1results about How to "Work around application limitations" patented technology

This invention discloses a single-component moisture-curing conductive and thermally conductive adhesive and its preparation process, comprising the following raw materials in parts by weight: 100 parts SMP adhesive; 15-30 parts flake silver powder; 500-900 parts spherical silver-coated copper powder; 0-400 parts dendritic silver-coated copper powder; 10-20 parts decamethyltetrasiloxane; 1-1.5 parts β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate isooctyl ester; 7.5-10 parts N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane; and 1-1.5 parts vinyltrimethoxysilane. This invention allows the adhesive to cure at room temperature / low temperature using moisture in the air, eliminating the need for temperatures above 120°C. This completely avoids thermal stress damage to heat-sensitive substrates such as plastics, flexible circuit boards, and PET / PI films, making it perfectly suited for low-temperature processing scenarios such as flexible electronics manufacturing, wearable devices, and flexible sensors.