1479 results about "Total thickness" patented technology

A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 μm/cm², wherein nTTV is total thickness variation normalized for surface area of the generally planar surface, the substrate having a diameter not less than about 9.0 cm.

A method for rapid growth of gallium and nitrogen containing material is described. The method includes providing a bulk gallium and nitrogen containing substrate. A first epitaxial material of first thickness is formed over the substrate, preferably with a pseudomorphical process. The method also forms a second epitaxial layer over the first to create a stacked structure. The stacked structure consists of a total thickness of less than about 2 microns.

The present invention relates to a cutting tool comprising a body of sintered cemented carbide or cermet, ceramic or high speed steel on which at least one of the functioning parts of the surface of the body, a thin, adherent, hard and wear resistant coating is applied. The coating comprises a laminar, multilayered structure of refractory compounds in polycrystalline, non-repetitive form, MX/NX/MX/NX where the alternating layers MX and NX are metal nitrides or carbides with the metal elements M and N selected from the group consisting of Ti, Nb, Hf, V, Ta, Mo, Zr, Cr, Al and W. The sequence of individual layer thicknesses is essentially aperiodic throughout the entire multilayered structure, and layer thicknesses are larger than 0.1 nanometer but smaller than 30 nanometer, preferably smaller than 20 nanometer. The total thickness of said multilayered coating is larger than 0.5 mu m but smaller than 20 mu m.

Laminated shingles are manufactured from roll stock roofing material that is wider than that used to make similar laminated shingles. The roll stock includes longitudinal edge strips having a reduced thickness. The roll stock is cut into strips of tabbed top sheets and backing sheets. The strips of material used for the backing sheets are at once wider than commonly used in the industry, and include the longitudinal edge strips of reduced-thickness material. Because the backing sheet is wider two rain seal strips are laid down on the backing sheet prior to being laminated to the tabbed top sheet. The backing sheets are laminated to the tabbed top sheets with the longitudinal edges aligned. The wider backing sheet provides a substantially wider nail zone. In addition, since it allows for a second rain seal strip, provides somewhat more protection against leakage. The portion of the backing sheet that comprises the added width is relatively thinner than the remaining portions of the sheet. Paired shingles may therefore be oriented adjacent one another in opposite directions and stacked and bundled. The total thickness of the stack will be the same throughout the stack, so the stack of shingles is flat.

Various embodiments provide semiconductor devices including a package structure and methods of forming the semiconductor devices. In one embodiment, the package structure can include a through-hole at least partially filled by one or more layers of material(s) to form a through-hole interconnect between semiconductor devices in the package structure. The through-hole can be filled by an insulating layer, a diffusion barrier layer, a metal interconnect layer, and/or a protective layer having a total thickness from the sidewall of the through-hole of less than or equal to the radius of the through-hole.

The magnetic tape comprises, on a nonmagnetic support, a nonmagnetic layer comprising nonmagnetic powder and binder, and on the nonmagnetic layer, a magnetic layer comprising ferromagnetic powder, nonmagnetic powder, and binder, wherein a total thickness of the magnetic tape is less than or equal to 4.80 μm, and a coefficient of friction as measured on a base portion of a surface of the magnetic layer is less than or equal to 0.35.

An organic light-emitting diode (OLED) device is described, comprising: a) a substrate; b) an OLED formed over the substrate comprising a first electrode, a partially transparent second electrode through which light from the OLED is emitted, and at least one layer of organic light-emitting material disposed between the first electrode and partially transparent second electrode; and c) an encapsulating layer deposited on the partially transparent second electrode, wherein the encapsulating layer comprises one or more component layers, and wherein the encapsulating layer and the partially transparent second electrode combined have a transparency greater than the transparency of the partially transparent second electrode in the absence of the encapsulating layer, or wherein the encapsulating layer and the partially transparent second electrode combined have an absorbance less than the absorbance of the partially transparent second electrode in the absence of the encapsulating layer. To provide adequate encapsulation, in accordance with various embodiments of the invention at least one component layer of the encapsulating layer is deposited by atomic layer deposition, or the total thickness of encapsulating layer is at least about 150 nm. In a preferred embodiment, both such features are incorporated.

A reusable silicon substrate device for use with layer transfer process. The device has a reusable substrate having a surface region, a cleave region, and a total thickness of material. The total thickness of material is at least N times greater than a first thickness of material to be removed. In a specific embodiment, the first thickness of material to be removed is between the surface region and the cleave region, whereupon N is an integer greater than about ten. The device also has a chuck member adapted to hold a handle substrate member in place. The chuck member is configured to hold the handle substrate in manner to facilitate bonding the handle substrate to the first thickness of material to be removed. In a preferred embodiment, the device has a mechanical pressure device operably coupled to the chuck member. The mechanical pressure device is adapted to provide a force to cause bonding of the handle substrate to the first thickness of material to be removed.

Provided is a magnetic tape in which the total thickness of a non-magnetic layer and a magnetic layer is equal to or smaller than 0.60 μm, the magnetic layer includes a timing-based servo pattern, the magnetic layer includes fatty acid ester, a full width at half maximum of spacing distribution measured by optical interferometry regarding the surface of the magnetic layer before performing vacuum heating with respect to the magnetic tape is greater than 0 nm and equal to or smaller than 7.0 nm, a full width at half maximum of spacing distribution measured after performing the vacuum heating is greater than 0 nm and equal to or smaller than 7.0 nm, and a difference between a spacing measured after performing the vacuum heating and a spacing measured before performing the vacuum heating is greater than 0 nm and equal to or smaller than 8.0 nm.

Provided is a magnetic tape in which the total thickness of the non-magnetic layer and the magnetic layer is equal to or smaller than 0.60 μm, the magnetic layer includes ferromagnetic hexagonal ferrite powder and an abrasive, a percentage of a plan view maximum area of the abrasive confirmed in a region having a size of 4.3 μm×6.3 μm of the surface of the magnetic layer by plane observation using a scanning electron microscope, with respect to the total area of the region is equal to or greater than 0.02% and less than 0.06%, and a tilt cos 0 of the ferromagnetic hexagonal ferrite powder with respect to a surface of the magnetic layer acquired by cross section observation performed by using a scanning transmission electron microscope is 0.85 to 1.00.

The magnetic tape includes a non-magnetic support; and a magnetic layer including ferromagnetic powder and a binder on the non-magnetic support, in which the total thickness of the magnetic tape is equal to or smaller than 5.30 μm, the magnetic layer includes a timing-based servo pattern, a center line average surface roughness Ra measured regarding a surface of the magnetic layer is equal to or smaller than 1.8 nm, the ferromagnetic powder is ferromagnetic hexagonal ferrite powder, the magnetic layer includes an abrasive, and a tilt cos θ of the ferromagnetic hexagonal ferrite powder with respect to a surface of the magnetic layer acquired by cross section observation performed by using a scanning transmission electron microscope is 0.85 to 1.00.

The magnetic tape includes a non-magnetic support; a non-magnetic layer including non-magnetic powder and a binder on the non-magnetic support; and a magnetic layer including ferromagnetic powder and a binder on the non-magnetic layer, in which the total thickness of the non-magnetic layer and the magnetic layer is equal to or smaller than 0.60 μm, the magnetic layer includes a timing-based servo pattern, and logarithmic decrement acquired by a pendulum viscoelasticity test performed regarding the surface of the magnetic layer is equal to or smaller than 0.050.

The magnetic tape includes a non-magnetic layer including non-magnetic powder and a binder on a non-magnetic support; and a magnetic layer including ferromagnetic powder and a binder on the non-magnetic layer, the total thickness of the non-magnetic layer and the magnetic layer is equal to or smaller than 0.60 μm, the magnetic layer includes a timing-based servo pattern, one or more components selected from the group consisting of fatty acid and fatty acid amide are at least included in the magnetic layer, and a C—H derived C concentration calculated from a C—H peak area ratio of C1s spectra obtained by X-ray photoelectron spectroscopic analysis performed on the surface of the magnetic layer at a photoelectron take-off angle of 10 degrees is equal to or greater than 45 atom %.

The magnetic tape includes a magnetic layer having ferromagnetic powder and a binder on a non-magnetic support, in which a total thickness of the magnetic tape is equal to or smaller than 5.30 μm, the magnetic layer includes a timing-based servo pattern, a center line average surface roughness Ra measured regarding a surface of the magnetic layer is equal to or smaller than 1.8 nm, one or more components selected from the group consisting of fatty acid and fatty acid amide are included in the magnetic layer, and a C—H derived C concentration calculated from a C—H peak area ratio of C1s spectra obtained by X-ray photoelectron spectroscopic analysis performed on the surface of the magnetic layer at a photoelectron take-off angle of 10 degrees is equal to or greater than 45 atom %.

The magnetic tape has on one surface of a nonmagnetic support a magnetic layer containing ferromagnetic powder and binder, and on the other surface of the nonmagnetic support, a backcoat layer containing nonmagnetic powder and binder, wherein the total thickness of the magnetic tape is less than or equal to 4.80 μm, the backcoat layer contains one or more components selected from the group consisting of a fatty acid and a fatty acid amide, and a C—H derived carbon, C, concentration calculated from a C—H peak area ratio in a C1s spectrum obtained by X-ray photoelectron spectroscopy conducted at a photoelectron take-off angle of 10 degrees on a surface on the backcoat layer side of the magnetic tape ranges from 35 to 60 atom %.

A flexible protective padding material is described and comprises an array of resilient multilayered elements or blocks which have generally planar top and bottom surfaces and each of which have at least two layers which include a first layer bonded to an outer second layer. The total compressibility of each element with the at least two layers, the spacing between the elements and the total thickness of the elements provides the elements with the ability to compress such that at least one side wall of each of adjacent elements move together and touch each other to provide a joined outer surface of elements which dissipates a blow to the protective padding.

The magnetic tape includes a magnetic layer including ferromagnetic powder and a binding agent, in which a magnetic tape total thickness is equal to or smaller than 5.30 μm, the magnetic layer has a servo pattern, a center line average surface roughness Ra measured regarding a surface of the magnetic layer is equal to or smaller than 1.8 nm, the ferromagnetic powder is ferromagnetic hexagonal ferrite powder, an intensity ratio of a peak intensity of a diffraction peak of a (110) plane with respect to a peak intensity of a diffraction peak of a (114) plane of a hexagonal ferrite crystal structure obtained by an X-ray diffraction analysis of the magnetic layer by using an In-Plane method is 0.5 to 4.0, and a vertical direction squareness ratio of the magnetic tape is 0.65 to 1.00, and a magnetic tape device including this magnetic tape.

A method for fabricating an electronic component embedded substrate including an electronic component that is embedded within a buildup layer is disclosed. The method includes a first buildup layer lamination step of laminating plural first buildup layers on a core substrate such that the total thickness of the first buildup layers corresponds to the thickness of the electronic component; a cavity formation step of forming a cavity for accommodating the electronic component at the laminated first buildup layers; an accommodating step of accommodating the electronic component within the cavity; and a second buildup layer lamination step of laminating a second buildup layer on the first buildup layers and the electronic component.

The invention discloses a nanometer multiple-layer composite thermal insulation material and a preparation method thereof. The nanometer multiple-layer thermal insulation composite material is formed by alternatively overlapping an infrared reflecting screen and a spacer; the ratio of total layer amounts n of the infrared reflecting screens and the spacers to the total thickness of the nanometer multiple-layer composite thermal insulation material is 0.5-4; the infrared reflecting screen is a metal foil or a metal plated foil; the spacer is a thermostability nanometer porous aerogel composite thermal insulation material; the infrared reflecting screen and the spacer are combined by being adhered with thermostability adhesives or in puncturing connection by thermostability sewing threads. The invention also comprises the preparation method of the nanometer multiple-layer composite thermal insulation material. The nanometer multiple-layer composite thermal insulation material of the invention has low density, favorable mechanical property and favorable high-temperature thermal insulation property, lowers requirements on the vacuum degree by a VIP plate when being used as vacuum thermal insulation plate core materials, does not need getter and can satisfy harsh high-efficiency thermal insulation using requirements on materials by aviation, aerospace and civil fields. The method of the invention can prepare thermal insulation material members with large size and complex shape.

The present invention relates to a vertically aligned LCD (VA-LCD) comprising a negative compensation film including one or more of a first retardation film (+A-plate) satisfying the condition of n_x>n_y=n_z and a first retardation film (−A-plate) satisfying the condition of n_x<n_y=n_z, and one or more of a second retardation film (−C-plate) satisfying the condition of n_x=n_y>n_z, wherein the first retardation film is arranged such that its optical axis is perpendicular to an optical absorption axis of a neighboring polarizing plate, and a total thickness retardation (R_−C+R_VA) including the thickness retardation of the second retardation film and the thickness retardation of a VA-panel has a negative value. The VA-LCD in accordance with the present invention improves contrast characteristics on a front surface and at a tilt angle and minimizes coloring in a black state according to the tilt angle.

The invention provides a solid golf ball having a solid core and a cover layer that encases the core and has an outermost layer on an outside surface of which are formed a plurality of dimples. The solid core is formed of a rubber composition composed of 100 parts by weight of a base rubber that includes from 60 to 100 parts by weight of a polybutadiene rubber having a cis-1,4 bond content of at least 60% and synthesized using a rare-earth catalyst, from 0.1 to 5 parts by weight of an organosulfur compound, an unsaturated carboxylic acid or a metal salt thereof, an inorganic filler, and an antioxidant. The solid core has a deformation, when compressed under a final load of 130 kgf from an initial load of 10 kgf, of from 2.0 to 4.0 mm, and has a specific hardness distribution. The cover layer has a thickness of from 0.5 to 1.9 mm, and a Shore D hardness at the surface of from 50 to 70. The ball has at least one intermediate layer between the core and the cover, any one of which intermediate layer or layers has a surface hardness in Shore D units of from 40 to 60, the intermediate layer or layers having a total thickness of from 0.9 to 7.0 mm. The golf ball has a deformation, when compressed under a final load of 130 kgf from an initial load of 10 kgf, of from 2.0 to 3.8 mm. The solid golf ball is advantageous overall in competitive use.

According to the package and the method for manufacturing the package of the present invention, a chip can be formed extremely to be thin, and manufactured at lower cost and higher throughput, and the variations of a chip thickness can be reduced without back grind that causes cracks or polishing marks. In the present invention, a semiconductor film with a thickness of at most 500 μm deposited over a substrate serving as a support medium is crystallized with a CW laser light, and a chip having a semiconductor device is formed to have a total thickness of 5 μm, preferably at most 2 μm by using the crystallized semiconductor film. Consequently, the chip is mounted on an interposer after separating a substrate.

The invention relates to a terminal and a display screen. The display screen comprises a display area including at least two display zones; the at least two display zones includes a first display zoneand a second display zone; and the total thickness of the metal layer in the first display zone is smaller than that of the metal layer in the second display zone. When the terminal uses the displayscreen, pre-posed equipment like a front-facing camera can be installed below the first display zone. When the front-facing camera is needed, only the first display zone needs not to be lightened; andwhen the front-facing camera does not work, all display zones in the display screen carry out displaying normally to realize full-screen displaying.

The present invention relates to a method of producing an SOI wafer in which an SOI layer is formed on a buried oxide film by forming an oxide film on a surface of at least one of a bond wafer and a base wafer, bonding the bond wafer to the base wafer through the formed oxide film, and making the bond wafer into a thin film, wherein after the oxide film is formed so that a total thickness of the oxide film formed on the surface of at least one of the bond wafer and the base wafer is thicker than a thickness of the buried oxide film that the SOI wafer to be produced has, the bond wafer is bonded to the base wafer through the formed oxide film, the bond wafer is made into a thin film to form an SOI layer, and thereafter, an obtained bonded wafer is subjected to heat treatment to reduce a thickness of the buried oxide film. Thereby, there can be provided a method of producing an SOI wafer in which blisters and voids are not generated even if the thickness of the buried oxide film is thinned, and its SOI layer has extremely good crystallinity.

A method is disclosed for forming a semiconductor wafer having a strained Si or SiGe layer on an insulator layer. The method produces a structure having a SiGe buffer layer between the insulator layer and the strained Si or SiGe layer, but eliminates the need for Si epitaxy after bonding. The method also eliminates interfacial contamination between strained Si and SiGe buffer layer, and allows the formation of Si/SiGe layers having a total thickness exceeding the critical thickness of the strained Si layer.

A composite material having a preferably rigid preformed ceramic fiber matrix at least partially impregnated with an aerogel and forming a multi-layered material. The matrix is impregnated with an aerogel material which forms a layer having a total thickness r where r is less than t or equal to t, where t is the thickness of the matrix, thus forming a single or multilayered composite material. The material may be formed with numerous layers s1, s2, S3, . . . snn where r=SIGMAsn and r is less than or equal to t. Thus, a multi-layered material is formed. Alternatively, the aerogel/fiber matrix composite has channels devoid of aerogel.

In order to produce a cellulose ester film constructed of a front layer, an intermittent layer and a rear layer, a dope solution is doped on a supporter. In at least one of the front layer and the rear layer, a mass ratio of a cotton linter to a wood pulp (cotton linter/wood pulp) is between 5/95 and 0/100, and a solvent of the dope contains more than 15 wt. % alcohols and hydrocarbons whose carbon number each is 1-10. Further, a ratio of a solid content density of a solution for forming the front layer and the rear layer to a solid density of a solution for forming the intermittent layer is less than 0.9 wt. %, and a total thickness of the solutions for front and rear layers is more than 5% of the dope ribbon.

A long life balloon formed from a lamination. The lamination includes a polyester film with a total thickness of 4 μm to 12 μm. The polyester film includes a biaxially oriented polyester core layer and at least one amorphous copolyester skin layer. The lamination also includes a sealant layer and a gas barrier layer on an opposite side of the polyester film from the sealant layer. The oxygen transmission rate of the balloon is less than 0.1 cc/100 sqin/day, a bonding strength of the gas barrier layer to the surface of the polyester film is more than 300 g/in at dry conditions, a sealing strength of the balloon is more than 3.5 kg/in, and a floating time of the balloon is more than 20 days.

A process for fabricating a pendulous accelerometer, including the steps of: providing a first substrate having a top planar surface, etching a portion of the first substrate to a first predetermined depth from the top planar surface to form a plurality of first protrusions, providing a second substrate, etching a portion of the second substrate to a second predetermined depth to form a plurality of second protrusions, bonding planar surfaces of the first protrusions to planar surfaces of the second protrusions, and etching a portion of the first substrate from an opposite side of the first substrate to a third predetermined depth equal to or greater than the difference between the total thickness of the first substrate and the first predetermined depth to form a freely rotatable sensing plate that includes a substantially hollow proof mass.

The invention belongs to the technical field of concrete reinforcement and relates to a method for reinforcing concrete with a fibrage net and a cement-based material. The method is to pour the fibrage net the total thickness of which is between 10 and 20 millimeters and fine concrete on the outer surface of a structure, and is characterized by comprising the following steps that: drilling holes on the surface of the structure in the process of construction; using the short end foot of a U-shaped shear resistant pin of which the two end feet have different lengths to hook the fibrage net, and inserting the long end foot thereof into the hole after a building structural adhesive is smeared on the long end foot; spraying the fine concrete after the adhesive is solidified; using the short end foot of a U-shaped hook of which the two end feet have different lengths to hook a second layer fibrage net, and inserting the long end foot thereof to the fine concrete; and spraying the fine concrete. The method can avoid the generation of interface micro cracks at high stress, effectively prevent interface peeling damages, reinforces building structures reliably, simply, efficiently and environmental protection, and is applicable to reinforcing and repairing various types of structures.