3results about How to "Work around application limitations" patented technology

The invention provides a true three-dimensional landslide model test device under a multi-factor coupling effect, the true three-dimensional landslide model test device comprises an assembly type model box and a support arranged on the outer side of the assembly type model box, a mechanical lifting system is arranged at the bottom of the assembly type model box, and the left side of the assembly type model box is connected with a flow velocity and water temperature control system through a pipeline; a rainfall and temperature control system is arranged on the support, a stress simulation system is arranged on the side edge of the assembly type model box, a deformation monitoring system is further arranged in the assembly type model box, and a true three-dimensional model arrangement system is arranged on the side edge of the assembly type model box. The rainfall system can effectively overcome the application limitation that accurate control cannot be achieved, the rainfall intensity, range, position and duration can be adjusted in real time, and simulation of various rainfall working conditions is achieved; by controlling the precipitation amount, the influence of the rainfall effect on the stability of the reservoir bank slope at different water levels can be studied.

This invention discloses a single-component moisture-curing conductive and thermally conductive adhesive and its preparation process, comprising the following raw materials in parts by weight: 100 parts SMP adhesive; 15-30 parts flake silver powder; 500-900 parts spherical silver-coated copper powder; 0-400 parts dendritic silver-coated copper powder; 10-20 parts decamethyltetrasiloxane; 1-1.5 parts β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate isooctyl ester; 7.5-10 parts N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane; and 1-1.5 parts vinyltrimethoxysilane. This invention allows the adhesive to cure at room temperature / low temperature using moisture in the air, eliminating the need for temperatures above 120°C. This completely avoids thermal stress damage to heat-sensitive substrates such as plastics, flexible circuit boards, and PET / PI films, making it perfectly suited for low-temperature processing scenarios such as flexible electronics manufacturing, wearable devices, and flexible sensors.

The invention discloses an expansion sample matching-based artwork price index compilation method and device. The method comprises the following steps of: separating and quantifying all features of each artwork; all artworks are subjected to sample grouping according to a predetermined condition, and only any two artwork samples in adjacent time are matched to form a repeated transaction sample pair; constructing a repeated transaction model equation by performing difference on a preset feature price model, and then inputting expanded repeated transaction pair data to calculate an artwork transaction time influence coefficient; and performing index processing on the artwork transaction time influence coefficient to obtain an artwork price index. The method can effectively solve the problem of artwork heterogeneity, the estimation of the artwork price index has higher accuracy and effectiveness, the index trend is more obvious, the volatility is lower, the comprehensive quality is higher, and the method has a better application prospect in the artwork market.