2966results about "Film/foil adhesives without carriers" patented technology

An electro-optic display comprises a layer (130) of a solid electro-optic material, at least one electrode disposed adjacent the layer (130) of electro-optic material, and a layer (180) of a lamination adhesive interposed between the layer (130) of electro-optic material and the electrode, the lamination adhesive (180) having a higher electrical conductivity in a direction perpendicular to the layer of lamination adhesive than in the plane of the layer.

The present invention may relate to provision of a mechanism to join together the various substrate layers of a flexible display with optically clear adhesives that permit improved flexibility of the substrate layer stack and may also optically guide images to locations on a display surface that are not aligned with the display layer of a substrate layer stack. Embodiments of the present invention may provide for an improved user interface which may include enhanced flexibility and enhanced optical characteristics.

It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

A process for the production of a thinned wafer, comprising bonding the circuit surface (surface A) of a semiconductor wafer (a) to a holding substrate (b) with an adhesive film (c), grinding and polishing the back surface (surface B) of the semiconductor wafer to thin the semiconductor wafer, carrying out the metallization of the back surface (surface B) and the like as required, and then separating the thinned wafer from the holding substrate (b), wherein a thermoplastic resin film is used as the adhesive film (c) and the above bonding of the circuit surface (surface A) of the semiconductor wafer (a) to the holding substrate (b) is carried out at a bonding temperature selected from the range of from +10.degree. C. to +120.degree. C. of glass transition point of the thermoplastic resin film or the range of from -40.degree. C. to +20.degree. C. of melting point of the thermoplastic resin film.

Films having a microreplicated topography are prepared from contacting a microembossed pattern to a layer of film. When an adhesion interface is established between the layer of film and a supporting substrate, the topography of the film surface controls the performance of the adhesion interface. Articles having microreplicated film surfaces are also disclosed that have an advantage of providing microchannels for fluid egress for an effective period of time. Multiple microembossed patterns produce microreplicated film surfaces having both microchannels for fluid egress and pegs for improved film properties.

A pressure sensitive adhesive layer with a structured surface, wherein the adhesive layer is capable of being dry laminated to a substrate to form a laminate. The adhesive layer has a haze after lamination, measured according to ASTM D 1003-95, of less than about 50% of the haze of the adhesive layer before lamination. After dry lamination, the adhesive layer has a luminous transmittance of more than about 85%, a haze of less than about 25%, and an opacity of less than about 3%.

This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration.

The invention provides pressure-sensitive adhesive (PSA) coated articles, including tapes and transfer coatings, having microstructured surfaces and methods of making pressure-sensitive adhesive articles bearing such microstructured surfaces. The performance properties of the pressure-sensitive adhesive articles can be tailored by independently varying the microstructure and the rheological properties of the pressure-sensitive adhesive.

Provided is a pressure-sensitive adhesive sheet for optical use which less suffers from a misoperation-causing change in capacitance upon application to an optical member.

The pressure-sensitive adhesive sheet for optical use includes a pressure-sensitive adhesive layer and has a dielectric constant of from 2 to 8 at a frequency of 1 MHz and a dielectric loss tangent of more than 0 and 0.2 or less at a frequency of 1 MHz. The pressure-sensitive adhesive sheet for optical use preferably has a dielectric constant at a frequency of 1.0×10⁶ Hz being 60% or more of that at a frequency of 1.0×10⁴ Hz. In addition, the pressure-sensitive adhesive sheet for optical use preferably has an absolute value of difference between the dielectric loss tangent at a frequency of 1.0×10⁶ Hz and that at a frequency of 1.0×10⁴ Hz of 0.15 or less.

The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.

A wafer processing laminate, a wafer processing member, a temporary adhering material for processing a wafer, and a method for manufacturing a thin wafer, which facilitates to establish a temporary adhering the wafer and the support, enables to form a layer of uniform thickness on a heavily stepped substrate, and is compatible with the TSV formation and wafer back surface interconnect forming steps, and the wafer processing laminate includes a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed, wherein the temporary adhesive material layer includes a three-layered structure composite temporary adhesive material layer.

There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.5 MPa; a wiring board for mounting a semiconductor equipped with said adhesive film on a surface for mounting a semiconductor chip; and a semiconductor device using said adhesive film or said wiring board for mounting a semiconductor.

Disclosed are adhesive compositions comprising nonfunctionalized base resins and functionalized ethylene copolymers such as ethylene/maleic anhydride (E/MAH) or ethylene/ethyl hydrogen maleate (E/MAME) copolymer, which are synthesized directly in a high pressure autoclave. These adhesive compositions can be applied as self-supporting films or can be co-extruded or extrusion coated onto a substrate. Also disclosed are multilayer structures, films, pipe coatings and building panels comprising these compositions.

The present invention relates to a pressure sensitive adhesive composition. The present invention may effectively provide a pressure sensitive adhesive where peel forces for both sides are different and an modulus differs along the thickness direction. By applying the pressure sensitive adhesive as above, the present invention may provide, for example, an optical element, such as a polarizing plate, which can effectively inhibit light leakage and shows excellent durability, while being formed to have a thin thickness as well.

This invention relates to an adhesive article which provides air egress. Air egress is provided by supplying a mute, such as areas of no initial adhesion for the air to flow out from under the construction. The invention relates to an adhesive article comprising a facestock having a front surface and a back surface, a continuous layer of adhesive having an upper surface and a lower surface wherein the upper surface of the adhesive layer is adhered to the back surface of the facestock, and a plurality of spaced-apart non-adhesive material which is in contact with the lower surface of the adhesive layer wherein the lower surface of the adhesive layer has a Sheffield roughness of at least about 10 and the adhesive article provides air egress. The invention also relates to methods of preparing the adhesive articles, These articles have usefulness as industrial graphics images, as well as decorative coverings, etc. The articles provide air egress and optionally repositionability and slideability.

An adhesive film that includes a first region having a first hardness, and second regions disposed on opposing sides of the first region and having a second hardness that is greater than the first hardness.

A B-stageable film that includes a thermal interface material is provided. The film may secure a heat-generating device to a heat-dissipating component, may further cross-link, and may conduct thermal energy from the heat-generating device to the heat-dissipating component. A method of making and using the film is provided, as well as a device that incorporates the film.

An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.

The present invention relates to an adhesive tape and to a method for its manufacture, the tape comprising: (A) a heat-activatable adhesive resin layer, wherein the resin is a polymer of one or more monomers selected from the group consisting of olefins, and (B) a pressure-sensitive adhesive layer, comprising an acrylic-type pressure sensitive adhesive, wherein said pressure sensitive adhesive layer is permanently and directly bonded to a first major surface of said heat-activatable adhesive layer. The present invention also relates to an intermediate article comprising the heat-activatable adhesive resin layer (A) releasably bonded to a support layer, to a composite article comprising the adhesive tape and a rubber article bonded to the second major surface of the heat-activatable layer (A), and to a vehicle comprising the composite article.

There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

An adhesive cutout includes an adhesive layer having a first surface and an opposing second surface, the first and the second surfaces at least partially covered by a first release liner and a second release liner, respectively. The first release liner includes first removal means for facilitating removal of the first release liner from the first surface of the adhesive layer. The second release liner includes second removal means for facilitating removal of the second release liner from the second surface of the adhesive layer.

Provided is a viscoelastic article which exerts different properties between one surface and the other surface thereof, which has a transparent appearance, and which less causes staining of objects to which the viscoelastic article is adopted. The viscoelastic article is an article having a multilayer structure including a polymer layer, and a monomer-absorptive layer capable of absorbing at least one of monomer component(s) constituting the polymer, in which the polymer layer is a polymer layer containing an elastomer unevenly distributed and enriched at an interface, or in the vicinity thereof, opposite to the monomer-absorptive layer. The vicinity of the interface opposite to the monomer-absorptive layer is preferably a region ranging from the interface opposite to the other interface with the monomer-absorptive layer and occupying, in a thickness direction, 50% or less of the total thickness.