504 results about "Epoxy adhesive" patented technology

The invention discloses an adhesive containing epoxy-terminated polyurethane epoxy resin as well as a preparation method and application of the adhesive. The adhesive comprises the following components in parts by weight: 10-15 parts of epoxy resin, 70-75 parts of epoxy-terminated polyurethane epoxy resin, 19-21 parts of an amine curing agent and 8-15 parts of heat-conducting filler, wherein the epoxy-terminated polyurethane epoxy resin is obtained by reacting a polyurethane prepolymer and epoxy resin, NCO of the polyurethane prepolymer and hydroxyl of the epoxy resin are subjected to an addition reaction, and after the reaction is finished, NCO of a system is eliminated by adopting a small-molecule epoxy compound; the polyurethane prepolymer is obtained by reaction of isocyanate and polyether polyol with flexible chain segments. According to the adhesive, the curing heat release peak value is reduced, the toughness is improved, meanwhile, the high strength is kept, the foaming problem is avoided, the defects that a traditional epoxy adhesive is high in heat release and poor in toughness are overcome, and the adhesive is suitable for the fields such as aerospace and electronic and electric appliances which have strict performance requirements.

The invention discloses a high-toughness conductive and thermal-conductive epoxy adhesive, a preparation method thereof and a conductive film, and belongs to the technical field of conductive materials. Comprising the following raw material components in parts by weight: 100 parts of epoxy resin, 4-25 parts of a latent curing agent, 0.5-5 parts of an accelerant, 200-600 parts of conductive filler, 5-15 parts of an epoxy-terminated polyurethane flexibilizer, 5-20 parts of a core-shell flexibilizer, 5-10 parts of a nitrile rubber flexibilizer, 2-10 parts of a reactive diluent, 0.5-2 parts of a coupling agent and 20-50 parts of a solvent. Through compounding of the over-end epoxy type polyurethane flexibilizer, the core-shell flexibilizer and the nitrile rubber flexibilizer, the prepared conductive adhesive has excellent toughness and bonding characteristics, and meanwhile, the shrinkage stress and thermal stress in the curing process can be reduced.

The invention relates to the technical field of optical-mechanical structures, in particular to a secondary mirror supporting structure and a common-aperture optical system mounting method applying the same, and the secondary mirror supporting structure comprises a secondary mirror bracket, a secondary mirror frame and a flexible hinge; on one hand, through the epoxy glue injection hole and the silicone rubber injection hole, the stability of the angle posture of the secondary mirror can be improved in a manner of jointly fixing the secondary mirror by using epoxy glue and silicone rubber; on the other hand, the flexible hinge is used for elastically supporting the secondary mirror, stress caused by difference of thermal expansion coefficients of the secondary mirror and the secondary mirror frame can be absorbed, the stability of the angle posture of the secondary mirror is further improved, and actual experiment requirements are met.

The invention discloses a supramolecular host-guest photoinitiator with an adjustable curing rate and an epoxy adhesive, the supramolecular host-guest photoinitiator comprises a supramolecular host compound and a guest photoinitiator included in the supramolecular host compound, the supramolecular host compound has a macrocyclic structure with a repeating unit number of 2-30, the guest photoinitiator comprises a cationic photoinitiator; in the supramolecular host-guest photoinitiator, the molar ratio of the supramolecular host compound to the guest photoinitiator is (0.8-1.5): 1, and the mass percentage of carbon element to hydrogen element is (40-75): (3-8). The UV epoxy adhesive comprises the supramolecular host-guest photoinitiator with the adjustable curing rate, a delayed curing window period is formed after UV light irradiation initiation, the adhesive is excellent in flowing and coating performance, the adhesive can continue to initiate polymerization curing without depending on illumination after the window period, heat input can be controlled, and the curing rate can be adjusted.

The invention relates to an installation structure and a precision adjustment method of a long-distance laser target tracking and ranging light path, which are used for high-precision adjustment of a laser emission direction of a space target tracking and ranging light path. And the deviation between the emergent direction of the laser reflected by the three reflectors and the swing angle of the rotary table is minimum. The method comprises the following steps: firstly, leading a pitch axis and an azimuth axis to a plane mirror by using an autocollimator; secondly, a second reflecting mirror and a first reflecting mirror are installed and adjusted through the installation mode of a cushion column and a fastening screw, the grinding amount of the cushion column is calculated according to the back image motion track of an autocollimator or the motion track of a laser imaging point in a measurement camera, the cushion column is ground on the basis, and the purpose of high-precision installation and adjustment is achieved; thirdly, through zero calibration of a visible light camera, a measurement camera and a corner reflector, an adjustment system of a third reflector is built, and adjustment of the third reflector is achieved; finally, the cushion columns and the fastening screws are reinforced through epoxy glue, and the mechanical resistance of the light path is guaranteed.

The invention discloses a forming method of a high-bending-strength composite insulator winding pipe, which comprises the following steps: firstly, an inner layer structure of the insulator winding pipe is prepared by a pultrusion process, the inner layer structure is cylindrical, the outer diameter of the inner layer structure is matched with the inner diameter of the winding pipe, and a plurality of uniformly distributed cambered surface bulges are formed on the surface of the inner layer structure; a reinforced interface layer is formed on the outer wall of the inner layer structure, is formed by aramid fiber preform fabric, and is treated by a modified epoxy glue solution by adopting a three-dimensional orthogonal weaving process; the interface layer is tightly attached to the inner layer structure, epoxy / polyurethane glue liquid is coated outside the interface layer, and a semi-finished winding pipe product is formed; the winding pipe semi-finished product is subjected to pre-curing treatment, a small number of uncured groups are reserved, external packaging is conducted through an injection molding method, a winding pipe blank with an outer layer structure is obtained, and the outer diameter of the winding pipe blank is matched with that of the finished product; and demolding the winding pipe blank, fettling and carrying out quality inspection to obtain a finished product of the high-bending-strength composite insulator winding pipe. The method can remarkably improve the mechanical strength and durability of the winding pipe, and has wide application prospects.

The invention discloses a single-component high-heat-resistance type epoxy adhesive and a preparation method of the single-component high-heat-resistance type epoxy adhesive. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of N, N-4, 4 '-diphenylmethane bismaleimide; 50 parts of bisphenol F epoxy resin; 36.47 parts of 4, 4 '-diaminodiphenyl sulfone; 20 to 40 phr of phenyl glycidyl ether; 1 to 2 phr of two terminal type epoxy silicone oil; 4 to 6 phr of hydroxyl-terminated polyether sulfone; 10 to 20 phr of boron nitride, the surface of which is modified by gamma-glycidyl ether oxypropyl trimethoxy silane; and 1 to 3 phr of an adhesion promoter. According to the adhesive disclosed by the invention, the heat resistance, the mechanical property, the dimensional stability, the process adaptability and the like are synergistically improved, the use requirements of an aviation structural part on long-term service at 150-180 DEG C and an electronic packaging device on the condition of short-time reflow soldering at about 200 DEG C can be met, and the reliability of the adhesive in a high-temperature environment is remarkably improved.

The invention relates to the technical field of epoxy AB adhesives, in particular to a special epoxy AB adhesive for a back mesh as well as a preparation method and application of the special epoxy AB adhesive for the back mesh, and the epoxy A adhesive is prepared from the following components in percentage by weight: a component A: 40-60% of bisphenol A epoxy resin; 10-20% of carboxyl-terminated nitrile rubber; 5%-10% of nano SiO2; 1-3% of a silane coupling agent; 5-10% of a reactive diluent; 3-8% of a plasticizer; the component B comprises 50-70% of a fatty amine curing agent; 10-20% of polyether amine; 1-3% of an accelerant; and 10-20% of nano calcium carbonate. Through an interpenetrating network structure formed by the carboxyl-terminated nitrile rubber and the epoxy resin, the peel strength of the adhesive reaches 15-20 N / mm and is improved by 50% or above compared with that of traditional epoxy glue, the peeling stress between a back mesh material and a matrix can be effectively resisted, and the stability and reliability of the structure are ensured.

The invention relates to the technical field of adhesives, in particular to a high-bonding-strength bio-based epoxy adhesive and a preparation method thereof. Comprising 20-50 parts of bio-based epoxy resin, 8-20 parts of a bio-based epoxy flexibilizer, 5-10 parts of an epoxy diluent, 25-60 parts of an inorganic filler, 2-8 parts of a curing agent and 0.2-1 part of a curing accelerator, the epoxy resin adhesive with excellent performance is developed by using a bio-based material as a raw material, has high adhesion to metal aluminum and the like, has excellent toughness, can be widely applied to automobiles, aviation, industry, electronics and other directions requiring shock absorption, impact resistance and structural adhesion, has an excellent economic prospect, and is worthy of popularization and application. Meanwhile, the method has important significance in environmental protection.

The invention discloses a pressure-resistant steel-based nano-film pressure sensor and application thereof, and belongs to the technical field of pressure sensors, and the pressure-resistant steel-based nano-film pressure sensor comprises a pressure core body which is fixedly connected with a lower ceramic insulating plate through a glass micro-melting layer; the pressure guide nozzle and the steel-based connecting piece are melted through the glass micro-melting layer to form a closed structure; the protective layer comprises a glaze layer which is coated on the annular outer surface of a combined piece formed by combining the steel-based connecting piece and the ceramic insulating plate; and the epoxy glue layer covers the exposed end surface of the glass micro-melting layer to form a closed space. The pressure-resistant steel-based nano-film pressure sensor prepared by the invention is relatively high in insulating strength and precision, and can be applied to petroleum and natural gas, aerospace, military industry, industrial automation and medical and special equipment.

The invention discloses a preparation method and application of a controllable depolymerization and debonding high-performance epoxy adhesive. The preparation method comprises the following steps: S1, reacting an aldehyde monomer with an alcohol monomer to obtain a polyhydroxy intermediate containing an acetal structure; the aldehyde monomer has at least one hydroxyl functional group; the alcohol monomer has more than three hydroxyl functional groups; s2, carrying out ring-opening addition and alkaline environment ring-closing epoxidation reaction on epoxy chloropropane and the polyhydroxy intermediate to obtain an epoxy monomer containing an acetal dynamic bond; and S3, compounding the epoxy monomer obtained in the step S2 with a temperature-resistant epoxy monomer, and mixing and curing with an amine curing agent to obtain the controllable depolymerization debonding thermosetting adhesive under the acidic condition, the temperature-resistant epoxy monomer comprises at least one of an epoxy monomer containing a naphthalene ring structure and an epoxy monomer containing a biphenyl structure.

The invention relates to the use of an epoxy resin adhesive for bonding substrates at least partially coated with a cured epoxy resin adhesive, characterized in that the adhesive comprises a resin component comprising at least one epoxy resin and a curing agent component comprising at least one epoxy resin, the curing agent component comprises at least one amine having at least one aliphatic amino group wherein the amine is selected from the group consisting of polyetheramines and linear or branched but non-cyclic aliphatic polyamines wherein the amine comprises at least 50% by weight of all amine curing agents having at least one amine hydrogen contained in the curing agent component, the curing agent component is based on all amine curing agents in the curing agent component. The use according to the invention allows the adhesion of substrates at least partially coated with a cured epoxy adhesive, forming a stable weather-resistant adhesive connection, and is particularly suitable for repairing rotor blades in wind turbines.

A single-component photothermal dual-curing epoxy adhesive. The raw materials, calculated by weight, include: 100 parts of an acrylic / polyurethane dual-modified epoxy resin, 10-40 parts of a low-viscosity epoxy resin, 8-30 parts of an epoxy curing agent, 30-300 parts of an inorganic filler, 2-30 parts of a dispersant, and 0.25-5 parts of a photoinitiator. This adhesive exhibits excellent photocuring activity, high toughness, and excellent high- and low-temperature resistance, while maintaining other properties. The photoinitiator in this system participates in the curing reaction, avoiding the degradation of the adhesive's mechanical and bonding properties due to initiator molecular migration. The adhesive also offers a flexible curing process and minimal curing shrinkage, meeting the weather resistance requirements of semiconductor packaging. This makes it an industrially viable epoxy adhesive for semiconductor packaging.

The invention provides an epoxy adhesive solution composition, a preparation method of an epoxy adhesive solution and a modified cellular board. The epoxy adhesive liquid composition comprises the following components in parts by weight: 53-58 parts of epoxy resin, 2-10 parts of a silane coupling agent, 1-10 parts of a curing agent, 1-5 parts of blocked isocyanate and 60-70 parts of water, wherein a blocking group of the blocked isocyanate is selected from hydroxyl, oximido, acylamino, amino, imidazolyl, pyrazolyl or piperazinyl. By introducing the blocked isocyanate with the specific structure, the epoxy adhesive liquid can be subjected to pre-crosslinking reaction in the early drying treatment process, the modulus and high temperature resistance of a formed dry film are improved, and the phenomenon of glue overflow in the subsequent curing stage is inhibited; therefore, the structural integrity and the bonding strength of the adhesive layer in the modified cellular board under the high-temperature condition are improved.

The invention provides a packaging structure and a packaging method for improving the heat dissipation performance of an IGBT power module. The packaging structure comprises a copper substrate, a first epoxy glue layer, an epoxy resin-based composite material layer, a second epoxy glue layer, an upper bridge copper layer, a lower bridge copper layer, a chip solder layer and a power chip which are sequentially arranged from bottom to top, wherein the upper bridge copper layer and the lower bridge copper layer are integrally arranged; the power chip comprises an upper bridge chip and a lower bridge chip; the chip solder layer comprises an upper bridge chip solder layer and a lower bridge chip solder layer; the upper bridge chip solder layer is arranged on the upper bridge copper layer, and the upper bridge chip is arranged on the upper bridge chip solder layer; the lower bridge chip solder layer is arranged on the lower bridge copper layer, and the lower bridge chip is arranged on the lower bridge chip solder layer. According to the packaging structure, the epoxy resin-based composite material layer is adopted as the insulating layer, copper and a welding layer are reduced in heat flow transmission, the heat resistance from the chip to the shell is reduced, and the heat dissipation performance is improved; the copper layers of the upper and lower bridge arms are integrated, leads between the upper and lower bridges are reduced, the power loss of the IGBT is reduced, and the heat is reduced.

The invention belongs to the field of adhesives, and particularly relates to a laser-curable epoxy adhesive as well as a preparation method and application thereof. The laser-curable epoxy adhesive is prepared from the following raw materials: low-viscosity epoxy resin, toughened epoxy resin, epoxy acrylate resin, dopamine modified graphene oxide nanosheets, a curing agent and a thermal initiator in a mass ratio of 1: (0.5-2): (0.75-3): (0.05-0.5): (0.75-2.5): (0.05-0.5): (0-1): (0-0.2): (0-0.15): (0-2) as well as optional epoxy diluent, stabilizer, coupling agent and filler. The laser-curable epoxy adhesive provided by the invention has high modulus and high Tg, and can be rapidly cured.

The invention relates to a single-component epoxy adhesive as well as a preparation method and application thereof. The single-component epoxy adhesive is prepared from the following components in parts by weight: 35 to 45 parts of bisphenol epoxy resin, 5 to 20 parts of polyurethane modified epoxy resin, 20 to 30 parts of curing agent, 0.1 to 1 part of fluorocarbon surfactant and 0.1 to 1 part of flatting agent. According to the single-component epoxy adhesive provided by the invention, the leveling agent and the fluorocarbon surfactant are introduced into an epoxy resin system, so that the problem that an epoxy adhesive on the market at present is easy to diffuse and separate out is solved, and the single-component epoxy adhesive also has excellent adhesive property, ageing resistance and reliability.

The invention discloses a high-strength epoxy-based adhesive and a preparation method thereof, and relates to the technical field of epoxy-based adhesives, the high-strength epoxy-based adhesive comprises the following components: 80-120 parts of epoxy resin; 20-40 parts of a curing agent; 10-35 parts of ethylene propylene diene monomer powder; 5 to 20 parts of toughening resin; 30-80 parts of an inorganic filler; 0.5 to 3 parts of a coupling agent; 0.5 to 2 parts of an auxiliary agent; the preparation is performed based on the formula. According to the invention, the ethylene propylene diene monomer powder is introduced into an epoxy resin system and is matched with the toughening resin, the inorganic filler and the coupling agent for collaborative design, so that the impact resistance and deformation adaptability of a cured adhesive layer are remarkably improved while the adhesive keeps relatively high bonding strength and structural stability; the obtained high-strength epoxy-based adhesive has good mechanical properties, construction performance and engineering adaptability, and is suitable for popularization and application under various complex working conditions.

The invention relates to a built-in foam material for noise reduction of a new energy automobile tire as well as a preparation method and application of the built-in foam material, and belongs to the technical field of polyurethane foam materials. The foam material is composed of a component A and a component B, wherein the weight percentage ratio of the component A to the component B is 100: (30-70); the component A is prepared from the following components in parts by weight: 100 to 120 parts of polyhydric alcohol I, 50 to 70 parts of polyhydric alcohol II, 20 to 30 parts of polyhydric alcohol III, 0.01 to 0.1 part of catalyst, 15 to 25 parts of chain extender, 20 to 40 parts of foam stabilizer, 5 to 10 parts of liquid nitrile rubber, 1 to 5 parts of high-temperature-resistant epoxy adhesive and 4 to 8 parts of foaming agent; the component B comprises isocyanate; the polyol I comprises polytetramethylene ether glycol, the polyol II comprises polycaprolactone diol, and the polyol III comprises one or more of 2, 2-dimethylolpropionic acid and 2, 2-dimethylolbutyric acid. The foam material has better high temperature resistance, rigidity and toughness, foam cavities are uniform, the overall material density is small, and the mute effect is good.

The invention relates to an organic adhesive and a preparation method thereof, in particular to a high-strength damp-heat-resistant adhesive suitable for adhering a plated metal chip and a preparation method of the high-strength damp-heat-resistant adhesive. The problem that in the existing semiconductor field, the bonding reliability is poor under the high-humidity state and the high-humidity heat in the bonding process of an epoxy adhesive and precious metal such as a gold-plated base material is solved. The high-strength damp-heat-resistant adhesive is prepared from epoxy resin, chelated epoxy resin, polyimide precursor resin, a polyimide and chelated epoxy resin synergistic curing agent, a phthalate coupling agent, an inorganic filler and a solvent I; the preparation method comprises the following steps: 1, preparing polyimide precursor resin; 2, weighing; and 3, preparing the adhesive. The invention relates to a high-strength damp-heat-resistant adhesive suitable for bonding a plated metal chip and a preparation method thereof.

The invention discloses an intelligent assembling method of a glass reference mirror, which utilizes an intelligent mechanical arm to complete the assembling of the glass reference mirror, utilizes a set of six-degree-of-freedom intelligent mechanical arm to complete the accurate position control of the glass reference mirror, and utilizes two sets of double-shaft photoelectric autocollimators to measure the orientation of the reference mirror. The position of the mechanical arm is adjusted through a central control closed-loop algorithm, and the glued surface of the reference mirror is aligned with the reference mirror mounting surface of the inertial attitude sensor, so that the reading of a reference collimator is the lowest, namely the precision is the highest, and the actual measurement precision can be within 15 seconds of arc. Meanwhile, by using the system, the thickness of the epoxy adhesive layer can be controlled through a known reference surface, and the temperature cycle of-35 DEG C to 70 DEG C can be resisted when the thickness of the adhesive film is 0.20 mm to 0.60 mm through test verification.

The invention discloses a high-toughness and high-adhesion epoxy resin adhesive and a preparation method thereof, and relates to an epoxy resin adhesive and a preparation method thereof. The invention aims to solve the problems of high brittleness, low adhesion to metal materials such as steel, titanium alloy and nickel alloy and poor strength of the existing epoxy adhesive. The high-toughness and high-adhesion epoxy resin adhesive comprises a component A and a component B, the component A comprises the following components in parts by mass: epoxy resin, phosphate acrylate oligomer toughened epoxy resin, core-shell particle toughened epoxy resin and epoxy phosphate; and the component B comprises the following components in parts by mass: a polyamide curing agent, an alicyclic amine curing agent and a phosphate esterification curing agent. According to the invention, the phosphate esterification acrylate oligomer toughened epoxy resin and the core-shell particle type toughening agent are used for synergistic toughening, so that the toughness of the epoxy adhesive is greatly improved; the adhesive force of the epoxy adhesive to various metal materials is improved, and the high-toughness and high-adhesive-force epoxy resin adhesive is prepared.

The utility model provides a submarine cable armored structure anchoring device which comprises a protective sleeve, an armored structure is arranged in the protective sleeve, one end of the protective sleeve is sealed through a grouting cover plate, the other end of the protective sleeve is connected with an anti-bending pipe through a connecting flange, and through holes for a submarine cable to penetrate through are formed in the anti-bending pipe and the protective sleeve. The protective sleeve comprises two protective covers which are symmetrically arranged, one sides of the two protective covers are connected through a hinge, the other sides of the two protective covers are fixed through bolts, and the split type protective sleeve is adopted, so that installation, disassembly and maintenance are convenient; an anti-bending pipe is arranged, so that the submarine cable is prevented from being excessively bent under a relatively large bending moment, and the service life of the submarine cable is prolonged; the protective sleeve and the anti-bending pipe are connected through the connecting flange, so that the overall sealing performance is improved; and the epoxy binder is poured into the protective sleeve, so that the sealing performance of the submarine cable armoring anchoring device is enhanced, seawater is effectively prevented from entering the conical protective cover to corrode the first armoring steel wire layer and the second armoring steel wire layer, and the durability of the submarine cable is improved.

The invention relates to a thiourea-polyamine condensation polymer, an epoxy adhesive and a preparation method of the thiourea-polyamine condensation polymer, and the thiourea-polyamine condensation polymer is obtained by reacting thiourea with 3, 3 '-dimethyl-4, 4'-diaminodicyclohexylmethane. According to the preparation method, thiourea is used for modifying 3, 3 '-dimethyl-4, 4'-diaminodicyclohexylmethane under a proper condition, so that the modified thiourea-polyamine condensation polymer is obtained. The modified thiourea-polyamine polycondensate is simple in preparation process and high in yield. Moreover, the modified thiourea-polyamine polycondensate can be used as a chain extender for preparing an epoxy adhesive, the impact toughness and tensile property of the epoxy adhesive can be remarkably improved, the epoxy adhesive has better heat resistance, and the application field and scene of the epoxy adhesive are expanded.

The invention relates to the field of high polymer materials, and particularly provides a bio-based polythiol curing agent and a preparation method and application thereof.The bio-based polythiol curing agent is obtained through reaction of polyether polyol, epoxy chloropropane and a sulfhydrylation reagent, the epoxy chloropropane is prepared from bio-based raw materials, and the sulfhydrylation reagent is prepared from polyether polyol. The invention relates to epoxy chloropropane, in particular to epoxy chloropropane prepared by a glycerin method, and the mass content of 2, 3-epoxypropane methyl ether in the epoxy chloropropane is less than 0.4%. By controlling the content of 2, 3-epoxypropane methyl ether in the bio-based epoxy chloropropane, the humidity and heat resistance of a polythiol adhesive system applied to the downstream can be improved. The epoxy adhesive prepared from the epoxy resin has the advantages of higher humidity and heat resistance, higher adhesive property, higher glass transition temperature and longer service life, can reduce the maintenance cost, and is widely applied to the fields of electronic and electrical appliances, automobile manufacturing, aerospace, architectural decoration and the like.

The invention relates to an epoxy resin adhesive composition and a preparation method thereof, and belongs to the technical field of high-performance polymer material modification and electronic packaging materials, and the epoxy resin adhesive composition comprises the following components by weight: 100 parts of basic epoxy resin; 5-30 parts of a hyperbranched liquid crystal modifier; adding the curing agent according to a stoichiometric ratio; 100 to 600 parts of a heat-conducting filler; 0.1-5 parts of an accelerant and an auxiliary agent; the hyperbranched liquid crystal modifier has a core-shell structure and is prepared from a hydrogen-containing hyperbranched polysiloxane core and an alkenyl-terminated liquid crystal epoxy monomer through a hydrosilylation reaction under the action of a catalyst, the hyperbranched polysiloxane core is introduced, the friction resistance among high-concentration fillers is reduced by utilizing the torispherical structure of the hyperbranched polysiloxane core, and the hyperbranched liquid crystal modifier has the advantages that the friction resistance is reduced; under the condition that 350 parts of heat-conducting filler is filled, the modifier is added, so that the high-filling system still has excellent flowability and leveling property while keeping high heat-conducting property, and is suitable for high-precision micro-encapsulation scenes; the heat conductivity of the scheme is obviously superior to that of a system which does not use the modifier or does not adopt a stepped heating process.

The invention belongs to the technical field of adhesives, and particularly relates to a single-component epoxy adhesive for adhering a carbon fiber composite material and a preparation method of the single-component epoxy adhesive. The single-component epoxy adhesive comprises the following components in parts by weight: 70-85 parts of epoxy resin, 1-5 parts of modified polytetrafluoroethylene, 10-20 parts of a curing agent, 5-20 parts of a diluent and 3-10 parts of a toughening thixotropic modifier, the toughening thixotropic modifier comprises polyimide, a silane coupling agent and silicon dioxide, and the mass ratio of the polyimide to the silane coupling agent to the silicon dioxide is (0.1-2): (0.5-1): 10. The modified polytetrafluoroethylene and the toughening thixotropic modifier are introduced into the single-component epoxy adhesive, and the modified polytetrafluoroethylene and the toughening thixotropic modifier are synergistically matched, so that the single-component epoxy adhesive has excellent heat resistance and toughness after being cured, and is relatively low in water absorption and good in adhesive property; the adhesive is especially suitable for bonding of carbon fiber structural members.

The invention provides a preparation method of modified mica powder for a high-barrier epoxy adhesive, which comprises the following steps: sequentially introducing amino and long-chain alkyl to the surface of natural mica powder through the steps of dispersion, suction filtration, drying and the like to obtain the modified mica powder. The preparation method has the characteristics that two kinds of silane with different properties are used for modifying the mica powder, the using method is simple, the obtained modified mica powder is good in uniformity and stability, the compatibility and binding force of the mica powder and an epoxy resin system are improved due to existence of amino, the problem that the mica powder is difficult to disperse in epoxy resin is well solved due to alkyl, and the service life of the mica powder is prolonged. And the barrier property of the epoxy adhesive can be improved.

The present invention relates to the field of grinding equipment, specifically an epoxy glue raw material grinding equipment, including a feed roller, an intermediate roller and a discharge roller, and a cutting assembly and a blanking plate are sequentially provided on one side of the discharge roller, and the cutting assembly includes a moving roller, and the moving roller is provided with three arc-shaped bearing surfaces, and the center of the bearing surface is located on the corner edge on the opposite side, and the cutting assembly also includes a side frame and a rotating executive part, and the side frame is provided with three shaft parts, and the rotating executive part drives the shaft part close to the blanking plate and the shaft part close to the discharge roller side to rotate in turn. The present invention arranges a moving roller between the discharge roller and the blanking plate, and the blanking plate obtains a larger inclination through the transfer of the moving roller. The rotating executive part allows the moving roller to rotate twice, and allows the next bearing surface to cooperate with the discharge roller while also allowing the material on the original bearing surface to be transferred to the blanking plate. The larger inclination and the conveying thrust of the moving roller are used to allow the material to flow downward and be discharged better, thereby avoiding the difficulty of material discharge.

The application discloses a single-component epoxy adhesive for magnetic core bonding, which comprises A) a rigid ring structure containing epoxy resin prepolymer, accounting for 30-60% of the total weight percentage of A-D; B) an organic silicon modified anhydride curing agent, accounting for 15-40% of the total weight percentage of A-D; C) a liquid anhydride curing agent, accounting for 15-42% of the total weight percentage of A-D; D) a curing accelerator, accounting for 0.5-5% of the total weight percentage of A-D; and E) glass microbeads, accounting for 5-30% of the total weight percentage of A-D. The adhesive has the characteristics of high adhesion, good heat resistance, low linear thermal expansion coefficient, low curing volume shrinkage, excellent wet heat resistance and excellent heat shock resistance, and can form a bonding layer with high uniformity in thickness between the magnetic cores.