808 results about "Total thickness" patented technology

The invention provides a package substrate and a manufacturing method thereof. According to the package substrate, a circuit structure is formed on one side of a core board body with a core layer, and the other side of the core board body is used as a ball mounting side, so that the number of layers of the package substrate is reduced, and the total thickness of the package substrate is reduced.

The invention discloses a method for determining the plugging thickness of a complex lithologic layer based on simplified lithologic combination, and the method comprises the steps: determining the vertical superposition relation of a silty rock layer and a shale layer and the total thickness of the silty rock layer and the shale layer according to the lithologic longitudinal distribution characteristics of an overlying stratum; integrally forming and preparing a roof rock sample by combining the properties of siltstone and shale; arranging a plurality of groups of temperature sensors, pressure sensors and strain sensors on the side surface of the rock sample at set intervals; heating the rock sample until the bottom temperature is the set temperature, pressurizing until the bottom pressure is the set pressure, applying stress to the bottom of the rock sample step by step from small to large until the set stress, and stabilizing at the temperature, the pressure and the stress until the measured value of the sensor is stable; determining the lower limit of the roof plugging thickness according to the measured value of each sensor and the up-and-down superposition relationship; and similarly, determining the bottom plate plugging thickness lower limit. According to the method, through simplified lithology and combined simulation of a temperature field, a pressure field and a stress field, the lower limit of the plugging thickness of the shale reservoir complex lithology roof and floor is reasonably quantified.

The invention discloses a method for determining the plugging thickness of a complex lithologic layer based on temperature-pressure field simulation, and the method comprises the steps: determining the vertical superposition relation of a silty rock layer and a shale layer and the total thickness of the silty rock layer and the shale layer according to the lithologic longitudinal distribution characteristics of an overlying stratum in a set range; respectively obtaining formulas for preparing siltstone and shale through experimental fitting; integrally forming and preparing a roof rock sample; arranging multiple groups of temperature sensors and pressure sensors on the side surface of the rock sample at set intervals; heating the rock sample until the bottom temperature is the set temperature, pressurizing the rock sample until the bottom pressure is the set pressure, and stabilizing at the temperature and the pressure until the measured value of the sensor is stable; determining the lower limit of the roof plugging thickness according to the measured value of each sensor and the up-and-down superposition relationship; and similarly, determining the bottom plate plugging thickness lower limit. According to the method, the lower limit of the plugging thickness of the shale reservoir complex lithology top and bottom plates can be reasonably quantified through simplified lithology and joint simulation of a temperature field and a pressure field.

Foldable substrates comprise a substrate thickness from about 80 micrometers to about 2 millimeters. Foldable substrates comprise a first portion, a second portion, and a central portion positioned therebetween. The central portion comprises a central thickness from about 25 micrometers to about 80 micrometers defined between a first central surface area and a second central surface area. A central total thickness variation of the central portion over the first central surface area is less than or equal to 10 micrometers. The central portion comprises a first transition region extending between a first surface area of the first portion and the first central surface area. The first central surface area is recessed from the first major surface by a first distance. A thickness of the first transition region smoothly and monotonically decreases between the substrate thickness of the first portion and the central thickness of the central portion.

Disclosed are a high-barrier inflatable cushion and a preparation process therefor, which related to the technical fields of high-barrier inflatable cushions. The preparation process includes the following steps: material feeding, heating, vacuum counter-pressure molding, spray cooling, air cooling and drying, die-cutting, and thermal bonding. The high-barrier inflatable cushion comprises an airbag forming material and an airbag base material. The airbag forming material is prepared by laminating a TPU-EVOH composite with Lycra fabric, the TPU-EVOH composite has a total thickness of 0.4-0.8 mm, and the Lycra fabric has a gram weight of 150-230 g / m2. The airbag base material is prepared by laminating the TPU-EVOH composite with non-woven fabric, the TPU-EVOH composite has a total thickness of 0.1-0.3 mm, and the non-woven fabric has a gram weight of 60-80 g / m2.

A bulk acoustic wave (BAW) device includes a layer stack (102) including a first electrode (104A) and a second electrode (104B), a first piezoelectric layer (106A) between the electrodes, and a second piezoelectric layer (106B) between the first piezoelectric layer and the second electrode. The polarization (P2) of the crystal structure of the second piezoelectric layer is opposite the polarization (P1) of the crystal structure of the first piezoelectric layer to achieve a higher order resonant frequency in the BAW device by reducing only the layers in the stack of thin layers. In some examples, the BAW device is a two-terminal device and does not include a metal layer configured as a third electrode. In some examples, the BAW device includes at least one intermediate layer (120, 122, 124) between the first and second piezoelectric layers, and the total combined thickness of the at least one intermediate layer is less than 4% of the total thickness of the layer stack.

The invention discloses a wave-absorbing foam / honeycomb core composite board as well as a preparation method and application thereof. Comprising a honeycomb core substrate layer, a wave-absorbing foam embedding layer and a wave-transparent foam filling layer which are sequentially stacked, the honeycomb core substrate layer is a honeycomb core with a plurality of through hollow areas, and each surface of the honeycomb core is provided with a wave-absorbing coating; the wave-absorbing foam embedded layer comprises a plurality of filling parts and protruding parts, the hollow area of the honeycomb core substrate layer is filled with the filling parts, and the protruding parts are arranged on the surface of the honeycomb core substrate layer in a protruding mode and form a fluctuating structure; the wave-absorbing foam embedded layer is made of a wave-absorbing material; the wave-transparent foam filling layer is filled in the protruding parts, and a flat surface is formed on the side, away from the honeycomb core substrate layer, of the wave-transparent foam filling layer. The low-frequency absorption performance is improved on the premise that the total thickness is not increased, the multiple wave-absorbing characteristics of the wave-absorbing foam embedded layer are reserved, and meanwhile the excellent performance of the plane plate in the aspects of bearing, cutting and splicing is ensured.

The invention discloses a mirror symmetry correlation receiving radiation metasurface and a polarization and complex amplitude regulation and control method thereof. The polarization state of the receiving and radiating end of the metasurface and the complex amplitude regulation and control method from any polarized wave to any polarized wave are regulated and controlled by controlling the in-plane mirror symmetry of the receiving and radiating metasurface patch structure. The polarization and complex amplitude regulation and control method is realized by a receiving and radiating metasurface, the metasurface structure is composed of five layers of metal and four layers of dielectric substrates, and the total thickness is about 0.086 lambda. Wherein the first-layer structure and the fifth-layer structure consist of circular rings with two pairs of arc-shaped grooves etched at the edges and C-shaped grooves etched at the centers; the relative rotation angle of the C-shaped groove and the arc-shaped groove is changed to control the elliptical angle of electromagnetic waves, the overall rotation angle of the C-shaped groove and the arc-shaped groove controls the polarization angle of the electromagnetic waves, and the opening size of the C-shaped groove is used for regulating the transmission amplitude; the transmission phase is regulated by changing the length of the third-layer transmission line; meanwhile, the four layers of dielectric plates are used for isolating radiation and receiving modes. The metasurface and the method have the ultra-thin characteristic and the ultra-high pixel resolution.

The invention discloses a three-dimensional printing method and three-dimensional printing equipment for manufacturing a target object. The three-dimensional printing method comprises the following steps: curing a first material to form a first part of a first layer in a plurality of target layers; curing the second material to form a second portion of the first layer of the plurality of target layers; curing the first material to form a first portion of a second layer of the plurality of target layers on the first portion of the first layer, the total thickness of the first portion of the first material being greater than the total thickness of the second portion of the second material; the steps are repeated to form a plurality of target layers of the target object. According to the scheme provided by the invention, various risks caused by the positioning accuracy of movement in the vertical direction are reduced.

The invention discloses a multilayer co-extrusion heat-shrinkable film and a preparation method thereof, the film comprises an outer wear-resistant layer, a middle support layer and an inner functional layer, the thickness ratio of each layer is 1: 3: 1-1: 5: 1, the total thickness is 50-150 [mu] m, and the raw materials are prepared according to respective formulas. The preparation method comprises the steps of raw material preparation, melt mixing, die head extrusion, two-way stretching, water-cooling shaping, electronic crosslinking, aging treatment, heating softening and cold and hot shaping. The carbon nanotubes (CNT) and the h-BN nanosheets synergistically hinder crack propagation in the middle layer, so that the crack propagation resistance of the film is remarkably improved, the tensile strength, the thermal shrinkage rate and other properties are also optimized, compared with a traditional film, the comprehensive properties of wear resistance, high strength and high thermal shrinkage rate are achieved through interface collaborative design, meanwhile, the production cost is reduced by 20-30%, and the application prospect is wide. The method is suitable for food packaging, electronic device protection and other fields.

The invention discloses a method for predicting the thickness of a composite layer of a composite board and related equipment, and relates to the technical field of composite board rolling, and the method comprises the following steps: obtaining assembly thickness data and target hot rolling process parameters of a to-be-measured composite board; inputting the assembly thickness data and the target hot rolling process parameters into a prediction model, and predicting the thickness of the composite plate to obtain a total thickness prediction value after cooling after hot rolling is finished; and based on the total thickness predicted value, calculating to obtain a composite layer thickness predicted value of the composite board. By fusing the assembly data, the hot rolling process parameters and the machine learning algorithm, online prediction and dynamic regulation and control of the thickness of the multi-layer are achieved.

The present invention provides a metal molded article, a manufacturing method therefor, and an inspection device having same. The metal molded article has an overall length dimension in a longitudinal direction, an overall thickness dimension in a thickness direction perpendicular to the longitudinal direction, and an overall width dimension in a width direction perpendicular to the longitudinal direction. The metal molded article is divided into a first body region and a second body region in the thickness direction. The lateral surfaces of the first body region are provided with multiple micro-trenches that are grooves formed to be elongated in the thickness direction and arranged side by side all over the entire lateral surfaces of the first body region. The lateral surfaces of the second body region are not provided with these micro-trenches.

The invention provides a manufacturing method of a groove type semiconductor structure, which comprises the following steps: after forming a groove, growing a thermal oxide layer, depositing an oxide layer on the surface of the thermal oxide layer through chemical vapor deposition, the thickness of the thermal oxide layer is A, the total thickness of the thermal oxide layer and the chemical vapor deposition oxide layer is B, and the range of A / B is 38%-46%. According to the invention, the trench side wall oxide layer is manufactured by several times and by adopting different methods, the stacked trench side wall oxide layer is obtained, the film layer stress is reduced by adjusting the film layer thickness ratio of the thermal oxide layer to the chemical vapor deposition oxide layer, the wafer warping degree is weakened, and the process is optimized on the basis of not influencing the electrical property. In the optional scheme of the invention, the stress of the front surface film layer can be balanced by forming the back surface deposition layer on the back surface of the wafer, the warping degree is further reduced, the method is simple and convenient, the operability is high, and the front surface structure is not influenced.

The invention aims at disclosing a high-flatness and high-heat-conductivity titanium-aluminum composite plate, a forming process and a heat treatment device, and relates to the technical field of titanium-aluminum composites.The high-flatness and high-heat-conductivity titanium-aluminum composite plate is formed by compositing a TC4 alloy titanium plate with the first thickness and a high-strength aluminum plate with the second thickness; the first thickness accounts for 12%-50% of the total thickness of the composite board, and the total thickness of the composite board is 2.0 mm-7. 5mm; the TC4 alloy titanium plate comprises the following components in percentage by weight: 86 to 89 percent of titanium, 5.5 to 6.8 percent of aluminum and 3.5 to 4.5 percent of vanadium; the high-strength aluminum plate comprises 0.4 wt%-0.8 wt% of silicon, 0.7 wt% of iron, 0.15 wt%-0.4 wt% of copper, 0.15 wt% of manganese, 0.8 wt%-1.2 wt% of magnesium, 0.04 wt%-0.35 wt% of chromium, 0.25 wt% of zinc, 0.15 wt% of titanium and aluminum, and the titanium-aluminum composite plate has the beneficial effects that the thickness of the TC4 alloy titanium plate in the titanium-aluminum composite plate accounts for 12%-50% of the total thickness, that is, the titanium-aluminum composite plate is mainly the high-strength aluminum plate, and due to the fact that the high-strength aluminum plate is lower in density and lower in cost, the titanium-aluminum composite plate can be used for manufacturing the high-strength aluminum plate; the titanium-aluminum composite plate has the advantage in the aspect of cost performance; and clamping a plurality of staggered-surface laminated plates between the first counterweight plate and the second counterweight plate, and carrying out heat treatment to enable the flatness of the composite plate to be 0.5-1mm, so that the composite plate can be used for preparing the high-throughput operation cabinet.

The invention discloses a laser welding method for a copper-aluminum composite material, which comprises the following steps of: performing upsetting thinning treatment on a three-layer sandwich structure base material to ensure that the total thickness of a welding area is 1.5 mm, the thickness of an aluminum layer is 0.9-1.1 mm (the deformation rate is 10-30%), the thickness of a copper layer is 0.2-0.3 mm, the surface roughness Ra is less than or equal to 1.6 mu m, and the surface roughness Ra of an oxide layer is less than or equal to 5 mu m; a 1064nm optical fiber laser is adopted, welding is conducted at the power of 85%-95%, the speed of 120-150 mm / s and the frequency of 4000-6000 Hz, the fusion depth is 0.3-0.6 mm, and the fusion width is 1.2-2.0 mm. By means of the method, the tensile strength of the connector can be larger than or equal to 110 MPa, the resistivity is smaller than or equal to 2.5 * 10 <-8 > omega.m, the problems that traditional welding strength is low and conductivity is poor are solved, batch quality consistency is ensured, and the method is suitable for the fields of new energy automobiles and the like.

The invention relates to the technical field of fire prevention, and discloses a grid filling type non-expansive fire retardant coating multi-layer brushing method which comprises the following steps: firstly, spraying a fire retardant coating on a square steel column in a crossed manner to form a grid-shaped spraying inner layer; both volume change and sagging can be absorbed by the pits in the centers of the grids, and the overall thickness of the ridge line position is uniform; after the sprayed inner layer is initially set, the convex points are scraped off, a new fireproof coating is scraped in the grids and is thickened outwards to form the scraped outer layer, the effect similar to reworking is achieved while the total thickness reaches the standard, and defects existing in the sprayed inner layer and local thickness unevenness are covered. Meanwhile, the main body of the blade coating outer layer is separated by the grids, so that the phenomena of thin upper part, thick lower part, edge deformation and sagging caused by paint flowing are avoided; and the inner corner protection net is used for preventing the latticed spraying inner layer from influencing the edge position shaping of the blade coating outer layer, so that the thickness and the appearance of the coating layer can be qualified at a time.

The invention discloses a method for determining the plugging thickness of a complex lithologic layer based on temperature-stress field simulation, and the method comprises the steps: determining the vertical superposition relation of a silty rock layer and a shale layer and the total thickness of the silty rock layer and the shale layer according to the lithologic longitudinal distribution characteristics of an overlying stratum in a set range; respectively obtaining formulas for preparing siltstone and shale through experimental fitting; integrally forming and preparing a roof rock sample; arranging multiple groups of temperature sensors and strain sensors on the side surface of the rock sample at set intervals; heating the rock sample until the bottom temperature is the set temperature, applying stress to the bottom of the rock sample from small to large step by step until the set stress, and stabilizing at the temperature and the stress until the measured value of the sensor is stable; determining the lower limit of the roof plugging thickness according to the measured value of each sensor and the up-and-down superposition relationship; and similarly, determining the bottom plate plugging thickness lower limit. According to the method, the lower limit of the plugging thickness of the shale reservoir complex lithology top and bottom plates can be reasonably quantified through simplified lithology and joint simulation of a temperature field and a stress field.

The invention relates to the technical field of semiconductor material precision machining, and discloses a 12-inch silicon wafer double-sided polishing upper and lower surface removal amount monitoring system and method, and the system comprises a macroscopic thickness monitoring unit, a microcosmic contact state decoupling sensing unit and a data processing controller. The method comprises the following steps: synchronously acquiring a total thickness signal of a silicon wafer, an acoustic emission signal of an upper / lower fixed disc side and a fluid dynamic pressure signal; the method comprises the following steps: constructing a lubrication state correction coefficient by utilizing fluid dynamic pressure, and carrying out nonlinear correction on a mechanical friction energy index extracted by acoustic emission to obtain an effective vector removal index representing real cutting capacity; and the removal distribution ratio of the upper surface and the lower surface is calculated, and the independent absolute removal amount of the upper surface and the lower surface is obtained through decoupling in combination with the total thickness variation. According to the method, by eliminating the interference of a fluid'water cushion effect 'on a friction signal, visualization and closed-loop feedback control of a single-face removal behavior in the double-face polishing process are achieved, and the problem of silicon wafer warping caused by removal asymmetry is effectively solved.

The invention relates to the technical field of deposition of wear-resistant and corrosion-resistant coating materials on metal surfaces, in particular to a high-toughness CrNbZrNiSiBN high-entropy nitride coating and a preparation method thereof. A bonding layer formed by a Cr layer, a transition layer formed by a CrN layer and a functional layer coated with CrNbZrNiSiBN high-entropy nitride are sequentially arranged on the surface of a base material. And the total thickness of the coated functional layer is 2-10 microns. The method is completed by adopting an ion beam assisted arc ion plating technology, and the prepared composite coating has the advantages of relatively high hardness, relatively good toughness, wear resistance, corrosion resistance, high-temperature oxidation resistance and the like. The coating can be used for strengthening and protecting the surfaces of cutters, molds, aerospace, marine ship parts and the like.

The invention provides a thermal matching optimization method for a U-shaped component of a high-temperature spray pipe, and the method comprises the steps: constructing parameterized models of the U-shaped component of the spray pipe and a typical TPS structure which is the same as a thermal protection structure of the U-shaped component of the spray pipe, the typical TPS structure is a multi-layer material composite structure which at least comprises a heat-proof layer on the outermost side and a heat-insulating layer located on the inner side of the heat-proof layer. Based on the parameterized model of the typical TPS structure, taking the thickness of each layer as a variable, taking the total thickness of the TPS and the temperature of a heat insulation layer as constraints, and taking the minimum weight of the typical TPS structure as a target, carrying out heat transfer design of the typical TPS structure to obtain an optimal thickness ratio of each layer; the optimal thickness ratio of each layer of a typical TPS structure is applied to a parameterized model of the U-shaped component of the spray pipe, and the optimal thickness ratio of each layer of the typical TPS structure is obtained by taking the bolt size and the bolt hole gap for connecting the bolts of each layer as variables, taking the stress and the nail load of each layer of the U-shaped component of the spray pipe as constraints and taking the minimum bolt hole gap as a target. And carrying out thermal matching optimization design on the U-shaped component of the spray pipe to obtain an optimal bolt size and an optimal bolt hole gap.

The invention discloses an anti-crack construction method for a concrete pavement. The anti-crack construction method comprises the steps that a high-pressure water gun with the pressure ranging from 15 MPa to 18 MPa is adopted to conduct scouring on the surface of a roadbed to form latticed grooves with the depth ranging from 3 mm to 5 mm; laying a double-layer isolating layer composed of a polyethylene film and polypropylene geotechnical cloth, and coating an organic silicon interface agent of 1-1.5 mm in the middle; erecting a three-dimensional steel reinforcement framework; during layered pouring, the thickness of lower-layer concrete is 60 + / -2% of the total thickness, inserting quincunx PVC exhaust pipes with the diameter of 25mm, and controlling the temperature difference between the upper-layer concrete and the lower-layer concrete to be less than or equal to 5 When the concrete strength reaches 5MPa-7MPa, the cutting depth of the shrinkage joint is 1 / 4-1 / 3 of the total thickness, and the length difference of the adjacent sections is less than or equal to 10%. The method can significantly improve the crack resistance of the pavement, and is suitable for concrete pavement projects such as highways and municipal roads.

The invention relates to a photoelectric composite cable suitable for an unmanned aerial vehicle platform, which comprises a wrapping layer formed by wrapping a covering film, an accommodating space is formed in the wrapping layer, a two-core electric unit and a one-core single-mode optical fiber are respectively placed in the accommodating space, and a plurality of aramid fibers are distributed in the accommodating space and are filled to form a cable; an insulating layer is distributed on the electric unit, an outer wrapping layer is distributed on the single-mode optical fiber, and the insulating layer, the outer wrapping layer and the covering film are all made of high-temperature-resistant fluoroplastic formed by ethylene-tetrafluoroethylene copolymer; the thickness of the covering film is 0.05 mm, and the total thickness after wrapping is 0.10 mm + / -0.02 mm; the outer diameter of the photoelectric composite cable is 2.2 mm + / -0.1 mm, and the total weight per meter is smaller than or equal to 12 g. Therefore, the whole photoelectric composite cable has better high temperature resistance, can meet high tensile strength under the condition of light weight, can realize low-loss signal transmission, and has better heat dissipation effect.

A method produces a microelectronics device by hybrid bonding of individual chips onto a handle wafer, of the Die-to-Wafer type, includes a flow protocol for thinning the rear substrate of the chips. The flow protocol includes a pre-thinning grinding of the rear substrate of the individual chips once they have been attached to the wafer. This grinding is preceded by the formation of a protective layer protecting the trenches formed by the spaces between the attached individual chips. Next, a rectification etching rectifies the height of the rear substrate of each of the attached individual chips, via chemical wet etching, to eliminate the Total Thickness Variation. This etching is selective with respect to an etch-stop element contained in the respective substrates of the attached chips and which is used to stop the etching at a level that is substantially uniform for each of the chips.

The invention discloses a cutting process for improving the sheet yield and cutting quality of a large-diameter silicon carbide cutting sheet, and belongs to the technical field of silicon carbide cutting. The cutting process comprises the steps that (1) spiral steel wires are wound on a grooved wheel at equal intervals to form a plurality of parallel cutting wires, the center diameter of the spiral steel wires is 50-80 micrometers, and the tensile strength is larger than 4100 N / mm < 2 >; (2) the linear speed and the linear tension F of the cutting line are set, and cutting liquid is conveyed to the cutting line; and (3) the silicon carbide crystal to be cut is fixed through a workpiece mechanism, the workpiece mechanism drives the silicon carbide crystal to be cut to move towards the cutting line, the cutting line cuts the silicon carbide crystal to be cut till cutting is completed, and the silicon carbide cutting piece is obtained. According to the cutting process, the surface quality of the cutting blade can be remarkably improved while the cutting efficiency is improved, and the cutting blade with the total thickness deviation smaller than 4 micrometers is obtained.

The utility model relates to the technical field of building components, in particular to a horse stool supporting assembly which accurately controls the total thickness of a raft foundation and the thickness of a protective layer of an upper steel bar. Comprising two supporting plates which are oppositely arranged, the top ends of the two supporting plates are connected through a connecting plate, a mounting plate is arranged above the connecting plate, first guiding pieces are arranged at the two ends of the mounting plate, guiding plates fixed to the connecting plate are arranged on the two sides of the mounting plate, and second guiding pieces are vertically arranged on the guiding plates; a telescopic assembly for driving the mounting plate to move up and down is arranged on the connecting plate, a mounting seat is arranged above the mounting plate, and a positioning cylinder is fixedly connected to the mounting seat. According to the raft foundation, the mounting plate is arranged above the connecting plate, and the driving assembly is used for driving the mounting plate to move up and down, so that the height of the positioning cylinder can be adjusted, the distance between the upper reinforcing steel bar and the lower raft is equal after the upper reinforcing steel bar is mounted in the positioning cylinder, and the total thickness of the raft foundation and the thickness of a protective layer of the upper reinforcing steel bar are accurately controlled.

The invention belongs to the technical field of sintering, and relates to a production method for reducing the edge effect of a sintering pallet, which comprises the following steps: laying a grate-layer material and a mixture in sequence, so that the total material layer thickness of the sintering pallet is a first thickness; on the premise that the first thickness is not changed, the thickness ratio of the bedding material to the mixture is adjusted so as to reduce the fringe effect; during material distribution, the bedding material is distributed in a mode that the middle is thick and the two sides are thin, and the mixture is distributed above the bedding material in a mode that multiple openings are distributed at the same time. The method has the beneficial effects that the bedding material and the mixture are distributed in different modes, so that the air permeability of the middle and the edge of a material layer is considered at the same time, the edge effect is effectively reduced, and the quality of sintered ore is improved; and the movable compression roller is arranged, so that the compaction degree of a material layer is ensured, gaps among mixed material particles are reduced, mineral powder particles can be tightly bonded by a liquid phase generated in the sintering process, and meanwhile, the solidification effect among mineral powder is also improved.

The invention provides a parameter determination method and device for an elastic flywheel, a storage medium and electronic equipment, and the method comprises the steps: constructing an optimization model, and carrying out the solving calculation of the optimization model according to an optimization variable, a constraint condition and an optimization target, and obtaining a calculation result; wherein the optimization variables are the number of the middle diaphragms, the thickness of a single middle diaphragm and the position relation between any two middle diaphragms, the constraint conditions are the total thickness of the diaphragms and the minimum strength range of the diaphragms, and the optimization target is to minimize the bending rigidity of the middle diaphragms; the target solution of the calculation result comprises the target diaphragm number of the middle diaphragms, the target thickness of each middle diaphragm and the target position relation between any two middle diaphragms. According to the method, under the condition that the torsional rigidity is not changed, the bending rigidity and strength are flexibly controlled by flexibly combining the number of diaphragms, the thickness of the diaphragms, the arrangement sequence of the diaphragms and the like, so that the effects of high reliability and shafting centering compensation capability are considered.

The method comprises applying a spot load to a joint part between a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other. When a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T0 mm, the total thickness thereof after bonding is defined as T1 mm, and T0 / T1=R is defined as a reduction ratio, the reduction ratio R is 1.4 or more.

The invention relates to an offshore wind turbine tower anticorrosive coating spraying thickness uniformity prediction method and system, and relates to the technical field of coating repair treatment.The method comprises the steps that firstly, a single-point spraying material adhesion amount model of a tower is established according to relevant parameters during spraying so as to reduce single-point prediction errors; then, a spraying track is deeply researched and analyzed, and a discretization technology is utilized to discretize a curved surface corresponding to the surface of the tower drum into grid units; and finally, realizing thickness and uniformity prediction by utilizing a three-dimensional curved surface superposition algorithm, predicting the coating thickness of each grid unit, and determining the total thickness of the coating through accumulated integration, so as to generate a thickness distribution cloud picture. Therefore, the method can accurately quantify the influence of complex geometric features on coating diffusion, predicts the coating thickness distribution of a complex curved surface through the track superposition and curved surface projection technology, achieves accurate uniformity quantitative evaluation, and achieves high-consistency thickness prediction from local to overall.

A substrate processing method of grinding a first substrate in a combined substrate in which the first substrate and a second substrate are bonded to each other includes measuring a total thickness distribution of the combined substrate; measuring a thickness distribution of the first substrate; calculating a thickness distribution of the second substrate by subtracting the thickness distribution of the first substrate from the total thickness distribution of the combined substrate; deciding a relative inclination between a substrate holder configured to hold the combined substrate and a grinder configured to grind the combined substrate, based on the thickness distribution of the second substrate; and grinding the first substrate while holding the combined substrate at the inclination which is decided.