362 results about "Epoxy adhesive" patented technology

The invention discloses an adhesive containing epoxy-terminated polyurethane epoxy resin as well as a preparation method and application of the adhesive. The adhesive comprises the following components in parts by weight: 10-15 parts of epoxy resin, 70-75 parts of epoxy-terminated polyurethane epoxy resin, 19-21 parts of an amine curing agent and 8-15 parts of heat-conducting filler, wherein the epoxy-terminated polyurethane epoxy resin is obtained by reacting a polyurethane prepolymer and epoxy resin, NCO of the polyurethane prepolymer and hydroxyl of the epoxy resin are subjected to an addition reaction, and after the reaction is finished, NCO of a system is eliminated by adopting a small-molecule epoxy compound; the polyurethane prepolymer is obtained by reaction of isocyanate and polyether polyol with flexible chain segments. According to the adhesive, the curing heat release peak value is reduced, the toughness is improved, meanwhile, the high strength is kept, the foaming problem is avoided, the defects that a traditional epoxy adhesive is high in heat release and poor in toughness are overcome, and the adhesive is suitable for the fields such as aerospace and electronic and electric appliances which have strict performance requirements.

The invention discloses a high-toughness conductive and thermal-conductive epoxy adhesive, a preparation method thereof and a conductive film, and belongs to the technical field of conductive materials. Comprising the following raw material components in parts by weight: 100 parts of epoxy resin, 4-25 parts of a latent curing agent, 0.5-5 parts of an accelerant, 200-600 parts of conductive filler, 5-15 parts of an epoxy-terminated polyurethane flexibilizer, 5-20 parts of a core-shell flexibilizer, 5-10 parts of a nitrile rubber flexibilizer, 2-10 parts of a reactive diluent, 0.5-2 parts of a coupling agent and 20-50 parts of a solvent. Through compounding of the over-end epoxy type polyurethane flexibilizer, the core-shell flexibilizer and the nitrile rubber flexibilizer, the prepared conductive adhesive has excellent toughness and bonding characteristics, and meanwhile, the shrinkage stress and thermal stress in the curing process can be reduced.

The invention discloses a supramolecular host-guest photoinitiator with an adjustable curing rate and an epoxy adhesive, the supramolecular host-guest photoinitiator comprises a supramolecular host compound and a guest photoinitiator included in the supramolecular host compound, the supramolecular host compound has a macrocyclic structure with a repeating unit number of 2-30, the guest photoinitiator comprises a cationic photoinitiator; in the supramolecular host-guest photoinitiator, the molar ratio of the supramolecular host compound to the guest photoinitiator is (0.8-1.5): 1, and the mass percentage of carbon element to hydrogen element is (40-75): (3-8). The UV epoxy adhesive comprises the supramolecular host-guest photoinitiator with the adjustable curing rate, a delayed curing window period is formed after UV light irradiation initiation, the adhesive is excellent in flowing and coating performance, the adhesive can continue to initiate polymerization curing without depending on illumination after the window period, heat input can be controlled, and the curing rate can be adjusted.

The invention discloses a single-component high-heat-resistance type epoxy adhesive and a preparation method of the single-component high-heat-resistance type epoxy adhesive. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of N, N-4, 4 '-diphenylmethane bismaleimide; 50 parts of bisphenol F epoxy resin; 36.47 parts of 4, 4 '-diaminodiphenyl sulfone; 20 to 40 phr of phenyl glycidyl ether; 1 to 2 phr of two terminal type epoxy silicone oil; 4 to 6 phr of hydroxyl-terminated polyether sulfone; 10 to 20 phr of boron nitride, the surface of which is modified by gamma-glycidyl ether oxypropyl trimethoxy silane; and 1 to 3 phr of an adhesion promoter. According to the adhesive disclosed by the invention, the heat resistance, the mechanical property, the dimensional stability, the process adaptability and the like are synergistically improved, the use requirements of an aviation structural part on long-term service at 150-180 DEG C and an electronic packaging device on the condition of short-time reflow soldering at about 200 DEG C can be met, and the reliability of the adhesive in a high-temperature environment is remarkably improved.

The invention relates to the technical field of adhesives, in particular to a high-bonding-strength bio-based epoxy adhesive and a preparation method thereof. Comprising 20-50 parts of bio-based epoxy resin, 8-20 parts of a bio-based epoxy flexibilizer, 5-10 parts of an epoxy diluent, 25-60 parts of an inorganic filler, 2-8 parts of a curing agent and 0.2-1 part of a curing accelerator, the epoxy resin adhesive with excellent performance is developed by using a bio-based material as a raw material, has high adhesion to metal aluminum and the like, has excellent toughness, can be widely applied to automobiles, aviation, industry, electronics and other directions requiring shock absorption, impact resistance and structural adhesion, has an excellent economic prospect, and is worthy of popularization and application. Meanwhile, the method has important significance in environmental protection.

The invention relates to the use of an epoxy resin adhesive for bonding substrates at least partially coated with a cured epoxy resin adhesive, characterized in that the adhesive comprises a resin component comprising at least one epoxy resin and a curing agent component comprising at least one epoxy resin, the curing agent component comprises at least one amine having at least one aliphatic amino group wherein the amine is selected from the group consisting of polyetheramines and linear or branched but non-cyclic aliphatic polyamines wherein the amine comprises at least 50% by weight of all amine curing agents having at least one amine hydrogen contained in the curing agent component, the curing agent component is based on all amine curing agents in the curing agent component. The use according to the invention allows the adhesion of substrates at least partially coated with a cured epoxy adhesive, forming a stable weather-resistant adhesive connection, and is particularly suitable for repairing rotor blades in wind turbines.

The invention provides an epoxy adhesive solution composition, a preparation method of an epoxy adhesive solution and a modified cellular board. The epoxy adhesive liquid composition comprises the following components in parts by weight: 53-58 parts of epoxy resin, 2-10 parts of a silane coupling agent, 1-10 parts of a curing agent, 1-5 parts of blocked isocyanate and 60-70 parts of water, wherein a blocking group of the blocked isocyanate is selected from hydroxyl, oximido, acylamino, amino, imidazolyl, pyrazolyl or piperazinyl. By introducing the blocked isocyanate with the specific structure, the epoxy adhesive liquid can be subjected to pre-crosslinking reaction in the early drying treatment process, the modulus and high temperature resistance of a formed dry film are improved, and the phenomenon of glue overflow in the subsequent curing stage is inhibited; therefore, the structural integrity and the bonding strength of the adhesive layer in the modified cellular board under the high-temperature condition are improved.

The invention provides a packaging structure and a packaging method for improving the heat dissipation performance of an IGBT power module. The packaging structure comprises a copper substrate, a first epoxy glue layer, an epoxy resin-based composite material layer, a second epoxy glue layer, an upper bridge copper layer, a lower bridge copper layer, a chip solder layer and a power chip which are sequentially arranged from bottom to top, wherein the upper bridge copper layer and the lower bridge copper layer are integrally arranged; the power chip comprises an upper bridge chip and a lower bridge chip; the chip solder layer comprises an upper bridge chip solder layer and a lower bridge chip solder layer; the upper bridge chip solder layer is arranged on the upper bridge copper layer, and the upper bridge chip is arranged on the upper bridge chip solder layer; the lower bridge chip solder layer is arranged on the lower bridge copper layer, and the lower bridge chip is arranged on the lower bridge chip solder layer. According to the packaging structure, the epoxy resin-based composite material layer is adopted as the insulating layer, copper and a welding layer are reduced in heat flow transmission, the heat resistance from the chip to the shell is reduced, and the heat dissipation performance is improved; the copper layers of the upper and lower bridge arms are integrated, leads between the upper and lower bridges are reduced, the power loss of the IGBT is reduced, and the heat is reduced.

The invention belongs to the field of adhesives, and particularly relates to a laser-curable epoxy adhesive as well as a preparation method and application thereof. The laser-curable epoxy adhesive is prepared from the following raw materials: low-viscosity epoxy resin, toughened epoxy resin, epoxy acrylate resin, dopamine modified graphene oxide nanosheets, a curing agent and a thermal initiator in a mass ratio of 1: (0.5-2): (0.75-3): (0.05-0.5): (0.75-2.5): (0.05-0.5): (0-1): (0-0.2): (0-0.15): (0-2) as well as optional epoxy diluent, stabilizer, coupling agent and filler. The laser-curable epoxy adhesive provided by the invention has high modulus and high Tg, and can be rapidly cured.

The invention relates to a single-component epoxy adhesive as well as a preparation method and application thereof. The single-component epoxy adhesive is prepared from the following components in parts by weight: 35 to 45 parts of bisphenol epoxy resin, 5 to 20 parts of polyurethane modified epoxy resin, 20 to 30 parts of curing agent, 0.1 to 1 part of fluorocarbon surfactant and 0.1 to 1 part of flatting agent. According to the single-component epoxy adhesive provided by the invention, the leveling agent and the fluorocarbon surfactant are introduced into an epoxy resin system, so that the problem that an epoxy adhesive on the market at present is easy to diffuse and separate out is solved, and the single-component epoxy adhesive also has excellent adhesive property, ageing resistance and reliability.

The invention discloses a high-strength epoxy-based adhesive and a preparation method thereof, and relates to the technical field of epoxy-based adhesives, the high-strength epoxy-based adhesive comprises the following components: 80-120 parts of epoxy resin; 20-40 parts of a curing agent; 10-35 parts of ethylene propylene diene monomer powder; 5 to 20 parts of toughening resin; 30-80 parts of an inorganic filler; 0.5 to 3 parts of a coupling agent; 0.5 to 2 parts of an auxiliary agent; the preparation is performed based on the formula. According to the invention, the ethylene propylene diene monomer powder is introduced into an epoxy resin system and is matched with the toughening resin, the inorganic filler and the coupling agent for collaborative design, so that the impact resistance and deformation adaptability of a cured adhesive layer are remarkably improved while the adhesive keeps relatively high bonding strength and structural stability; the obtained high-strength epoxy-based adhesive has good mechanical properties, construction performance and engineering adaptability, and is suitable for popularization and application under various complex working conditions.

The invention relates to a built-in foam material for noise reduction of a new energy automobile tire as well as a preparation method and application of the built-in foam material, and belongs to the technical field of polyurethane foam materials. The foam material is composed of a component A and a component B, wherein the weight percentage ratio of the component A to the component B is 100: (30-70); the component A is prepared from the following components in parts by weight: 100 to 120 parts of polyhydric alcohol I, 50 to 70 parts of polyhydric alcohol II, 20 to 30 parts of polyhydric alcohol III, 0.01 to 0.1 part of catalyst, 15 to 25 parts of chain extender, 20 to 40 parts of foam stabilizer, 5 to 10 parts of liquid nitrile rubber, 1 to 5 parts of high-temperature-resistant epoxy adhesive and 4 to 8 parts of foaming agent; the component B comprises isocyanate; the polyol I comprises polytetramethylene ether glycol, the polyol II comprises polycaprolactone diol, and the polyol III comprises one or more of 2, 2-dimethylolpropionic acid and 2, 2-dimethylolbutyric acid. The foam material has better high temperature resistance, rigidity and toughness, foam cavities are uniform, the overall material density is small, and the mute effect is good.

The utility model provides a submarine cable armored structure anchoring device which comprises a protective sleeve, an armored structure is arranged in the protective sleeve, one end of the protective sleeve is sealed through a grouting cover plate, the other end of the protective sleeve is connected with an anti-bending pipe through a connecting flange, and through holes for a submarine cable to penetrate through are formed in the anti-bending pipe and the protective sleeve. The protective sleeve comprises two protective covers which are symmetrically arranged, one sides of the two protective covers are connected through a hinge, the other sides of the two protective covers are fixed through bolts, and the split type protective sleeve is adopted, so that installation, disassembly and maintenance are convenient; an anti-bending pipe is arranged, so that the submarine cable is prevented from being excessively bent under a relatively large bending moment, and the service life of the submarine cable is prolonged; the protective sleeve and the anti-bending pipe are connected through the connecting flange, so that the overall sealing performance is improved; and the epoxy binder is poured into the protective sleeve, so that the sealing performance of the submarine cable armoring anchoring device is enhanced, seawater is effectively prevented from entering the conical protective cover to corrode the first armoring steel wire layer and the second armoring steel wire layer, and the durability of the submarine cable is improved.

The invention relates to a thiourea-polyamine condensation polymer, an epoxy adhesive and a preparation method of the thiourea-polyamine condensation polymer, and the thiourea-polyamine condensation polymer is obtained by reacting thiourea with 3, 3 '-dimethyl-4, 4'-diaminodicyclohexylmethane. According to the preparation method, thiourea is used for modifying 3, 3 '-dimethyl-4, 4'-diaminodicyclohexylmethane under a proper condition, so that the modified thiourea-polyamine condensation polymer is obtained. The modified thiourea-polyamine polycondensate is simple in preparation process and high in yield. Moreover, the modified thiourea-polyamine polycondensate can be used as a chain extender for preparing an epoxy adhesive, the impact toughness and tensile property of the epoxy adhesive can be remarkably improved, the epoxy adhesive has better heat resistance, and the application field and scene of the epoxy adhesive are expanded.

The invention relates to an epoxy resin adhesive composition and a preparation method thereof, and belongs to the technical field of high-performance polymer material modification and electronic packaging materials, and the epoxy resin adhesive composition comprises the following components by weight: 100 parts of basic epoxy resin; 5-30 parts of a hyperbranched liquid crystal modifier; adding the curing agent according to a stoichiometric ratio; 100 to 600 parts of a heat-conducting filler; 0.1-5 parts of an accelerant and an auxiliary agent; the hyperbranched liquid crystal modifier has a core-shell structure and is prepared from a hydrogen-containing hyperbranched polysiloxane core and an alkenyl-terminated liquid crystal epoxy monomer through a hydrosilylation reaction under the action of a catalyst, the hyperbranched polysiloxane core is introduced, the friction resistance among high-concentration fillers is reduced by utilizing the torispherical structure of the hyperbranched polysiloxane core, and the hyperbranched liquid crystal modifier has the advantages that the friction resistance is reduced; under the condition that 350 parts of heat-conducting filler is filled, the modifier is added, so that the high-filling system still has excellent flowability and leveling property while keeping high heat-conducting property, and is suitable for high-precision micro-encapsulation scenes; the heat conductivity of the scheme is obviously superior to that of a system which does not use the modifier or does not adopt a stepped heating process.

The invention belongs to the technical field of adhesives, and particularly relates to a single-component epoxy adhesive for adhering a carbon fiber composite material and a preparation method of the single-component epoxy adhesive. The single-component epoxy adhesive comprises the following components in parts by weight: 70-85 parts of epoxy resin, 1-5 parts of modified polytetrafluoroethylene, 10-20 parts of a curing agent, 5-20 parts of a diluent and 3-10 parts of a toughening thixotropic modifier, the toughening thixotropic modifier comprises polyimide, a silane coupling agent and silicon dioxide, and the mass ratio of the polyimide to the silane coupling agent to the silicon dioxide is (0.1-2): (0.5-1): 10. The modified polytetrafluoroethylene and the toughening thixotropic modifier are introduced into the single-component epoxy adhesive, and the modified polytetrafluoroethylene and the toughening thixotropic modifier are synergistically matched, so that the single-component epoxy adhesive has excellent heat resistance and toughness after being cured, and is relatively low in water absorption and good in adhesive property; the adhesive is especially suitable for bonding of carbon fiber structural members.

The invention provides a preparation method of modified mica powder for a high-barrier epoxy adhesive, which comprises the following steps: sequentially introducing amino and long-chain alkyl to the surface of natural mica powder through the steps of dispersion, suction filtration, drying and the like to obtain the modified mica powder. The preparation method has the characteristics that two kinds of silane with different properties are used for modifying the mica powder, the using method is simple, the obtained modified mica powder is good in uniformity and stability, the compatibility and binding force of the mica powder and an epoxy resin system are improved due to existence of amino, the problem that the mica powder is difficult to disperse in epoxy resin is well solved due to alkyl, and the service life of the mica powder is prolonged. And the barrier property of the epoxy adhesive can be improved.

The application discloses a single-component epoxy adhesive for magnetic core bonding, which comprises A) a rigid ring structure containing epoxy resin prepolymer, accounting for 30-60% of the total weight percentage of A-D; B) an organic silicon modified anhydride curing agent, accounting for 15-40% of the total weight percentage of A-D; C) a liquid anhydride curing agent, accounting for 15-42% of the total weight percentage of A-D; D) a curing accelerator, accounting for 0.5-5% of the total weight percentage of A-D; and E) glass microbeads, accounting for 5-30% of the total weight percentage of A-D. The adhesive has the characteristics of high adhesion, good heat resistance, low linear thermal expansion coefficient, low curing volume shrinkage, excellent wet heat resistance and excellent heat shock resistance, and can form a bonding layer with high uniformity in thickness between the magnetic cores.

Provided herein is an expandable epoxy adhesive.

The application discloses a manufacturing method of an involute transformer core, which comprises the following steps: S1, cutting a stainless steel silicon steel sheet to obtain a silicon steel sheet blank; S2, using a rolling tool to manufacture the silicon steel sheet blank into an involute silicon steel sheet; S3, stacking a plurality of the involute silicon steel sheets on the periphery of a base cylinder, and tightly holding the involute silicon steel sheets and the base cylinder by using a plurality of stainless steel hoops to form a holding piece, and annealing the holding piece as a whole; S4, bundling; S5, preheating the bundled piece; S6, immersing the preheated bundled piece into insulating paint; S7, solidifying the bundled piece; S8, surface treatment; and S9, gluing, coating epoxy glue on the outer surface of the component which has been surface treated in the step S8, and firmly bonding the component with an epoxy cylinder. The manufacturing method of the involute transformer core provided by the application has single specification of the involute silicon steel sheet, avoids a plurality of specifications of the width of the radial silicon steel sheet, is convenient to manage, and reduces storage devices.

The utility model provides a storage device for epoxy adhesive production, which comprises a base structure, the top of the base structure is provided with a plurality of storage structures, the plurality of storage structures are stacked in sequence, and the bottom of the bottommost storage structure is provided with a connecting pipe. The device is reasonable in design, by arranging the transmission lead screw capable of rotating, the transmission lead screw can drive the lifting plate to ascend and descend, when the lifting plate moves downwards, the storage barrel can suck epoxy adhesive in the connecting pipe into the storage barrel to be stored, when the epoxy adhesive needs to be discharged, the lifting plate moves upwards, and therefore the epoxy adhesive can be conveniently discharged. And the lifting plates push the epoxy adhesives in the storage barrels to enter the storage barrels again, the epoxy adhesives in the multiple stacked storage barrels can be placed in and discharged out at the same time, and the epoxy adhesives do not need to be taken down.

The invention discloses a high-performance modified epoxy adhesive and a preparation method thereof, and belongs to the technical field of epoxy adhesives, and the preparation method comprises the following steps: preparing a hydrolyzed silane solution, silane modified silicon dioxide, carboxylated silicon dioxide and modified nano silicon dioxide, and premixing and curing to obtain the high-performance modified epoxy adhesive. According to the method, curing process parameters are optimized, a mild segmented low-temperature curing system is constructed, the damage risk of traditional high-temperature curing on the thermosensitive base material is technically avoided, the bonding requirements of different thermosensitive base materials can be met without additionally adding a base material protection or pretreatment step, and the technical suitability is higher.

The invention discloses an epoxy glue tail-attached external potting mold for an engine cable connector, and relates to the technical field of tail-attached cable potting, the epoxy glue tail-attached external potting mold comprises a mold support, a wire passing clamp used for placing a tail-attached cable piece is arranged on the mold support, and the lower end of the tail-attached cable piece penetrates through a potting mold body and a potting mold cover to be connected with a joint connector. The glue pouring mold body and the glue pouring mold cover are arranged in a matched mode, a cavity space enabling epoxy glue to be formed outside the tail attaching cable piece in a thermoplastic mode is formed in the glue pouring mold body and the glue pouring mold cover, and a connector male head is arranged at the end, away from the tail attaching cable piece, of the connector connector. According to the epoxy glue tail-attached external potting mold for the engine cable connector, the mold is simple in structure and high in positioning precision, the problem of bubble residues in the potting process can be avoided, good sealing performance and insulating performance are achieved, it is ensured that the tail-attached cable piece is evenly coated with epoxy glue, the waterproof effect, the moisture permeation blocking effect and the anti-corrosion effect are achieved, and the service life of the tail-attached cable piece is prolonged. And chemical corrosion is resisted.

Curable adhesive compositions include a curable adhesive and a filler comprising expanded microspheres. Expanded microspheres are polymeric spheres with a central void. Curable adhesives include curable epoxy adhesives. The cured adhesive composition has a dielectric constant (Dk) of 3.0 or less, a shrinkage of less than 4.5%, and an elongation of 2-400%. The curable adhesive compositions can be used to form articles where one substrate is adhered to a second substrate with the cured adhesive composition between them.

The present application relates to a kind of high-efficiency lossless preparation multi-element wafer assembly method, the method utilizes the high bonding strength of water boiling glue epoxy adhesive, excellent water boiling glue, glue layer soft characteristics, so that piezoelectric ceramic small particle does not fall in wafer assembly preparation process, substrate removal is simple and easy, and does not damage the electrode surface of piezoelectric ceramic small column, including the following steps: surface treatment;Gluing;Cutting;Washing, normal temperature air dry;Low-temperature prebaking, fill high molecular decoupling material, remove the decoupling material on the electrode surface of piezoelectric ceramic small particle clean;Solidification;Polish and remove substrate;Remove excess particles to form approximately circular wafer assembly;Positive and negative electrode line lead out.The present application prepares multi-element wafer assembly method, utilizes the high bonding strength of water boiling glue epoxy adhesive, good impact resistance characteristics, overcomes the problem that its bonding strength is reduced due to factors such as water vapor and temperature in preparation process, and does not damage the electrode surface of piezoelectric ceramic small column.

This application discloses a fast-curing, thermally conductive, and flame-retardant epoxy adhesive. The raw materials for preparation include component A and component B. Component A, by weight, comprises: 14-25 parts epoxy resin, 5-20 parts modified epoxy resin, 3-8 parts toughening agent I, 3-6 parts diluent, 0.5-2.5 parts coupling agent I, 0-1 part additives, 0.3-1.5 parts thixotropic agent I, and 55-70 parts thermally conductive and flame-retardant filler I. Component B is the curing component. This invention is applied to the fixing of battery cells to the bottom water-cooling plate, suitable for power battery PACK modules. It exhibits good adhesion to untreated PI and PET films, excellent aging performance, stable storage period, resistance to high and low temperature shocks, high thermal conductivity, and achieves V0 flame-retardant performance. Furthermore, its fast-curing properties well meet the requirements of early-stage production processes.

The application discloses a new energy automobile circuit board glue curing device and a method and application thereof, and mainly comprises a surface light source module, a main controller, a temperature sensing module and the like, the main controller is connected with the temperature sensing module and the surface light source module, the surface light source module irradiates the area to be glued, and the flux is heated to the activation temperature. In the application, the flux is heated to the activation temperature and then the epoxy glue is dotted, which is beneficial to improving the flowability of the epoxy glue and timely removing the bubbles in the epoxy glue, promoting the fusion of the flux and the epoxy glue, and significantly improving the filling, bubble removing and curing effects; the LED lamp bead array arranged in sequence is arranged to form the surface light source module, and the surface light source module is matched with the main controller, so that the surface light source module can be used immediately, the irradiation power, irradiation time, irradiation range and the like can be adjusted, rapid heating is realized, the working efficiency is high, the automatic production is beneficial to be realized, and the surface light source module realizes the glue curing through irradiation, the risk of blowing away and scattering the flux does not exist, and the curing is more reliable.

The utility model discloses a miniature 60A gradient magnetic conductivity direct-current-resistant current transformer which comprises a bottom shell, a winding magnetic ring, an electronic wire with a terminal and an epoxy glue layer. A shell cavity is formed in the bottom shell; a wire connecting seat extending upwards from the bottom along the shell wall is arranged in the shell cavity; a plurality of wire connecting grooves are formed in the wire connecting seat at intervals, and each wire connecting groove is provided with a through hole in the top surface of the wire connecting seat and one surface, opposite to the shell wall, of the wire connecting seat; each external connection end of the winding magnetic ring is correspondingly connected with one wiring end of the electronic wire with the terminal to form a connection part, and each connection part is reinforced by tin immersion; the winding magnetic ring is installed in the shell cavity, the electronic wire with the terminal is arranged outside the bottom shell, and the connecting part penetrates into the wire connecting groove and is positioned through the wire connecting groove. The epoxy glue layer is formed by pouring epoxy glue into the shell cavity after the winding magnetic ring and the electronic wire with the terminal are installed. According to the utility model, the size reduction and miniaturization of the mutual inductor can be realized under the condition that the connection between the winding magnetic ring and the electronic wire is not influenced.

The invention discloses a sulfonated carbon nanotube-amino silicon dioxide double-phase reinforced epoxy adhesive, which is prepared from the following components in parts by mass: 0.5 to 2 parts of sulfonated carbon nanotube, 1 to 3 parts of amino silicon dioxide, 100 to 200 parts of epoxy resin matrix and 30 to 60 parts of curing agent. The sulfonated carbon nanotubes and the amino silicon dioxide form a uniformly distributed disperse network in an epoxy resin matrix, so that the load is effectively transmitted, the tensile shear strength of the adhesive is improved by 96% or above, the standard deviation of the tensile shear strength is reduced by about 59% compared with that of the unmodified adhesive, and large-scale application is facilitated. Due to the fact that the sulfonic acid base body is good in heat resistance, meanwhile, due to introduction of silicon dioxide, pinning points can be formed to inhibit high-temperature slippage of a resin chain, and the tensile shear strength retention rate of the adhesive at 200 DEG C / 30 min is about 84%; and the adhesive is beneficial to non-combustion chamber parts which have high requirements on the adhesive property at a certain temperature in tail pipes and diffusion sections in the field of solid rocket engines.

This invention relates to a method for assessing the defect risk of epoxy-impregnated paper bushing cores under rapid temperature rise conditions, belonging to the field of bushing core insulation condition assessment. This invention aims to solve the problem that existing technologies cannot assess the impact of bushing core defects on partial discharge and dielectric properties under rapid temperature rise scenarios. The technical solution includes: constructing a feature parameter dataset and determining defect classification thresholds; conducting performance parameter tests before and after rapid temperature rise; comparing and analyzing the defect discharge characteristic spectrum of the bushing core, the sensitivity of partial discharge under different voltage measurement methods, and the changes in high-voltage broadband dielectric spectrum characteristic parameters under cyclic voltage excitation; and finally achieving defect risk classification assessment. This invention can comprehensively assess the electrical performance reliability of bushing cores, effectively identify potential defect risks within the core, and provide technical support for the safe and stable operation of ultra-high voltage transmission systems under extreme temperature environments.