The application discloses a manufacturing method for improving poor resin flow of a multilayer
printed circuit board, and particularly relates to the field of
printed circuit board manufacturing, and comprises the following steps: step S1, first, inner layer circuit manufacturing and brown
processing are completed to obtain a core board to be laminated, the core board comprises a core board with a circuit pattern and a full
copper / half
copper light board core board; step S2, a lamination structure is configured according to the type of the core board, the type of the core board comprises
kraft paper and special auxiliary materials, the special auxiliary materials comprise a partition plate
copper foil and a release film; step S3, a large-area glue filling special program is adopted, and pressure, temperature and holding parameters are set; step S4, a laminated board is completed according to the configuration, a press is fixed, and lamination is completed according to the set program. The application precisely improves the resin flow state of a small-area copper-free area of the multilayer
printed circuit board, completely solves the problem of poor resin flow, significantly improves product
pass rate and interlayer bonding reliability, has strong process adaptability, is low in cost, does not need additional equipment modification, and is suitable for
batch production requirements.