1293 results about "Organic group" patented technology

As a high-performance resist material, a tin compound is provided which has properties such as solubility, hydrophobicity, and resist sensitivity with good balance. A tin compound includes a tin atom; an organic group R; and at least one of an oxo-ligand and a hydroxo-ligand. One molecule of the tin compound includes two or more types of organic group R and includes a Sn—O—Sn structure, and the organic group R has 1 to 30 carbon atoms.

As a high-performance resist material that can have high purity and uniform solubility, the following tin compound is provided. The tin compound includes: a tin atom; an organic group R; and at least one of an oxo-ligand and a hydroxo-ligand, wherein the tin compound has a diffraction angle 2θ (°) of a peak with a strongest intensity between 5.00 to 15.00° in X-ray diffraction measurement, the strongest intensity peak has a half-value width of 1.00 to 4.00°, and the organic group R has 1 to 30 carbon atoms.

A method for producing a tin compound represented by formula (A1) with a purity of 95 mol % or higher, involves a step of distilling the tin compound, in which the number of plates of the distillation is 10 or more, and the reflux ratio is 30 or less.RSnX3  (A1)In formula (A1), R is an organic group with 1 to 30 carbon atoms, and may be substituted with halogen, oxygen atoms, or nitrogen atoms. X is selected from OR′ and NR′2. R′ is an organic group with 1 to 10 carbon atoms, and part may be substituted with halogen, oxygen atoms, or nitrogen atoms. When there are multiple R′ groups in the molecule, they may have the same or different structures, and they may be bonded to each other to form a cyclic structure.

The invention relates to an organic compound, a solar cell and application thereof. The organic compound is shown as a formula (1), wherein Ar is selected from any one of substituted or unsubstituted aryl with the ring-forming atom number of 6-50, substituted or unsubstituted heteroaryl with the ring-forming atom number of 5-50, a group shown as a formula (A) and a group shown as a formula (B), Ar'is selected from an electrically neutral organic group, and L is selected from a paraffin subunit with the carbon atom number of 1-10; r1 is an oxyacid group; n1 is selected from any integer of 1-3, and m1 is selected from any integer of 1-10; or the organic compound is an oxyacid radical salt of the compound as shown in the formula (1). The organic compound not only can be used as a passivation material, but also can be used as a hole transport material, and can improve the photoelectric conversion efficiency of a solar cell when being applied to preparation of the solar cell.

The invention relates to the technical field of biodiesel hydrogenation catalysts, and particularly discloses a hydrogenation catalyst of organic bentonite loaded cerium-zirconium solid solution and nickel-molybdenum phosphide as well as a preparation method and application of the hydrogenation catalyst. The hydrogenation catalyst with the organic bentonite loaded with the cerium-zirconium solid solution and the nickel-molybdenum phosphide comprises an organic bentonite carrier, the cerium-zirconium solid solution and the nickel-molybdenum phosphide, the loading capacity of the cerium-zirconium solid solution on the organic bentonite carrier is 2-2.5 wt%; the cerium-zirconium solid solution comprises cerium dioxide and zirconium dioxide; the loading capacity of the nickel molybdenum phosphide on the organic bentonite carrier is 10-15 wt%; and the nickel molybdenum phosphide is Ni2Mo3P. The organobentonite carrier provides an acid site and promotes deoxidation path optimization, the layered structure of the organobentonite carrier can limit the cerium-zirconium solid solution and the nickel-molybdenum phosphide, and organic groups are also embedded into the layered structure, so that the organic compatibility of the organobentonite carrier to biodiesel is improved, and the catalytic efficiency is improved. The cerium-zirconium solid solution provides oxygen vacancies, promotes hydrogenation / deoxidation, and improves the thermal stability and sintering resistance of the catalyst.

A surface treatment agent containing a hydrocarbon-terminal-group-containing compound of the following formula makes it possible to form a cured film that is exceptional in water repellency, slipperiness, dirt removability, and abrasion resistance, particularly steel wool abrasion resistance and wet abrasion resistance. (R1 is a C12-80 monovalent hydrocarbon group that includes a C12 or higher monovalent or divalent linear unsubstituted aliphatic saturated hydrocarbon group and does not contain a hydrocarbon branched structure, R2 is H, a halogen atom, a hydroxyl group, a siloxy group, an -OSi(CH3)3 group, an -OSi(C2H5)3 group, an amino group, an SH group, a monovalent hydrocarbon group, R1, -V-Z-(Y-A)m, or -Y-A, U is a single bond, C, or a trivalent or tetravalent organic group, V is a single bond or a divalent hydrocarbon group, Z is a single bond, C, Si, N, S, or a trivalent to octavalent organic group, Y is a single bond or a divalent hydrocarbon group, A is a monovalent reactive group, k is 0, 1, or 2, and m is 1-7.)

Provided is a liquid crystal alignment film which suppresses AC afterimage at a high level and which reduces charge accumulation and flicker due to backlight. The liquid crystal aligning agent contains the following polymer (A) and polymer (B). The polymer (A) is selected from the group consisting of polyimide precursors having formula (A1) and polyimides that are imides of the polyimide precursors. The polymer (B) is selected from the group consisting of polyimide precursors of formula (B1) and polyimides that are imides of the polyimide precursors, and the proportion of tetravalent organic groups represented by formula (X-10) is 40 mol% or more with respect to the total of 1 mol of tetracarboxylic acid residues of the polymer (B). # imgabs0 # (wherein the meaning of each symbol in the formula is as defined in the description. ) # imgabs1 # (* represents a bond).

Hot melt adhesive including a polar group-containing olefin copolymer has: number average molecular weight (Mn) between 10 to 50 kg / mol, crystallinity (Xc) content below 30%, enthalpy (ΔH) between 5 to 65 J / g, polydispersity index (PDI) from 2 to 6, melting temperature (Tm) between 40 and 120° C., and including at least 80 mol % of a constituent unit of formula (1), optionally a constituent unit of formula (2), and between 0.1 to 1 mol %, of a constituent unit of formula (3):wherein R1 is H or CH3; R2 is a hydrocarbyl group having 0 to 10 carbon atoms; R3 is a hydrocarbyl group having 2 to 10 carbon atoms, when X is hydroxyl functionality or a hydrocarbyl group having 0 to 10 carbon atoms, when X is polar organic group containing at least one carboxylic acid functionality and 0 to 6 carbon atoms.

The invention relates to alkali-soluble light-cured resin and a preparation method thereof, a light-cured resin composition, a photosensitive dry film and a semiconductor device. The structural formula of the alkali-soluble light-cured resin is shown as a formula (I) or a formula (II), wherein in the formula (I), R1 is selected from one of a single bond, an oxygen atom, a sulfonyl group and an organic group with 1-30 carbon atoms; in the formula (I) and the formula (II), n is a natural number greater than or equal to 0; r2 is selected from organic groups with 1-50 carbon atoms; r3 is selected from an aromatic organic group or an aliphatic organic group; r4 is selected from organic groups containing unsaturated carbon-carbon double bonds; and R5 is selected from carboxyl-containing organic groups. A molecular chain of the alkali-soluble light-cured resin contains a photosensitive group, an imide structure and an alkali-soluble group, on one hand, the thermal mechanical property of the alkali-soluble light-cured resin can be enhanced, and on the other hand, the alkali-soluble light-cured resin can form a uniform and stable resin glue solution in a solvent, so that the comprehensive performance of the alkali-soluble light-cured resin is improved.

Provided are a radiation-sensitive composition and a pattern formation method that can exhibit, at the time of pattern formation, a sufficient level of sensitivity, LWR performance, pattern rectangularity, development defect suppression, CDU performance, and pattern circularity. This radiation-sensitive composition includes: a polymer that includes a structural unit (I) represented by formula (1); an onium salt that includes an organic acid anion including a cyclic structure, and an onium cation; and a solvent. (In formula (1), R1 is a hydrogen atom or a C1-20 monovalent organic group, L is a single bond or a divalent linking group, R2 is a C1-5 substituted or unsubstituted monovalent hydrocarbon group, R3 is a C1-10 monovalent organic group, a hydroxy group, a nitro group, a cyano group, an amino group, a halogen atom, or a sulfanyl group, in cases in which there are a plurality of R3s present, the plurality of R3s may be the same as or different from each other, and n is an integer from 0 to 10.)

The invention provides a sulfinate organic positive alkali metal ion supplement for a secondary battery, and relates to the technical field of secondary batteries. The organic positive electrode alkali metal ion supplement has a structure as shown in the following general formula: [R-SO2]-M < + >, wherein M < + > is a metal cation and is selected from at least one of Li < + >, Na < + > and K < + >; [R-SO2]-is a sulfinate anion, and wherein R is an organic group. The supplement compensates irreversible capacity loss by efficiently releasing active ions, so that the energy density of the battery is improved; the oxidation potential is proper, the environmental stability is excellent, and the catalyst is not needed to decompose and easy to process; decomposition products are harmless, an electrode interface can be optimized, and the cycle life of the battery is remarkably prolonged.

The invention provides a silica hydrogel, a method for removing the same, and a silica hydrogel film. A silica-based composite material modified by an alkyl amine group NH2L and an organic alkyl group R is prepared by adopting a reversed-phase microemulsion method, and a silica colloid material highly modified by an organic group is obtained by controlling the molar weight of alkyl amine silane and alkyl silane and controlling no use and no contact of any alcohol solvent in the whole preparation process. Adding acetone for demulsification, centrifugally collecting, washing solids, drying to obtain a solid silicon dioxide colloid material, and dissolving the solid silicon dioxide colloid material in deionized water to obtain the silicon dioxide hydrogel. The silica hydrogel has solubility in an alcohol solvent and can be removed by the alcohol solvent. The silicon dioxide hydrogel can be combined on the surface of a membrane material to obtain a silicon dioxide hydrogel membrane.

The purpose of the present invention is to provide a bismaleimide compound which is capable of achieving a high glass transition point (Tg), and with which it is possible to provide a resin composition that satisfies: (1) the dielectric loss tangent is low; (2) the compatibility with organic solvent and resin material, especially with a resin material having a polar functional group is good; and (3) photolithography using an organic solvent or an alkaline aqueous solution is possible. Disclosed is a bismaleimide compound which includes a structural unit represented by general formula (1). In general formula (1), A represents a tetravalent organic group including a cyclic structure. B1 represents a divalent hydrocarbon group having 13 to 200 carbon atoms and no cyclic structure. In cases where a plurality of structural units of general formula (1) are present in the bismaleimide compound, a plurality of A's may be independent and may be the same as or different from each other, and a plurality of B1s may be independent and may be the same as or different from each other.

The present invention is a polymer containing: a structural unit of general formula (1) and / or (2); and a structural unit of general formula (3) and / or (4), where X1 represents a tetravalent organic group, R1 to R4 each represent a monovalent organic group or a hydrogen atom, provided that at least one is a monovalent organic group, L represents a divalent organic group or a divalent atom, X2 represents a divalent organic group, X3 represents a tetravalent organic group, "s" represents 0 or 1, Z represents a divalent bonding group, and X4 represents a divalent organic group. This provides a polymer soluble in an aqueous alkaline solution and usable as a base resin for positive and negative photosensitive resin compositions which enable fine pattern formation, provide high resolution, and have excellent mechanical characteristics even when cured at low temperatures.

The present application provides a preparation method for a thermally expandable microsphere containing hydrophilic organic-modified colloidal silicon dioxide. In the preparation method, hydrophilic organic-modified colloidal silicon dioxide is mixed with a mixture of a monomer material capable of polymerizing to form a thermoplastic polymer shell and at least one foaming agent to form an emulsion, and the emulsion is polymerized to form the thermally expandable microsphere. Surface-modified colloidal silicon dioxide with hydrophilic organic group in the present application has good salt tolerance stability, can be stabilized in brine and is beneficial to the preparation of the thermally expandable microsphere; and the prepared microsphere has a narrow particle size distribution, can be easily dispersed in water and an organic system, and has good wettability. The application also relates to a thermally expandable microsphere and use thereof.

The present invention provides a compound represented by formula (1). [In the formula, R1 is a monovalent group containing one or more Si atoms to which a hydroxyl group or a hydrolyzable group is not directly bonded, X1 is a divalent organic group containing an alkylene group having 11 or more carbon atoms, and RSi is a monovalent group containing Si atoms to which a hydroxyl group or a hydrolyzable group is bonded. ] R1-X1-RSi (1).

The invention belongs to the technical field of semiconductor materials, and particularly relates to a hafnium precursor material and a preparation method and application thereof. The hafnium precursor material has a structure as shown in a formula (1). The hafnium precursor material with a specific structure is designed and synthesized, and the molecular structure of the hafnium precursor material contains an alkylene dicyclopentadienyl organic group structure, so that compared with an existing cyclopentadienyl hafnium precursor material (such as cyclopentadienyl) tris (dimethylamino) hafnium), the hafnium precursor material has higher thermal stability, and meanwhile, the hafnium precursor material can be used for preparing a hafnium precursor material. The viscosity is low, the film yield is improved, and the performance of the film prepared from the raw material is better. # imgabs0 #

To provide a food quality preservative enabling further reduction of acetaldehyde concentration in a food packaging body.SOLUTION: A food quality preservative is used, the preservative comprising at least an ethanol vapor-releasing body, an oxygen absorber, and an aminooxyalkyl group-containing polysiloxane having a structural unit represented by the following general formula (1). [In the formula, R independently represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a hydroxyl group. The alkyl group may have an amino group (-NH2) at any position. Q independently represents a divalent organic group having 1 to 20 carbon atoms. n represents a real number of 0 to 100].SELECTED DRAWING: None

Provided are a fluorine-containing compound suitable to produce rubber having both excellent short-term and long-term heat resistance, a fluorine-containing copolymer using such a compound, and a fluorine-containing copolymer composition. A fluorine-containing compound represented by formula (1) below, a fluorine-containing copolymer using such a compound, and a fluorine-containing copolymer composition. In formula (1), R1 to R3 are each independently a hydrogen atom or a fluorine atom; R4 is a hydrogen atom, a fluorine atom, or a C1-8 monovalent organic group free from a carbonyl group; Z is an oxygen atom, a sulfur atom, or -N(R5)- where R5 is a hydrogen atom or a C1-4 monovalent organic group; X is a single bond or a difluoromethylene group; Y1 to Y4 are each independently a fluorine atom or a trifluoromethyl group; and Q is a C1-8 perfluoroalkylene group optionally containing an etheric oxygen atom.

The purpose of the present invention is to provide a bismaleimide compound which has good compatibility with other resins, has a high Tg value and can be developed by an alkali. This bismaleimide compound is represented by general formula (1). In formula (1), X moieties are each independently a divalent hydrocarbon group having 6-200 carbon atoms, Y moieties are each independently a divalent hydrocarbon group having 6-50 carbon atoms, and Z moieties are each independently a hydrogen atom or a monovalent group that is a carboxyl group-containing organic group or an ethylenically unsaturated group-containing organic group. However, at least one Z moiety is a carboxyl group-containing organic group or an ethylenically unsaturated group-containing organic group. n is the average number of repeating units, and represents an integer between 1 and 100.

The invention discloses a photosensitive polyimide, a negative photoresist and an application of the photosensitive polyimide in preparation of a film, the structure of the photosensitive polyimide is shown in the specification, X is a tetravalent organic group and is a residue X of a polyimide polymerization monomer tetracarboxylic dianhydride; y is a divalent organic group and is a residue Y of a polyimide polymerization monomer diamine; r1 and R2 are monovalent organic groups and are residues of primary alcohol forming side chain ester bonds of side chain polyamic acid ester; side chains R1 and R2 at least contain tertiary amine structures, and at least one of the side chains R1 and R2 containing the tertiary amine structures can form ammonium salt with phosphate containing an allyl structure; and n is an integer from 2 to 150. The invention provides a photosensitive polyimide which can be developed by adopting an alkaline aqueous solution, can be cured at low temperature and can form a negative pattern, a preparation method of a photoresist composition of the photosensitive polyimide, and a photoetching curing film, which can be applied to display industry or semiconductor industry as an insulating layer, a passivation layer or an interlayer dielectric layer and the like.

A PARP1 inhibitor compound has a structure: (I) y is 0, 1, or 2. Each XD is selected from C, N, O or S. XET and XEB are selected from C and N. Each R1 and each R4 is independently absent, H, or an organic group. The R4 groups are not fused to form a ring. R3 is H or an organic group. L is: (II) Ring C is aromatic. XA1 and XB3 are selected from C and N. Each XA2, XB2 and XC is selected from C, N, O and S. Ring C is a heterocycle. Each R5A, R5B, and R5C is absent, H, or an organic group. R6 is H or an organic group. n, m, p, q, r and s are integers, with n+m being 1 to 5, p p+q being 2 to 6, and r+s being 3 or 4. Q1 and Q2 are each independently a bond or a linking group.

The present invention provides a compound represented by the following formula (1) wherein R1 is a monovalent group containing one or more Si atoms to which neither a hydroxyl group nor a hydrolyzable group is directly bonded, X1 is a divalent organic group including an alkylene group having 11 or more carbon atoms, and RSi is a monovalent group containing a Si atom to which a hydroxyl group or a hydrolyzable group is bonded.         R1-X1-RSi     (1)

Disclosed is a polymer which includes a repeating unit that is derived from a monomer (1) represented by formula (1-1) or formula (1-2), and which has a tackiness of 800 gf or less. (1-1): Ra-X-CY3-αZα (1-2): Ra-X-NY2-βZβ (In each formula, Ra represents a polymerizable organic group, X represents a single bond or a divalent group, each Y independently represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, α represents an integer of 1 to 3, β represents an integer of 1 or 2, each Z independently represents -Z1-SiZ2 3-mZ3 m, Z1 represents a single bond or a divalent group, each Z2 independently represents a hydrocarbon group having 1 to 10 carbon atoms, m represents an integer of 1 to 3, each Z3 independently represents -(O-SiZ31 2)p-(CH2)q-Z32-SiZ33 3, each Z31 independently represents a hydrocarbon group having 1 to 10 carbon atoms or -OSiZ311 3, each Z311 independently represents a hydrocarbon group having 1 to 10 carbon atoms or -OSiZ3111 3, each Z3111 independently represents a hydrocarbon group having 1 to 10 carbon atoms, Z32 represents O or CH2, each Z33 independently represents a hydrocarbon group having 1 to 10 carbon atoms or -OSiZ331 3, each Z331 independently represents a hydrocarbon group having 1 to 10 carbon atoms, p represents an integer of 0 to 196, and q represents an integer of 0 to 10.)

One embodiment of the present invention pertains to a resin composition, a cured object, or an electronic component. The resin composition contains: a polymer (A) having a structural unit represented by formula (a1-1); and a hydrogenated styrene-based thermoplastic elastomer (B). In formula (a1-1), Ra1 represents a divalent group represented by formula (a2), and Ra2 represents a substituted or unsubstituted divalent aromatic heterocyclic group. In formula (a2), Ara1 and Ara2 each independently represent a substituted or unsubstituted aromatic hydrocarbon group, L represents a single bond, -O-, -S-, -N(R8)-, -C(O)-, -C(O)-O-, -C(O)-NH-, -S(O)-, -S(O)2-, -P(O)-, or a divalent organic group, y represents an integer of 0-5, and Ra6 and Ra7 each independently represent a single bond, a methylene group, or an alkylene group having 2-4 carbon atoms.

Provided are: a composition which contains a first compound and a second compound and in which the first compound and the second compound are represented by formula (A), and T and / or Y1 in formula (A) are different for the first compound and the second compound; and an application of said composition. In formula (A), Y1 denotes a monovalent hydrocarbon group or TA-(Si(R1A)2-O)ma-＊1A, Y2 denotes ＊S1-Si(R2)nL3-n or ＊S3-[Si(L2)2-P]r1-Si(L2)3, T and TA each denote a monovalent group, R1, R2 and R1A each denote a monovalent hydrocarbon group, A denotes a linking group having a valency of (q+1), m and ma each denote a number of 1 or more, q denotes an integer of 1 or more, L2 denotes a hydrolyzable group, a group having a hydrolyzable group, a hydroxyl group or a hydrocarbon group, L and at least four L2 moieties each denote a hydrolyzable group, a group having a hydrolyzable group, or a hydroxyl group, P denotes an oxygen atom or an organic group having one carbon atom that bonds to two adjacent Si atoms, n denotes an integer between 0 and 2, r1 denotes an integer between 1 and 3, and ＊1A, ＊A1 and ＊S3 each denote a bonding site.

To provide a thermosetting maleimide resin composition which has low melt viscosity during heating, has excellent flexibility of the cured film in its cured product, has low dielectric constant and dielectric loss tangent, has high glass transition temperature, has a low coefficient of thermal expansion, and has excellent long-term heat resistance and moisture resistance.SOLUTION: A thermosetting maleimide resin composition contains (A) a bismaleimide compound represented by the following formula (1) (in the formula (1), A represents a tetravalent organic group including a cyclic structure, B represents a divalent hydrocarbon group derived from a dimer acid skeleton, Q represents a divalent group having a fluorene skeleton or an indene skeleton, W is B or Q, n is 1 to 100, and m is 1 to 100, (B) a thermosetting resin having one or more maleimide group reactive functional groups selected from an alkenyl group, a maleimide group, an epoxy group, a cyanate group, a hydroxyl group, an acid anhydride group, a (meth)acrylic group and a thiol group, and (C) a reaction accelerator.SELECTED DRAWING: None

A negative electrode material for secondary battery use includes silicon-containing particles and coating layers covering at least part of the surfaces of the silicon-containing particles. The silicon-containing particles each include an ion conductive phase and silicon phases dispersed in the ion conductive phase. The coating layers contain at least one phosphate compound selected from the group consisting of a phosphate compound, a polyphosphate compound, and a metaphosphate compound, each of which contains an anion represented by general formula (1):In general formula (1), A represents an organic group or an oxygen atom.

To provide a silicone release agent composition having lower odor than conventional one.SOLUTION: There is provided a silicone release agent composition which comprises (A) 83 to 99.5 pts.mass of a linear, branched or cyclic organopolysiloxane having at least two alkenyl group-containing organic groups in one molecule and 0.001 to 0.20 mol of an alkenyl group in 100 g of an organopolysiloxane, (B) a polyorganohydrogensiloxane having at least three SiH groups in one molecule in an amount such that the ratio of the number of moles of SiH groups in the component (B) to the number of moles of alkenyl groups in the component (A) is 0.6 to 20, (C) a platinum group metal-based catalyst in a catalytic amount, (D) 1 to 20000 pts.mass of at least one solvent selected from terpene and a terpene derivative based on 100 pts.mass of the total of the components (A), (B) and (C), and (E) 0.5 to 10 pts.mass of an addition reaction controlling agent based on 100 pts.mass of the total of the components (A), (B) and (C).SELECTED DRAWING: None

A PARP1 inhibitor compound has a structure of: Formul (i) A dotted line represents a single bond or a double bond, y is 0, 1, or 2. Each XD is selected from C, O, and N. No more than one XD is O. When an XD is O or N, ring D is non-aromatic. Each R1 is absent, H, or an organic group. Each R4 is absent; H; a halogen; C(R9)o-3; OR9; or S(R9)1-5. Each R9 is H or an organic group. R2 and R3 are each H or an organic group. L is: Formul (ii) Each X1, X3, X4 and X5 is C or N. Each X2 is C, N, O, or S. n+m and r+s are 2 to 5. p and q are each 1 to 3. p+q is 2 to 5. Each R5A, R5B, R5C, and R6 is absent, H, or an organic group. Q1 and Q2 are each independently a bond or linking group.