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10065results about How to "Reduce coefficient of friction" patented technology

Capacitive touch screen stylus

In some embodiments, a stylus for providing input to a capacitive touch screen, having a tip including or consisting of conductive felt, which provides a deformable conductive surface for contacting the touch screen. The tip is produced by felting base fibers (which are typically non-conductive) with conductive fibers. In other embodiments, a capacitive touch stylus having at least a first mode of operation and a second mode of operation, and including at least one conductive tip and switched circuitry (preferably, passive circuitry) including at least one switch biased in a default state indicative of the first mode of operation but switchable into a second state indicative of the second mode of operation in response to movement of the tip (typically, in response to exertion of not less than a threshold force on the tip). In some embodiments, a stylus having a conductive tip (e.g., a conductive, felted tip) and including switched circuitry (preferably, passive circuitry) having a first state which couples a capacitance to the tip, where the capacitance is sufficient to allow a capacitive touch screen device to recognize (as a touch) simple contact of the tip on the screen of the touch screen device, and a second state which decouples the capacitance from the tip, thereby preventing the touch screen device from recognizing (as a touch) simple contact of the tip on the screen.
Owner:RB CONTROLS CO

Modular ball and socket joint preferably with a ceramic head ball

Modular ball and socket joint has 1) a cupped ball head, preferably of ceramic, having a support body with an inferior, deep, distally facing, preferably generally planar, surface having a substantially circular outer boundary thereto; a distally opening stem receiving bore preferably centrally located in the support body; a cup wall, extending distally from the support body and having a preferably substantially cylindrical inner surface which extends from said outer boundary of said distally facing surface; and a superficially facing, generally semispherical, smooth external surface, preferably and optimally of a low friction coefficient, encapsulating the support body and cup wall; and 2) an interchangable and modular stem, preferably of metal or metal alloy, having a distally directed spike, and a superior stem cap which is insertable into the bore of the head; optionally with 3) a head-receiving articular cup having an inner articular surface and a mountable back surface, the articular surface of which, when the head-receiving cup is suitably mounted in suitable receiving stock, mates in articulating contact with said smooth external surface of said head when said head and stem are suitably mounted in suitable receiving stock. The head and stem modularity allows for noticeably increased versatility and efficiency in surgical procedures, and the ceramic material is beneficially adapted for employment in the fabrication of femoral resurfacing implants for conservative arthroplasty.
Owner:BIOPRO

Customized polishing pads for CMP and methods of fabrication and use thereof

The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior themo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.
Owner:CMC MATERIALS INC
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