The invention provides a
wafer displacement identification method and device, equipment, a medium and a product, and the method comprises the steps: constructing a plane coordinate
system through a plane where a to-be-detected
wafer is located, and obtaining a first length value collected by a first capacitive sensor and a second length value collected by a second capacitive sensor; acquiring a first
standard position coordinate of the first capacitive sensor on the plane coordinate
system and a second
standard position coordinate of the second capacitive sensor on the plane coordinate
system; and according to the first length value, the second length value, the first
standard position coordinate and the second standard position coordinate, calculating the offset from the actual circle center of the
wafer to be measured to the original point. According to the method, the
offset distance of the actual circle center of the wafer to be measured in the horizontal plane direction can be accurately calculated by designing the
layout mode of the coplanar capacitive sensors, the method has low requirements for light conditions, contact with the wafer is not needed, the recognition accuracy is further improved, and the wafer
breakage rate is reduced.