction equipment, the cement wall prefabricating drilling device for building construction comprises a supporting bottom plate and further comprises a first drilling mechanism, and the first drilling mechanism is located above the supporting bottom plate. Therefore, the first drilling operation table is driven to be adjusted in the overall direction, the drilling requirements of different directions are met, the equipment use flexibility of overall drilling operation is improved, and the device is suitable for various scenes. According to the drilling equipment, the driving adjusting mechanism is arranged, large particles cannot enter a fixing box, recycling treatment is conducted through a recycling box at the bottom, classified storage is conducted on equipment needed on site through a classified storage box, drilling modes of different states are switched according to drilling scene needs, and the drilling efficiency is improved. And meanwhile, the functions of storage of equipment required during drilling, field environment purification during drilling, field equipment movement and the like are integrated.

The invention relates to the technical field of diamond saw blades, in particular to a laser welding diamond saw blade for ultra-narrow slit cutting and a preparation method of the laser welding diamond saw blade. The copper-cobalt-tin alloy material comprises the following raw materials: copper-cobalt-tin alloy powder, tungsten carbide powder, titanium-aluminum nitride, spherical cobalt powder, rare earth yttrium powder, ferrophosphorus powder and diamond abrasive particles. According to the preparation method, the core of the preparation method lies in the combination of powder metallurgy prefabrication of the tool bit and the precise laser welding process, especially the innovative laser welding process, and the prepared diamond saw blade is high in welding seam strength, narrow in heat affected zone and extremely small in matrix deformation; the problems of base body deformation, insufficient welding seam strength, short service life and the like of a traditional saw blade in the ultra-narrow seam cutting process are solved, and the saw blade is perfectly suitable for ultra-narrow seam cutting scenes with extremely high requirements for precision and stability.

The utility model discloses a PC imitation stone brick cutting device capable of quickly replacing a blade, and relates to the technical field of stone brick cutting, the PC imitation stone brick cutting device comprises a support frame, one side of the support frame is fixedly connected with a fixing frame, one side of the fixing frame is fixedly connected with a shell, the middle position of the other side of the shell is rotatably connected with a shaft rod, and the other side of the shaft rod is fixedly connected with a blade. A driving mechanism is arranged at one end of the shaft rod, a fixing sleeve is fixedly connected to the other end of the shaft rod, the outer side of the fixing sleeve is sleeved with a cutting blade and a first positioning disc from outside to inside, and the tail end of the fixing sleeve is connected with a second positioning disc. The positioning shaft is taken out from the interior of the second inserting hole, then the first positioning disc is conveniently slid, the positioning disc is taken down from the outer side of the fixing sleeve, meanwhile, the inserting rod is taken down from the interiors of the third inserting hole and the first inserting hole, and then the cutting blade is conveniently taken down from the outer side of the fixing sleeve to be replaced.

The invention relates to the technical field of wafer cutting, in particular to a high-stability wafer bearing platform for a wafer cutting machine, which comprises a first base, a lifting power part and a bearing table, the first base is provided with an accommodating groove; the lifting power piece is arranged in the accommodating groove; the bearing table comprises a driving ring and an objective table; the driving ring is rotationally arranged at the top of the first base; a plurality of driving tables are arranged at the edge position of the driving ring in the circumferential direction; a central shaft is arranged on the bottom surface of the objective table; the central shaft downwards penetrates through the driving ring, then extends into the accommodating groove and is connected with the output end of the lifting power piece; the central shaft is matched with the molded surface of the driving ring; a plurality of clamping assemblies in one-to-one correspondence with the driving tables are arranged at the edge position of the objective table in the circumferential direction; the clamping assembly can press a wafer placed on the top face of the objective table downwards and limit the wafer in the radial direction under the action of the driving table. According to the invention, the stability and reliability during wafer cutting or movement are improved.

The invention discloses a cutting fluid drainage nozzle of a high-measurement slicing machine, which belongs to the technical field of cutting processing equipment and comprises a base, a drainage panel, an adjustable composite damping support module, a piezoelectric adjusting strip, a microcirculation flow channel network, a vibration sensing system and a control system. Comprising a high-molecular polymer damping material layer and a high-strength light alloy restraint layer, a piezoelectric ceramic actuator is embedded, passive damping energy absorption and active vibration counteracting are achieved, a piezoelectric adjusting strip is fixed in a drainage groove, and the dual functions of local vibration suppression and flow control are achieved; vibration sensing monitors the vibration state in real time through a plurality of piezoelectric acceleration sensors, the control system achieves working condition self-adaption and frequency division cooperative control through a neural network algorithm, cooperative work is achieved through multiple vibration reduction mechanisms, the vibration suppression effect is improved, the line breakage rate is reduced, meanwhile, the functions of fault diagnosis and predictive maintenance are achieved, and the reliability of the system is improved. And the cutting precision and efficiency and the equipment intelligence level are improved.

The utility model discloses a chip frame removing structure. The chip frame removing structure comprises an X-axis module, an auxiliary sliding rail parallel to the X-axis module, a Y-axis module erected between the X-axis module and the auxiliary sliding rail, a Z-axis module vertically arranged on the Y-axis module, and a frame removing unit arranged on the Z-axis module. According to the chip frame removing structure provided by the invention, mechanical equipment is effectively utilized to replace manual work, so that the consumption of human resources is greatly reduced, the chip frame removing efficiency and effect are effectively improved, and the development and progress of enterprises and industries are well promoted.

The invention provides a precise air floating main shaft based on small hole throttling. The precise air floating main shaft comprises a cylinder barrel, a shell, a rotating shaft, a front radial air floating bearing, a rear radial air floating bearing, a front axial thrust air floating bearing, a rear axial thrust air floating bearing, a driving motor, a broach mechanism and various sensors. A reciprocating type spiral groove is formed in the outer circle of the cylinder barrel and forms a spiral cooling water channel with the shell, and the rear end cover is integrated with an air inlet interface, an air outlet interface, a cooling water interface and an air control interface; compressed gas is throttled through an axial gas path and a small hole to form a high-rigidity gas film to support the rotating shaft, and cooling water flows in the spiral water path to take away heat; the control module is based on rotating speed, displacement, temperature and pressure signals, adopts a thermal-mechanical coupling model and a predictive control algorithm, adaptively adjusts air supply pressure and cooling water flow, and is suitable for semiconductors and ultra-precision machining equipment. Through the collaborative design of the small hole throttling air bearing, the reciprocating type spiral cooling water channel and multi-sensor intelligent control, the rigidity, the heat stability and the operation reliability of the main shaft are greatly improved, and the high-precision ultra-precision machining device is suitable for long-term high-rotating-speed and high-precision ultra-precision machining.

The application relates to the technical field of wall body dismantling, and discloses a building wall body dismantling device capable of guaranteeing the completeness of old bricks, which comprises a surrounding wall and a bearing box, further comprises a dismantling unit arranged on the bearing box, the dismantling unit comprises a flattening component and a cutting component arranged in the bearing box; the flattening component comprises shafts arranged on the inner walls of the bearing box, deflection frames arranged on the shafts, and a plurality of connecting rods arranged on the inner walls of the deflection frames; through the dismantling unit, a construction worker can divide a wall body into a plurality of wall body units when dismantling the wall body, and slowly lays down the single wall body units one by one, and through the cutting unit, the wall body units after being laid down are cut in the horizontal direction, the wall body units are divided into strips one by one, and then the strip-shaped wall bodies are cut into single bricks, so that the safety during the dismantling of the wall body is effectively improved, the completeness of the bricks is guaranteed, the construction cost is reduced, and the utilization rate of resources is improved.

The utility model provides a bar sticking machine. The bar sticking machine comprises a rack, a rolling bar and a rotation angle detection mechanism, the rolling bar is rotatably arranged on the rack; the rotation angle detection mechanism comprises a mounting frame, a base body and an angle detection element; the mounting frame is connected to the rack, the base body is rotationally arranged on the mounting frame and at least partially located at one axial end of the rolling bar, the rotating axis of the base body extends in the axial direction of the rolling bar, and an alignment part is arranged on the base body; the angle detection element detects the rotation angle of the base. During application, the rolling bar bears a crystal bar and drives the crystal bar to rotate, the rotation angle detection mechanism detects whether the rotation angle of the crystal bar is a preset angle or not, and specifically, when the notch of the crystal bar is located at the zero position, the alignment part is aligned with the notch, and the rotation axis of the base body coincides with the axis of the crystal bar; then the rolling bar and the base body are controlled to rotate, so that the alignment part is aligned with the notch, the rotation angle of the base body is detected through the angle detection element, and the rolling bar is controlled to stop rotating when the rotation angle of the base body reaches a preset angle. The rotation angle detection mechanism is not in contact with the rolling bar and the crystal bar, the detection precision of the angle detection element is not influenced by the rolling bar and the crystal bar, and the reliability is high.

The invention relates to the technical field of cement prefabricated products, and discloses a multi-station drilling device for cement prefabricated product production, which comprises a rack, a controller is fixedly mounted on one side of the rack, four mounting frames are fixedly connected to the interior of the rack through bolts, U-shaped blocks are arranged in the mounting frames, and the U-shaped blocks are fixedly connected with the controller through bolts. A punching motor is fixedly mounted in the U-shaped block, the output end of the punching motor penetrates to the bottom of the U-shaped block and is fixedly connected with a drill bit, and a hydraulic rod is fixedly mounted at the top of the mounting frame. By arranging the gas collecting mechanism, a transmission motor can be started while punching is conducted, the transmission motor can drive a transmission rod and a lead screw to rotate and be matched with the gas collecting mechanism, compressed gas is intermittently sprayed out of a gas spraying pipe and then sprayed into a hole through a trapezoid spraying head, dust in the hole is blown out, and the situation that a drill bit is stuck due to dust particle accumulation is avoided; and therefore, the punching speed is increased.

The invention relates to the technical field of precision machining control, and discloses an intelligent control method for a cutting path of a scribing machine, which comprises the following steps: acquiring a load current signal of a main shaft servo motor in real time and storing the load current signal into a sliding window data queue; performing weighted differential calculation to obtain a real-time load change rate representing a load trend, and calculating an average absolute deviation to obtain an oscillation state quantity representing load dispersion; querying based on a preset nonlinear gain scheduling relationship to obtain a first speed regulation coefficient and an oscillation suppression coefficient; according to the method, an orthogonal dual-channel feed-forward control mechanism is constructed in the same data window, and multiplication cooperation of weighted differential and dispersion statistics is utilized, so that a feed speed set value is corrected in real time; the problems of phase lag and response mismatch of conventional feedback control in the case of transient impact and microcosmic oscillation of hard and brittle materials are solved.

The invention relates to the technical field of wafer cutting machines, in particular to a large-stroke wafer cutting machine suitable for large-size wafer cutting, which comprises a base and a stand column arranged on the base, a placing assembly is movably arranged on the base; the stand column is movably provided with a movable base. A lifting seat is movably arranged on the moving seat; a cutter assembly is rotationally arranged at the bottom of the lifting base. A driving plate is movably arranged on the lifting seat; the driving plate is provided with a trigger pin in a floating manner; the lifting seat is provided with a reset plate at the top of the driving plate; a reset spring is arranged between the reset plate and the driving plate; the movable seat is provided with an ejector rod; a driving barrel is rotationally arranged on the lifting seat; a driving groove is formed in the outer wall of the driving barrel. Through one-time up-and-down circulating action of the lifting base, reversing of the cutter assembly can be achieved; after the cutter assembly is reversed, the placing assembly drives the wafer to move reversely, and the cutter assembly can continue to cut the next cutting channel of the wafer in a reverse cutting mode without returning to the initial side in an idle stroke, so that the cutting efficiency is improved.

According to the three-axis trepanning machining center disclosed by the utility model, the appropriate cutter can be automatically taken according to different materials to be machined in a mode of firstly positioning and then automatically taking the cutter to machine the materials to be machined, namely, the cutter can be automatically replaced, so that the problems in the prior art can be solved. The three-shaft trepanning machining center comprises a conveying mechanism 1, a positioning mechanism 2, a clamping mechanism 3, a tool magazine mechanism 4 and an electric spindle mechanism 5 which are arranged on a rack 6. The conveying mechanism 1 is used for conveying materials to be processed; the positioning mechanism 2 is used for positioning the to-be-processed material; the clamping mechanism 3 is used for clamping the to-be-processed material conveyed to the preset position; and the motorized spindle mechanism 5 takes and places the tools from the tool magazine mechanism 4 and processes the clamped to-be-processed materials.

The utility model relates to a ceramic tile cutting machine head for a track ceramic tile cutting machine, which comprises a ceramic tile cutting machine head, and the ceramic tile cutting machine head consists of a machine head sliding body, a cutter wheel lifting connecting seat and a cutter wheel; the upper portion of the machine head sliding body is a sliding rail guide sleeve, the lower portion of the machine head sliding body is in lifting fixed fit with the cutter wheel lifting connecting base, and the cutter wheel is installed on the cutter wheel lifting connecting base. The cutting wheel has the advantages that firstly, the defect of lateral stress during ceramic tile cutting is overcome, vertical stress of the center of the cutting wheel is realized, and the glaze surface of the ceramic tile can be well scratched to ensure effective cutting; secondly, the auxiliary wheel and the cutter wheel are synchronously adjusted, so that the ceramic tile cutting machine is suitable for guiding and cutting ceramic tiles with different thicknesses, and also plays a good auxiliary guiding role on the cutter wheel; and thirdly, due to the compression amount design of the auxiliary wheel, rigid impact with the cutter wheel is avoided, the cutting force of the cutter wheel is limited, the direct action of excessive force on the cutter wheel is dispersed, and the phenomenon that the cut ceramic tile is damaged due to excessive force during cutting is avoided.

A slab processing machine includes a work table, a machining head, and at least one drive mechanism. The machining head mounts a circular saw blade for respective cutting of a stone or stone-like slab positioned on the work table with a finished face of the slab down on vacuum pods. A controller operates the machining head to rotate the machining head on the A-axis and bevel cut the slab while positioned upside down with the finished face down on the vacuum pods.

The invention provides a ceramic flat sheet membrane end seal bonding surface roughening treatment device, and relates to the technical field of flat sheet ceramic membrane manufacturing, the ceramic flat sheet membrane end seal bonding surface roughening treatment device comprises a fixing plate, two grooves are formed in the outer wall of the fixing plate, connecting rods are slidably connected to the positions, corresponding to the grooves, of the outer wall of the fixing plate, and fixers are fixedly connected to the outer walls of the connecting rods; a pressure sensor is installed on the outer wall of the bottom end of the fixator, supporting plates are fixedly connected to the outer walls of the two sides of the fixing plate, adjusters are installed on the outer walls of the supporting plates, adjusting rods are fixedly connected to the outer walls of the adjusters, and a plurality of threaded holes are formed in the outer walls of the adjusting rods. According to the device, the groove structure of the continuous sinusoidal waveform structure similar to the gecko sole line is adopted, the binding force between the polymer and the plastic end seal can be improved to a great extent, the pressure sensor and other structures are additionally arranged, the machining state of the device can be detected in real time, and therefore the practicability of the device is higher.

The utility model relates to a drill bit for ceramic tile drilling, which belongs to the technical field of drill bits and comprises a barrel and a tool bit, a connecting column is mounted at the top of the barrel, a connector is mounted at the top of the connecting column, the tool bit is connected to the bottom of the barrel, a plurality of convex teeth and concave teeth which are alternately arranged are arranged on the tool bit, and the convex teeth and the concave teeth form a wavy structure on the tool bit. A water storage cavity is formed in the barrel, a water injection opening is formed in the side wall of the connecting column, a through water injection channel is arranged between the water injection opening and the water storage cavity, and a one-way valve structure is installed at the joint of the water storage cavity and the water injection channel. The tool bit made of the integrally-formed diamond alloy material is arranged at the bottom of the barrel, so that tool bit abrasion caused by falling of diamond sand is avoided, the service life is prolonged, and the durability is improved; the convex teeth and the concave teeth are alternately arranged on the tool bit, so that the tapping time is short; the water storage cavity is formed in the cylinder to absorb heat, the one-way valve structure is installed to prevent internal cooling water from spilling out when the drill bit rotates, heat dissipation of the drill bit is faster, and the working efficiency is improved.

The invention relates to the technical field of wafer cutting, in particular to a wafer cutting machine capable of quickly replacing cutters, which comprises a cutter rest, a main shaft and a centering mechanism, the main shaft is provided with a locking bayonet; the centering mechanism comprises a centering rotating disc, a locking sliding rod, a rotating disc and a pressing ring. A centering assembly is arranged on the centering rotary table in the circumferential direction; one end of the locking sliding rod is provided with a locking structure used for being matched with the locking bayonet in an unlocking and locking mode. The rotating disc is provided with a centering hole and a pressing assembly in the circumferential direction. The centering assembly is movably matched with the centering hole, so that when the rotating disc rotates, the rotating disc drives the centering assembly to extend out in the radial direction through the centering hole, the cutting blade is self-centered, the rotating disc continues to be rotated after the cutting blade is centered, and the centering assembly drives the corresponding pressing assembly to apply pressing force to the pressing ring; the cutting blade is pressed between the pressing ring and the knife rest; the blade replacement time is shortened, the operation of manually contacting the blade is reduced, the safety risk is reduced, and the mounting efficiency and the mounting precision are improved.

The invention provides a silicon carbide crystal ingot defect detecting and cutting device based on optical coherence tomography, and belongs to the technical field of silicon carbide crystal ingot defect detecting and cutting. In order to solve the technical problems that after a traditional crystal ingot is cut, the detection efficiency is low, imaging is not timely, the imaging resolution is low, and the portability and the linkage performance are poor due to the fact that detection equipment and cutting equipment are separated, the adopted technical scheme is that the output end of an OCT module is connected with the input end of a sample arm module through a wire; the sample arm module is installed below the sample arm support through the sample arm lifting support, and supporting legs on the two sides of the sample arm support are installed on the base. A fixed seat is arranged right below the sample arm module, the fixed seat is mounted on the base through a lifting base, and a crystal ingot is placed on the fixed seat; rolling wheels are further arranged on the two sides of the fixing base and placed on the base, and a cutting line is further connected between the two rolling wheels; the method is applied to defect detection of the silicon carbide crystal ingot.

This invention discloses a robot and method for drilling and installing gypsum board ceilings, comprising: a movable platform system; a lifting structure system installed on the movable platform system to raise the top working platform to a corresponding height for construction operations; a drilling turntable system installed on the working platform, comprising a turntable, a motor turntable for driving the turntable to rotate, and dust removal, drilling, and repair spraying parts evenly installed around the turntable, for realizing the functions of drilling, dust removal, and repair spraying of gypsum board ceilings; a keel delivery system for delivering main and secondary keels and gripping gypsum board; a gypsum board lifting system for lifting gypsum board; and a gypsum board cutting system for cutting gypsum board. This invention integrates gypsum board ceiling drilling and installation, automatically completing commands such as drilling and installation of gypsum board ceilings, further improving construction efficiency and quality.

The invention discloses an edge sealing and rolling cutting device for gypsum board production, which comprises a conveying frame for conveying gypsum boards, a tensioning tray, a gluing mechanism, a guide wheel set and a pressing mechanism are arranged on the conveying frame, an edge sealing belt is wound on the tensioning tray, and the edge sealing and rolling cutting device further comprises a guide strip mounted on the conveying frame, the guide strip guides the bottom end of the edge sealing belt to abut against the bottom end of the gypsum board firstly, the press-fit mechanism comprises a driving part and a press-fit part, and the driving part drives the press-fit part to push the edge sealing belt to adhere to the gypsum board from bottom to top along an oblique line; by arranging the guide strip, the bottom end of the edge sealing belt is firstly adhered to the bottom end of the gypsum board, then the pressing part is driven by the driving part to push the edge sealing belt to be adhered to the side wall of the gypsum board from bottom to top along an oblique line, and a glue solution moves upwards along the adhesion direction of the edge sealing belt under the action of shear force and overflows from the gypsum board and the edge of the upper end of the edge sealing belt; and the situation that redundant glue liquid overflows from the lower end of the gypsum board to the conveying frame, and the appearance quality of the gypsum board is affected is avoided.

The invention provides a wafer stripping device and a control method thereof, and belongs to the technical field of semiconductor processing. The wafer stripping device comprises an ultrasonic water tank, wherein a liquid medium for transmitting ultrasonic waves is accommodated in the ultrasonic water tank; the ultrasonic generator is arranged in the liquid medium, and the radiating surface of the ultrasonic generator faces the top of the ultrasonic pool; the movement mechanism is used for installing the crystal ingot, so that the target end of the crystal ingot faces the ultrasonic water tank, the target end of the crystal ingot is close to the modified layer, the end face of the target end is parallel to the radiating surface of the ultrasonic generator, and the movement mechanism is further used for controllably driving the crystal ingot to rotate in the axial direction of the crystal ingot and move in a reciprocating mode in the horizontal direction; wherein the movement mechanism is used for driving the crystal ingot to rotate at a preset rotating speed and move along the horizontal direction at a preset speed, so that the energy of the ultrasonic generator continuously acts on the modified layer of the crystal ingot to strip the wafer. According to the wafer stripping device, the probability of wafer cracking can be remarkably reduced.

The utility model discloses an indoor top drilling assembly which comprises an upper supporting rod, a lower supporting rod and a lower supporting rod. The lower supporting rod is of a hollow structure; the compression spring is clamped between the upper supporting rod and the lower supporting rod and is configured to adjust the distance between the upper supporting rod and the lower supporting rod; the guide rod sequentially penetrates through the upper supporting rod, the compression spring and the lower supporting rod and is connected with the lower supporting rod; the sliding rod penetrates through the upper end of the upper supporting rod and is connected with the upper supporting rod; the electric drill is fixedly connected with the upper end of the sliding rod and comprises a drill bit and an electric drill body, and the drill bit is arranged in the vertical direction. According to the drilling assembly, an operator can still conduct drilling operation at the high altitude of the top in a room under the condition that the operator is located at the low ground position, operation is easy, and working efficiency is high; and particularly, when the number of to-be-drilled holes in the indoor top is large and the to-be-drilled holes are dispersed, the drilling efficiency is effectively improved.

The utility model discloses a fixing clamp for quartz rod grooving, and relates to the field of quartz rod machining. Vertical plates are fixedly mounted on the two sides of the base, mounting bases are movably mounted on the opposite sides of the pair of vertical plates, cavities are formed in the mounting bases, driving plates are movably mounted in the cavities, the middles of the driving plates extend to the positions above the mounting bases, and a pair of connecting plates are hinged to the inner walls of the mounting bases. A pair of connecting plates are arranged on the inner wall of the mounting base, the connecting plates are connected with the driving plate through a linkage assembly, a pair of clamping plates is hinged to the tops of the connecting plates, the clamping plates are hinged to the inner wall of the mounting base, and chucks are mounted on the tops of the driving plate and the clamping plates. The technical problems that a quartz rod needs to be clamped and fixed by adjusting a plurality of bolts in the prior art, the operation process is complex, time and labor are wasted, and the working efficiency is low are solved.

The invention relates to the technical field of aspherical lens machining, in particular to an edge milling device for aspherical lens machining, which comprises a clamping assembly, a first milling assembly and a second milling assembly, the milling assembly comprises a milling cutter for grinding the edge of the aspherical lens and a grinding rod for grinding the surface of the aspherical lens; the fixing assembly is used for fixing the milling cutter and the polishing rod; the protection assembly is arranged outside the clamping plates in a sleeving manner and is used for surrounding the lens between the two groups of clamping plates; the grinding device has the beneficial effects that through cooperation of the bolts and the mounting plates, the grinding rods are mounted on one sides of the clamping plates, then the lens is adsorbed to the other set of clamping plates, surface grinding of the aspheric lens is achieved, when the edge of the aspheric surface needs to be ground, the lens is clamped through the clamping assemblies, a milling cutter is driven by the connecting rods to be inserted between the two sets of clamping plates, and grinding is achieved. The edge of the aspherical lens is ground, all-directional grinding machining of the aspherical lens can be achieved without replacing equipment, and the production efficiency is improved.