Epoxy resin structural adhesive with high binding force and preparation method thereof

A technology of strong epoxy resin and epoxy resin, which is applied in the field of high-binding epoxy structural adhesive and its preparation, and can solve the problems of low elongation at break, low bonding strength, and long curing time of epoxy structural adhesive. problems, achieve the effect of improving wall-hanging performance, excellent bonding performance, and reducing curing time

Inactive Publication Date: 2019-11-29
上海闰龙电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a high-binding epoxy structural adhesive and a preparation method thereof, which have the advantages of improving the bonding performance, flexibility, curing at room temperature and reducing economic losses, etc. of the epoxy structural adhesive. Advantages, solve the problems of low elongation at break, low bond strength, long curing time and high curing requirements of epoxy structural adhesives

Method used

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  • Epoxy resin structural adhesive with high binding force and preparation method thereof
  • Epoxy resin structural adhesive with high binding force and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0037] A high-binding epoxy resin structural adhesive, the epoxy structural adhesive is formed by curing the A component and the B component in a weight ratio of 100 / 50;

[0038] Wherein the A component is composed of the following components: 95 parts by mass of special epoxy resin; 0.5 parts by mass of defoamer; 0.8 parts by mass of coupling agent; 2 parts by mass of rheological additive;

[0039] The B component is composed of the following components: 95 parts by mass of polyamide; 2 parts by mass of accelerator; 0.2 parts by mass of defoamer.

Embodiment 2

[0041] A high-binding epoxy resin structural adhesive, the epoxy structural adhesive is formed by curing the A component and the B component in a weight ratio of 100 / 50;

[0042] Wherein the A component is composed of the following components: 98 parts by mass of special epoxy resin; 0.3 parts by mass of defoamer; 0.6 parts by mass of coupling agent; 1.5 parts by mass of rheological additive;

[0043] The B component is composed of the following components: 97 parts by mass of polyamide; 4 parts by mass of accelerator; 0.4 parts by mass of defoamer.

Embodiment 3

[0045] A high-binding epoxy resin structural adhesive, the epoxy structural adhesive is formed by curing the A component and the B component in a weight ratio of 100 / 50;

[0046] The A component described therein is composed of the following components: 100 parts by mass of special epoxy resin; 0.5 parts by mass of defoamer; 0.4 parts by mass of coupling agent; 0.5 parts by mass of rheological additive;

[0047] The B component is composed of the following components: 100 parts by mass of polyamide; 5 parts by mass of accelerator; 0.5 parts by mass of defoamer.

[0048] in,

[0049] The special epoxy resin is one or both of polyurethane modified epoxy and polyether modified epoxy;

[0050] The defoamer is a silicone defoamer;

[0051] The coupling agent is a silane coupling agent;

[0052] The rheological additive is one or both of thixotropic rheological additives and fumed silica;

[0053] Polyamide is one or more of 115, 125, 140;

[0054] Accelerator is one or both of...

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Abstract

The invention relates to the technical field of adhesive materials, and discloses an epoxy resin structural adhesive with high binding force and a preparation method thereof, the epoxy resin structural adhesive is formed by curing a component A and a component B according to a weight ratio of 100/50; the component A comprises the following components: 95-100 parts by mass of special epoxy resin; 0.2 to 0.5 part by mass of a defoaming agent; 0.3 to 0.8 part by mass of a coupling agent and 0.5 to 2.0 parts by mass of a rheological assistant; the component B comprises the following components inparts by mass: 95-100 parts of polyamide; 0.2 to 5.0 parts of an accelerant and 0.2 to 0.5 part of a defoaming agent, and the epoxy resin structural adhesive solves the problems of long curing time and high curing temperature requirement of epoxy resin structural adhesives, has high bonding performance and flexibility, high and low temperature resistance, high elongation at break and excellent electrical insulation performance of cured products, and can better protect battery packs and reduce economic losses when accidents occur.

Description

technical field [0001] The invention relates to the technical field of adhesive materials, in particular to a high-binding epoxy resin structural adhesive and a preparation method thereof. Background technique [0002] With the deepening of the global energy crisis, the depletion of oil resources and the increasing harm of air pollution and global temperature rise, governments and automobile companies in various countries generally recognize that energy saving and emission reduction are the main direction of future automobile technology development. The development of electric vehicles will It is one of the best ways to solve these two technical difficulties. The biggest advantage of electric vehicles is to lead the development direction of the future automobile industry, which is low-carbon, informatization, and intelligent. Electric vehicles have better energy and environmental benefits than conventional vehicles throughout their life cycle. [0003] Power lithium polyme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C08G59/44
CPCC08G59/44C08L2201/08C08L2205/025C09J11/04C09J163/00C08L63/00C08K7/26
Inventor 路劲松邹建平翁伟君
Owner 上海闰龙电子材料有限公司
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