65277results about "Lamination apparatus" patented technology

A process of fabricating a slip ring component, a slip ring component, and a slip ring assembly are disclosed. The process includes forming a first shot, forming a second shot, and immersion bathing the first shot and the second shot. The immersion bathing applies an electrically conductive plating to exposed surfaces of the second shot.

The invention relates to a preparation method and an application of multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric. The multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is formed by successively arranging and laminating a metal foil reflection layer, a phase change temperature limitation layer, an interval composite membrane heat-insulation layer and a flame-retardant comfortable layer, wherein the metal foil reflection layer has high reflectivity and an enhanced heat-dissipation function; the phase change temperature limitation layer has functions of high energy consumption absorption and evenly-distributed heat conduction; the interval composite membrane heat-insulation layer has the functions of reflection insulation and even distribution of heat; and the flame-retardant comfortable layer has the functions of low-contact heat conduction, heat insulation and comfort. When the front side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is under the action of open fire and strong heat flow environment, the back side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric can be kept below 50DEG C which is near the safe temperature state of the human skin, and the integral structural form and the mechanical property are stable. The natural thickness of the composite fabric is 5-15mm, the compression thickness of the composite fabric is 3-8mm, and the square meter quality of the composite fabric is 400-1500g / m<2>. The composite fabric is fire-proof heat-insulation material which is totally sealed, stuck and sewn and can be used for individual protection and environment heat insulation in special high-temperature occasions, such as fire control, military, exploration, safe escape and industry and the like.

An electro-optic display comprises first and second substrates and a lamination adhesive layer and a layer of a solid electro-optic material disposed between the first and second substrates, the lamination adhesive layer having a volume resistivity, measured at 10° C., which does not change by a factor of more than about 3 after being held at 25° C. and 45 percent relative humidity for 1000 hours. The electro-optic material is preferably an encapsulated electrophoretic material. Other desirable characteristics of lamination adhesives for use in electro-optic displays are also described.

Flexible and / or drawable substrates having coatings comprising a dispersion of resin coated nanoparticles are disclosed, as are laminated articles comprising such flexible and / or drawable substrates.

A method for making apertures in a web comprising providing a precursor web material; providing a pair of counter-rotating, intermeshing rollers, wherein a first roller comprises circumferentially-extending ridges and grooves, and a second roller comprises teeth being tapered from a base and a tip, the teeth being joined to the second roller at the base, the base of the tooth having a cross-sectional length dimension greater than a cross-sectional width dimension; and moving the web material through a nip of the counter-rotating, intermeshing rollers; wherein apertures are formed in the precursor web material as the teeth on one of the rollers intermesh with grooves on the other of the rollers.

A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.

A manufacturing method of a top plate hermetically attached to an upper opening of a tubular shaped container body for forming a processing container of a plasma processing apparatus is provided. The manufacturing method includes the steps of; preparing a top plate body comprised of a dielectric body for transmitting an electromagnetic wave, and having a gas ejection hole for ejecting a gas into the processing container; forming a discharge prevention member having a discharge prevention member body comprised of a dielectric body having a permeability, and a dense member comprised of a dielectric body without a permeability covering at least a side face of the discharge prevention member body; and attaching the discharge prevention member in the gas ejection hole of the top plate body.

Fabric laminates having superior resistance to penetration of fragments, such as shrapnel. The fabrics are formed of high-strength fibers consolidated with from about 7% to about 15% by weight of an elastomeric matrix composition, and in combination with protective layers of a polymer film on each surface of the fabric. The fabrics achieve a significant improvement in fragment resistance compared to fabrics of the prior art, while also maintaining excellent ballistic resistant properties.

A wafer-processing apparatus includes: eight or ten reactors with identical capacity for processing wafers on the same plane, constituting four or five discrete units, each unit having two reactors arranged side by side with their fronts aligned in a line; a wafer-handling chamber including two wafer-handling robot arms each having at least two end-effectors; a load lock chamber; and a sequencer for performing, using the two wafer-handling robot arms, steps of unloading / loading processed / unprocessed wafers from / to any one of the units, and steps of unloading / loading processed / unprocessed wafers from / to all the other respective units in sequence while the wafers are in the one of the units.

Provided are reinforced composite stamps, devices and methods of making the reinforced composite stamps disclosed herein. Reinforced composite stamps of certain aspects of the present invention have a composition and architecture optimized for use in printing systems for dry transfer printing of semiconductor structures, and impart excellent control over relative spatial placement accuracy of the semiconductor structures being transferred. In some embodiments, for example, reinforced composite stamps of the present invention allow for precise and repeatable vertical motion of the patterned surface of the printing apparatus with self-leveling of the stamp to the surface of a contacted substrate. Reinforced composite stamps of certain aspect of the present invention achieve a uniform distribution of contact forces between the printing apparatus patterned surface and the top surface of a substrate being contacted by the reinforced composite stamp of the printing apparatus.