3507results about "Electrically-conducting adhesives" patented technology

An electro-optic display comprises a layer (130) of a solid electro-optic material, at least one electrode disposed adjacent the layer (130) of electro-optic material, and a layer (180) of a lamination adhesive interposed between the layer (130) of electro-optic material and the electrode, the lamination adhesive (180) having a higher electrical conductivity in a direction perpendicular to the layer of lamination adhesive than in the plane of the layer.

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

An electro-optic assembly comprises an adhesive layer and a layer of electro-optic material. The adhesive layer comprises a polymeric adhesive material and an ionic material having either its cation or its anion fixed to the polymeric adhesive material. The ionic material reduces the volume resistivity of the polymeric adhesive material and is not removed upon heating to 50° C. In a similar electro-optic assembly comprising an adhesive layer and a layer of electro-optic material, the adhesive layer comprises a polymeric adhesive material which has been subjected to dialysis or diafiltration to remove organic species having a molecular weight less than about 3,500, so that the adhesive material has a content of N-methylpyrrolidone not exceeding 500 ppm based upon the total weight of the adhesive layer and layer of electro-optic material.

The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.

An anisotropic conductive adhesive contains conductive particles dispersed in a resin composition, wherein the resin composition includes a radical polymerization resin (A), an organic peroxide (B), a thermoplastic elastomer (C) and a phosphoric ester (D). The resin composition can further contain an epoxy silane coupling agent (E) represented by formula (2) or (3). The resin composition is mixed with other components after the radical polymerization resin (A), the thermoplastic elastomer (C), the phosphoric ester (D) and the epoxy silane coupling agent (E) are reacted. It is also possible to preliminarily react only the phosphoric ester (D) and the epoxy silane coupling agent (E) and to react the product of the preliminary reaction with the radical polymerization resin (A) and the thermoplastic elastomer (C), and then to add other components. The anisotropic conductive adhesive of the present invention can be used for electrical joining of electronic or electric parts of electrical apparatus.

An adhesive, comprising a pressure-sensitive adhesive composition; and carbon nanotubes in an amount effective to render the pressure-sensitive adhesive composition electrically conductive. Such adhesives are of particular use with gasketing materials.

The invention is based on use of a heat-activated adhesive for manufacturing of intelligent devices comprising printed conductive electronics on a flexible substrate, where the adhesive is an anisotropic electrically conductive adhesive and is applied to the substrate as a thin film which can be used for electrical connections and for providing mechanical stability to the printed conductive electronics.

It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

A conductive electrolessly plated powder used, for example, for bonding a small electrode of an electronic device, its producing method, and a conductive material containing the plated powder. Conventionally, there has been known, as conductive powders, metallic powders such as of nickel, carbon powders, and conductive plating powders the resin core particles of which are coated with a metal, e.g., nickel. However, there has been no conductive electrolessly plated powders having a good conductivity with respect to connection between conductive patterns having an oxide coating thereon or between electrodes and no methods for producing such powders industrially. The conductive electrolessly plated powder of the present invention consists of resin spherical core particles the average size of which is 1 to 20 mum and each of which has a nickel or nickel alloy coating formed by electroless plating. The coating includes small projections of 0.05 to 4 mum on its outermost layer and the coating is substantially continuous with the small projections. A method of producing such a powder is also disclosed.

A structural joint for the transmission and control of high current flows in a carbon fiber or carbon fiber hybrid composite structure, said joint includingat least two composite structures comprising a multiplicity of resin bonded carbon fiber plies,an adhesive applied there between and capable of conducting high currentssaid adhesive comprising a conductive carrier film comprising carbon fibers,wherein the electrical conductivity of the adhesive is comparable with that of the adjacent composite structures.

An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.

Adhesives and sealants comprising submicron particles and nanomaterials, methods of making such adhesives and sealants, and methods of using such adhesives and sealants are provided.

Pressure-sensitive adhesives for optical films exhibit high cohesion, excellent re-workability, adhesion properties, heat resistance and durability without chemical crosslinking.

A pressure-sensitive adhesive contains an acrylic triblock copolymer (I) at not less than 60% by mass based on the total mass of all solids contained in the pressure-sensitive adhesive, the acrylic triblock copolymer being represented by the formula A1-B-A2 wherein: A1 and A2 are each independently an alkyl methacrylate polymer block having Tg of not less than 100° C. and B is an acryl acrylate polymer block having Tg of not more than −20° C.; the content of the polymer block B is 50 to 95% by mass; Mw is in the range of 50,000 to 300,000; and the molecular weight distribution is in the range of 1.0 to 1.5. In a preferred embodiment, the acrylic triblock copolymer (I) is a combination of an acrylic triblock copolymer (Ia) having Mw of 50,000 to less than 100,000 and an acrylic triblock copolymer (Ib) having Mw of 100,000 to 300,000, in a mass ratio (Ia):(Ib) of 45:55 to 75:25.

(1) A carbonaceous material for forming an electrically conductive composition, comprising a vapor grown carbon fiber, each fiber filament of the carbon fiber having an outer diameter of 2 to 500 nm and an aspect ratio of 10 to 15,000, or the carbon fiber containing boron in an amount of 0.01 to 5 mass %, and graphitic particles and/or amorphous carbon particles, wherein the amount of the vapor grown carbon fiber is 10 to 90 mass %, the amount of the graphitic particles is 0 to 65 mass %, and the amount of the amorphous carbon particles is 0 to 35 mass %; (2) an electrically conductive composition comprising the carbonaceous material for forming an electrically conductive composition, and a producing method thereof; (3) an electrically conductive coating material comprising, as an electrically conductive material, the electrically conductive composition, and an electrically conductive coating film and electric device using the electrically conductive coating material.

Electrically conductive workpieces with facing surfaces are bonded with an adhesive that is filled with conductive metal particles that are reactive with the surfaces of the workpieces. In the bonding process the surfaces are coated with the adhesive, pressed together and an electric current passed between them to momentarily melt the conductive particles. The molten droplets agglomerate and wet the facing surfaces. When the molten clusters re-solidify, electrically conductive paths are formed between the workpieces. For example, the practice is useful for bonding ferrous-based or aluminum-based alloy sheets, strips or plates in making products such as bipolar plates for fuel cells.

Laminated composites such as noise damping sheet metal sandwiches with viscoelastic adhesive cores are strengthened against delamination during forming and made more conductive for welding. Electrically conductive, metal-element containing particles, wires, wire meshes, or the like conductive bonding elements are included in the core material and fused to facing surfaces of the metal sheets to provide many mechanical bonding connections and electrical connections over the bonded area of the composites.

The invention provides a method for preparing high-heat-conductivity conductive adhesive containing graphene. The method comprises the steps of (1) functionalizing surface of graphene, namely adding graphene to acetone solution of an organic matter containing a conjugate ring, and strongly ultrasonically shaking for 6-48 hours at 40-100 DEG C to form non-covalent modified graphene; (2) mixing epoxy resin with an epoxy diluent for 3-30 minutes at room temperature to obtain a mixture of epoxy resin and the epoxy diluent, and sequentially adding metal powder and a coupling agent to the mixture; (3) adding the non-covalent modified graphene prepared in the step (1) to the mixture in the step (2); and (4) adding a curing agent to the mixture in the step (3) to prepare the even conductive adhesive. The method has the advantages that dispersing and enhancing interface joint in an epoxy system are facilitated by functionalizing the surface of graphene by a non-covalent bond; and then graphene is mixed with metal powder to obtain the high-heat-conductivity conductive adhesive. The high-heat-conductivity conductive adhesive has the application prospect in a high-power apparatus.

An electrically conductive adhesive tape used for electrical and electronic products to bond or fix an element to a support while maintaining an electrical conductibility between the element and support. The conductive adhesive tape has a structure including a resin film, a metal layer formed over one surface of the resin film by depositing a conductive metal over the surface of the resin film, and a conductive adhesive layer coated over the metal layer. The metal layer has a net-shaped structure. In some cases, the metal layer may have a planar structure. The conductive adhesive tape has a very small thickness by virtue of its metal layer deposited to a very small thickness. Accordingly, the conductive adhesive tape maintains a desired strength while exhibiting a high flexibility and a high bondability, thereby exhibiting a superior conductibility. In the case in which the metal layer has a net-shaped structure, the tape has a structure having spaces where the metal layer does not exist. Where the tape is applied to a Braun tube, accordingly, there is no influence on an electron beam emitted from a deflection yoke while a desired conductibility is maintained. The manufacture of the tape is simple. By virtue of the conductibility, the tape of the present invention also has an elecromagnetic wave shielding function.

An object of the present invention is to provide a pressure-sensitive adhesive composition which is excellent in antistatic property of a non-electrification-prevented adherend (subject to be protected) upon peeling, and has reduced stainability in an adherend and is excellent in adhesion reliance, and electrification preventing pressure-sensitive adhesive sheets using the same. There is provided a pressure-sensitive composition comprising an ionic liquid, and a (meth)acryl-based polymer containing, as a monomer component, 0.1 to 100% by weight of a (meth)acrylic acid alkylene oxide. In addition, there is provided a pressure-sensitive composition comprising an ionic liquid, and a polymer containing, as a monomer component, 0.5 to 30% by weight of a nitrogen-containing monomer and having a glass transition temperature Tg of no higher than 0° C. Furthermore, there is provided a pressure-sensitive composition comprising an ionic liquid, and a (meth)acryl-based polymer containing, as a monomer component, 0.01 to 20% by weight of a reactive surfactant.

Adhesive compositions and methods of bonding and disbanding involve materials that include a polymer and an electrolyte, wherein the electrolyte provides sufficient ionic conductivity to enable a faradaic reaction at a bond formed between the composition and an electrically conductive surface, allowing the composition to disbond from the surface at room temperature. In some embodiments, the polymer component comprises or consists essentially of a thermoplastic polymer.

Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention comprises: a main ACA film based upon epoxy resin and containing conductive particles having a particle size of 3 to 10 μm and optionally non-conductive particles having a particle size of 0.1 to 1 μm; and adhesion reinforcing layers based upon epoxy resin and formed at both sides of the main ACA film.

The present invention is directed to an antistatic pressure sensitive adhesive. The antistatic pressure sensitive adhesive comprises a pressure sensitive adhesive, and an antistatic agent comprising at least one organic salt. Certain embodiments of the antistatic pressure sensitive adhesive also have a luminous transmission of greater than about 89% according to ASTM D 1003-95. Additional embodiments of the antistatic pressure sensitive adhesive have a haze of less than about 5% according to ASTM D 1003-95, and in specific embodiments the haze is less than about 2% according to ASTM D 1003-95.