3591results about How to "Easy to polish" patented technology

A powered toothbrush to provide oral hygiene having a brush section with a first bristle carrier that is powered and driven to rotate in an oscillating manner through a prescribed angle. A second bristle carrier is pivotally connected to the first bristle carrier and also pivotally connected to the brush section. The second bristle carrier oscillates in accordance with the oscillation of the first bristle carrier in a sectorial manner. The bristle carriers may include a variety of elastomeric and non-elastomeric bristles or combinations thereof to provide cleaning, polishing, whitening and stimulating to the teeth and gums.

Method for making diamond bearings and diamond bearing components. Some methods include sintering diamond feedstock and a substrate under high pressure and high temperature to create a sintered polycrystalline diamond compact with a non-planar bearing and articulation surface. Various machining, grinding and polishing methods for finishing the compact are provided.

Described is a fragrance-containing and fragrance-emitting polymeric fiber which optionally contains (i) at least one antimicrobial agent; and (ii) at least one compatible coloring material or color-forming material which is useful in the ascertainment of the exhaustion or substantial reduction of fragrance, produced by either (i) a processing comprising the steps of:(a) co-extruding fragrance and optionally (i) antimicrobial agent and/or (ii) at least one compatible coloring material or color-forming material which is useful for ascertainment of the exhaustion or substantial reduction of fragrance with a thermoplastic polymer to form an extrudate;(b) forming fragrance and (optionally (i) antimicrobial agent and/or (ii) at least one compatible coloring material or color-forming material which is useful for ascertainment of the exhaustion or substantial reduction of fragrance agent)-emitting particles which may or may not be foamed from the extrudate; and(c) extruding a fiber of from about 3 denier up to about 60 denier from the thus-formed particles;or (ii) a process comprising the steps of:(a) forming fragrance-emitting particles, foamed or not foamed, from a mixture of fragrance and thermoplastic polymer; and then(b) extruding a fiber of from about 3 denier up to about 60 denier from the thus-formed particles.

The present invention provides an oxide CMP slurry composition for use in planarizing silicon oxide-containing films via CMP during CMOS device fabrication, and a method of planarizing silicon oxide-containing films via CMP using the slurry composition. The oxide CMP slurry composition according to the invention includes: (i) proline, lysine and/or arginine; (ii) a pyrrolidone compound; and (iii) abrasive particles. Proline is presently most preferred for use in the invention. In the STI sub-process of the CMOS device fabrication process, the oxide CMP slurry composition according to the present invention acts to aggressively remove only the silicon dioxide overburden on the processed wafer that is in contact with a polishing pad, which results in the formation of a substantially planar, defect-free surface. The oxide CMP slurry composition according to the invention does not aggressively remove trench silicon dioxide thereby allowing for extended polishing beyond the end point without substantially increasing the minimum step height.

The invention relates to a high-sealing polyacrylic ester dispersoid and a preparation method thereof; a multi-element emulsifier system which consists of an anionic emulsifier and a compound non-ionic emulsifier is adopted for controlling the charging process and components of the emulsifier in different polymerization periods, and the room-temperature self-crosslinking high-sealing polyacrylic ester dispersoid is prepared by a semi-continuous seeding emulsion polymerization process. The dispersoid has small particle size, good electrolyte-resistance (calcium ion) stability and high tolerance to various film forming accessory ingredients (various organic solvents with high boiling point). The dispersoid is used as seal coat of water-based wood coating and has good sealing performance to various woods; harmful volatile organic compounds (VOC) such as formaldehyde, and the like sealed against escaping from plates to pollute indoor environment, and the colored compounds such as turpentine, pine oil and tannin and the like are sealed against dissolving out of the plates to pollute pure top coating and white top coating of a water-based wooden ware; and in addition, the dispersoid can be used in water-based leather finishing agents.

A suture cutter having a handle and a barrel with a movable cutting head on the barrel, and the barrel supporting a stationary cutting edge and a movable cutting edge. A movable support carries the movable cutting edge and includes a surface spaced from the stationary cutting edge a selected distance. An abutment wall spaced from the stationary cutting edge at the selected distance provides for snugly restricting movement of the moving cutting edge away from cutting contact with the stationary cutting edge while cutting the suture. Recesses are defined on a guiding support surface along which the movable cutting edge slides when the handle is actuated, allowing for sharpening of the moveable cutting edge when said edge is retracted proximally.

The invention provides a solidified abrading agent polishing pad and the preparation method thereof. The solidified abrading agent polishing pad comprises at least three layers, including an elastic layer (3), a rigid layer (2) and an abrading agent layer (1) sequentially arranged from the bottom layer to the top layer. The solidified abrading agent polishing pad is characterized in that the abrading agent layer (1) comprises the following components by the weight percentage: 1% to 40% of an abrading agent with the particle size being 1 nm to 40 Mum, 20% to 80% of polyacrylate prepolymer, 0.05% to 3% of free radical photoinitiator, 0% to 2% of poly-dimethylsiloxane/acrylic polymer, 0% to 20% of a performance adjusting addition agent, and 5% to 40% of esterified acrylic acid reactive diluent. The solidified abrading agent polishing pad which is prepared by the figure-transfer method has a series of advantages of stable grinding and polishing performance, high polishing efficiency, high surface texture of processed workpieces, and the like.

A polishing pad is disclosed which is less likely to cause scratches, and has an excellent planarization performance and polishing stability. In one aspect, the invention provides a polishing pad comprising an ultrafine fiber-entangled body formed of ultrafine fibers having an average fineness of 0.01 to 0.8 dtex, and a polymeric elastomer. The polymeric elastomer has a glass transition temperature of −10° C. or below, storage moduli at 23° C. and 50° C. of 90 to 900 MPa, and a water absorption ratio, when saturated with water at 50° C., of 0.2 to 5 mass %.

A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.

The invention discloses a ceramic glaze pattern-glazed brick and a production method thereof. The ceramic glaze pattern-glazed brick is prepared by performing decorations of printing, colors and patterns in a ceramic brick glaze, burning the ceramic brick glaze at a high temperature of between 1,220 and 1,260 DEG C, and adopting a soft surface polishing process. The production method comprises the following steps: preparing a formulation of a combined blank; performing press forming on the blank; drying the blank; spraying a ground glaze on the surface of the dried blank; using a fancy glaze to perform printing on the ground glaze; spraying a cover glaze on the surface of the blank after the printing; burning the blank sprayed with the cover glaze at a temperature of between 1,220 and 1,260 DEG C for 50 to 60 minutes; and finally edging and polishing the burnt blank to obtain the ceramic glaze pattern-glazed brick. The ceramic glaze pattern-glazed brick has the advantages of abrasion resistance, no dirt absorption, good texture, high glossiness and transparency, good decorative effect and wide decorative varieties.

The invention relates to an automatic sanding and polishing device for an industrial robot, wherein the industrial robot is served as the core of the device; the device comprises the industrial robot, an automatic shifting fixture, a polishing machine, and a force control program; and the device can be used for sanding and polishing the parts having complex exteriors, and is especially suitable for processing faucet, ironware, blade, and the like. A method for automatically sanding and polishing by using the device comprises the following steps: the automatic shifting fixture arranged on the tail end of the industrial robot is used for holding the parts; adjusting the position and posture of the industrial robot according to different areas for sanding or polishing of the parts; contacting the areas for sanding or polishing with a sanding belt of the polishing machine and keeping a certain contact force; controlling the size of the contact force by a force control mechanism; after finishing programming the whole surface of parts, using the industrial robot to perform the reprogramming operation; and sanding or polishing the parts having same exteriors in batch.

A furnace incorporating a novel thermal design is disclosed. Heating element temperature is reduced compared to conventional designs while providing a precisely controllable process temperature in the range 1000-1400 degrees centigrade. A plurality of Kanthal heating elements are arranged in a planar array as close to the work as possible, thus approximating an isothermal condition with respect to the work. The process chamber is made of aluminum and its internal surfaces are highly polished to reflect heat. The chamber walls have built in active cooling to carry away non-reflected heat and preserve high reflectivity. The heating elements are modular to facilitate removal and replacement without disassembly of the furnace. The configuration of the heating elements is linear rather than coiled and the temperature is monitored directly by measuring the electrical resistance of the Kanthal wires.

The invention provides a self-pressurized high-speed polishing method for the inner surface of a hole by means of abrasive particles and a magnetic flow. According to the method, the abrasive particles are coated with and restrained on the inner surface of the hole of a workpiece by the aid of ferromagnetic particles in a magnetorheological polishing fluid, which flows at a high speed, under the effect of a magnetic field produced by moving magnetic bodies, a flexible polishing abrasive brush flowing at a high speed is formed and reciprocates to rub against the inner surface of the hole of the machined workpiece to remove burrs and reduce the roughness of the inner surface of the hole, and burr removal and deterministic polishing are realized for various types of inner surfaces of holes. The invention further provides a self-pressurized high-speed polishing device for the inner surface of the hole by means of the abrasive particles and the magnetic flow. The device comprises a polishing mechanism, the magnetic bodies, a clamping mechanism, a sliding guide rail and a driving motor, wherein the driving motor drives the magnetic bodies to enable the polishing fluid to reciprocate in the hole at the high speed for polishing. The method and the device can solve problems that special holes are difficult to polish and the polishing efficiency is low, and have the advantages of high precision, high machining efficiency, low damage and low cost.

The invention discloses a manufacturing method of paint dyeing weaver with oxford textile, chambray and denim, which comprises the following steps: predisposing warp; drying; dyeing; predrying; drying; after-treating; shafting warp; weaving; dressing; finishing one step by one machine continually. The invention satisfies large batch and scale manufacturing request, which is fit for producing original paint dyeing and other pain dyeing weaver product.

An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.

A chemical mechanical planarization solution is useful for removing tantalum barrier materials. The solution includes by weight percent 0 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal and 0 to 20 complexing agent for the nonferrous metal, 0.01 to 12 tantalum removal agent selected from the group consisting of formamidine, formamidine salts, formamidine derivatives, guanidine derivatives, guanidine salts and mixtures thereof, 0 to 5 abrasive, 0 to 15 total particles selected from the group consisting of polymeric particles and polymer-coated coated particles and balance water. The solution has a tantalum nitride to TEOS selectivity of at least 3 to 1 as measured with a microporous polyurethane polishing pad pressure measure normal to a wafer less than 20.7 kPa.

The present invention provides an aqueous composition useful for polishing copper on a semiconductor wafer comprising by weight percent 0.001 to 6 inhibitor for a nonferrous metal, 0.05 to 10 complexing agent for the metal, 0.01 to 25 copper removal agent for accelerating the removal of the copper, 0.5 to 40 abrasive, 0 to 10 selected from the group comprising, polyvinylpyrrolidone, thermoplastic polymer and mixtures thereof, wherein the copper removal agent is imidazole.

A non-slip floor covering which includes a plurality of depressions that are regularly or randomly distributed over a floor covering surface such that the depressions provide a suction effect.

The invention discloses a polyvinyl alcohol-polyurethane elastic buffing wheel and a preparation method of the polyvinyl alcohol-polyurethane elastic buffing wheel. The preparation method comprises the steps that firstly, polyvinyl alcohol is mixed with distilled water, and the mixture is dissolved for 20-30 minutes under the condition of 50-95 DEG C water bath and at the rotation speed of 400-600r/min to obtain a polyvinyl alcohol aqueous solution; then, the polyvinyl alcohol aqueous solution is heated up to 30-100 DEG C, grinding materials are firstly added into the polyvinyl alcohol aqueous solution, after the mixture of the grinding materials and the polyvinyl alcohol aqueous solution is stirred and mixed evenly at the rotation speed of 400-600r/min, polyurethane pre-polymers, catalysts and air hole generating agents are added, and all the components are stirred and mixed evenly at the rotation speed of 400-600r/min and react for 5-10min; solidification is conducted for 2-4h under the condition of 30-100 DEG C, and then the buffing wheel which is good in elasticity, good in water resistance, good in heat-dissipating performance and high in mechanical strength is obtained. The elastic buffing wheel is even in foam hole, good in abrasion resistance and grinding force, not prone to deforming or curling in humid environment and applicable to long-time grinding work.

An article of jewelry supports a plurality of primary stones in a linear mounting array and which is bordered on both sides by accent stones. The girdles of the primary stones and of the accent stones are positioned close to each other with the accent stone girdles being above the primary stone girdles. A method of making the article of jewelry includes the use of a lost wax casting process followed by hand-setting of the accent stones and an application of a highly reflective coating, such as rhodium to surfaces that are adjacent the areas of congruence of the primary and accent stones. The resultant piece of jewelry presents the appearance of floating or unsupported primary stones.

The present invention provides methods for fabricating a stent using a chemical treatment to smooth, polish or strengthen the stent. One such treatment involves exposing the stent to acetone or a similar solvent. In certain embodiments, the additional step comprises placing the stent in a bath containing acetone, or a similar solvent, where the bath also contains the polymer the stent is composed of. The acetone bath step may be conducted at a temperature that is below the glass transition temperature. The present invention also provides for methods of fabricating a stent using an acetone bath that comprises poly (lactic) acid. Other embodiments provide for methods of fabricating a stent using an acetone bath that comprises poly (lactic) acid and polyethylene glycol.

A chemical mechanical polishing aqueous dispersion includes (A) silica particles, and (B1) an organic acid, the number of silanol groups included in the silica particles (A) calculated from a signal area of a ²⁹Si-NMR spectrum being 2.0 to 3.0×10²¹/g.

An improved low pressure low speed concrete polishing apparatus and method of cleaning and polishing a floor is used with a conventional rotary flooring machine. A polishing pad has interchangeable polymer strips that are slideably received within the housing of the pad. The polymer strips have an abrasive material embedded therein which collectively work to polish the floor while cleaning the floor during normal low speed floor cleaning conditions.

Polishing tools and associated methods are disclosed. In one aspect, a method of polishing a work piece is provided. Such a method may include providing a polishing tool having asperities on a working surface, where the asperities have a tip-to-tip RA value of less than or equal to about 10 μm, and the working surface has a surface roughness RA value of less than or equal to about 50 μm. The method may further include contacting the tips of the asperities against an interface surface of the work piece and moving the tips of the asperities in a direction substantially parallel to the interface surface of the work piece such that the interface surface is polished.