Provided herein, according to some embodiments of the invention, are organosilane polymers prepared by reacting organosilane compounds including
- (a) at least one compound of Formula I
Si(OR1)(OR2)(OR3)R4 (I)
wherein R
1, R
2 and R
3 may each independently be an alkyl group, and R
4 may be —(CH
2)
nR
5, wherein R
5 may be an aryl or a substituted aryl, and n may be 0 or a positive integer; and
- (b) at least one compound of Formula II
Si(OR6)(OR7)(OR8)R9 (II)
wherein R6, R7 and R8 may each independently an alkyl group or an aryl group; and R9 may be an alkyl group.
Also provided are hardmask compositions including an organosilane compound according to an embodiment of the invention, or a hydrolysis product thereof.
Methods of producing semiconductor devices using a hardmask compostion according to an embodiment of the invention, and semiconductor devices produced therefrom, are also provided.