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1275results about "Inorganic adhesives" patented technology

Low temperature curing high temperature resistant inorganic / organic hybridization epoxy adhesive and preparation thereof

InactiveCN101440268AImprove brittlenessImprove high temperature heat aging resistanceInorganic adhesivesEpoxy resin adhesivesCouplingLow temperature curing
The invention discloses a low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive and a preparation method thereof, which relate to an inorganic/organic hybrid epoxy adhesive and a preparation method thereof. The invention solves the problems that inorganic/organic hybrid epoxy adhesive prepared by the prior art has poor high-temperature thermal aging resistance and needs high curing temperature. The low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive is prepared by an epoxy resin, an epoxy resin low-temperature curing agent, a coupling agent, an inorganic active hybrid material and a dispersant. The preparation method comprises the following steps: the epoxy resin, the epoxy resin low-temperature curing agent and the coupling agent are mixed and stirred evenly, and then the inorganic active hybrid material and the dispersant are added into the mixture to be stirred evenly to obtain the low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive. The low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive has high high-temperature bonding strength, good high-temperature thermal aging performance and low curing temperature. The low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive has the advantages of simple production technology, convenient operation and broad application.
Owner:INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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