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2122 results about "Hybrid material" patented technology

Hybrid materials are composites consisting of two constituents at the nanometer or molecular level. Commonly one of these compounds is inorganic and the other one organic in nature. Thus, they differ from traditional composites where the constituents are at the macroscopic (micrometer to millimeter) level. Mixing at the microscopic scale leads to a more homogeneous material that either show characteristics in between the two original phases or even new properties.

Hybrid organic-inorganic planar optical waveguide device

InactiveUS6511615B1Reduce stressStress induced polarization effects can be minimizedOptical articlesGlass shaping apparatusOptical radiationSilanes
A planar optical device is formed on a substrate. The device comprises an array of waveguide cores which guide optical radiation. A cladding layer is formed contiguously with the array of waveguide cores to confine the optical radiation to the array of waveguide cores. At least one of the array of waveguide cores and cladding layer is an inorganic-organic hybrid material that comprises an extended matrix containing silicon and oxygen atoms with at least a fraction of the silicon atoms being directly bonded to substituted or unsubstituted hydrocarbon moieties. This material can be designed with an index of refraction between 1.4 and 1.55 and can be deposited rapidly to thicknesses of up to 40 microns. In accordance with another embodiment of the invention, a method for forming a planar optical device obviates the need for a lithographic process. Illustratively, a method for forming an array of cores comprises the steps of: (1) preparing a waveguide core composition precursor material comprising at least one silane and a source of hydrocarbon moiety, (2) partially hydrolyzing and polymerizing the waveguide core precursor material to form a waveguide core composition, (3) using a mold, forming an array of waveguide cores comprising the waveguide core composition, and (4) completing hydrolysis and polymerization of the waveguide core composition under conditions effective to form an inorganic-organic hybrid material that comprises an extended matrix containing silicon and oxygen atoms with at least a fraction of the silicon atoms being directly bonded to substituted or unsubstituted hydrocarbon moieties. A cladding layer is then deposited over the array of waveguide cores. The use of the mold to pattern the array of waveguide cores obviates the need for a lithographic process.
Owner:CORNING INC

Low temperature curing high temperature resistant inorganic / organic hybridization epoxy adhesive and preparation thereof

InactiveCN101440268AImprove brittlenessImprove high temperature heat aging resistanceInorganic adhesivesEpoxy resin adhesivesCouplingLow temperature curing
The invention discloses a low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive and a preparation method thereof, which relate to an inorganic/organic hybrid epoxy adhesive and a preparation method thereof. The invention solves the problems that inorganic/organic hybrid epoxy adhesive prepared by the prior art has poor high-temperature thermal aging resistance and needs high curing temperature. The low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive is prepared by an epoxy resin, an epoxy resin low-temperature curing agent, a coupling agent, an inorganic active hybrid material and a dispersant. The preparation method comprises the following steps: the epoxy resin, the epoxy resin low-temperature curing agent and the coupling agent are mixed and stirred evenly, and then the inorganic active hybrid material and the dispersant are added into the mixture to be stirred evenly to obtain the low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive. The low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive has high high-temperature bonding strength, good high-temperature thermal aging performance and low curing temperature. The low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive has the advantages of simple production technology, convenient operation and broad application.
Owner:INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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