A high-speed method and
system for precisely positioning a
waist of a material-
processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a
laser-
processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a
semiconductor wafer. The
system includes a focusing lens subsystem for focusing a
laser beam along an
optical axis substantially orthogonal to a plane, an x-y stage for moving the
wafer in the plane, and a first
air bearing sled for moving the focusing lens subsystem along the
optical axis. The
system also includes a first controller for controlling the x-y stage based on reference data which represents 3-D locations of microstructures to be processed within the site, a second controller, and a first
voice coil coupled to the second controller for positioning the first
air bearing sled along the
optical axis also based on the reference data. The reference data is generated by the system which includes a modulator for reducing power of the material-
processing laser beam to obtain a probe laser beam to measure height of the
semiconductor wafer at a plurality of locations about the site to obtain reference height data. A computer computes a
reference surface based on the reference height data. A trajectory planner generates trajectories for the wafer and the
waist of the laser beam based on the
reference surface. The x-y stage and the first
air bearing sled controllably move the wafer and the focusing lens subsystem, respectively, to precisely position the
waist of the laser beam so that the waist substantially coincides with the 3-D locations of the microstructures within the site. The system also includes a spot size lens subsystem for controlling size of the waist of the laser beam, a second air bearing sled for moving the spot size lens subsystem along the optical axis, a third controller for controlling the second air bearing sled, and a second
voice coil coupled to the third controller for positioning the second air bearing sled along the optical axis.