5 results about "Cure time" patented technology

The thermosetting resin composition contains an epoxy resin containing an epoxy compound represented by formula (1), a curing agent, and an inorganic filler. The glass transition temperature of a thermosetting resin composition in which m is 2 and n is 2 in formula (1), measured at a heating rate of 5°C / min using thermomechanical analysis (TMA), is 190°C or more, and the die shear strength of the thermosetting resin composition to copper at 230°C, measured by the following <Procedure>, is 3.0 MPa or more. <Procedure> The thermosetting resin composition is molded using a low-pressure transfer molding machine at a mold temperature of 175° C, an injection pressure of 10 MPa, and a curing time of 120 seconds, and four 10 mm2 test pieces per level are molded on a copper lead frame. Subsequently, the die shear strength between the test piece and the copper lead frame is measured at 230°C using an automatic die shear measuring device. The die shear strength of the four test pieces is adopted.

The utility model provides a kind of glue reduction wall-penetrating terminal for preventing copper bar position deviation, including terminal main body, it is characterized in that, the terminal main body is equipped with multiple glue storage grooves, the glue storage groove is a blind hole structure, the top of the glue storage groove is upper opening, the upper opening is horn shape structure, the end of the glue storage groove is lower passage, the width of the lower passage gradually decreases from top to bottom, the inner wall of the glue storage groove is equipped with the baffle of opposite arrangement, gap for inserting copper bar is equipped between baffle;The baffle is arranged between the upper opening and the lower passage, and the gap height between the upper end of the baffle and the bottom of the upper opening is less than the gap height between the lower end of the baffle and the top of the lower passage.The utility model can occupy the space in glue storage groove by baffle, so as to reduce the amount of glue, reduce glue cost, accelerate glue curing time, also greatly reduce copper bar side deviation influence.

This invention discloses a starch-based particleboard adhesive that cures rapidly at medium and low temperatures and its preparation method, belonging to the field of adhesive preparation technology. The starch-based particleboard adhesive of this invention comprises component A and component B; component A includes: 150 parts starch, 200-300 parts water, 20-25 parts concentrated hydrochloric acid, 12-18 parts dilute nitric acid, 25-40 parts sodium hydroxide solution, 6-9 parts initiator, 27-35 parts grafted monomer, and 2-5 parts emulsifier; component B includes: 8-11 parts ethylenediamine, a post-crosslinking agent. This starch-based particleboard adhesive effectively solves the problems of high curing temperature and long curing time in existing starch adhesives. While maintaining a relatively fast curing speed, it can reduce the curing temperature to 105℃, reducing the energy consumption in particleboard production. It can be widely used in the hot-press bonding of particleboard, plywood, fiberboard, and wood blocks.

Curable resin compositions with a long open time at room temperature and a short curing time at high temperatures are produced using a curable resin that can be cured with one or more liquid organic peroxides or mixtures thereof, and an accelerator / activator accelerator containing a metal salt and a thiol-functionalized organic compound.

This invention relates to a nano-metakaolin-modified hydraulic lime-based composite material and its preparation and application. The composite material comprises natural hydraulic lime and nano-metakaolin dispersed in the natural hydraulic lime, wherein the mass ratio of natural hydraulic lime to nano-metakaolin is (60-90):(10-40). The nano-metakaolin-modified hydraulic lime-based composite material of this invention exhibits controllable dispersibility and fluidity in the slurry after mixing with water. It also demonstrates good rock compatibility, low soluble salt content, controllable curing time, suitable post-curing strength, low permeability, and low shrinkage and expansion rate. The presence of a repair agent can specifically enhance the additional protective performance of the reinforcement material. It possesses high applicability, safety, and durability for the protection of stone cultural relics, without causing derivative damage.