629 results about "Epoxy adhesive" patented technology

The invention relates to the technical field of chip packaging, and particularly discloses a high-thermal-conductivity epoxy adhesive for chip packaging and a chip packaging method. The epoxy adhesive comprises a component A and a component B. Based on the total weight of the component A, the component A comprises the following raw materials in parts by weight: 28-44 parts of polyethylene glycol grafted epoxy resin, 15-20 parts of polyamide coated nano filler, 4-7 parts of a flame retardant, 3-4 parts of a diluent and 12-15 parts of a flexibilizer, and the component B comprises an epoxy curing agent and a curing accelerator in a weight ratio of 10: (0.5-1). According to the epoxy adhesive for chip packaging, the dispersity of all components in the epoxy adhesive for chip packaging can be improved, so that the epoxy adhesive has good heat-conducting property and mechanical property, and the chip packaging quality can be improved.

The invention discloses an adhesive containing epoxy-terminated polyurethane epoxy resin as well as a preparation method and application of the adhesive. The adhesive comprises the following components in parts by weight: 10-15 parts of epoxy resin, 70-75 parts of epoxy-terminated polyurethane epoxy resin, 19-21 parts of an amine curing agent and 8-15 parts of heat-conducting filler, wherein the epoxy-terminated polyurethane epoxy resin is obtained by reacting a polyurethane prepolymer and epoxy resin, NCO of the polyurethane prepolymer and hydroxyl of the epoxy resin are subjected to an addition reaction, and after the reaction is finished, NCO of a system is eliminated by adopting a small-molecule epoxy compound; the polyurethane prepolymer is obtained by reaction of isocyanate and polyether polyol with flexible chain segments. According to the adhesive, the curing heat release peak value is reduced, the toughness is improved, meanwhile, the high strength is kept, the foaming problem is avoided, the defects that a traditional epoxy adhesive is high in heat release and poor in toughness are overcome, and the adhesive is suitable for the fields such as aerospace and electronic and electric appliances which have strict performance requirements.

The invention belongs to the technical field of adhesive preparation, and particularly relates to a flexible epoxy adhesive modified organic silicon adhesive and a preparation method and application thereof.The flexible epoxy adhesive modified organic silicon adhesive is composed of a component A and a component B, the component A is prepared from 40-70 parts of vinyl-terminated silicone oil, 10-30 parts of hydrogen-containing silicone oil, 5-20 parts of filler, 1-5 parts of coupling agent and 1-10 parts of curing agent; and the component B comprises the following components in parts by weight: 60-70 parts of vinyl-terminated silicone oil, 5-20 parts of epoxy resin, 5-15 parts of a platinum catalyst, 1-5 parts of an accelerant, 1-5 parts of an inhibitor and 5-20 parts of filler. Epoxy resin is introduced into an organic silicon matrix and is matched with a toughening agent and a catalyst, so that efficient combination of a two-phase system is realized, and the adhesive which is stable in performance, high in adhesive force and excellent in flexibility is obtained and has excellent comprehensive performance and application prospects in electronic packaging, automobile part bonding and building sealing.

The invention discloses a high-toughness conductive and thermal-conductive epoxy adhesive, a preparation method thereof and a conductive film, and belongs to the technical field of conductive materials. Comprising the following raw material components in parts by weight: 100 parts of epoxy resin, 4-25 parts of a latent curing agent, 0.5-5 parts of an accelerant, 200-600 parts of conductive filler, 5-15 parts of an epoxy-terminated polyurethane flexibilizer, 5-20 parts of a core-shell flexibilizer, 5-10 parts of a nitrile rubber flexibilizer, 2-10 parts of a reactive diluent, 0.5-2 parts of a coupling agent and 20-50 parts of a solvent. Through compounding of the over-end epoxy type polyurethane flexibilizer, the core-shell flexibilizer and the nitrile rubber flexibilizer, the prepared conductive adhesive has excellent toughness and bonding characteristics, and meanwhile, the shrinkage stress and thermal stress in the curing process can be reduced.

The invention provides a cyclodextrin modified epoxy resin flexibilizer, an epoxy adhesive and a preparation method of the cyclodextrin modified epoxy resin flexibilizer. The chemical structural formula of the cyclodextrin modified epoxy resin flexibilizer is as shown in a formula 1: # imgabs0. The cyclodextrin modified epoxy resin flexibilizer is excellent in mechanical strength and temperature resistance, low in production cost, easy to synthesize, non-toxic and environment-friendly.

The invention discloses a fixing method of a mechanical vibration resistant profound hypothermia lens group. The fixing method is suitable for assembling a mechanical vibration resistant low-stress lens group applied to profound hypothermia. The lens group is composed of a lens, a lens seat and epoxy glue. On the premise that heat transmission, low stress and high reliability are ensured, the required glue filling amount is determined according to the borne external force, the glue joint strength, the lens diameter and the lens base diameter, good mechanical strength can be achieved, and the strength requirement can be met; the epoxy glue adopts four-section symmetrical glue joint and is cured at room temperature, and the surface type of the lens meets the use requirement after verification; the device is simple in structure, convenient to operate, good in compatibility and high in reliability. The method can be applied to various mechanical vibration resistant profound hypothermia lens group fixing processes.

The invention relates to the technical field of optical-mechanical structures, in particular to a secondary mirror supporting structure and a common-aperture optical system mounting method applying the same, and the secondary mirror supporting structure comprises a secondary mirror bracket, a secondary mirror frame and a flexible hinge; on one hand, through the epoxy glue injection hole and the silicone rubber injection hole, the stability of the angle posture of the secondary mirror can be improved in a manner of jointly fixing the secondary mirror by using epoxy glue and silicone rubber; on the other hand, the flexible hinge is used for elastically supporting the secondary mirror, stress caused by difference of thermal expansion coefficients of the secondary mirror and the secondary mirror frame can be absorbed, the stability of the angle posture of the secondary mirror is further improved, and actual experiment requirements are met.

The invention discloses a supramolecular host-guest photoinitiator with an adjustable curing rate and an epoxy adhesive, the supramolecular host-guest photoinitiator comprises a supramolecular host compound and a guest photoinitiator included in the supramolecular host compound, the supramolecular host compound has a macrocyclic structure with a repeating unit number of 2-30, the guest photoinitiator comprises a cationic photoinitiator; in the supramolecular host-guest photoinitiator, the molar ratio of the supramolecular host compound to the guest photoinitiator is (0.8-1.5): 1, and the mass percentage of carbon element to hydrogen element is (40-75): (3-8). The UV epoxy adhesive comprises the supramolecular host-guest photoinitiator with the adjustable curing rate, a delayed curing window period is formed after UV light irradiation initiation, the adhesive is excellent in flowing and coating performance, the adhesive can continue to initiate polymerization curing without depending on illumination after the window period, heat input can be controlled, and the curing rate can be adjusted.

The invention relates to the technical field of adhesives, and discloses a high-temperature-resistant epoxy AB adhesive and a preparation method thereof, and the high-temperature-resistant epoxy AB adhesive comprises a component A and a component B, wherein the component A comprises the following raw materials: bisphenol A epoxy resin, an ultraviolet light absorber, a defoaming agent, anti-aging graphene oxide and deionized water; and the component B comprises the following raw materials: anhydridized silicone oil and deionized water. The anti-aging graphene oxide and the anhydridized silicone oil are prepared to participate in the preparation process of the epoxy AB glue, so that the prepared epoxy AB glue has excellent mechanical properties, high temperature resistance and anti-aging performance, can stably play a bonding role in a long time in a high-temperature environment, and cannot be sticky to affect the use effect during use; moreover, aging and cracking are not prone to occurring, the use requirements of multiple fields can be met, and the long service life is achieved.

The invention relates to the field of building structure adhesives, and discloses a low-temperature double-component epoxy adhesive system for a wind power mixing tower and a preparation method of the low-temperature double-component epoxy adhesive system. The system comprises an epoxy resin component (A) and a curing agent component (B) in a weight ratio of (1.5-2.2): 1, wherein the epoxy resin component (A) contains 80-150 parts by weight of epoxy resin (a1), 5-15 parts by weight of a diluent (a2), 3-8 parts by weight of a thixotropic agent (a3) and 150-300 parts by weight of a filler I (a4); wherein the curing agent component (B) contains 50-200 parts by weight of a curing agent (b1) and 100-300 parts by weight of a filler II (b2). The adhesive system is used for vertical and horizontal bonding construction of wind power concrete tower tube segments in the environment of-15 DEG C to 5 DEG C, and is convenient to apply, high in sagging resistance, good in thixotropy, high in curing speed and high in compression strength after curing.

The invention relates to an installation structure and a precision adjustment method of a long-distance laser target tracking and ranging light path, which are used for high-precision adjustment of a laser emission direction of a space target tracking and ranging light path. And the deviation between the emergent direction of the laser reflected by the three reflectors and the swing angle of the rotary table is minimum. The method comprises the following steps: firstly, leading a pitch axis and an azimuth axis to a plane mirror by using an autocollimator; secondly, a second reflecting mirror and a first reflecting mirror are installed and adjusted through the installation mode of a cushion column and a fastening screw, the grinding amount of the cushion column is calculated according to the back image motion track of an autocollimator or the motion track of a laser imaging point in a measurement camera, the cushion column is ground on the basis, and the purpose of high-precision installation and adjustment is achieved; thirdly, through zero calibration of a visible light camera, a measurement camera and a corner reflector, an adjustment system of a third reflector is built, and adjustment of the third reflector is achieved; finally, the cushion columns and the fastening screws are reinforced through epoxy glue, and the mechanical resistance of the light path is guaranteed.

The invention relates to an epoxy adhesive and a preparation method thereof, in particular to a low-hygroscopicity medium-temperature curing single-component epoxy adhesive suitable for bonding special-shaped structure composite materials and a preparation method of the low-hygroscopicity medium-temperature curing single-component epoxy adhesive. The invention aims to solve the problems of poor flowability resistance and wet resistance of the medium-temperature curing dicyandiamide system single-component epoxy adhesive for bonding special-shaped composite structures. The invention relates to a low-hygroscopicity medium-temperature curing single-component epoxy adhesive suitable for bonding special-shaped structure composite materials. The epoxy resin is prepared from the following components in parts by mass: 70 to 90 parts of bisphenol A epoxy resin, 10 to 30 parts of multifunctional epoxy resin, 10 to 30 parts of core-shell toughened epoxy resin, 10 to 20 parts of polysulfide rubber modified resin, 8 to 12 parts of dicyandiamide, 1 to 2 parts of 2-ethyl-4-methylimidazole and 7 to 9 parts of fumed silica. The polysulfide rubber modified resin disclosed by the invention has a good toughening effect in the epoxy resin adhesive, the shear strength can be improved, and the moisture resistance can be remarkably improved.

The present disclosure relates to the field of generator manufacturing, and disclosed are a stator annular lead fixing structure and method for a large generator. The structure comprises a conical ring, stator annular leads, insulating pressing plates, and a hooping device; the outer circle surface of the conical ring is provided with arc-shaped grooves used for embedding the stator annular leads; the insulating pressing plates are pressed on the outer surfaces of the stator annular leads protruding out of the arc-shaped grooves; the hooping device comprises tightening strips and a tightener; the tightening strips are tied on the outer sides of the insulating pressing plates, and are tightened by means of the tightener to fix the stator annular leads. The method comprises: placing in a large conical ring groove a shape-adaptive material which is thick enough, impregnating the shape-adaptive material in medium-temperature curing epoxy glue, then mounting all annular leads in the large conical ring groove, and screwing steel tool screws into two ends of each of insulating pressing plates and tool holes of a large conical ring to temporarily fix the annular leads and the insulating pressing plates; and mounting a hooping device. The lead fixing structure of the present invention has large overall rigidity, high strength and good insulating properties, and effectively improves the reliability of fixing of annular leads.

The invention discloses a forming method of a high-bending-strength composite insulator winding pipe, which comprises the following steps: firstly, an inner layer structure of the insulator winding pipe is prepared by a pultrusion process, the inner layer structure is cylindrical, the outer diameter of the inner layer structure is matched with the inner diameter of the winding pipe, and a plurality of uniformly distributed cambered surface bulges are formed on the surface of the inner layer structure; a reinforced interface layer is formed on the outer wall of the inner layer structure, is formed by aramid fiber preform fabric, and is treated by a modified epoxy glue solution by adopting a three-dimensional orthogonal weaving process; the interface layer is tightly attached to the inner layer structure, epoxy / polyurethane glue liquid is coated outside the interface layer, and a semi-finished winding pipe product is formed; the winding pipe semi-finished product is subjected to pre-curing treatment, a small number of uncured groups are reserved, external packaging is conducted through an injection molding method, a winding pipe blank with an outer layer structure is obtained, and the outer diameter of the winding pipe blank is matched with that of the finished product; and demolding the winding pipe blank, fettling and carrying out quality inspection to obtain a finished product of the high-bending-strength composite insulator winding pipe. The method can remarkably improve the mechanical strength and durability of the winding pipe, and has wide application prospects.

The invention discloses a single-component high-heat-resistance type epoxy adhesive and a preparation method of the single-component high-heat-resistance type epoxy adhesive. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of N, N-4, 4 '-diphenylmethane bismaleimide; 50 parts of bisphenol F epoxy resin; 36.47 parts of 4, 4 '-diaminodiphenyl sulfone; 20 to 40 phr of phenyl glycidyl ether; 1 to 2 phr of two terminal type epoxy silicone oil; 4 to 6 phr of hydroxyl-terminated polyether sulfone; 10 to 20 phr of boron nitride, the surface of which is modified by gamma-glycidyl ether oxypropyl trimethoxy silane; and 1 to 3 phr of an adhesion promoter. According to the adhesive disclosed by the invention, the heat resistance, the mechanical property, the dimensional stability, the process adaptability and the like are synergistically improved, the use requirements of an aviation structural part on long-term service at 150-180 DEG C and an electronic packaging device on the condition of short-time reflow soldering at about 200 DEG C can be met, and the reliability of the adhesive in a high-temperature environment is remarkably improved.

The invention relates to the technical field of epoxy AB adhesives, in particular to a special epoxy AB adhesive for a back mesh as well as a preparation method and application of the special epoxy AB adhesive for the back mesh, and the epoxy A adhesive is prepared from the following components in percentage by weight: a component A: 40-60% of bisphenol A epoxy resin; 10-20% of carboxyl-terminated nitrile rubber; 5%-10% of nano SiO2; 1-3% of a silane coupling agent; 5-10% of a reactive diluent; 3-8% of a plasticizer; the component B comprises 50-70% of a fatty amine curing agent; 10-20% of polyether amine; 1-3% of an accelerant; and 10-20% of nano calcium carbonate. Through an interpenetrating network structure formed by the carboxyl-terminated nitrile rubber and the epoxy resin, the peel strength of the adhesive reaches 15-20 N / mm and is improved by 50% or above compared with that of traditional epoxy glue, the peeling stress between a back mesh material and a matrix can be effectively resisted, and the stability and reliability of the structure are ensured.

The invention relates to the technical field of adhesives, in particular to a high-bonding-strength bio-based epoxy adhesive and a preparation method thereof. Comprising 20-50 parts of bio-based epoxy resin, 8-20 parts of a bio-based epoxy flexibilizer, 5-10 parts of an epoxy diluent, 25-60 parts of an inorganic filler, 2-8 parts of a curing agent and 0.2-1 part of a curing accelerator, the epoxy resin adhesive with excellent performance is developed by using a bio-based material as a raw material, has high adhesion to metal aluminum and the like, has excellent toughness, can be widely applied to automobiles, aviation, industry, electronics and other directions requiring shock absorption, impact resistance and structural adhesion, has an excellent economic prospect, and is worthy of popularization and application. Meanwhile, the method has important significance in environmental protection.

The invention discloses an ultralow-temperature-resistant organic silicon modified epoxy adhesive and a preparation method thereof. The preparation method of the adhesive comprises the following steps: firstly, preparing an organic silicon epoxy monomer by taking bis (aminopropyl)-terminated polydimethylsiloxane and epoxy chloropropane as raw materials; 2-amino-4-hydroxy-6-methylpyrimidine and 1, 1 '-carbonyldiimidazole are mixed to obtain a compound UPy-CDI, and the compound UPy-CDI reacts with polyether diamine to obtain a curing agent containing quadruple hydrogen bonds; and finally, mixing the curing agent containing quadruple hydrogen bonds and the organosilicon epoxy monomer in proportion, and heating and curing to obtain the organosilicon modified epoxy adhesive. The low-temperature toughness of the epoxy resin is improved through cooperation of organic silicon flexible chain segments and multiple hydrogen bonds, and the epoxy resin can keep high bonding performance in an ultralow-temperature working environment.

The invention discloses a pressure-resistant steel-based nano-film pressure sensor and application thereof, and belongs to the technical field of pressure sensors, and the pressure-resistant steel-based nano-film pressure sensor comprises a pressure core body which is fixedly connected with a lower ceramic insulating plate through a glass micro-melting layer; the pressure guide nozzle and the steel-based connecting piece are melted through the glass micro-melting layer to form a closed structure; the protective layer comprises a glaze layer which is coated on the annular outer surface of a combined piece formed by combining the steel-based connecting piece and the ceramic insulating plate; and the epoxy glue layer covers the exposed end surface of the glass micro-melting layer to form a closed space. The pressure-resistant steel-based nano-film pressure sensor prepared by the invention is relatively high in insulating strength and precision, and can be applied to petroleum and natural gas, aerospace, military industry, industrial automation and medical and special equipment.

The invention discloses a preparation method and application of a controllable depolymerization and debonding high-performance epoxy adhesive. The preparation method comprises the following steps: S1, reacting an aldehyde monomer with an alcohol monomer to obtain a polyhydroxy intermediate containing an acetal structure; the aldehyde monomer has at least one hydroxyl functional group; the alcohol monomer has more than three hydroxyl functional groups; s2, carrying out ring-opening addition and alkaline environment ring-closing epoxidation reaction on epoxy chloropropane and the polyhydroxy intermediate to obtain an epoxy monomer containing an acetal dynamic bond; and S3, compounding the epoxy monomer obtained in the step S2 with a temperature-resistant epoxy monomer, and mixing and curing with an amine curing agent to obtain the controllable depolymerization debonding thermosetting adhesive under the acidic condition, the temperature-resistant epoxy monomer comprises at least one of an epoxy monomer containing a naphthalene ring structure and an epoxy monomer containing a biphenyl structure.

The utility model relates to the technical field of old bridge reinforcement, and discloses an old bridge reinforcement device with a monitoring function, which comprises an old bridge main body, a crack, a carbon fiber plate, a steel wire bundle, a zinc coating, a sensing groove, a strain sensor, a stainless steel pipe, a pressure steel plate, a bolt, a sensing element lead and an epoxy adhesive, the strain sensor is used for monitoring the stress and deformation of the structure in real time, the bolt is used for mechanically fixing the pressure steel plate and the sensor to guarantee stable installation, and the epoxy adhesive is used for bonding the sensor and other assemblies to guarantee long-term fixity and waterproofness. According to the old bridge reinforcing device with the monitoring function, the double advantages of structure enhancement and real-time state monitoring are provided, the bearing capacity of a bridge is remarkably improved through combination of the carbon fiber plates and the steel wire bundles, the service life of the bridge is greatly prolonged due to high strength and good corrosion resistance of the carbon fiber plates and the steel wire bundles, and the service life of the bridge is prolonged. And the whole reinforcing process is more efficient and economical due to the light characteristic of the carbon fibers.

The invention relates to the use of an epoxy resin adhesive for bonding substrates at least partially coated with a cured epoxy resin adhesive, characterized in that the adhesive comprises a resin component comprising at least one epoxy resin and a curing agent component comprising at least one epoxy resin, the curing agent component comprises at least one amine having at least one aliphatic amino group wherein the amine is selected from the group consisting of polyetheramines and linear or branched but non-cyclic aliphatic polyamines wherein the amine comprises at least 50% by weight of all amine curing agents having at least one amine hydrogen contained in the curing agent component, the curing agent component is based on all amine curing agents in the curing agent component. The use according to the invention allows the adhesion of substrates at least partially coated with a cured epoxy adhesive, forming a stable weather-resistant adhesive connection, and is particularly suitable for repairing rotor blades in wind turbines.

The invention relates to the technical field of adhesives, in particular to high-strength and high-toughness epoxy glue and a preparation method thereof.The high-strength and high-toughness epoxy glue comprises a component A and a component B. The component A and the component B are used in cooperation according to the mass ratio of 1: 1, and the component A comprises, by mass, 80-100 parts of epoxy resin, 10-20 parts of reactive diluent, 30-50 parts of liquid nitrile rubber buna 40 and 40-60 parts of filler; the component B is prepared from the following components in parts by mass: 40 to 60 parts of methylhexahydroanhydride, 0.4 to 0.6 part of PEG (polyethylene glycol)-carboxyl pyrazole copolymer and 40 to 60 parts of filler. According to the invention, the viscosity of the system is reduced by the PEG-carboxyl pyrazole copolymer, so that the epoxy glue is easier to process, coat and level in the use process, the viscosity reduction is beneficial to spreading of a material on a larger surface area, construction is convenient, the material can form a uniform thin-layer structure with a cross-linked network, and the strength and the toughness are improved.

A single-component photothermal dual-curing epoxy adhesive. The raw materials, calculated by weight, include: 100 parts of an acrylic / polyurethane dual-modified epoxy resin, 10-40 parts of a low-viscosity epoxy resin, 8-30 parts of an epoxy curing agent, 30-300 parts of an inorganic filler, 2-30 parts of a dispersant, and 0.25-5 parts of a photoinitiator. This adhesive exhibits excellent photocuring activity, high toughness, and excellent high- and low-temperature resistance, while maintaining other properties. The photoinitiator in this system participates in the curing reaction, avoiding the degradation of the adhesive's mechanical and bonding properties due to initiator molecular migration. The adhesive also offers a flexible curing process and minimal curing shrinkage, meeting the weather resistance requirements of semiconductor packaging. This makes it an industrially viable epoxy adhesive for semiconductor packaging.

The invention discloses an epoxy plaster for repairing high-strength concrete for electric power engineering, which comprises a component A and a component B. The mass ratio of the component A to the component B is (8-12): 1. The component A comprises the following components in parts by weight: 35-50 parts of bisphenol A epoxy resin, 15-25 parts of multifunctional epoxy resin, 10-15 parts of a functional diluent, 20-40 parts of filler, 1-5 parts of a coupling agent and 1-3 parts of an auxiliary agent; the component B comprises the following components in parts by weight: 45-65 parts of hydrophobic amine modifier curing agent, 20-40 parts of filler, 1-5 parts of coupling agent, 1-5 parts of adhesion promoter and 1-5 parts of assistant. The epoxy plaster is a modified high-molecular high-strength repairing and protecting material, and has the advantages of high bonding force, high temperature resistance, durability, impermeability, impact resistance, compactness, extremely high bonding force and extremely strong waterproof effect.

The invention provides an epoxy adhesive solution composition, a preparation method of an epoxy adhesive solution and a modified cellular board. The epoxy adhesive liquid composition comprises the following components in parts by weight: 53-58 parts of epoxy resin, 2-10 parts of a silane coupling agent, 1-10 parts of a curing agent, 1-5 parts of blocked isocyanate and 60-70 parts of water, wherein a blocking group of the blocked isocyanate is selected from hydroxyl, oximido, acylamino, amino, imidazolyl, pyrazolyl or piperazinyl. By introducing the blocked isocyanate with the specific structure, the epoxy adhesive liquid can be subjected to pre-crosslinking reaction in the early drying treatment process, the modulus and high temperature resistance of a formed dry film are improved, and the phenomenon of glue overflow in the subsequent curing stage is inhibited; therefore, the structural integrity and the bonding strength of the adhesive layer in the modified cellular board under the high-temperature condition are improved.

The invention discloses an enamel composite board as well as a preparation method and application thereof. The preparation method specifically comprises the following steps: (1) carrying out sand blasting treatment, glaze spraying, high-temperature sintering, stacking placement and pre-pressing shaping on enamel steel plates; (2) the backing aluminum plate is subjected to sand blasting treatment; and (3) sequentially compounding the enameled steel plate, the aluminum honeycomb core and the backing aluminum plate by using an epoxy adhesive to obtain the aluminum honeycomb composite plate. The enamel composite board is excellent in performance, the bonding strength, the weather resistance and the flatness of the board are all remarkably improved, and the enamel composite board is suitable for interior decoration and can also be widely applied to building curtain walls, so that the application range of the enamel composite board is widened, and the economic value of the enamel composite board is improved.

The invention provides a packaging structure and a packaging method for improving the heat dissipation performance of an IGBT power module. The packaging structure comprises a copper substrate, a first epoxy glue layer, an epoxy resin-based composite material layer, a second epoxy glue layer, an upper bridge copper layer, a lower bridge copper layer, a chip solder layer and a power chip which are sequentially arranged from bottom to top, wherein the upper bridge copper layer and the lower bridge copper layer are integrally arranged; the power chip comprises an upper bridge chip and a lower bridge chip; the chip solder layer comprises an upper bridge chip solder layer and a lower bridge chip solder layer; the upper bridge chip solder layer is arranged on the upper bridge copper layer, and the upper bridge chip is arranged on the upper bridge chip solder layer; the lower bridge chip solder layer is arranged on the lower bridge copper layer, and the lower bridge chip is arranged on the lower bridge chip solder layer. According to the packaging structure, the epoxy resin-based composite material layer is adopted as the insulating layer, copper and a welding layer are reduced in heat flow transmission, the heat resistance from the chip to the shell is reduced, and the heat dissipation performance is improved; the copper layers of the upper and lower bridge arms are integrated, leads between the upper and lower bridges are reduced, the power loss of the IGBT is reduced, and the heat is reduced.

The invention relates to the technical field of epoxy adhesives, in particular to a low-temperature curing epoxy adhesive and a preparation method thereof. The epoxy resin composition comprises the following components in parts by weight: 30-80 parts of epoxy resin, 20-40 parts of a curing agent and 0.1-2 parts of an accelerant, the accelerant comprises a zeolite imidazate framework material. Zinc ions and 2-methylimidazole are coordinated and self-assembled to form a porous crystal material, and the porous crystal material is used as an accelerant, so that the storage stability of the epoxy adhesive can be improved; the particle size of the accelerant is 50-250 nm, the pore diameter is 0.2-1 nm, the pore volume is 0.3-1 cm < 3 > / g, and the addition amount of the accelerant can be reduced; the accelerator prepared by the invention is simple and convenient in synthesis method, is used in an epoxy adhesive formula, and can improve the adhesion and reduce the shrinkage rate.

The invention belongs to the field of adhesives, and particularly relates to a laser-curable epoxy adhesive as well as a preparation method and application thereof. The laser-curable epoxy adhesive is prepared from the following raw materials: low-viscosity epoxy resin, toughened epoxy resin, epoxy acrylate resin, dopamine modified graphene oxide nanosheets, a curing agent and a thermal initiator in a mass ratio of 1: (0.5-2): (0.75-3): (0.05-0.5): (0.75-2.5): (0.05-0.5): (0-1): (0-0.2): (0-0.15): (0-2) as well as optional epoxy diluent, stabilizer, coupling agent and filler. The laser-curable epoxy adhesive provided by the invention has high modulus and high Tg, and can be rapidly cured.