57 results about "Epoxy adhesive" patented technology

This invention relates to a method for assessing the defect risk of epoxy-impregnated paper bushing cores under rapid temperature rise conditions, belonging to the field of bushing core insulation condition assessment. This invention aims to solve the problem that existing technologies cannot assess the impact of bushing core defects on partial discharge and dielectric properties under rapid temperature rise scenarios. The technical solution includes: constructing a feature parameter dataset and determining defect classification thresholds; conducting performance parameter tests before and after rapid temperature rise; comparing and analyzing the defect discharge characteristic spectrum of the bushing core, the sensitivity of partial discharge under different voltage measurement methods, and the changes in high-voltage broadband dielectric spectrum characteristic parameters under cyclic voltage excitation; and finally achieving defect risk classification assessment. This invention can comprehensively assess the electrical performance reliability of bushing cores, effectively identify potential defect risks within the core, and provide technical support for the safe and stable operation of ultra-high voltage transmission systems under extreme temperature environments.

This utility model discloses a limited-position bending type infrared receiver module, including an epoxy resin body, a built-in shielding bracket, a receiving PD, an integrated chip, and bending pins. The built-in shielding bracket includes a fixing part, a connecting part, and a shielding part. The fixing part and the shielding part are connected by the connecting part. The receiving PD and the integrated chip are fixedly installed in the fixing part. The shielding part has a receiving window, and the top of the epoxy resin body has a convex mirror structure. By adopting a built-in shielding bracket, PD receiver, and convex mirror structure, the product achieves advantages such as miniaturization, strong sealing, strong anti-interference, strong receiving signal, and good stability. Integrating the receiving PD and the integrated chip together has the advantages of small size and high sensitivity. By providing a convex mirror structure on the top of the epoxy resin body, the external transmission signal is effectively improved, and the receiving line distance reaches 30m, thus giving the entire product the characteristics of strong anti-interference ability and high receiving signal strength.

The present application relates to the technical field of patching material utilization, and provides an epoxy patching material, a preparation method and application thereof.The epoxy patching material comprises modified epoxy glue and aggregate; the modified epoxy glue comprises component A and component B; the components of the component A comprise epoxy resin, toughening agent, active diluent and adhesion promoter, and the components of the component B comprise curing accelerator and curing agent.The selected curing agent is not water-soluble curing agent, and the active diluent and adhesion promoter used have hydrophobic structures, have good dispersion prevention effect, and still have excellent interfacial bonding performance on steel or concrete base surface after high-temperature boiling experiment.The epoxy patching material can be used on water and underwater, especially has good curing performance underwater, is not easy to scatter in water, has good water resistance, excellent interfacial bonding performance and excellent comprehensive performance, and has wide application prospect in underwater / on-water repair of concrete structure.

An aerosol generator has a vibratable plate with apertures therein and an annular piezo which causes movement of the vibratable plate. An annular support member supports the piezo and the vibratable plate. A first electrical power conducting pin engages directly with a first, top, surface of the piezo. A second electrical power conducting pin indirectly conducts electrical power to a second surface of the piezo, by contacting an extension tab of the support member, also on its top side. There is a film of cured epoxy adhesive on the tab, providing excellent gripping force between the pin and the support. The aerosol generator avoids need for soldered joints for electrical contact, and the pins are conveniently mounted parallel to each on the on the same lateral and top side of the piezo and support member. The pins may have multi-point tips for particularly effective electrical contact.

This invention provides a low-temperature resistant epoxy-terminated polyurethane toughened epoxy adhesive and its preparation method, comprising the following steps: Step 1, drying polyol and isocyanate; Step 2, adding the dried polyol, dried isocyanate, and a portion of catalyst at 50-60℃, and stirring; Step 3, continuing to maintain the 50-60℃ condition, adding glycidyl ether and the remaining catalyst, and stirring to obtain an epoxy-terminated polyurethane prepolymer; Step 4, slowly adding epoxy resin and stirring; Step 5, adding a curing agent to react; Step 6, eliminating air bubbles; Step 7, drying to further cure and obtain the epoxy-terminated polyurethane toughened epoxy adhesive. This invention can be used even in ultra-low temperature environments of -196℃, reducing engineering losses and safety issues caused by low-temperature brittle fracture of resin, extending service life, and saving manpower and resources. Simultaneously, the preparation process is simple and requires no complex equipment, and the synthesis temperature is low and easy to control.

A low-density, high-temperature, creep-resistant benzoxazine hybrid epoxy paste and its preparation method are disclosed, relating to the field of adhesive technology. The aim is to address the insufficient long-term high-temperature creep resistance of existing lightweight epoxy adhesives. The paste is prepared from the following raw materials: Raw materials are weighed, and amide-containing trifunctional benzoxazine resin, amide-containing difunctional benzoxazine resin, amide-containing monofunctional benzoxazine resin, multifunctional epoxy resin, bisphenol A type epoxy resin, and toughening agent are added to a reaction vessel. The mixture is heated and stirred to obtain a homogeneous resin premix. The mixture is then cooled, and hollow glass microspheres, a coupling agent, and 2-methyl-pyrazolo[1,5-A]pyrimidine-6-carboxylic acid are added, and the mixture is stirred to obtain an intermediate product. Finally, a curing agent is added and stirred to obtain the low-density, high-temperature, creep-resistant benzoxazine hybrid epoxy paste. This invention is applicable to structural bonding applications in aerospace, rail transportation, and electronic packaging where lightweighting and long-term high-temperature reliability are critical.

The present invention relates to an adhesive sheet for use in bonding electronic batteries, comprising: a first conductive foil; a second conductive foil; and a conductive and removable 2K epoxy adhesive composition, wherein the conductive and removable 2K epoxy adhesive composition is disposed between the first conductive foil and the second conductive foil.

The application discloses a black matte epoxy adhesive film for a display module and a preparation method thereof. The adhesive film comprises, in sequence, a light release film layer, a transparent adhesive film layer, a black adhesive film layer and a heavy release film layer. The transparent adhesive film layer and the black adhesive film layer both contain raw materials such as epoxy resin, epoxy curing agent and modified UV resin in a specific ratio. The modified UV resin is prepared from polyol, isocyanate and hydroxy acrylate through a specific process. The black and transparent film layers are prepared by step-by-step preparation of glue, and the four-layer composite structure is formed through roll coating, compounding and weak light curing. The adhesive film has excellent matte effect and ink color consistency, low internal stress, firm adhesion, strong environmental stability, simple and efficient preparation process, small equipment investment, and is suitable for display module packaging requirements and mass production.

This application relates to a low-temperature, fast-curing, low-modulus, one-component epoxy adhesive and its preparation method. The raw materials for preparation include the following components in parts by weight: 20-60 parts of base epoxy resin, 40-80 parts of silicone-modified epoxy resin, 5-10 parts of silane coupling agent, 100-200 parts of inorganic filler, 50-100 parts of low-temperature flexible curing agent, and 20-40 parts of curing accelerator. The silicone-modified epoxy resin is prepared by reacting an amine-terminated epoxy prepolymer and an epoxy-functionalized silicone using a gradient temperature-controlled process. The low-temperature flexible curing agent is an amine-terminated dynamic flexible curing agent with dynamic covalent bonds in its molecular backbone. This application, through the synergy of the silicone-modified epoxy resin and the low-temperature flexible curing agent, enables the epoxy adhesive to cure rapidly within a low-temperature range while simultaneously exhibiting excellent properties such as low modulus and high adhesive strength, and its resistance to damp heat aging is also simultaneously improved.

This utility model discloses a multi-layer potting structure for a high-voltage sensor, relating to the technical field of voltage sensor potting structures. It aims to solve the problem of electro-corrosion of IC devices caused by the aging of internal filling materials in existing sensors, ultimately leading to severe and unstable zero-point drift in the voltage sensor. The key technical solution includes a circuit board with components fixedly connected to its upper end. The components are coated with a conformal coating, and a silicone protective layer is fixedly connected to the outside of the conformal coating. A polytetrachloroethylene (PTFE) shell for protection is fixedly connected to the outside of the silicone protective layer, and a high-pressure epoxy adhesive layer is fixedly connected to the outside of the PTFE shell, achieving sufficient and multi-level protection.

Provided are: a laminated iron core in which an Fe-N-based alloy plate is used as a soft magnetic material plate, and an electrically insulating layer / interlayer insulation layer are formed and laminated while maintaining the magnetic properties of the Fe-N-based alloy plate; and a method for manufacturing the same. A laminated iron core according to the present invention is a laminated iron core in which a plurality of soft magnetic material plates are laminated with an electrically insulation layer therebetween, the laminated iron core being characterized in that: the soft magnetic material plates are Fe–N-based alloy plates containing Fe as a main component and containing a N component; the electrically insulation layer is a layer having a predetermined resin material as a matrix; and the predetermined resin material is at least one selected from an epoxy adhesive, a dimethacrylate adhesive, an acrylic adhesive, an ene–thiol adhesive, and a methacrylate ester adhesive.

This invention relates to the field of safety protection technology for ultra-high voltage (UHV) reactors, and discloses a high-strength, single-component epoxy adhesive for UHV reactors, comprising the following components: epoxy resin: 65-85 parts by weight; diluent: 0-10 parts by weight; pigment: 0-5 parts by weight; additive: 0-3 parts by weight; filler: 10-30 parts by weight; rheology modifier: 0-5 parts by weight; curing agent: 3-10 parts by weight, wherein the curing agent is an acid anhydride curing agent. The adhesive prepared by this invention has high strength, good insulation, and low water absorption, meeting the operating requirements of UHV reactors.

This utility model relates to the field of electrical connector technology, specifically to a high-reliability housing riveting pin adhesive head assembly, including a housing, a groove on one side of the housing, and a pin fixed in the groove by adhesive; the pin has a T-shaped structure, and the top of the pin is flared, wider on the outside and narrower on the inside; the groove has a T-shaped structure, and an annular groove is formed on the inner side of the groove; the adhesive is an epoxy adhesive, which, after curing, has high bonding strength, meeting the impact resistance requirements after the pin is riveted. The adhesive fills the gap between the pin and the housing, isolating the connection between the housing and the pin, reducing corrosion caused by potential differences. The adhesive, combined with a loose riveting process, can significantly reduce the types of pins and lower inventory pressure. Furthermore, the adhesive fills the gaps in the housing, increasing the connector's protection level, changing the traditional tight riveting pin process to loose riveting, leaving gaps for adhesive filling, and increasing the amount of adhesive applied.

The application relates to a mounting structure and a precise mounting method of a long-distance laser target tracking and ranging optical path, which are used for high-precision mounting of the laser emission direction of a space target tracking and ranging optical path, the optical path comprising three reflecting mirrors, and the deviation between the laser emission direction reflected by the three reflecting mirrors and the rotation angle of a rotating table during the oscillation of an azimuth axis and a pitch axis is required to be minimized. First, a collimator is used to lead the azimuth axis and the pitch axis to a plane mirror; second, the second reflecting mirror and the first reflecting mirror are mounted and adjusted through the mounting mode of a spacer and a fastening screw, the grinding amount of the spacer is calculated according to the image movement track of the collimator or the laser imaging point movement track in a measuring camera, and the spacer is ground based on the grinding amount, so that the purpose of high-precision mounting is achieved; third, the mounting system of the third reflecting mirror is built through visible light camera zero-point calibration and the measuring camera and an angle reflector, so that the mounting of the third reflecting mirror is realized; and finally, the spacer and the fastening screw are reinforced through epoxy glue, so that the mechanical performance of the optical path is ensured.

This invention is directed to single component (1K) epoxy-based adhesives capable of fully curing under broadened cure conditions.

The utility model relates to the technical field of thermal measurement, and specifically relates to a parallel partial electroplating thermopile integrated heat flow sensor, including module, the module includes bakelite support baseplate and constantan wire, copper wire and epoxy glue, the outside of bakelite support baseplate is wound with constantan wire and copper wire, the outside of constantan wire is covered with epoxy glue, the contact point between constantan wire and copper wire forms thermal junction, the constantan wire is covered area of epoxy glue and forms cold junction, three pieces are oppositely parallel to the module. Replace traditional manual welding with short side half-sealing electroplating process, and three hundred pairs of copper-constantan thermoelectric junctions can be generated in batches by single module, and the total thermoelectric junction reaches nine hundred pairs after three-module cascade, which significantly improves production efficiency and junction consistency, and solves the problem of uneven multi-module integrated thermal field by parallel three-stage direct connection topology and four-millimeter spacing design, and the output voltage is stable under the actual measurement of heat flow, the response time is short, and the high-precision rapid measurement demand is met.

This application belongs to the field of polymer materials and discloses a polymer material for semiconductor bonding and its preparation method. The preparation method involves reacting a spherical thermally conductive filler with a furan modifier to obtain a modified spherical filler, which is then added to an epoxy polyacrylate and mixed to obtain an epoxy adhesive. A sheet-like thermally conductive filler is reacted with a carboxyl modifier to obtain a modified sheet-like filler, which is then added to a hydroxyl polyacrylate and mixed to obtain a hydroxyl adhesive. One side of a glass fiber cloth is etched to obtain a glass fiber cloth with pits on one side. The epoxy adhesive is then coated onto a release film, and the side of the glass fiber cloth without pits is covered onto the epoxy adhesive for pre-curing to obtain a composite semi-finished product. The hydroxyl adhesive is then coated onto the side of the glass fiber cloth with pits in the composite semi-finished product and cured to obtain the polymer material for semiconductor bonding. The polymer material for semiconductor bonding prepared by the above method maintains good peel strength even with a high content of thermally conductive filler.

The utility model discloses a kind of efficient brushless hollow cup DC motor stator, including the stator core made of high saturation soft magnetic material, the middle part of the stator core is equipped with core inner hole, the inside of the core inner hole is equipped with cup type winding, and the inside of the core inner hole is attached with insulating film, the cup type winding is by several sheet hexagonal winding column and is rolled by coiling machine, the cup type winding is fixed on the inner wall of core inner hole by high temperature epoxy adhesive layer;The utility model not only guarantees the electrical insulation between stator core and winding cup, but also reduces the inconvenience caused by artificial paste insulating film, improves the quality reliability of stator, shortens manufacturing cycle, improves work efficiency;Relative to filling process, manufacturing cycle is shortened by 2 / 3.

The application relates to the technical field of building material waterproofing, and particularly discloses a grouting type epoxy adhesive and a preparation method thereof. The grouting type epoxy adhesive comprises an A component and a B component which are separately stored and used in a weight ratio of (2.2-2.8):1; the A component contains the following raw materials in parts by weight: 70-80 parts of epoxy resin, 3-7 parts of carbon dodecyl to tetradecyl glycidyl ether and 15-25 parts of ortho-tolyl glycidyl ether; and the B component contains the following raw materials in parts by weight: 20-30 parts of polyether amine, 3-5 parts of N-aminoethylpiperazine and 0.5-1.5 parts of tri-(dimethylaminomethyl)phenol. The grouting type epoxy adhesive has good fluidity, high strength, high modulus and can adapt to complex construction environments of wet substrates.

The present invention relates to a piezoelectric epoxy adhesive laminate tape assembly. The adhesive laminate tape demonstrates excellent adhesive properties while maintaining good piezoelectric response.

The application relates to the field of low earth orbit battery packaging, in particular to a low earth orbit (LEO) perovskite solar cell packaging structure and process, the structure comprising a docking module and a frame, the module comprising a top sealing layer, an epoxy adhesive layer, a packaging isolation film layer, a battery piece and a substrate layer, and the inner adhesive layer of the frame comprising an epoxy adhesive layer, a fluororubber layer and a chloroprene rubber adhesive layer. The process comprises isolation film material cutting, isolation film material and battery piece bonding, module face sealing, packaging backboard bonding, frame slot insertion after frame slot glue coating, U-shaped frame and one-shaped frame combination, normal temperature curing and excess glue trimming. The sealing stability, space adaptability and stress control of the whole packaging are strengthened, the negative phenomena such as delamination and cracking easily occurring in the space environment are avoided, and the battery piece can keep long-term reliable operation in the extreme environment of high humidity, high frequency and high temperature cycle, and high vacuum.

This invention relates to one component thermal curable epoxy adhesive suitable for use in structural bonding applications on various substrates. The invented composition is composed of at least one hydrogenated bisphenol A epoxy resin, multi-functional epoxy resin, core-shell toughener and latent curing agents including dicyandiamide and accelerator. The epoxy adhesive composition according to the invention shows good stability at room temperature and fast thermal curability at elevated temperatures. Further, the present invention relates to a cured product obtained from the liquid one-component (1K) epoxy resin composition according to the invention and the cured product's use. The cured epoxy adhesive possesses very good thermal property, very strong tensile and adhesion strength as well as good reliability performance. suitable for use in structural bonding applications on various substrates.

This utility model belongs to the field of epoxy resin cooling technology, and in particular, a rapid cooling device for epoxy resin production, including a cooling tank and a water pool. Both the cooling tank and the water pool are equipped with heat removal devices, which include a spiral tube, a connecting pipe, a drive motor, a driving gear, and a driven gear. In this rapid cooling device for epoxy resin production, the epoxy resin is first placed in the cooling tank. Then, a water pump and a circulation pump are started. The water pump draws water, which enters the spiral tube through the connecting pipe on the right, then enters the connecting pipe and the water pump on the left, and is then pumped into the water pool on the left. The circulation pump circulates the water. As the water passes through the spiral tube, it carries away the heat from the epoxy resin. The continuous flow of water in the spiral tube cools the epoxy resin. Then, the drive motor is started to rotate the spiral tube within the cooling tank, agitating the epoxy resin.

The application belongs to the field of epoxy resin glue, and specifically provides a wet environment special epoxy glue, a preparation method and application thereof. The wet environment special epoxy glue comprises independently packaged component A and component B; the component A comprises bisphenol A type epoxy resin, hydrophobic modified epoxy resin, amino-terminated liquid nitrile rubber, diluent, hydrophobic nano calcium carbonate, silane coupling agent, defoaming agent and anti-settling agent; the component B comprises modified polyamide curing agent, modified alicyclic amine curing agent, water-based accelerator, hydrophobic filler, modified silk fibroin, defoaming agent and compatibilizer. The epoxy glue prepared by the application has the advantages of high adhesion and good mechanical properties in a wet environment.

This invention discloses a photoacoustic field coupling structure and coupling method, belonging to the field of photoacoustic coupling technology. The coupling structure includes a coupling body, a signal receiving unit, and a signal output unit. The coupling body is a three-layer integrated structure consisting of a light transmission layer, an acoustic reflection layer, and a field coupling layer, which are physically bonded together using high-temperature resistant epoxy adhesive. The light transmission layer is made of quartz glass, the acoustic reflection layer is made of aluminum foil, and the field coupling layer is made of piezoelectric ceramic sheet. The core coupling function is achieved through the physical material properties and structural design, without relying on built-in chips, power supplies, or integrated circuits. Optional low-power auxiliary micro-devices can be integrated without participating in the core coupling process. The signal receiving unit receives three types of signals, and the signal output unit uses a coaxial cable interface for direct connection to external devices. The coupling method achieves the coordinated coupling of light, sound, and field signals through four steps: signal interaction, coordinated coupling, signal reception, and signal output. The coupling efficiency is ≥60%, and a clear method for testing the coupling efficiency is provided. This invention features a simple structure, low power consumption, high coupling efficiency, and good stability, and can be widely applied in photoacoustic scenarios such as detection equipment and sensing systems, possessing independent technical and application value.

This invention provides a highly weather-resistant modified epoxy adhesive and its preparation method, belonging to the field of adhesive technology. The highly weather-resistant modified epoxy adhesive of this invention comprises component A and component B adhesive in a mass ratio of 100:12-18. Component A adhesive comprises the following raw materials in parts by mass: 30-39.5 parts phenolic epoxy resin, 20-30 parts diluent, 30-40 parts inorganic filler, and 8-12 parts amino-organic silicone prepolymer. Component B adhesive comprises the following raw materials in parts by mass: 90-95 parts organosilicon-modified amine curing agent and 5-10 parts accelerator. This invention introduces specially structured organosilicon segments into component A phenolic epoxy resin and component B, thereby improving the weather resistance of the modified epoxy adhesive under outdoor solar ultraviolet radiation and greatly extending the service life of the adhesive.