13153results about "Grinding/polishing safety devices" patented technology

The present invention discloses a CMP pad dresser which has a plurality of uniformly spaced abrasive particles protruding therefrom. The abrasive particles are super hard materials, and are typically diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), or polycrystalline cubic boron nitride(PcBN). The abrasive particles are brazed to a substrate which may be then coated with an additional anti-corrosive layer. The anti-corrosive layer is usually a diamond or diamond-like carbon which is coated over the surface of the disk to prevent erosion of the brazing alloy by the chemical slurry used in conjunction with the CMP pad. This immunity to chemical attack allows the CMP pad dresser to dress the pad while it is polishing a workpiece. In addition to even spacing on the substrate, the abrasive particles extend for a uniform distance away from the substrate, allowing for even grooming or dressing of a CMP pad both in vertical and horizontal directions. A method of producing such a CMP pad dresser is also disclosed.

A power tool (10) having a dust suction device (19) integrated into its housing (12) and having an ejection fitting (20) which is connected to the dust suction device (19) and can be detachably fastened with its injection fitting (22) to a dustproof dust box (21) is particularly suitable for containing sanding dust because of a number of side walls (34) of the dust box (21) have air openings (40) and on the inside, support at least one filter element (48), in particular a folded filter, which overlaps the air openings (40).

The disclosure relates to abrasive articles useful in chemical-mechanical polishing (CMP), the articles including a substrate with opposite major surfaces, an abrasive material overlaying at least a portion of at least one of the major surfaces, a means for providing CMP information positioned near the substrate, and a transmitter positioned near the substrate and adapted to transmit the CMP information to a remote receiver. The disclosure also relates to a CMP pad conditioner having a means for communicating CMP information, a CMP process monitoring system, and a method for conditioning a CMP pad.

An auxiliary dust collection system can be interposed between a sander or other dust producing tool and a vacuum source, e.g., shop vacuum. This auxiliary system has a cyclonic separator connected by a flexible hose to the tool and by another hose to the vacuum source. The cone of the separator is mounted onto the lid of a drum into which the dust precipitates. For a tool that has its own blower, the vacuum source can be omitted, and the air leaving the outlet duct of the separator can be filtered and returned to the ambient. A drop in silencer formed of a sleeve or tube of acoustic foam can be positioned into the inlet side of a filter cartridge following a cyclonic separator. The silencer absorbs a significant fraction of the process noise.

A cutting and dust collecting assembly comprises a rotatable, circular saw blade (4) having a first side (20), a second side (21), and a cover device (6) with a terminal member (52). The bottom surface (36) of the cover device extends in a plane. A longitudinal passage (45, 46) for the saw blade extends through the cover device from its top surface to its bottom surface. The terminal member comprises a terminal chamber (60) having an inlet (45a), the mouth of which coincides with the plane of said bottom surface. An outlet (58) can be connected to a vacuum source. The direction of rotation of the operating blade is such that the rear part (4a) of the saw blade which has passed beyond the bottom surface of the cover device will move in a direction upwards-rearwards towards the bottom surface. The invention also concerns the cover device, a sealing body belonging to the cover device and a working machine which is provided with the cutting and dust collecting assembly.

A removable guard for a hand-held power tool. The guard is configured to cover an area proximate a spindle assembly of the tool between the spindle assembly and a user of the tool. The guard is further configured to be securely mounted to a semi-elastic lower bearing housing supporting the spindle assembly of the tool. The guard, when mounted to the semi-elastic lower bearing housing of the tool, and when in use during operation of the tool, must remain functional under conditions of flying debris, such as under conditions of an exploding, rotating abrasive grinding wheel mounted on the spindle assembly of the tool.The guard includes a clamp ring depending from a guard hood. The clamp ring's inner circumferential portion has at least a partially-knurled surface, whereby when securely tightened around the semi-elastic lower bearing housing, the at least partially-knurled surface of the clamp ring inner circumferential portion compresses into the semi-elastic lower bearing housing to securely mount the guard to the tool.

An improved method of in-situ conditioning of a polishing pad for use with a stationary pad conditioner during chemical mechanical polishing is described. A polishing table having a polishing pad on its surface is rotated in a first direction during polishing of a semiconductor wafer. A polishing pad conditioner is adjustably attached to the rotating polishing table such that the conditioner is stationary in relation to the rotating polishing table. The conditioner has a roughened surface which is in contact with the polishing pad providing in-situ conditioning during polishing of a semiconductor wafer. After polishing of the semiconductor wafer, the polishing table is rotated in a second direction while the conditioner is still in contact with polishing pad. Rotating the polishing pad in a second direction dislodges the polishing debris clogging the roughened surface of the conditioner and redistributes CMP slurry. The roughened surface of the pad conditioner is refreshed allowing more effective conditioning of the polishing pad. Pad life is prolonged, polishing is stabilized, and the polish cycle time is reduced.

An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

In the electrodeposited abrasive wheel 20 of the abrasive tool according to the present invention, plural mound parts 21, which are upheaved at the central domain of base metal 19 in almost columnar shape, are arranged mostly in the shape of lattice. An abrasive grain layer 22 is formed on a base metal 19, and plural ultra abrasive grains 14 are adhered only to each mound parts 21 by electrodeposited metal phase 25, and referred as the small abrasive-grain-layer parts 24, respectively. Ultra abrasive grains are laid out at corner R part 21a and top 21b of the mound parts 21 at the small abrasive-grain-layer parts 24. Ultra abrasive grains at each small abrasive-grain-layer parts are set as 11-500 pieces, and the rate which ultra abrasive grains occupy to the whole area of abrasive grain layer accounted by plane projection is set as 20%-80% of the range. At the time of grinding, only ultra abrasive grains contact to grinding work piece, then high abutment pressure is maintained, and sharpness and the discharge performance of ground wastes are good.

A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A bonding system employing finely powdered aluminum oxide particles mixed with a suitable adhesive is employed to bond the abrasive layer to the aluminum oxide substrate. Silicon carbide particles mixed into a compatible adhesive carrier including a polymer composition is preferred for bonding the abrasive particle layer to a graphite or carbide substrate.

A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques for manipulating the workpiece; arrangements and/or operations designed for cooling and swarf (debris) removal; controls and/or automation that can be used in conjunction with these features.

An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

A conditioning tool for restoring a used CMP polishing pad to an operable condition. The tool includes a base that attaches to a driven machine and has a surface from which a shoulder protrudes that receives a peripheral edge of a disk. The disk has two opposing surfaces, each of which is substantially planar and has abrasive mounted thereon. The disk's peripheral edge is held in place between the base shoulder and a ring that has a shoulder that is complementary to the disk's peripheral edge. The ring is fastened to the base with the abrasive of the first disk surface protruding through an aperture in the ring, and the opposing disk surface spaced from the base's surface. After the disk's first surface is worn, the disk can be turned around to expose the opposite surface's abrasive to a CMP pad.

An apparatus for polishing a substrate is provided. The apparatus includes: a rotatable polishing table supporting a polishing pad; a substrate holder configured to hold a substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate; a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad; a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface; and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

The invention relates to a steel plate surface polishing device, in particular to a steel plate surface polishing device for hardware machining. The steel plate surface polishing device for hardware machining aims to achieve the technical purposes that manual labor is not needed, the requirement for professional operation skills is not high, operation is easy, the price-performance ratio is high, the safety coefficient is high, and harm of the operation environment to health of operators is small. In order to achieve the technical purposes, the steel plate surface polishing device for hardware machining comprises a bottom plate, a first sliding rail, a first sliding block, a collection tank, a fixing stop block, a spring, a supporting rod, a first bearing pedestal, a first air cylinder, a disc and the like, wherein the first sliding rail is arranged in the middle of the top of the bottom plate. Through ingenious cooperation of the components, the effects that manual labor is not needed, the requirement for professional operation skills is not high, operation is easy, the price-performance ratio is high, the safety coefficient is high, and harm of the operation environment to health of the operators is small are achieved.

A dressing blade for finishing and reconditioning new and used abrasive grinding and cutting tools has a slab-shaped shank with an extension protruding longitudinally from the shank. Superabrasive grains are disposed on the surface of the extension and held in place by a brazed metal composition. This composition is formed by brazing a powdered mixture of brazing metal components and active metal components. Specific extension configurations are provided which allow aligning the superabrasive grains in single layer arrangement for precise dressing and simple fabrication of the tool. The novel dressing tool exhibits excellent wear characteristics.

The invention relates to the field of machining, in particular to a nano particle jet flow micro-scale lubricating and grinding three-phase flow supply system. The system is characterized in that: nano fluid is conveyed to a nozzle by a liquid path, high temperature gas enters the nozzle through a gas path at the same time, the high pressure gas and the nano fluid are fully mixed and atomized in the mixing room of the nozzle, the mixed high pressure gas and nano fluid are accelerated in an acceleration room and enter a vortex room, compressed gas enters from the vent hole of the vortex room, and a three-phase flow is further mixed and accelerated by rotating, and is jetted in the form of atomized liquid drops to a grinding area through the outlet of the nozzle. The system has the advantages that: the helical vent hole of the mixing room of the nozzle is tangent to the wall surface of the mixing room, and the nano fluid and the gas are uniformly mixed; pressure adjusting valves, throttles and flow meters are arranged in the gas path and the liquid path, and the pressure and the flow of the nano fluid and the high pressure gas can be adjusted as required so as to achieve an optimal micro-scale lubricating effect; and the problems of insufficient cooling capability in micro-scale lubricating, the large using quantity of a lubricant in pouring type grinding, high waste liquid processing cost and heavy environment pollution are solved.

A guard for a rotary cutting tool allows for automatic adjustment of the guard relative to the cutting disc and to a workpiece. Such an automatic adjustment allows a user to cut around substantially the entire circumference of a rounded workpiece, such as a pipe, without requiring alteration of the angle at which the tool is held, repositioning by the user, or repositioning or removal of the guard. The guard includes a bracket for mounting the guard to the rotary cutting tool, a hood mounted to the bracket and enclosing a portion of the cutting disc, and a spring for biasing one end of the hood into substantially continuous contact with the workpiece during operation of the rotary cutting tool.

A flexible vacuum shroud provides an improved seal to the work surface and allows for use on curved surfaces. The shroud incorporates support structures around the cutting tool hole which improve performance with different cutting tools and which prevent collapse of the shroud.

A method of using a finishing element having a fixed abrasive finishing surface including boundary lubricants for finishing semiconductor wafers is described. The lubricants in the finishing element are transferred to operative finishing interface a forming lubricating boundary layer. The lubricating boundary layer thickness is controlled to improve finishing and reduce unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.

A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.

A fluid is filtered by first preparing a filter which includes a base filter and solid substances provided on the base filter, such that the solid substances differ from objects within the fluid to be filtered that are removed by the filter. The objects of filtration are filtered by supplying the fluid to the filter. During filtration, a force is applied to the filter to move the solid substances and objects deposited on the filter. The application of such force thus allows continuous filtration through the filter. The force can take the form of application of rising bubbles, a mechanical vibration or sonic waves to the filter. The filtration method is useful in processing fluid waste from mechanical processes, such as CMP steps.

The invention discloses a pipeline inner wall rust removal device, belonging to the technical field of polishing units. The device comprises a first end cover and a second end cover which are hermetically installed at two ends of the pipeline, a rust removal trolley is arranged in the pipeline, the dust removal trolley comprises a pneumatic motor with dual output shafts, a shell of the pneumatic motor is provided with a plurality of support shafts, the end part of each support shaft is provided with a roller wheel, a grinding disc is fixedly installed on the output shaft of the pneumatic motor, close to the first end cover, and is provided with a plurality of support rods in the radial direction, the end part of each support rod is provided with an abrasive disc, the output shaft of the pneumatic motor, close to the second end cover, is connected with a shot-blasting machine in a transmission manner; the end part of the grinding disc is connected with a traction rope, the traction rope extends out of the first end cover, one end of the shot-blasting machine, close to the second end cover, is connected with a shot feeding pipe, the pneumatic motor is connected with a gas inlet pipe, the shot feeding pipe and the gas inlet pipe extend out of the second end cover. The pipeline inner wall rust removal device can be used for solving the technical problems that the pipeline inner wall is serious in rust removal pollution and the rust removal effect is poor, and can be widely applied to pipeline cleaning.

A compact, hand held carpet and upholstery extractor nozzle is provided having an air turbine and a compact gear reduction operatively connected to and driven by said turbine. At least a pair of scrub modules are interchangeably attachable to said gear reduction. A first scrub modules includes at least a pair of vertical axis scrub brushes for cleaning upholstery, carpeting and the like. When said first scrub module is attached to said gear reduction, the scrub brushes are operatively connected to and driven by said gear reduction. A second scrub module includes a single vertical axis scrub pad that is driven by said gear reduction for scouring hard surfaces, such as tiles, tubs, counter tops, etc.

The present disclosure is directed to a dust vacuuming abrasive tool comprising an abrasive sheet material having an abrasive surface, a back surface and 20 or more perforations; and a backup pad having a support surface, a back surface and 20 or more perforations, or a plurality of perforations and also having, in the supporting surface. The configuration of the abrasive sheet and back-up pad eliminate the need to align perforations in the abrasive sheet and back-up pad.

A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

Simultaneous double-side grinding of a plurality of semiconductor wafers involves positioning each wafer freely in a cutout of one of plural carriers which rotate on a cycloidal trajectory, wherein the wafers are machined between two rotating ring-shaped working disks, each disk having a working layer of bonded abrasive, wherein the form of the working gap between working layers is determined during grinding and the form of the working area of at least one disk is altered such that the gap has a predetermined form. The wafers, during machining, may temporarily overhang the gap. The carrier is optionally composed only of a first material, or is completely or partly coated with the first material such that during machining only the first material contacts the working layer, and the first material does not reduce the machining ability of the working layer.

The invention discloses mold grinding and cleaning equipment in the technical field of mold processing equipment, comprising a movable support, a base is welded to the top of the movable support, a transparent cabinet is arranged on the top of the base, and the upper part of the inner wall of the transparent cabinet is There is a micro-vacuum cleaner, the top of the inner cavity of the base is fixed with a grid plate by screws, the side of the base is provided with an air inlet pipe and a liquid inlet pipe through a through hole, and through the rotating grinding wheel up and down, left and right, not only The flat surface can be polished, and the curved surface can be polished at the same time. The air inlet pipe and the liquid inlet pipe respectively use nozzles to eject air flow and liquid flow to clean the mold, and then filter out the grinding debris through the filter device to reduce pollution. The vacuum cleaner absorbs the dust generated during grinding and reduces the dust damage to the workers. The device has simple structure, convenient operation and strong practicability.

The invention discloses a synchronous dust extraction steel tube piece inner wall polishing device which comprises an outer box and a base. A transverse support is arranged on the right side of the top of the base, a second stretchable cylinder is arranged on the left side of the transverse support, a rotary barrel is rotationally arranged on a vertical support, an eccentric gear is installed at the left end of the rotary barrel, a fixing rod is installed on the left side of the eccentric gear, and a polishing rod is installed at the left end of the fixing rod; and a driven belt wheel on the rotary barrel is connected with a driving belt wheel through a triangular belt, the driving belt wheel is fixedly installed on an output shaft of a driving motor, and the lower end of a piston rod of a first stretchable cylinder on the left side of the outer box and the upper end of a piston rod of a third stretchable cylinder are provided with an upper clamping plate and a lower clamping plate corresponding. By means of the synchronous dust extraction steel tube piece inner wall polishing device, the steel tube polishing time is greatly saved, steel tube polishing is more sufficient, the steel tube polishing quality and working efficiency are improved, synchronous dust extraction during polishing is achieved, the clean and tidy working environment is kept, and the health of workers is facilitated.

An electrical hand tool is proposed, whose handle, with is rotatably maintained on the motor housing, and has a maintenance opening. By means of this, the structural length of the hand tool is reduced, servicing is simplified and the production costs are lowered.