A kind of insulating and heat-conducting double-sided adhesive tape and preparation method thereof

Abstract

The invention provides an insulating and heat-conducting double-sided adhesive tape and a preparation method thereof. In the insulating and heat-conducting double-sided adhesive tape, the outer layers on both sides are release paper, and a single layer of insulating and heat-conducting adhesive is arranged between the two layers of release paper. Or the outer layers on both sides are release paper, a single-layer substrate is arranged between the two layers of release paper, and an insulating and heat-conducting adhesive is arranged between the substrate and the release paper. The preparation method is as follows: mixing heat-conducting medium and solvent, adding insulating heat-conducting glue, stirring, coating and drying, and the preparation is completed. The adhesive tape of the invention has the advantages of good thermal conductivity, electrical insulation, stability at room temperature, easy die-cutting, reworkable characteristics, and easy operation.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to an insulating and heat-conducting double-sided adhesive tape with good thermal conductivity and electrical insulation and a preparation method thereof. Background technique [0002] With the densification and miniaturization of integrated circuits, electronic components become smaller and operate at higher speeds, so the heat dissipation requirements are getting higher and higher. Therefore, in order to dissipate the heat from the heating place as soon as possible, the high thermal conductivity of the heat dissipation system material is used to quickly take away the heat to achieve the effect of heat dissipation. However, there is usually a gap between the heat dissipation system and the surface of the heat-generating part, so that the heat-dissipating system and the surface of the heat-generating part cannot be in complete and close contact, so that the heat dissipation device system cannot a...

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Problems solved by technology

[0004] The first type is ceramic heat-conducting adhesive materials, which use ceramic gaskets as heat-conducting materials, mainly flake mica and graphite, etc. When using them, heat-conducting paste needs to be applied on both sides of the heat-conducting sheet to reduce the lack of tight fit between the interfaces. The thermal resistance rises, the disadvantage is that it is easy to break, which is not conducive to die-cutting

[0005] The second type is thermally conductive film, which is made by coating thermally conductive material on glass fiber cloth, using glass fiber cloth as the base material, so that the film has the advantages of high tensile strength and softness, but the disadvantage is that the film is die-cut When the heat conduction material is easy to overflow glue, it will pollute the machine during die cutting

[0006] The third type is thermally conductive adhesive, which is made of liquid or semi-solid thermally conductive adhesive by adding ceramic powder, graphite or metal powder to liquid polymer. The advantages of this type of material are low thermal resistance and good heat transfer effect. It is easy to contaminate electronic components and circuit boards when used, and it will dry and volatilize into small molecular substances under constant high temperature

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